CN103325764B - 支撑安装的电互连管芯组件 - Google Patents
支撑安装的电互连管芯组件 Download PDFInfo
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- CN103325764B CN103325764B CN201310240369.5A CN201310240369A CN103325764B CN 103325764 B CN103325764 B CN 103325764B CN 201310240369 A CN201310240369 A CN 201310240369A CN 103325764 B CN103325764 B CN 103325764B
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- tube core
- stacking
- support
- interconnection
- die
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Abstract
堆叠管芯组件电连接到任何支撑上的连接部位,而无需电连接到插入的衬底或者引线框架,并且也无需焊料。
Description
本申请是申请日为2009年3月12日、申请号为200980112952.X、发明名称为“支撑安装的电互连管芯组件”的中国发明专利申请的分案申请。
相关申请的交叉引用
本申请要求对通过引用结合于此、提交于2008年3月12日、标题为“Support mounted electrically interconnected die assembly”、Simon J.S.McElrea等人的第61/035,989号美国临时申请的优先权。
本申请与各自提交于2008年5月20日、并且各自通过引用结合于此、标题为“Electrically interconnected stacked die assemblies”、Simon J.S.McElrea等人的第12/124,077号美国申请和标题为“Electrical interconnect formed by pulsed dispense”、Terrence Caskey等人的第12/124,097号美国申请有关。
技术领域
本发明涉及集成电路芯片的电互连并且具体地涉及将互连的堆叠管芯安装到支撑上。
背景技术
典型的半导体管芯具有其中形成有集成电路的前(“有源”)侧、后侧和侧壁。侧壁在前边缘与前侧汇合而在后边缘与后侧汇合。半导体管芯通常具有位于前侧的互连焊盘(管芯焊盘),这些焊盘用于管芯上的电路与管芯部署于其中的器件中的其它电路的电互连。所提供的一些管芯沿着一个或者多个管芯边际在前侧上具有管芯焊盘。并且这些可以称为外围焊盘管芯。所提供的其它管芯在管芯的中心附近在前侧具有排列成一行或者两行的管芯焊盘,并且这些可以称为中心焊盘管芯。管芯可以“重新布线”以在管芯的一个或者多个边际或者附近提供互连焊盘的适当布置。
半导体管芯可以通过若干手段中的任何手段来与封装中(例如封装衬底上或者引线框架上)的其它电路电连接。可以例如通过导线键合(wire bond)或者通过倒装芯片互连或者通过接片(tab)互连来进行这样的z互连。封装衬底或者引线框架在封装装配于其中以供使用的器件中提供封装与下层电路(例如印刷电路板上的电路)的电互连(二级互连)。
已经提出多种方案用于增加集成电路芯片封装中的有源半导体电路密度而同时最小化封装尺寸(封装覆盖区、封装厚度)。在用以制作具有较小覆盖区的高密度封装的一种方案中,将相同或者不同功能的两个或者更多半导体管芯相互堆叠并安装于封装衬底上。
第7,245,021号美国专利描述了一种包括由“垂直传导元件”电互连的多个集成电路管芯的垂直堆叠管芯组件。管芯由电绝缘保形涂层覆盖。垂直传导元件由与管芯的边缘相邻涂敷的传导聚合物材料形成。管芯具有金属传导元件,各金属传导元件的一端附着到管芯外围处的电连接点,并且另一端嵌入于垂直传导聚合物元件中。第7,215,018号美国专利描述了一种安装到球面栅格阵列(“BGA”)或者平面栅格阵列(“LGA”)衬底上的类似的垂直堆叠管芯组件。堆叠管芯组件通过垂直传导元件(“垂直互连”)到衬底表面上的电连接焊区的电连接和物理连接来安装到BGA或LGA衬底上。认为在管芯堆叠的垂直互连与衬底之间通过使用传导聚合物“点”或者“坑”来完成电连接。该专利公开了衬底可以包括用于在衬底的底部与印刷电路板之间进行电连接的手段,例如在衬底的底部上的“LGA接触”、凸块或者焊球。
发明内容
在各种实施例中,本发明的特征在于堆叠管芯组件电连接到任何支撑上的连接部位而无需电连接到任何插入的管芯或者衬底或者引线框架或者封装。堆叠管芯组件中的各个管芯具有外围互连端子,并且堆叠中的管芯通过可以是导电聚合物或者导电墨的导电材料的线或者迹线来电互连,这些导电材料的线或者迹线接触相应管芯上的互连端子。互连材料可以包括可固化聚合物。堆叠管芯组件可以直接安装到管芯堆叠组件所电连接到的支撑的表面上。或者,堆叠管芯组件可以安装到附加支撑(例如附加管芯或者衬底或者引线框架或者封装)的表面上并且电连接到该支撑上的连接部位。在一些实施例中,附加支撑包括电连接到支撑上的附加连接部位的半导体构造,其中堆叠管芯组件电连接到这些附加连接部位。
在一个主要方面中,本发明的特征在于在其表面上具有电连接部位的支撑以及安装到该表面上并且电连接到一个或者多个连接部位的堆叠管芯组件,其中堆叠管芯组件中的各个管芯具有外围互连端子,并且堆叠中的管芯通过可以是导电聚合物或导电墨的导电材料的线或者迹线来电互连,这些线或者迹线接触相应管芯上的互连端子。
在一些实施例中,互连堆叠中的管芯的导电材料的迹线也可以连接到支撑上的连接部位。在这样的实施例中,将管芯堆叠定位于支撑上或者相对于支撑来定位,使得管芯上的互连端子与支撑电路上的对应连接部位适当对准,并且然后将互连材料以适当图案涂敷于管芯上的互连端子和支撑上的连接部位之上。并且在这样的实施例中,当互连材料包括可固化聚合物时,可以在向管芯和连接部位涂敷可固化材料之后固化该互连材料。
在其它实施例中,可以提供附加数量的导电材料以在管芯堆叠互连与支撑上的连接部位之间形成接触。在一些这样的实施例中,在将组件定位于支撑上或者相对于支撑对组件进行定位之前完成管芯堆叠组件互连,并且在这样的实施例中,在互连材料包括可固化聚合物的情况下,可以在向管芯涂敷可固化材料之后并且在将组件定位于支撑上或者相对于支撑对组件进行定位之前固化或者部分地固化该互连材料。固化或者部分固化的互连可以在后续处理期间、例如在将组件装配于支撑上的期间提高堆叠组件的机械稳定性。可以在将组件定位于支撑上或者相对于支撑对组件进行定位之前向支撑上的连接部位或者向互连上的接触部位涂敷附加材料。附加材料可以与管芯堆叠互连的材料相同或者可以不同;并且在附加材料是可固化聚合物的情况下,在将组件定位于支撑上或者相对于支撑对组件进行定位之后进行最终固化。
在另一主要方面中,本发明的特征在于:第一支撑,在其表面上具有电连接部位;第二支撑,安装于第一支撑上;以及堆叠管芯组件,安装到第二支撑的表面上并且电连接到第一支撑上的一个或者多个连接部位,其中堆叠管芯组件中的各个管芯具有外围互连端子,并且堆叠中的管芯通过可以是导电聚合物或者导电墨的导电材料的线或者迹线来电互连,这些线或者迹线接触相应管芯上的互连端子。
在一些实施例中,附加支撑电连接到第一支撑。在这样的实施例中,堆叠管芯单元或者组件中的管芯的至少一些电连接未电连接到附加支撑,并且在一些这样的实施例中,在管芯单元或者组件与附加支撑上的互连焊盘或者部位之间无直接电连接。
在一些实施例中,附加支撑用作用于管芯组件或者单元的机械或者结构支撑并且不包括电部件或者电子部件。它可以例如包括假管芯;或者电介质材料片;或者具有高热容或者高导热率材料的散热片或者块。
在一些实施例中,附加支撑可以仅包括无源电特征。附加支撑中的无源电特征可以电连接到第一支撑中的一个或者多个部位;或者它们可以连接到管芯单元或者组件中的所选数目(少于所有)的互连;或者它们可以连接到管芯单元或者组件中的所选数目(少于所有)的互连以及支撑中的一个或者多个部位。在这样的实施例中,附加支撑可以例如包括接地平面。
在一些实施例中,附加支撑可以包括电子电路并且可以包括一个或者多个半导体器件。例如,附加支撑可以是半导体封装;或者附加管芯。在一些这样的例子中,附加支撑中的一个或者多个连接部位可以电连接到:第一支撑中的部位;或者管芯单元或者组件中的所选数目(少于所有)的互连;或者管芯单元或者组件中的所选数目(少于所有)的互连以及支撑中的一个或者多个部位。
在具体实施例中,在附加支撑包括电子电路的情况下,第二支撑中的电子电路和管芯组件或者单元分开地连接到第一支撑。也就是说,在管芯组件或者单元与第一支撑之间的电连接绕过第二支撑,并且可以制作相应连接以分离第一支撑上的成组部位。在一些这样的实施例中,附加支撑是管芯;管芯上的焊盘连接到第一支撑上的第二组键合部位,并且管芯组件或者单元中的互连连接到第一支撑上的第一组键合部位。在其它这样的实施例中,附加支撑是半导体封装,并且封装上的焊区连接到第一支撑上的第二组键合焊盘,并且管芯组件或者单元中的互连连接到第一支撑上的第一组键合部位。
根据本发明的管芯堆叠的装配以及管芯到支撑上的连接部位的电连接无需焊料或者导线、插座、管脚或者其它连接器。
在一些实施例中,互连材料是:导电聚合物,例如导电环氧树脂;或者导电墨。在一些实施例中,导电聚合物是可固化聚合物并且可以分级固化。互连材料可以例如包括含有导电填充物的基体;基体可以是可固化或者可固着材料,并且导电填充可以是粒子形式,例如使得当基体固着或者固化时,材料本身为导电。在一些实施例中,材料是导电环氧树脂,例如填充银的环氧树脂;例如具有60%-90%(更常见为80%-85%)银的填充环氧树脂可以是适合的。在点涂之后固化环氧树脂,从而在一些实施例中造成连串点阵融合成连续互连束。
在一些实施例中,在与堆叠中的管芯的互连相同的操作中进行堆叠到支撑的连接的情况下,可以使用涂敷工具例如注射器或者喷嘴或者针来涂敷互连材料。材料在大体上朝向管芯焊盘或者互连端子的沉积方向上离开工具,并且工具在工作方向上在存在的堆叠面之上移动。可以在连续流中从工具挤压材料,或者材料可以逐滴离开工具。在一些实施例中,材料作为小滴喷射离开工具并且沉积为在接触时或者在接触之后与堆叠面表面接合的点阵。在一些实施例中,沉积方向一般垂直于管芯的侧壁表面,并且在其它实施例中,沉积方向偏离垂直于管芯的侧壁表面而成一个角度。工具根据待连接的对应端子在各种管芯上的位置可以在大体上线性工作方向上或者在锯齿形工作方向上移动。
在一些实施例中,在单个操作中形成多个互连迹线,并且在一些这样的实施例中,在单个操作中(或者在比迹线数目少的多个操作中)形成给定堆叠组件上的所有互连迹线。涂敷工具在这样的实例中可以包括与管芯边缘大体上平行的成行聚在一起的多个针或者喷嘴。
在一些实施例中,通过例如使用印刷头(该印刷头可以具有适当喷嘴阵列)的印刷或者例如通过丝网印刷或者使用掩模来涂敷互连。在一些实施例中,使用光敏材料和曝光过程以对材料进行构图来形成互连。例如,材料可以是光固化导电材料,例如填充金属的光聚合有机聚合物;并且一般在包括焊盘或者互连端子的区域之上涂敷材料,然后以希望的图案使材料曝光,并且去除未固化的材料。
在其它实施例中,在电互连管芯堆叠使用在管芯堆叠互连与支撑上的连接部位之间的附加少量互连材料来连接到支撑的情况下,可以例如通过浅浸入互连材料的贮存器中或者例如通过丝网印刷或者孔版印刷,在传送操作中向管芯堆叠互连涂敷附加少量材料。
在更多其它实施例中,在电互连管芯堆叠使用在管芯堆叠互连与支撑上的连接部位之间的附加少量互连材料来连接到支撑的情况下,可以通过点胶操作向支撑上的连接部位涂敷附加少量材料。可以使用涂敷工具来点涂材料,并且可以在设备的控制之下使用压力点涂(例如在受控时间和压力体制之下)、活塞点涂(例如在受控时间和活塞行进体制之下)或者螺旋钻点涂(例如在受控时间和螺旋钻旋转体制之下)使材料离开工具。或者,可以例如使用喷嘴或者孔阵列通过构图印刷操作向支撑上的连接部位涂敷材料。可以按照小滴或者在连续流中点涂材料。
根据本发明,堆叠管芯组件可以使用导电聚合物或者导电墨来直接电连接到任何支撑上的任何电连接部位上。适当支撑在一个主要类别中包括在一层或者多层中载有构图的电导体的任何电介质衬底。电介质衬底可以是或者包括自然或者合成的有机或者无机材料。例如,在玻璃或者陶瓷或者硅或者其它电介质片或者膜上或者中形成的电路可以构成适当支撑。其它适当支撑包括常规电路板,例如印刷电路板(可以例如是母板或者模块板或者子板)。
在另一主要方面中,本发明的特征在于堆叠管芯单元或者堆叠管芯组件与使用器件中的支撑上的电路电互连。在一些实施例中,堆叠管芯组件互连成使得管芯的有源侧面向下层电路;在其它实施例中,堆叠管芯组件互连成使得管芯的后侧面向下层电路。在其它实施例中,堆叠中的一个或者多个管芯可以定向成背离下层电路而堆叠中的一个或者多个其它管芯面向下层电路。在更多其它实施例中,管芯或者管芯堆叠定向成使得管芯的平面与支撑的管芯安装表面不平行;在一些这样的实施例中,管芯的平面定向成垂直于支撑的管芯安装表面的平面;或者以平行与垂直之间的某一其它角度来定向。
在一些实施例中,管芯在至少前表面和与互连焊盘布置于其上的管芯边际相邻的侧壁之上设置有电绝缘保形涂层,并且在一些这样的实施例中,管芯在管芯的前表面、后表面和侧壁表面之上设置有电绝缘保形涂层。
保形涂层在组装期间保护管芯并且用以将管芯与它可能接触的导电部分电绝缘。在一些实施例中,保形涂层的材料包括有机聚合物,例如对二甲苯的聚合物或者其派生物如聚亚二甲苯聚合物(例如聚对二甲苯C或者聚对二甲苯N或者聚对二甲苯A或者聚对二甲苯SR)。在一些实施例中,通过沉积例如汽相沉积或者液相沉积或者通过固相沉积来形成保形涂层。
在一些实施例中,将底部填充材料涂敷于管芯堆叠与支撑之间。在一些实施例中,可以优选使用硬性底部填充材料以向管芯和支撑的组件提供机械稳定性。
根据本发明的组件可以用于构建计算机、电信设备以及消费者和工业电子设备。
附图说明
图1是图示了根据本发明的管芯组件可以电连接到的广义支撑的图解表示。
图2是示出了BGA衬底上安装的四个管芯的堆叠的局部截面图的图解略图。
图3A至图3F是示出了各种管芯边缘结构的例子的截面图的图解略图。
图4A至图4F是示出了具有如图3A至图3F中的管芯边缘结构的管芯堆叠的截面图的图解略图。
图5A至图5F是示出了具有如图3A至图3F中的管芯边缘结构的管芯堆叠的截面图的图解略图,其中相应管芯由保形电介质涂层覆盖。
图6A、图6B是图示了在偏移结构中堆叠的管芯的平面图和截面图的图解略图。
图7A至图7C是图示了根据本发明例子的安装于支撑上的大致如图6A、图6B中构造的管芯堆叠的截面图的图解略图。
图8和图9是各自图示了根据本发明其它实施例的管芯组件可以安装和电连接到的广义第一和第二支撑的图解表示。
图10A、图10B是图示了根据本发明一个实施例的安装到管芯(用作第二衬底)上并且电连接到第一衬底的在偏移结构中的管芯组件的平面图和截面图的图解略图。
具体实施方式
现在将参照图示了本发明替代实施例的附图更详细地描述本发明。附图为图解性质从而示出了本发明的特征及其与其它特征和结构的关系而并未按比例绘制。为了更简洁的表达,在图示了本发明实施例的图中,与其它图中所示元件对应的元件并未都具体加以重新编号,尽管它们在所有图中都可易于标识。也为了简洁表达,在图中未示出对于理解本发明而言并非必需的某些特征。在描述中的一些点,参照附图的定向可以使用诸如“上方”、“下方”、“上”、“下”、“顶部”、“底部”等相对位置的术语;这样的术语并非为了限制器件在使用时的定向。
根据本发明,堆叠管芯组件电连接到任何支撑上的互连部位而无插入的衬底或者引线框架;并且通过导电聚合物或者导电墨来进行堆叠中的管芯的电互连以及管芯堆叠与支撑的电互连,而无需焊料或者导线、插座、管脚或者其它连接器。图1在截面图中象征性地图示了具有连接侧12和反面侧14的广义支撑10。互连部位16至少存在于支撑的连接侧。在图中未表明支撑的厚度,因为支撑除了其它因素之外还根据支撑的特性可以范围从很厚到很薄;例如印刷电路板可以具有例如下衬底更大的厚度,该衬底具有由单个电介质层分离的两个金属层。如虚线箭头11和13所示,支撑可以具有更大或者更小长度和宽度尺寸。管芯堆叠可以在广泛多种类别的支撑中的任何支撑的附着侧直接连接到互连部位,这些支撑例如包括:其它管芯,例如包括逻辑芯片;其它管芯堆叠;其它封装器件或者部件;电路板,包括系统电路板、母板、子板、模块板等;引线框架等。
如上文在背景中声明的那样,第7,215,018号美国专利描述了一种安装到球面栅格阵列(“BGA”)或者平面栅格阵列(“LGA”)衬底上的垂直堆叠管芯组件。堆叠中的管芯电互连,并且堆叠使用可固化导电聚合物电连接到衬底。图2在20总体地在局部截面图中示出了安装于BGA衬底22上的四个管芯12、14、16、18的堆叠。在这一例子中,各管芯如管芯12由电绝缘保形涂层34覆盖;涂层覆盖管芯的后侧120、侧壁和前侧,其中在管芯焊盘(例如焊盘36)之上的涂层中的开口(例如开口35)暴露用于连接互连端子(例如管芯外端子129)的焊盘的区域。
堆叠中的相邻管芯可以可选地使用粘合剂来相互接连安装。(以堆叠中的管芯为参照的术语“相邻”是指管芯垂直相邻;管芯也可以例如在晶片中或者在管芯阵列中或者在共同支撑上的一些结构中水平相邻)。在这里所示例子中运用膜粘合剂件(例如在相邻管芯14与16之间的33)。
键合焊盘228布置于衬底22的管芯安装表面224。在所示例子中,管芯利用垂直对准(也就是大体上垂直于管芯的前侧或者后侧)的相应互连端子129、149、169、189来相互接连布置。并且在所示例子中,管芯堆叠利用在相应键合焊盘228之上至少部分对准的相应互连端子来安装于衬底上。焊球227在回流工艺中附着到在衬底225的与管芯安装侧224相反的一侧暴露的焊盘阵列226。焊球阵列提供组件20到使用器件中的下层电路上(例如引线框架或者印刷电路板上)的二级互连。
管芯堆叠可以使用粘合剂来安装于衬底上。在这里所示例子中,与衬底22相邻的管芯18使用膜粘合剂37来粘贴到衬底22的管芯安装侧224。如可以理解的那样,可以通过形成管芯堆叠并且然后在衬底22上安装管芯堆叠来制作如图2中所示的结构;或者取而代之,可以通过在连续操作中在衬底上串行堆叠管芯(也就是通过在衬底22上安装管芯18(可选地使用粘合剂37)、然后在管芯18上安装管芯16(可选地使用粘合剂33)、然后在管芯18上安装管芯14等)以及然后向管芯上的端子以及向衬底上的键合焊盘涂敷互连材料,以构建(build-up)方式制作该结构。
图2示出了在固化互连之后的在衬底上的堆叠管芯组件。这一例子中的组件具有安装于衬底上的四个管芯的堆叠,其中管芯相互电互连并且通过互连410来电互连到衬底电路(z互连);也就是说,互连410在互连端子129、149、169、189与衬底22上的键合焊盘228之间提供电连续性。
图3A至图3F示出了根据本发明各种实施例的待互连的管芯中的各种管芯边缘结构的例子。
图3A示出了具有“管芯外”互连的管芯。在局部截面图中示出了管芯,该管芯具有管芯的集成电路311形成于此的有源侧315和管芯侧壁319。在管芯外结构中,互连端子322键合到互连焊盘(管芯焊盘)313。管芯焊盘可以是提供的管芯中的外围管芯焊盘,或者它可以由于管芯电路的重新布线而处于管芯外围或者管芯外围附近。互连端子可以例如是导线(例如在导线键合操作中形成)或者接片或者带(例如在带键合操作中形成)。互连端子322向外延伸超出管芯边缘319(因此为“管芯外”端子)。
图3B示出了如下管芯,该管芯具有沉积到管芯焊盘313上的导电聚合物材料的凸块或者团(glob)323。团可以成形为它朝着管芯边缘延伸并且可以延伸到管芯边缘或者(如图3B中所示例子中那样)略微超出管芯边缘19;它可以是例如拇指形状。取而代之,团可以例如图5B中所示完全形成于焊盘上方。导电聚合物材料可以例如为可固化导电聚合物,例如导电环氧树脂。
图3C示出了如下管芯,该管芯具有在管芯的边际(管芯的有源侧315在该边际与管芯侧壁319汇合)或者附近、在管芯的有源侧中或者有源侧处形成的互连端子324。这样的边际互连端子可以例如是管芯焊盘的延伸,并且可以由于管芯电路的重新布线而处于管芯边际或者附近。
图3D示出了如下管芯,该管芯具有形成于管芯侧壁319中的互连端子326。互连端子可以通过将导电材料的焊盘例如附着到管芯焊盘的延伸或者重新布线的电路来连接到管芯的集成电路。
图3E示出了具有如下互连端子的管芯,该互连端子形成为使得它包围在形成于前侧管芯边缘(在管芯侧壁319与管芯的有源侧315的交点)的斜面周围。这样的包围端子具有在斜面上的端子部分327和在管芯侧壁上的端子部分328。类似包围端子可以形成于不存在斜面的后侧管芯边缘(在管芯侧壁与管芯的后侧317的交点)之上。
图3F示出了具有如下互连端子的管芯,该互连端子形成为使得它包围在形成于前侧管芯边缘(在管芯侧壁与管芯的有源侧315的交点)的斜面周围并且还包围在形成于后侧管芯边缘(在管芯侧壁与管芯的后侧317的交点)的斜面周围。这样的包围端子具有在前边缘斜面上的端子部分327和在管芯侧壁上的端子部分328以及在后边缘斜面上的端子部分329。
图4A至图4F示出了相互接连定向的分别如图3A至图3F中那样的管芯的布置(在这些例子中,各布置在堆叠中具有三个管芯)。示出了“垂直”布置的管芯;也就是说,它们参照管芯的前侧或者后侧的任意指定“水平”平面大体上垂直对准,因而它们例如使用导电环氧树脂的迹线在垂直堆叠面垂直互连。
如图4A和图4B示出的那样,管芯外端子322、323在堆叠面突出从而使它们可用于通过多种方法来连接。如图4C中示出的那样,在管芯的有源侧的边际中的互连端子324在堆叠于它们之上的管芯的边际之下(除了管芯之一的有源侧被暴露并且可被容易取得而用于互连之外)。如图4D、图4E和图4F示出的那样,对照而言,形成于管芯边缘中的互连端子326(图4D)和包围互连端子327、328(图4E)或者327、328、329(图4F)存在于堆叠面而用于互连。
图5A至图5F示出了大体上分别如图4A至图4F中那样布置的堆叠管芯。这里各管芯52由在管芯焊盘之上具有开口55的保形绝缘涂层54覆盖。
图5A示出了具有管芯外端子522的管芯的三个管芯的堆叠。由于这一例子中的管芯外互连端子位于管芯的前侧上方,所以堆叠中的相邻管芯由空间53分离。间隔物可以可选地插入于空间53中以支撑相邻管芯;可选地,间隔物可以是厚度适合于填充空间并且将管芯相互粘贴的膜粘合剂。管芯外互连端子522垂直对准并且如箭头50所示存在于堆叠面,从而可以例如使用如美国7,245,021中大体上所述的垂直定位的互连来容易地将它们互连。
图5B示出了如下管芯的三个管芯的堆叠,这些管芯具有沉积到管芯焊盘上的导电聚合物材料的团523。在这里所示例子中,团完全形成于暴露的管芯焊盘上方而未朝着堆叠面延伸(比较图3B、4B而言)。如图5A的例子中那样,团位于管芯的前侧上方,从而堆叠中的相邻管芯由空间53分离;并且可选地,可以将间隔物插入于空间53中以支撑相邻管芯;并且可选地,间隔物可以是厚度适合于填充空间并且将管芯相互粘贴的膜粘合剂。虽然这一例子中的团523未朝着堆叠面延伸,但是它允许如箭头50所示在管芯边缘侵入管芯之间的空间中的对互连材料部分(此图中未示出)的使用。
图5C示出了如下管芯的三个管芯的堆叠,这些管芯具有在管芯的边际(管芯的有源侧在该边际与管芯侧壁汇合)或者附近、在管芯的有源侧中或者有源侧处形成的互连端子524。在这样的结构中,堆叠中的下管芯(也就是堆叠中的除了最上管芯之外的所有管芯)的互连端子524由堆叠于它们之上的管芯覆盖。假如互连在相邻管芯之间侵入到互连端子524上,则可以在堆叠面通过垂直对准的互连来进行这样的堆叠中的管芯的互连。例如,涂敷的互连材料(例如导电环氧树脂)具有在相邻管芯之间的边际流入空间中的一些能力,以在管芯有源侧的边际中进行与互连端子的电连接。这需要在相邻管芯之间提供足以允许侵入的间隔53。如图5A中所示结构中那样,间隔物可以可选地插入于空间53中以支撑相邻管芯;并且可选地,间隔物可以是厚度适合于填充空间并且将管芯相互粘贴的膜粘合剂。
图5D、图5E和图5F中的各图示出了如下管芯的三个管芯的堆叠,这些管芯具有形成于管芯侧壁中或者形成于管芯侧壁处并且如箭头50所示存在于堆叠面处的互连端子。在这些例子中,保形涂层至少覆盖管芯的前侧和后侧。可以通过涂覆管芯的所有表面的全部、然后形成贯穿涂层的开口以暴露下层互连端子来制作这样的结构;或者可以通过仅涂覆管芯的前表面和后表面从而留下互连端子未涂覆来制作这样的结构。由于互连端子存在于堆叠面并且由于互连端子不位于管芯的前侧上方,所以在堆叠中的相邻管芯之间无需空间。因而如图所示,在上管芯后侧的涂层表面可以直接搁放于堆叠中的相邻较低管芯的前(“有源”)侧上的涂层表面上。
可以例如使用向堆叠面涂敷的互连(也就是通过向堆叠中的管芯的侧壁涂敷的互连)来容易地互连例如图5D、图5E和图5F中所示结构中的堆叠管芯。以这一方式电互连的在堆叠中的管芯根据本发明可以通过直接连接来与多种支撑中的任何支撑上的连接部位电连接,而无需使用焊料并且无需任何插入的衬底或者引线框架。
在上文示例的例子中,堆叠管芯使得管芯侧壁垂直对准从而基本上齐平于与管芯的x-y平面的平面垂直的假想平面,该平面在某种程度上称为堆叠面。由于在大致液体状态下涂敷互连材料,所以涂敷的互连材料在某种程度上可流动或者可变形。因而可以容许管芯侧壁的未对准而无损于互连的完整性。
在一些实施例中,按照设计来偏移管芯,从而堆叠在管芯边缘具有阶梯式结构,该结构具有待互连的互连端子。这在互连端子在管芯侧壁不可直接使用的情况下(例如对于如图5C中所示结构的管芯)会特别地有用。在图6A、图6B中通过例子示出了具有偏移管芯的互连管芯堆叠。
图6A在平面图中示出了堆叠管芯的布置,各管芯具有在与前管芯边缘相邻的一条边际中布置的互连端子,并且该图示出了在对应互连端子之上形成的互连材料;并且图6B示出了在如图6A中的6B-6B所示截面图中的堆叠。例如参照堆叠中的最上管芯,互连端子在这一例子中处于前管芯边缘旁边的行中。这一例子中的管芯在所有表面上(后表面、前表面、侧壁)由保形涂层覆盖,该涂层具有暴露互连端子的开口。堆叠中的相继涂覆管芯可以如这些例子中那样相互直接接连搁放,从而较上管芯的后侧上的涂层可以接触下层管芯的前侧上的涂层。
在图6A和图6B中所示例子中,管芯都为相同尺寸,并且焊盘仅沿着一条管芯边缘定位。因而,堆叠中的相继管芯仅在与焊盘所处的管芯边缘正交的方向上移位。
各管芯需要仅在如下程度上移位,该程度至少足以暴露下层管芯中的焊盘的足够区域以允许互连材料进行与焊盘的可靠电连接,因而示出了比所需更大的例如在图中的d表明的移位程度。在原理上,如果留下焊盘的至少部分区域不为上层管芯所覆盖,则移位可以是充分的。在实践中,如果焊盘的未覆盖区域太小,则沉积的互连材料可能在如下区域之上未接触焊盘,该区域足以在材料固化时建立可靠电连接。优选的是,对移位程度进行最小化以便堆叠的覆盖区最小化。
对于互连工艺,可以例如在堆叠中的最下管芯的后侧支撑堆叠,并且可以沿着待连接的焊盘之上的轨迹和在它们之间的管芯表面涂敷互连材料。可以使用涂敷工具例如注射器或者喷嘴来涂敷互连材料。材料在大体上朝着互连材料的沉积方向上离开工具,并且工具在工作方向上在管芯堆叠面之上移动。
在图6A、图6B中的62通过示例示出了具有所得互连材料迹线的管芯堆叠。重复这一过程以沉积将希望电互连的所有焊盘进行连接的迹线并且在沉积之后固化材料。
可以在进一步处理之前可选地测试电互连的堆叠管芯的组件。完整组件可以安装于支撑上,并且堆叠中的互连管芯可以通过与互连的固定电接触来与下层电路连接。例如可以提供具有如下键合焊盘的印刷电路板或者封装衬底,这些键合焊盘布置于管芯附着侧以与管芯堆叠互连的末端61或者63对应。例如参照图6B,互连62在组件的顶部(或者如果组件倒转则在底部)的管芯的有源侧的边际具有末端63而在组件的底部(或者如果组件倒转则在顶部)的管芯的后侧边缘具有末端61。可以提供具有以与互连末端61或者63布置对应的方式布置的z互连部位的支撑,例如电路板。组件可以安装于支撑上,例如其中管芯的有源侧面向支撑而互连末端63与z互连部位对准并且接触(例如参见图7A);或者例如其中管芯的后侧面向支撑而互连末端61与z互连部位对准并且接触(例如参见图7B)。取而代之,例如可以安装组件而管芯与支撑垂直(或者在任何其它角度)定向(例如参见图7C)、互连末端61与z互连部位对准并且接触。
堆叠管芯组件中的管芯可以如图6A、图6B中所示都为相同尺寸,但是可以根据本发明来堆叠不同尺寸的管芯并且通过导电聚合物迹线来互连这些不同尺寸的管芯。例如在一些实施例中,较小管芯可以堆叠于较大管芯上,其中较小管芯设置成使得在较大管芯的至少一个管芯边缘附近的边际中的外围管芯焊盘可用于互连。在这样的布置中,管芯的堆叠可以在截面中表现为阶梯式锥形;或者管芯可以参照第一管芯边缘在一个方向上移位、但是在另一管芯边缘上垂直互连。上管芯可以在一个尺寸上更大(也就是说,管芯可以相同宽度、但是一个比另一个更长)或者在两个方向上更大(也就是说,一个管芯比另一个更宽且更长)。例如,10mm×10mm管芯可以堆叠于在更短边具有外围焊盘的10mm×12mm管芯之上。在这样的实施例中,较小管芯处于较大管芯之上,从而在较大管芯的窄末端的管芯焊盘与较小管芯的两条边相邻暴露。或者,例如10mm×10mm管芯可以堆叠于12mm×12mm管芯之上并且设置成使得沿着较大管芯的任何一条或者多条(或者所有四条)边的外围焊盘可用于互连。
根据本发明的堆叠管芯组件可以具有与可能希望的一样多的管芯,并且作为机械设计事项可以无上限。所示例子示出了各堆叠中的三个或者四个或者七个管芯,但是设想在堆叠中具有两个或者更多管芯的组件。具体而言,例如可以制作具有四个或者六个或者八个或者16个或者17个管芯的组件并且无焊料、也无插入衬底或者引线框架地将这些组件直接安装到支撑上。
除此之外或者取而代之,可以通过在模块化设计中构造堆叠管芯单元以及然后堆叠模块化单元来制作更大堆叠管芯组件。
可堆叠的模块化单元可以既稳健又可测试。例如,特定的两个管芯的单元和四个管芯的单元可以构成模块;根据这些模块,例如可以通过堆叠两个管芯的单元和四个管芯的单元来制作六个管芯的组件或者通过堆叠两个含四个管芯的单元来制作八个管芯的组件。
如上所示,根据本发明构造的堆叠管芯单元或者组件可以安装于支撑上并且与直接在支撑上的电路电互连。例如,堆叠管芯单元可以安装于封装衬底的电路侧上并且通过将单元的互连末端中的所有或者所选互连末端与衬底上的键合焊盘连接来电互连。衬底可以是多种封装衬底中的任何封装衬底,这些封装衬底例如包括具有一个或者多个构图的金属膜和一个或者多个电介质层的层积或者构建的衬底,例如BT衬底或者陶瓷衬底;以及例如柔性衬底。或者,例如堆叠管芯单元可以安装于另一管芯的有源侧上并且通过将单元的互连末端中的所有或者所选互连末端与管芯上的焊盘连接来电互连。或者,例如管芯堆叠组件可以安装于引线框架上并且通过将单元的互连末端中的所有或者所选互连末端与引线上的部位连接来电互连。或者,例如管芯堆叠组件可以安装于印刷电路板(例如母板)上并且通过将单元的互连末端中的所有或者所选互连末端与印刷电路上的部位连接来电互连。
在其它实施例中,堆叠管芯单元或者组件可以通过将单元的互连末端中的所有或者所选互连末端与支撑上的部位连接来电连接到第一支撑并且安装于附加支撑上。附加支撑本身可以电连接到第一支撑。在这样的实施例中,堆叠管芯单元或者组件中的管芯的电连接中的至少一些电连接未电连接到附加支撑,并且在一些这样的实施例中在管芯单元或者组件与附加支撑上的互连焊盘或者部位之间无直接电连接。
附加支撑可以无电部件或者电子部件,从而它仅用作用于管芯组件或者单元的机械或者结构支撑。它可以例如包括假管芯;或者电介质材料片;或者高热容或者高导热率材料的散热片或者块。
取而代之,附加支撑可以仅包括无源电特征。附加支撑中的无源电特征可以电连接到第一支撑中的一个或者多个部位;或者它们可以连接到管芯单元或者组件中的互连中的所选数目(少于所有)的互连;或者它们可以连接到管芯单元或者组件中的互连的所选数目(少于所有)的互连以及支撑中的一个或者多个部位。它可以例如包括接地平面。
附加支撑可以包括电路。它可以例如包括印刷电路板;或者封装衬底;或者引线框架。
附加支撑可以包括电子线路并且可以包括一个或者多个半导体器件。例如,附加支撑可以是半导体封装;或者附加管芯。在一些这样的例子中,附加支撑中的一个或者多个连接部位可以电连接到:第一支撑中的部位;或者管芯单元或者组件中的互连中的所选数目(少于所有)的互连;或者管芯单元或者组件中的互连中的所选数目(少于所有)的互连以及支撑中的一个或者多个部位。
在附加支撑包括电子线路的具体实施例中,第二支撑中的电子电路和管芯组件或者单元分开地连接到第一支撑。也就是说,在管芯组件或者单元与第一支撑之间的电连接绕过第二支撑,并且可以制作相应连接以分离第一支撑上的成组部位。在一些这样的实施例中,附加支撑是管芯;管芯上的焊盘连接到第一支撑上的第二组键合部位,并且管芯组件或者单元中的互连连接到第一支撑上的第一组键合部位。在其它这样的实施例中,附加支撑是半导体封装,并且封装上的焊区连接到第一支撑上的第二组键合焊盘,并且管芯组件或者单元中的互连连接到第一支撑上的第一组键合部位。
图8在截面图中象征性地图示了与如图1中所示构造的广义第一支撑10大体上平行布置的具有管芯安装侧82和反面侧84的广义第二支撑80。图9在截面图中象征性地图示了与如图1中所示构造的广义第一支撑10大体上垂直布置的具有管芯安装侧92和反面侧94的广义第二支撑90。大体上如上所述,管芯组件或者单元可以安装于第二支撑80或者90的管芯安装侧82或者92上,并且管芯组件可以在第一支撑的连接侧电连接到互连部位16。
在图中未表明第二支撑的厚度,因为支撑除了其它因素之外还根据第二支撑的特性可以范围从很厚到很薄。例如,印刷电路板可以具有比具有由单个电介质层分离的两个金属层的层积衬底或者柔性衬底更大的厚度;并且例如封装可以具有比管芯更大的厚度。如图8和图9中虚线箭头11和13以及箭头81所示,第一和第二支撑可以具有更大或者更小的长度和宽度尺寸。
图10A和图10B图示了如下实施例的例子,在该实施例中附加支撑是安装到第一支撑上并且通过倒装芯片电互连来电连接到第一支撑的管芯;并且在该实施例中管芯组件是连接到第一支撑并且不电连接到倒装芯片管芯的管芯偏移堆叠。参照附图,第一支撑110具有电路表面112,其中成行的第一键合部位116和第二键合部位118的阵列在该表面暴露进行电连接。在这一例子中,附加支撑180是如下管芯(“支撑管芯”),该管芯在一个表面具有焊盘184的阵列并且具有附着到管芯焊盘184的焊料凸块186。管芯焊盘184的阵列和第二键合部位118的阵列布置成使得凸块在支撑管芯以管芯向下的定向来定位于第一支撑之上时与对应第二键合部位对准。布置成行的第一键合部位116使得当这样对准支撑管芯180时支撑管芯180的一边与成行的第一键合部位116平行和相邻或者(如图中所示例子中那样)部分地覆盖成行的第一键合部位116。凸块186通过焊料凸块的回流来与焊盘118配对和电连接。管芯180的后侧182背离第一支撑并且为在这一例子中大体上如参照图6A、图6B所述构造的管芯组件60提供安装表面。管芯组件的互连边缘位于与成行键合部位116平行定向的管芯180的边缘附近(并且在这一例子中从其略微后退设置)。管芯到管芯的电互连如在162所示那样延伸以将电互连62连接到对应的相应第一键合部位116。
参照图10A、图10B,设想各种附加实施例。例如,在附加支撑是管芯并且如图中所示安装成管芯向下的情况下,管芯可以通过接片互连来电连接到第一支撑。并且例如第二支撑可以是定向成暴露的封装引线或者焊区与第一支撑相向的引线框架封装,并且封装可以用常规表面安装方式来安装;或者例如第二支撑可以是定向成焊区侧与第一支撑相向的LGA或者BGA封装,并且封装可以用常规焊球格栅或者表面安装方式来安装和电连接。
并且例如在附加支撑是管芯的情况下,支撑管芯可以具有多种功能中的任何功能。例如管芯组件可以是存储器管芯的堆叠,并且支撑管芯可以包括处理器功能,例如模拟或者数字信号处理。支撑管芯可以例如是基带控制器IC,并且管芯组件可以包括存储器管芯的堆叠。并且例如在附加支撑是封装的情况下,管芯组件可以是存储器管芯的堆叠,并且附加封装可以包括具有多种功能(例如包括一个或者多个信号处理功能)中的任何功能的一个或者多个管芯。
或者,例如附加支撑可以是安装成管芯向上的管芯(也就是说,有源侧背离第一支撑)并且通过将沿着一个或者多个管芯边际的管芯焊盘行或者阵列连接到第一支撑上的对应键合部位的导线键合来电连接到第一支撑。优选地,支撑管芯的一条或者多条边无管芯焊盘,并且支撑管芯设置成支撑管芯的无焊盘边与第一支撑上的成行的第一键合部位平行和相邻(或者部分地覆盖这些部位)。管芯单元或者组件然后安装于支撑管芯的面向上方的表面之上并且设置成管芯组件的互连边缘处于支撑管芯的无焊盘边附近(并且可以从该边缘略微向后设置)。大体上如上所述,管芯到管芯的电互连延伸以将电互连连接到第一支撑中的对应第一键合部位。并且例如第二支撑可以是定向成暴露的封装引线或者焊区背离第一支撑的引线框架封装或者LGA封装,并且封装可以安装于第一衬底上的适当位置并且例如通过将支撑封装上的引线或者焊区连接到第一支撑中的键合部位的导线键合来电连接到第一支撑。
其它实施例在本发明的范围内。
Claims (19)
1.一种堆叠集成电路器件,包括:支撑,在所述支撑的表面具有电连接部位;以及堆叠管芯组件,安装到所述表面上并且电连接到所述连接部位中的一个或者多个,所述堆叠管芯组件包括安装到彼此之上的至少两个未被封装的管芯,其中所述堆叠管芯组件中的各个管芯具有外围互连端子,并且堆叠中的管芯通过是导电聚合物或者导电墨的导电材料的迹线来电互连,所述迹线接触相应管芯上的互连端子。
2.根据权利要求1所述的器件,其中所述堆叠管芯组件包括管芯的偏移堆叠。
3.根据权利要求1所述的器件,其中所述堆叠中的管芯被布置在彼此之上,从而所述堆叠中的所述管芯的第一管芯的管芯侧壁与所述堆叠中的所述管芯的第二管芯的管芯侧壁垂直对准。
4.根据权利要求1所述的器件,其中所述堆叠中的管芯被布置在彼此之上,从而所述堆叠中的所述管芯的第一管芯的管芯侧壁设置为远离所述堆叠中的所述管芯的第二管芯的管芯侧壁。
5.根据权利要求1所述的器件,其中所述堆叠中的管芯被定向,从而所述堆叠中的管芯的有源侧均面向第一方向。
6.根据权利要求1所述的器件,其中所述堆叠中的至少第一管芯的有源侧面向第一方向,并且至少第二管芯的有源侧面向与所述第一方向相反的第二方向。
7.根据权利要求1所述的器件,其中在所述堆叠的至少第一所述管芯上的外围互连端子包括管芯外端子。
8.一种堆叠集成电路器件,包括:第一支撑,在所述第一支撑的表面具有电连接部位;第二支撑,安装于所述第一支撑上;以及堆叠管芯组件,安装到所述第二支撑的表面上并且电连接到所述第一支撑上的所述连接部位中的一个或者多个,所述堆叠管芯组件包括安装到彼此之上的至少两个未被封装的管芯,其中所述堆叠管芯组件中的各个管芯具有外围互连端子,并且堆叠中的管芯通过是导电聚合物或者导电墨的导电材料的迹线来电互连,所述迹线接触相应管芯上的互连端子。
9.根据权利要求8所述的器件,其中所述堆叠中的管芯被定向,从而所述相应管芯的有源侧均面向第一方向。
10.根据权利要求8所述的器件,其中所述堆叠中的至少第一管芯的有源侧面向第一方向,并且至少第二管芯的有源侧面向与所述第一方向相反的第二方向。
11.根据权利要求8所述的器件,其中互连所述堆叠管芯组件,从而所述相应管芯的有源侧面朝所述第一支撑的所述表面。
12.根据权利要求8所述的器件,其中互连所述堆叠管芯组件,从而所述相应管芯的背侧面朝所述第一支撑的所述表面。
13.根据权利要求8所述的器件,其中所述堆叠中的一个或多个管芯被定向,从而所述相应有源侧面向为背离所述第一支撑的所述表面,并且所述堆叠中的一个或多个附加管芯被定向,从而所述相应有源侧面朝所述第一支撑的所述表面。
14.根据权利要求8所述的器件,其中定向所述管芯的堆叠,从而所述管芯的平面与所述第一支撑的所述表面并不平行。
15.一种用于制作堆叠集成电路器件的方法,包括:
提供堆叠管芯组件,所述堆叠管芯组件包括安装在彼此之上的至少两个未被封装的管芯,其中所述堆叠管芯组件中的各个管芯具有外围互连端子,并且堆叠中的管芯通过接触相应管芯上的互连端子的导电材料的迹线来电互连;
提供在其表面上具有电连接部位的第一支撑;
提供具有安装表面的第二支撑;
在所述第二支撑的所述安装表面上安装所述管芯组件,并且将所述管芯组件中的一个或者多个互连端子电连接到所述第一支撑上的连接部位中的一个或者多个,其中所述堆叠中的所述管芯被定向,从而所述堆叠中的管芯的有源侧均面向第一方向。
16.根据权利要求15所述的方法,其中所述堆叠管芯组件包括管芯的偏移堆叠。
17.根据权利要求15所述的方法,其中所述堆叠中的管芯被布置在彼此之上,从而所述堆叠中的所述管芯的第一管芯的管芯侧壁与所述堆叠中的所述管芯的第二管芯的管芯侧壁垂直对准。
18.根据权利要求15所述的方法,其中所述堆叠中的管芯被布置在彼此之上,从而所述堆叠中的所述管芯的第一管芯的管芯侧壁被设置为远离所述堆叠中的所述管芯的第二管芯的管芯侧壁。
19.根据权利要求15所述的方法,其中在所述堆叠中的至少第一所述管芯上的所述外围互连端子包括管芯外端子。
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US20160218088A1 (en) | 2016-07-28 |
TWI515863B (zh) | 2016-01-01 |
KR20100123858A (ko) | 2010-11-25 |
WO2009114670A3 (en) | 2009-11-26 |
CN101999167A (zh) | 2011-03-30 |
CN103325764A (zh) | 2013-09-25 |
CN101999167B (zh) | 2013-07-17 |
US20130099392A1 (en) | 2013-04-25 |
US9305862B2 (en) | 2016-04-05 |
US20090230528A1 (en) | 2009-09-17 |
JP2011514012A (ja) | 2011-04-28 |
TW201005916A (en) | 2010-02-01 |
WO2009114670A2 (en) | 2009-09-17 |
JP5763924B2 (ja) | 2015-08-12 |
US8178978B2 (en) | 2012-05-15 |
KR101554761B1 (ko) | 2015-09-21 |
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