TWI435927B - 螢光體及其製造方法，含螢光體之組成物，發光裝置，暨影像顯示裝置及照明裝置 - Google Patents

螢光體及其製造方法，含螢光體之組成物，發光裝置，暨影像顯示裝置及照明裝置 Download PDF

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TWI435927B
TWI435927B TW096105577A TW96105577A TWI435927B TW I435927 B TWI435927 B TW I435927B TW 096105577 A TW096105577 A TW 096105577A TW 96105577 A TW96105577 A TW 96105577A TW I435927 B TWI435927 B TW I435927B
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phosphor
light
emitting
less
usually
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TW096105577A
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Chinese (zh)
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TW200801159A (en
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吉野正彥
三浦千里
木島直人
小室直之
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三菱化學股份有限公司
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    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
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    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
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    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
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    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
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    • C09K11/77348—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
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    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
  • Vessels And Coating Films For Discharge Lamps (AREA)
TW096105577A 2006-02-10 2007-02-09 螢光體及其製造方法，含螢光體之組成物，發光裝置，暨影像顯示裝置及照明裝置 TWI435927B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006034393 2006-02-10
JP2006243165 2006-09-07

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Publication Number Publication Date
TW200801159A TW200801159A (en) 2008-01-01
TWI435927B true TWI435927B (zh) 2014-05-01

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TW096105577A TWI435927B (zh) 2006-02-10 2007-02-09 螢光體及其製造方法，含螢光體之組成物，發光裝置，暨影像顯示裝置及照明裝置

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US (1) US20100164365A1 (enExample)
EP (1) EP1995294A4 (enExample)
JP (3) JP5315616B2 (enExample)
KR (1) KR101184957B1 (enExample)
CN (1) CN101379164B (enExample)
TW (1) TWI435927B (enExample)
WO (1) WO2007091687A1 (enExample)

Families Citing this family (105)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007088966A1 (ja) * 2006-02-02 2007-08-09 Mitsubishi Chemical Corporation 複合酸窒化物蛍光体、それを用いた発光装置、画像表示装置、照明装置及び蛍光体含有組成物、並びに、複合酸窒化物
US8451401B2 (en) 2006-04-19 2013-05-28 Mitsubishi Chemical Corporation Color image display device
DE102007018099A1 (de) * 2007-04-17 2008-10-23 Osram Gesellschaft mit beschränkter Haftung Rot emittierender Leuchtstoff und Lichtquelle mit derartigem Leuchtstoff
JP2008285662A (ja) * 2007-04-18 2008-11-27 Mitsubishi Chemicals Corp 無機化合物の製造方法、蛍光体、蛍光体含有組成物、発光装置、照明装置及び画像表示装置
JP5578597B2 (ja) 2007-09-03 2014-08-27 独立行政法人物質・材料研究機構 蛍光体及びその製造方法、並びにそれを用いた発光装置
JP2009064842A (ja) * 2007-09-04 2009-03-26 Sumitomo Metal Electronics Devices Inc セラミックス焼結体およびそれを用いた基板およびそれを用いた発光素子搭載用パッケージおよびそれを用いた発光装置
JP5374855B2 (ja) * 2007-10-19 2013-12-25 三菱化学株式会社 蛍光体含有組成物の製造方法
JP5374857B2 (ja) * 2007-10-23 2013-12-25 三菱化学株式会社 蛍光体含有組成物の製造方法、及び半導体発光デバイスの製造方法
JP2009111100A (ja) * 2007-10-29 2009-05-21 Mitsubishi Chemicals Corp 集積型発光源およびその製造方法
JP5228442B2 (ja) * 2007-10-29 2013-07-03 三菱化学株式会社 集積型発光源およびその製造方法
JP2009111099A (ja) * 2007-10-29 2009-05-21 Mitsubishi Chemicals Corp 集積型発光源およびその製造方法
JP5228441B2 (ja) * 2007-10-29 2013-07-03 三菱化学株式会社 集積型発光源およびその製造方法
JP2009161576A (ja) * 2007-12-28 2009-07-23 Mitsubishi Chemicals Corp 蛍光体及びそれを用いた発光装置
US20110116520A1 (en) 2008-07-07 2011-05-19 Koninklijke Philips Electronics N.V. Eye-safe laser-based lighting
KR20110050552A (ko) * 2008-09-04 2011-05-13 바이엘 머티리얼사이언스 아게 발광 소자 및 그의 제조 방법
KR101519985B1 (ko) * 2008-09-11 2015-05-15 삼성디스플레이 주식회사 광원 모듈 및 이를 갖는 표시장치
EP2163593A1 (en) * 2008-09-15 2010-03-17 Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. Production of nitride-based phosphors
JP5641384B2 (ja) * 2008-11-28 2014-12-17 独立行政法人物質・材料研究機構 表示装置用照明装置及び表示装置
TWI356514B (en) 2009-03-19 2012-01-11 Lextar Electronics Corp Light emitting diode package
WO2010114061A1 (ja) * 2009-03-31 2010-10-07 三菱化学株式会社 蛍光体、蛍光体の製造方法、蛍光体含有組成物、発光装置、照明装置及び画像表示装置
JP2011046780A (ja) * 2009-08-25 2011-03-10 Futaba Corp 蛍光体の製造方法及び蛍光体
CN102656705B (zh) * 2009-09-29 2015-06-17 日立化成株式会社 波长转换用荧光材料和树脂组合物、太阳能电池模块及其制法
KR101280552B1 (ko) * 2009-10-23 2013-07-01 심현섭 육류의 신선도 현시(顯示) 또는 검사용 조명램프
KR101151203B1 (ko) * 2009-10-30 2012-05-29 심현섭 육류 선도 현시용 ｌｅｄ 또는 ｌｅｄ 조립체와 이를 이용한 ｌｅｄ 램프
JP4991834B2 (ja) 2009-12-17 2012-08-01 シャープ株式会社 車両用前照灯
US20130016494A1 (en) * 2010-01-11 2013-01-17 Ingo Speier Package for light emitting and receiving devices
JP5232815B2 (ja) * 2010-02-10 2013-07-10 シャープ株式会社 車両用前照灯
JP4930649B1 (ja) 2011-02-25 2012-05-16 三菱化学株式会社 ハロリン酸塩蛍光体、及び白色発光装置
EP2540798A4 (en) 2010-02-26 2014-04-30 Mitsubishi Chem Corp Halophosphate Phosphorus and White Light Output Device
JP5059208B2 (ja) * 2010-04-07 2012-10-24 シャープ株式会社 照明装置および車両用前照灯
US8733996B2 (en) 2010-05-17 2014-05-27 Sharp Kabushiki Kaisha Light emitting device, illuminating device, and vehicle headlamp
DE102010031237A1 (de) * 2010-07-12 2012-01-12 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
CN101899304B (zh) * 2010-07-22 2013-04-17 深圳大学 一种掺铕的锶铝硅系氮氧化物复合荧光粉及其制备方法
JP5127940B2 (ja) * 2010-08-31 2013-01-23 株式会社東芝 蛍光体の製造方法
US9816677B2 (en) 2010-10-29 2017-11-14 Sharp Kabushiki Kaisha Light emitting device, vehicle headlamp, illumination device, and laser element
KR20120061343A (ko) * 2010-12-03 2012-06-13 삼성엘이디 주식회사 형광체 제조방법 및 발광 장치
JP5735014B2 (ja) 2011-02-14 2015-06-17 株式会社小糸製作所 蛍光体の製造方法
US8754440B2 (en) * 2011-03-22 2014-06-17 Tsmc Solid State Lighting Ltd. Light-emitting diode (LED) package systems and methods of making the same
US8906263B2 (en) * 2011-06-03 2014-12-09 Cree, Inc. Red nitride phosphors
RU2474604C1 (ru) * 2011-07-08 2013-02-10 Государственное образовательное учреждение высшего профессионального образования "Кубанский государственный университет" (ГОУ ВПО КубГУ) Бесцветный фосфоресцирующий люминофор красного свечения
KR20130010283A (ko) * 2011-07-18 2013-01-28 삼성전자주식회사 백색 발광 장치 및 이를 이용한 디스플레이 및 조명장치
CN102903829B (zh) * 2011-07-26 2015-01-07 展晶科技(深圳)有限公司 发光二极管光源装置
KR101916245B1 (ko) 2011-07-27 2018-11-07 엘지이노텍 주식회사 광학 부재 및 이를 포함하는 표시장치
CN102384435A (zh) * 2011-08-08 2012-03-21 杨福明 一种防近视护眼灯
KR102045349B1 (ko) * 2011-08-16 2019-11-15 쇼오트 아게 형광체 조성물 및 그의 제조 방법
JP5490083B2 (ja) * 2011-12-22 2014-05-14 住友金属鉱山株式会社 アルカリ土類金属シリケート蛍光体の製造方法およびアルカリ土類金属シリケート蛍光体
CN102559174A (zh) * 2011-12-26 2012-07-11 华中科技大学 一种硅酸盐荧光粉及其制备方法
JP5689407B2 (ja) 2011-12-28 2015-03-25 宇部マテリアルズ株式会社 ケイ酸塩緑色発光蛍光体
JP5697765B2 (ja) * 2012-02-09 2015-04-08 電気化学工業株式会社 蛍光体及び発光装置
KR101643753B1 (ko) * 2012-02-09 2016-07-29 덴카 주식회사 형광체 및 발광 장치
JP5786756B2 (ja) * 2012-02-17 2015-09-30 豊田合成株式会社 蛍光体粉末の製造方法
CN102569571B (zh) * 2012-03-06 2015-06-24 华灿光电股份有限公司 半导体发光二极管及其制造方法
EP2823017B1 (en) * 2012-03-06 2017-04-19 Nitto Denko Corporation Ceramic body for light emitting devices
JP5840540B2 (ja) * 2012-03-15 2016-01-06 株式会社東芝 白色照明装置
JP2013196854A (ja) * 2012-03-16 2013-09-30 Sharp Corp 蛍光体基板およびこれを備えた表示装置
EP2833422A4 (en) 2012-03-30 2015-04-01 Mitsubishi Chem Corp LIGHT-EMITTING SEMICONDUCTOR DEVICE AND LIGHTING DEVICE
WO2014104155A1 (ja) * 2012-12-28 2014-07-03 信越化学工業株式会社 波長変換部材及び発光装置
TWI464238B (zh) * 2013-03-27 2014-12-11 奇美實業股份有限公司 螢光體與發光裝置
WO2015037715A1 (ja) * 2013-09-13 2015-03-19 宇部マテリアルズ株式会社 ケイ酸塩蛍光体の製造方法
CN104673287A (zh) * 2013-12-03 2015-06-03 辽宁法库陶瓷工程技术研究中心 一种长波长高亮度氮化物红色荧光粉及其制备方法
JP6070536B2 (ja) * 2013-12-26 2017-02-01 住友金属鉱山株式会社 シリケート蛍光体粒子の製造方法
JP6036678B2 (ja) * 2013-12-26 2016-11-30 住友金属鉱山株式会社 シリケート蛍光体粒子の製造方法およびシリケート蛍光体粒子
JP2016034017A (ja) 2014-02-28 2016-03-10 パナソニックＩｐマネジメント株式会社 発光装置
WO2015128909A1 (ja) 2014-02-28 2015-09-03 パナソニックＩｐマネジメント株式会社 発光素子および発光装置
US9618697B2 (en) 2014-02-28 2017-04-11 Panasonic Intellectual Property Management Co., Ltd. Light directional angle control for light-emitting device and light-emitting apparatus
US9515239B2 (en) 2014-02-28 2016-12-06 Panasonic Intellectual Property Management Co., Ltd. Light-emitting device and light-emitting apparatus
JP2016034012A (ja) 2014-02-28 2016-03-10 パナソニックＩｐマネジメント株式会社 発光素子および発光装置
US9518215B2 (en) 2014-02-28 2016-12-13 Panasonic Intellectual Property Management Co., Ltd. Light-emitting device and light-emitting apparatus
WO2015153485A1 (en) 2014-04-01 2015-10-08 The Research Foundation For The State University Of New York Electrode materials for group ii cation-based batteries
JP6323177B2 (ja) * 2014-05-30 2018-05-16 日亜化学工業株式会社 半導体発光装置
SG11201700912UA (en) * 2014-08-04 2017-03-30 Rhodia Operations Modified phosphors and compositions thereof
KR102318228B1 (ko) * 2014-11-11 2021-10-28 엘지이노텍 주식회사 조명 장치
JP6354607B2 (ja) * 2015-01-23 2018-07-11 日亜化学工業株式会社 発光装置
US10131836B2 (en) 2015-01-31 2018-11-20 Lg Chem, Ltd. Color conversion film and back light unit and display apparatus comprising the same
CN104830333B (zh) * 2015-03-06 2017-01-25 江苏师范大学 一种Li、Mg共掺的双钙钛矿红色荧光粉及其制备方法
JP2016171228A (ja) 2015-03-13 2016-09-23 パナソニックＩｐマネジメント株式会社 発光素子、発光装置および検知装置
JP6569856B2 (ja) 2015-03-13 2019-09-04 パナソニックＩｐマネジメント株式会社 発光装置および内視鏡
US10031276B2 (en) 2015-03-13 2018-07-24 Panasonic Intellectual Property Management Co., Ltd. Display apparatus including photoluminescent layer
US10182702B2 (en) 2015-03-13 2019-01-22 Panasonic Intellectual Property Management Co., Ltd. Light-emitting apparatus including photoluminescent layer
JP2017003697A (ja) 2015-06-08 2017-01-05 パナソニックＩｐマネジメント株式会社 発光素子および発光装置
JP2017005054A (ja) 2015-06-08 2017-01-05 パナソニックＩｐマネジメント株式会社 発光装置
EP3321342B1 (en) * 2015-07-07 2020-08-05 Dyden Corporation Blue-green-light-emitting phosphor, light-emitting element, light-emitting device, and white-light-emitting device
JP2017040818A (ja) 2015-08-20 2017-02-23 パナソニックＩｐマネジメント株式会社 発光素子
US10359155B2 (en) 2015-08-20 2019-07-23 Panasonic Intellectual Property Management Co., Ltd. Light-emitting apparatus
JP6748905B2 (ja) 2015-08-20 2020-09-02 パナソニックＩｐマネジメント株式会社 発光装置
CN108603957B (zh) * 2016-02-19 2019-11-15 东丽株式会社 颜色转换片、包含其的光源单元、显示器及照明装置
JP6447557B2 (ja) 2016-03-24 2019-01-09 日亜化学工業株式会社 発光装置の製造方法
JP6719094B2 (ja) 2016-03-30 2020-07-08 パナソニックＩｐマネジメント株式会社 発光素子
CN109073801A (zh) * 2016-04-25 2018-12-21 日本特殊陶业株式会社 波长转换构件、其制造方法及发光装置
CN106085429A (zh) * 2016-07-11 2016-11-09 河北大学 一系列颜色可调的宽谱led荧光粉及其制备方法
JP6741614B2 (ja) * 2017-03-16 2020-08-19 Ｊｆｅミネラル株式会社 希土類付活アルカリ土類ケイ酸塩化合物残光性蛍光体
KR102343843B1 (ko) * 2017-03-31 2021-12-24 도레이첨단소재 주식회사 고색재현 복합필름 및 이를 포함하는 백라이트 유닛
KR102373817B1 (ko) 2017-05-02 2022-03-14 삼성전자주식회사 백색 발광장치 및 조명 장치
US11340390B2 (en) * 2017-06-02 2022-05-24 Toray Industries, Inc. Color conversion sheet, light source unit comprising same, display and lighting device
JP7248379B2 (ja) * 2017-07-24 2023-03-29 日亜化学工業株式会社 発光装置及びその製造方法
WO2019064589A1 (ja) * 2017-09-29 2019-04-04 日立化成株式会社 波長変換部材、バックライトユニット、画像表示装置、波長変換用樹脂組成物及び波長変換用樹脂硬化物
CN111201304A (zh) * 2017-10-10 2020-05-26 电化株式会社 红色荧光体和发光装置
JP2019087691A (ja) * 2017-11-09 2019-06-06 シャープ株式会社 発光装置及び画像表示装置
EP3492554B1 (en) * 2017-11-30 2020-08-19 Nichia Corporation Light emitting device, illumination device and plant cultivation method
JP6940778B2 (ja) * 2019-02-27 2021-09-29 日亜化学工業株式会社 窒化物蛍光体の製造方法
US11807791B2 (en) 2019-06-28 2023-11-07 Denka Company Limited Phosphor plate and light emitting device using the same
KR102645584B1 (ko) * 2021-12-16 2024-03-12 신라대학교 산학협력단 푸른색 여기에 의한 초록-노란빛으로 발광하는 오소저머네이트류 인광체 및 이의 제조 방법
CN114621765B (zh) * 2022-03-31 2023-11-14 陕西师范大学 一种Ce3+掺杂氮氧化物单基质白光荧光粉
DE102022125141A1 (de) * 2022-09-29 2024-04-04 Schott Ag Beleuchtungseinrichtung mit optimierter Farbskala
WO2024136621A1 (ko) * 2022-12-23 2024-06-27 한양대학교 산학협력단 페로브스카이트 유사 구조를 가지며 우수한 발광 효율을 나타내는 청색 발광 물질, 및 이의 제조 방법

Family Cites Families (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3544482A (en) * 1968-03-15 1970-12-01 Sylvania Electric Prod Europium and manganese activated alkaline earth silicate phosphors
JP2841377B2 (ja) 1988-08-25 1998-12-24 住友化学工業株式会社 位相差板
JPH07119410B2 (ja) 1989-02-09 1995-12-20 日亜化学工業株式会社 極小球形の二酸化ケイ素を付着した蛍光体の製造方法
JPH07119411B2 (ja) 1989-03-08 1995-12-20 日亜化学工業株式会社 球形の二酸化ケイ素を付着した蛍光体の製造方法
JP2884702B2 (ja) 1989-12-26 1999-04-19 化成オプトニクス株式会社 螢光体及びその製造方法
JP3094113B2 (ja) 1990-05-25 2000-10-03 住友化学工業株式会社 位相差板およびその製造方法
JPH06314593A (ja) 1993-03-05 1994-11-08 Japan Synthetic Rubber Co Ltd エレクトロルミネッセンス素子
JP3168850B2 (ja) 1993-12-22 2001-05-21 住友化学工業株式会社 位相差フィルムの製造方法
JPH08315820A (ja) * 1995-05-11 1996-11-29 Petoca:Kk 二次電池負極材用炭素繊維及びその製造方法
CN1065897C (zh) * 1996-09-04 2001-05-16 北京电力电子新技术研究开发中心 一种翡翠绿色稀土荧光粉及其配制方法
US6278135B1 (en) * 1998-02-06 2001-08-21 General Electric Company Green-light emitting phosphors and light sources using the same
US6294800B1 (en) * 1998-02-06 2001-09-25 General Electric Company Phosphors for white light generation from UV emitting diodes
US6071432A (en) * 1998-03-31 2000-06-06 Sarnoff Corporation Long persistence red phosphors
US6099754A (en) * 1998-03-31 2000-08-08 Sarnoff Corporation Long persistence red phosphors
US6429583B1 (en) * 1998-11-30 2002-08-06 General Electric Company Light emitting device with ba2mgsi2o7:eu2+, ba2sio4:eu2+, or (srxcay ba1-x-y)(a1zga1-z)2sr:eu2+phosphors
US6466135B1 (en) * 2000-05-15 2002-10-15 General Electric Company Phosphors for down converting ultraviolet light of LEDs to blue-green light
US6621211B1 (en) * 2000-05-15 2003-09-16 General Electric Company White light emitting phosphor blends for LED devices
JP2002169025A (ja) 2000-07-21 2002-06-14 Sumitomo Chem Co Ltd 異方性散乱フィルムおよびそれを用いた液晶表示装置
DE10036940A1 (de) * 2000-07-28 2002-02-07 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Lumineszenz-Konversions-LED
TWI228535B (en) * 2000-09-29 2005-03-01 Sumitomo Chemical Co Fluorescent substances for vacuum ultraviolet radiation excited light-emitting devices
DE10051242A1 (de) 2000-10-17 2002-04-25 Philips Corp Intellectual Pty Lichtemittierende Vorrichtung mit beschichtetem Leuchtstoff
AT410266B (de) * 2000-12-28 2003-03-25 Tridonic Optoelectronics Gmbh Lichtquelle mit einem lichtemittierenden element
JP2003029030A (ja) 2001-07-12 2003-01-29 Sumitomo Chem Co Ltd 異方性散乱フィルムおよびそれを用いた液晶表示装置
WO2003021691A1 (en) * 2001-09-03 2003-03-13 Matsushita Electric Industrial Co., Ltd. Semiconductor light emitting device, light emitting apparatus and production method for semiconductor light emitting device
US7294956B2 (en) * 2001-10-01 2007-11-13 Matsushita Electric Industrial Co., Ltd. Semiconductor light emitting element and light emitting device using this
US6884367B2 (en) * 2001-12-19 2005-04-26 Sumitomo Chemical Company Limited Method for producing silicate phosphor
CN100468789C (zh) * 2002-02-15 2009-03-11 三菱化学株式会社 光发射器件及使用其的照明器
WO2003080763A1 (en) * 2002-03-25 2003-10-02 Philips Intellectual Property & Standards Gmbh Tri-color white light led lamp
JP2004115633A (ja) * 2002-09-25 2004-04-15 Matsushita Electric Ind Co Ltd 珪酸塩蛍光体およびそれを用いた発光装置
JP4725008B2 (ja) 2003-09-11 2011-07-13 日亜化学工業株式会社 発光装置、発光素子用蛍光体および発光素子用蛍光体の製造方法
JP2004300247A (ja) 2003-03-31 2004-10-28 Mitsubishi Chemicals Corp 蛍光体及びそれを用いた発光装置、並びに照明装置
US6982045B2 (en) * 2003-05-17 2006-01-03 Phosphortech Corporation Light emitting device having silicate fluorescent phosphor
US7026755B2 (en) * 2003-08-07 2006-04-11 General Electric Company Deep red phosphor for general illumination applications
JP4337468B2 (ja) * 2003-08-13 2009-09-30 三菱化学株式会社 発光装置及び照明装置ならびに画像表示装置
JP4617890B2 (ja) * 2004-01-16 2011-01-26 三菱化学株式会社 蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置
WO2005068584A1 (ja) * 2004-01-16 2005-07-28 Mitsubishi Chemical Corporation 蛍光体、及びそれを用いた発光装置、照明装置ならびに画像表示装置
JP4617889B2 (ja) * 2004-01-16 2011-01-26 三菱化学株式会社 蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置
US7573072B2 (en) * 2004-03-10 2009-08-11 Lumination Llc Phosphor and blends thereof for use in LEDs
US7391060B2 (en) * 2004-04-27 2008-06-24 Matsushita Electric Industrial Co., Ltd. Phosphor composition and method for producing the same, and light-emitting device using the same
JP2005336450A (ja) * 2004-04-27 2005-12-08 Matsushita Electric Ind Co Ltd 蛍光体組成物とその製造方法、並びにその蛍光体組成物を用いた発光装置
JP4904471B2 (ja) 2004-07-07 2012-03-28 東日本旅客鉄道株式会社 経路誘導システム
JP4619157B2 (ja) 2004-07-08 2011-01-26 日東電工株式会社 衝撃試験装置及び衝撃試験方法
JP4150362B2 (ja) 2004-07-21 2008-09-17 松下電器産業株式会社 ランプ用蛍光体の製造方法
JP2006034393A (ja) 2004-07-23 2006-02-09 Konica Minolta Medical & Graphic Inc 医用画像記録装置
US7311858B2 (en) * 2004-08-04 2007-12-25 Intematix Corporation Silicate-based yellow-green phosphors
US20060027785A1 (en) * 2004-08-04 2006-02-09 Intematix Corporation Novel silicate-based yellow-green phosphors
JP4836429B2 (ja) * 2004-10-18 2011-12-14 株式会社東芝 蛍光体およびこれを用いた発光装置
JP4669698B2 (ja) 2004-12-24 2011-04-13 信越化学工業株式会社 レジスト材料及びパターン形成方法
JP2006243165A (ja) 2005-03-01 2006-09-14 Ricoh Co Ltd 現像装置、及び画像形成装置
JP4631583B2 (ja) 2005-07-29 2011-02-16 東レ株式会社 ラミネート用積層ポリエステルフィルムおよびポリエステル樹脂ラミネート金属板

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