KR101184957B1 - 형광체 및 그 제조 방법, 형광체 함유 조성물, 발광 장치, 그리고 화상 표시 장치 및 조명 장치 - Google Patents
형광체 및 그 제조 방법, 형광체 함유 조성물, 발광 장치, 그리고 화상 표시 장치 및 조명 장치 Download PDFInfo
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- KR101184957B1 KR101184957B1 KR1020087021668A KR20087021668A KR101184957B1 KR 101184957 B1 KR101184957 B1 KR 101184957B1 KR 1020087021668 A KR1020087021668 A KR 1020087021668A KR 20087021668 A KR20087021668 A KR 20087021668A KR 101184957 B1 KR101184957 B1 KR 101184957B1
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- fluorescent substance
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- C—CHEMISTRY; METALLURGY
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- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/7734—Aluminates
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- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
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- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
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- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77342—Silicates
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- C09K11/77348—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
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- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H01L2924/12—Passive devices, e.g. 2 terminal devices
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- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
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- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Luminescent Compositions (AREA)
- Led Device Packages (AREA)
- Vessels And Coating Films For Discharge Lamps (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2006-00034393 | 2006-02-10 | ||
| JP2006034393 | 2006-02-10 | ||
| JP2006243165 | 2006-09-07 | ||
| JPJP-P-2006-00243165 | 2006-09-07 | ||
| PCT/JP2007/052405 WO2007091687A1 (ja) | 2006-02-10 | 2007-02-09 | 蛍光体及びその製造方法、蛍光体含有組成物、発光装置、並びに画像表示装置及び照明装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20080091295A KR20080091295A (ko) | 2008-10-09 |
| KR101184957B1 true KR101184957B1 (ko) | 2012-10-02 |
Family
ID=38345279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020087021668A Expired - Fee Related KR101184957B1 (ko) | 2006-02-10 | 2007-02-09 | 형광체 및 그 제조 방법, 형광체 함유 조성물, 발광 장치, 그리고 화상 표시 장치 및 조명 장치 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20100164365A1 (enExample) |
| EP (1) | EP1995294A4 (enExample) |
| JP (3) | JP5315616B2 (enExample) |
| KR (1) | KR101184957B1 (enExample) |
| CN (1) | CN101379164B (enExample) |
| TW (1) | TWI435927B (enExample) |
| WO (1) | WO2007091687A1 (enExample) |
Families Citing this family (105)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101379163B (zh) * | 2006-02-02 | 2013-01-02 | 三菱化学株式会社 | 复合氧氮化物荧光体、使用该荧光体的发光装置、图像显示装置、照明装置、含荧光体的组合物以及复合氧氮化物 |
| US8451401B2 (en) | 2006-04-19 | 2013-05-28 | Mitsubishi Chemical Corporation | Color image display device |
| DE102007018099A1 (de) * | 2007-04-17 | 2008-10-23 | Osram Gesellschaft mit beschränkter Haftung | Rot emittierender Leuchtstoff und Lichtquelle mit derartigem Leuchtstoff |
| US8178001B2 (en) * | 2007-04-18 | 2012-05-15 | Mitsubishi Chemical Corporation | Method for producing inorganic compound, phosphor, phosphor-containing composition, light-emitting device, lighting system, and display device |
| JP5578597B2 (ja) | 2007-09-03 | 2014-08-27 | 独立行政法人物質・材料研究機構 | 蛍光体及びその製造方法、並びにそれを用いた発光装置 |
| JP2009064842A (ja) * | 2007-09-04 | 2009-03-26 | Sumitomo Metal Electronics Devices Inc | セラミックス焼結体およびそれを用いた基板およびそれを用いた発光素子搭載用パッケージおよびそれを用いた発光装置 |
| JP5374855B2 (ja) * | 2007-10-19 | 2013-12-25 | 三菱化学株式会社 | 蛍光体含有組成物の製造方法 |
| JP5374857B2 (ja) * | 2007-10-23 | 2013-12-25 | 三菱化学株式会社 | 蛍光体含有組成物の製造方法、及び半導体発光デバイスの製造方法 |
| JP2009111100A (ja) * | 2007-10-29 | 2009-05-21 | Mitsubishi Chemicals Corp | 集積型発光源およびその製造方法 |
| JP2009111099A (ja) * | 2007-10-29 | 2009-05-21 | Mitsubishi Chemicals Corp | 集積型発光源およびその製造方法 |
| JP5228442B2 (ja) * | 2007-10-29 | 2013-07-03 | 三菱化学株式会社 | 集積型発光源およびその製造方法 |
| JP5228441B2 (ja) * | 2007-10-29 | 2013-07-03 | 三菱化学株式会社 | 集積型発光源およびその製造方法 |
| JP2009161576A (ja) * | 2007-12-28 | 2009-07-23 | Mitsubishi Chemicals Corp | 蛍光体及びそれを用いた発光装置 |
| US20110116520A1 (en) * | 2008-07-07 | 2011-05-19 | Koninklijke Philips Electronics N.V. | Eye-safe laser-based lighting |
| EP2324097A1 (de) * | 2008-09-04 | 2011-05-25 | Bayer MaterialScience AG | Lichtemittierende vorrichtung und verfahren zu deren herstellung |
| KR101519985B1 (ko) * | 2008-09-11 | 2015-05-15 | 삼성디스플레이 주식회사 | 광원 모듈 및 이를 갖는 표시장치 |
| EP2163593A1 (en) * | 2008-09-15 | 2010-03-17 | Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. | Production of nitride-based phosphors |
| JP5641384B2 (ja) | 2008-11-28 | 2014-12-17 | 独立行政法人物質・材料研究機構 | 表示装置用照明装置及び表示装置 |
| TWI356514B (en) | 2009-03-19 | 2012-01-11 | Lextar Electronics Corp | Light emitting diode package |
| WO2010114061A1 (ja) | 2009-03-31 | 2010-10-07 | 三菱化学株式会社 | 蛍光体、蛍光体の製造方法、蛍光体含有組成物、発光装置、照明装置及び画像表示装置 |
| JP2011046780A (ja) * | 2009-08-25 | 2011-03-10 | Futaba Corp | 蛍光体の製造方法及び蛍光体 |
| EP2485271A4 (en) * | 2009-09-29 | 2015-08-05 | Hitachi Chemical Co Ltd | FLUORESCENT MATERIAL FOR WAVELENGTH CONVERSION, RESIN COMPOSITION FOR WAVELENGTH CONVERSION BY FLUORESCENT MATERIAL FROM THE FLUORESCENT MATERIAL OR RESIN COMPOSITION MADE SOLAR CELL MODULE, METHOD FOR PRODUCING THE RESIN COMPOSITION FOR WAVELENGTH CONVERSION AND METHOD FOR PRODUCING THE SOLAR CELL MODULE |
| KR101280552B1 (ko) * | 2009-10-23 | 2013-07-01 | 심현섭 | 육류의 신선도 현시(顯示) 또는 검사용 조명램프 |
| KR101151203B1 (ko) * | 2009-10-30 | 2012-05-29 | 심현섭 | 육류 선도 현시용 led 또는 led 조립체와 이를 이용한 led 램프 |
| JP4991834B2 (ja) | 2009-12-17 | 2012-08-01 | シャープ株式会社 | 車両用前照灯 |
| US20130016494A1 (en) * | 2010-01-11 | 2013-01-17 | Ingo Speier | Package for light emitting and receiving devices |
| JP5232815B2 (ja) * | 2010-02-10 | 2013-07-10 | シャープ株式会社 | 車両用前照灯 |
| CN102686700B (zh) | 2010-02-26 | 2015-03-25 | 三菱化学株式会社 | 卤磷酸盐荧光体及白色发光装置 |
| JP4930649B1 (ja) | 2011-02-25 | 2012-05-16 | 三菱化学株式会社 | ハロリン酸塩蛍光体、及び白色発光装置 |
| JP5059208B2 (ja) * | 2010-04-07 | 2012-10-24 | シャープ株式会社 | 照明装置および車両用前照灯 |
| US8733996B2 (en) | 2010-05-17 | 2014-05-27 | Sharp Kabushiki Kaisha | Light emitting device, illuminating device, and vehicle headlamp |
| DE102010031237A1 (de) * | 2010-07-12 | 2012-01-12 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
| CN101899304B (zh) * | 2010-07-22 | 2013-04-17 | 深圳大学 | 一种掺铕的锶铝硅系氮氧化物复合荧光粉及其制备方法 |
| JP5127940B2 (ja) * | 2010-08-31 | 2013-01-23 | 株式会社東芝 | 蛍光体の製造方法 |
| US9816677B2 (en) | 2010-10-29 | 2017-11-14 | Sharp Kabushiki Kaisha | Light emitting device, vehicle headlamp, illumination device, and laser element |
| KR20120061343A (ko) * | 2010-12-03 | 2012-06-13 | 삼성엘이디 주식회사 | 형광체 제조방법 및 발광 장치 |
| KR101531123B1 (ko) | 2011-02-14 | 2015-06-23 | 가부시키가이샤 고이토 세이사꾸쇼 | 형광체의 제조 방법 |
| US8754440B2 (en) * | 2011-03-22 | 2014-06-17 | Tsmc Solid State Lighting Ltd. | Light-emitting diode (LED) package systems and methods of making the same |
| US8906263B2 (en) * | 2011-06-03 | 2014-12-09 | Cree, Inc. | Red nitride phosphors |
| RU2474604C1 (ru) * | 2011-07-08 | 2013-02-10 | Государственное образовательное учреждение высшего профессионального образования "Кубанский государственный университет" (ГОУ ВПО КубГУ) | Бесцветный фосфоресцирующий люминофор красного свечения |
| KR20130010283A (ko) * | 2011-07-18 | 2013-01-28 | 삼성전자주식회사 | 백색 발광 장치 및 이를 이용한 디스플레이 및 조명장치 |
| CN102903829B (zh) * | 2011-07-26 | 2015-01-07 | 展晶科技(深圳)有限公司 | 发光二极管光源装置 |
| KR101916245B1 (ko) | 2011-07-27 | 2018-11-07 | 엘지이노텍 주식회사 | 광학 부재 및 이를 포함하는 표시장치 |
| CN102384435A (zh) * | 2011-08-08 | 2012-03-21 | 杨福明 | 一种防近视护眼灯 |
| EP2744870B1 (en) * | 2011-08-16 | 2017-11-22 | Nitto Denko Corporation | Phosphor compositions and methods of making the same |
| JP5490083B2 (ja) * | 2011-12-22 | 2014-05-14 | 住友金属鉱山株式会社 | アルカリ土類金属シリケート蛍光体の製造方法およびアルカリ土類金属シリケート蛍光体 |
| CN102559174A (zh) * | 2011-12-26 | 2012-07-11 | 华中科技大学 | 一种硅酸盐荧光粉及其制备方法 |
| JP5689407B2 (ja) | 2011-12-28 | 2015-03-25 | 宇部マテリアルズ株式会社 | ケイ酸塩緑色発光蛍光体 |
| WO2013118330A1 (ja) * | 2012-02-09 | 2013-08-15 | 電気化学工業株式会社 | 蛍光体及び発光装置 |
| KR101650533B1 (ko) * | 2012-02-09 | 2016-08-23 | 덴카 주식회사 | 형광체 및 발광 장치 |
| JP5786756B2 (ja) * | 2012-02-17 | 2015-09-30 | 豊田合成株式会社 | 蛍光体粉末の製造方法 |
| CN104508082A (zh) * | 2012-03-06 | 2015-04-08 | 日东电工株式会社 | 用于发光装置的陶瓷体 |
| CN102569571B (zh) * | 2012-03-06 | 2015-06-24 | 华灿光电股份有限公司 | 半导体发光二极管及其制造方法 |
| JP5840540B2 (ja) * | 2012-03-15 | 2016-01-06 | 株式会社東芝 | 白色照明装置 |
| JP2013196854A (ja) * | 2012-03-16 | 2013-09-30 | Sharp Corp | 蛍光体基板およびこれを備えた表示装置 |
| WO2013147195A1 (ja) | 2012-03-30 | 2013-10-03 | 三菱化学株式会社 | 半導体発光装置、及び照明装置 |
| KR102202309B1 (ko) * | 2012-12-28 | 2021-01-14 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 파장 변환 부재 및 발광 장치 |
| TWI464238B (zh) * | 2013-03-27 | 2014-12-11 | 奇美實業股份有限公司 | 螢光體與發光裝置 |
| US20160222288A1 (en) * | 2013-09-13 | 2016-08-04 | Ube Material Industries, Ltd. | Method for producing silicate phosphor |
| CN104673287A (zh) * | 2013-12-03 | 2015-06-03 | 辽宁法库陶瓷工程技术研究中心 | 一种长波长高亮度氮化物红色荧光粉及其制备方法 |
| JP6070536B2 (ja) * | 2013-12-26 | 2017-02-01 | 住友金属鉱山株式会社 | シリケート蛍光体粒子の製造方法 |
| JP6036678B2 (ja) * | 2013-12-26 | 2016-11-30 | 住友金属鉱山株式会社 | シリケート蛍光体粒子の製造方法およびシリケート蛍光体粒子 |
| US9515239B2 (en) | 2014-02-28 | 2016-12-06 | Panasonic Intellectual Property Management Co., Ltd. | Light-emitting device and light-emitting apparatus |
| US9618697B2 (en) | 2014-02-28 | 2017-04-11 | Panasonic Intellectual Property Management Co., Ltd. | Light directional angle control for light-emitting device and light-emitting apparatus |
| WO2015129222A1 (ja) | 2014-02-28 | 2015-09-03 | パナソニックIpマネジメント株式会社 | 発光素子および発光装置 |
| WO2015128909A1 (ja) | 2014-02-28 | 2015-09-03 | パナソニックIpマネジメント株式会社 | 発光素子および発光装置 |
| US9518215B2 (en) | 2014-02-28 | 2016-12-13 | Panasonic Intellectual Property Management Co., Ltd. | Light-emitting device and light-emitting apparatus |
| JP2016034017A (ja) | 2014-02-28 | 2016-03-10 | パナソニックIpマネジメント株式会社 | 発光装置 |
| US10763491B2 (en) | 2014-04-01 | 2020-09-01 | The Research Foundation For The State University Of New York | Low-temperature synthesis process of making MgzMxOy, where M is Mn, V or Fe, for manufacture of electrode materials for group II cation-based batteries |
| JP6323177B2 (ja) * | 2014-05-30 | 2018-05-16 | 日亜化学工業株式会社 | 半導体発光装置 |
| TWI675904B (zh) * | 2014-08-04 | 2019-11-01 | 法商羅地亞經營管理公司 | 改質之磷光體及其組成物 |
| KR102318228B1 (ko) * | 2014-11-11 | 2021-10-28 | 엘지이노텍 주식회사 | 조명 장치 |
| JP6354607B2 (ja) * | 2015-01-23 | 2018-07-11 | 日亜化学工業株式会社 | 発光装置 |
| US10131836B2 (en) | 2015-01-31 | 2018-11-20 | Lg Chem, Ltd. | Color conversion film and back light unit and display apparatus comprising the same |
| CN104830333B (zh) * | 2015-03-06 | 2017-01-25 | 江苏师范大学 | 一种Li、Mg共掺的双钙钛矿红色荧光粉及其制备方法 |
| US10031276B2 (en) | 2015-03-13 | 2018-07-24 | Panasonic Intellectual Property Management Co., Ltd. | Display apparatus including photoluminescent layer |
| JP2016171228A (ja) | 2015-03-13 | 2016-09-23 | パナソニックIpマネジメント株式会社 | 発光素子、発光装置および検知装置 |
| US10182702B2 (en) | 2015-03-13 | 2019-01-22 | Panasonic Intellectual Property Management Co., Ltd. | Light-emitting apparatus including photoluminescent layer |
| JP6569856B2 (ja) | 2015-03-13 | 2019-09-04 | パナソニックIpマネジメント株式会社 | 発光装置および内視鏡 |
| JP2017003697A (ja) | 2015-06-08 | 2017-01-05 | パナソニックIpマネジメント株式会社 | 発光素子および発光装置 |
| JP2017005054A (ja) | 2015-06-08 | 2017-01-05 | パナソニックIpマネジメント株式会社 | 発光装置 |
| CN107735480A (zh) * | 2015-07-07 | 2018-02-23 | 大电株式会社 | 蓝绿色发光荧光体、发光元件、发光装置以及白色光发光装置 |
| JP6748905B2 (ja) | 2015-08-20 | 2020-09-02 | パナソニックIpマネジメント株式会社 | 発光装置 |
| US10359155B2 (en) | 2015-08-20 | 2019-07-23 | Panasonic Intellectual Property Management Co., Ltd. | Light-emitting apparatus |
| JP2017040818A (ja) | 2015-08-20 | 2017-02-23 | パナソニックIpマネジメント株式会社 | 発光素子 |
| JP6380653B2 (ja) * | 2016-02-19 | 2018-08-29 | 東レ株式会社 | 色変換シート、それを含む光源ユニット、ディスプレイおよび照明装置 |
| JP6447557B2 (ja) | 2016-03-24 | 2019-01-09 | 日亜化学工業株式会社 | 発光装置の製造方法 |
| JP6719094B2 (ja) | 2016-03-30 | 2020-07-08 | パナソニックIpマネジメント株式会社 | 発光素子 |
| US10590341B2 (en) * | 2016-04-25 | 2020-03-17 | Ngk Spark Plug Co., Ltd. | Wavelength conversion member, production method therefor, and light emitting device |
| CN106085429A (zh) * | 2016-07-11 | 2016-11-09 | 河北大学 | 一系列颜色可调的宽谱led荧光粉及其制备方法 |
| JP6741614B2 (ja) * | 2017-03-16 | 2020-08-19 | Jfeミネラル株式会社 | 希土類付活アルカリ土類ケイ酸塩化合物残光性蛍光体 |
| KR102343843B1 (ko) * | 2017-03-31 | 2021-12-24 | 도레이첨단소재 주식회사 | 고색재현 복합필름 및 이를 포함하는 백라이트 유닛 |
| KR102373817B1 (ko) | 2017-05-02 | 2022-03-14 | 삼성전자주식회사 | 백색 발광장치 및 조명 장치 |
| CN110612466B (zh) * | 2017-06-02 | 2021-10-01 | 东丽株式会社 | 颜色转换片、包含其的光源单元、显示器及照明装置 |
| JP7248379B2 (ja) * | 2017-07-24 | 2023-03-29 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
| WO2019064589A1 (ja) * | 2017-09-29 | 2019-04-04 | 日立化成株式会社 | 波長変換部材、バックライトユニット、画像表示装置、波長変換用樹脂組成物及び波長変換用樹脂硬化物 |
| KR102620016B1 (ko) * | 2017-10-10 | 2024-01-03 | 덴카 주식회사 | 적색 형광체 및 발광 장치 |
| JP2019087691A (ja) * | 2017-11-09 | 2019-06-06 | シャープ株式会社 | 発光装置及び画像表示装置 |
| EP3492554B1 (en) * | 2017-11-30 | 2020-08-19 | Nichia Corporation | Light emitting device, illumination device and plant cultivation method |
| JP6940778B2 (ja) * | 2019-02-27 | 2021-09-29 | 日亜化学工業株式会社 | 窒化物蛍光体の製造方法 |
| KR102859701B1 (ko) | 2019-06-28 | 2025-09-15 | 덴카 주식회사 | 형광체 플레이트 및 그것을 사용한 발광 장치 |
| KR102645584B1 (ko) * | 2021-12-16 | 2024-03-12 | 신라대학교 산학협력단 | 푸른색 여기에 의한 초록-노란빛으로 발광하는 오소저머네이트류 인광체 및 이의 제조 방법 |
| CN114621765B (zh) * | 2022-03-31 | 2023-11-14 | 陕西师范大学 | 一种Ce3+掺杂氮氧化物单基质白光荧光粉 |
| DE102022125141A1 (de) * | 2022-09-29 | 2024-04-04 | Schott Ag | Beleuchtungseinrichtung mit optimierter Farbskala |
| WO2024136621A1 (ko) * | 2022-12-23 | 2024-06-27 | 한양대학교 산학협력단 | 페로브스카이트 유사 구조를 가지며 우수한 발광 효율을 나타내는 청색 발광 물질, 및 이의 제조 방법 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004111156A1 (en) | 2003-05-17 | 2004-12-23 | Phosphortech Corporation | Light emitting devices having silicate fluorescent phosphors |
| US20050200271A1 (en) * | 2002-03-25 | 2005-09-15 | Koninklijke Philips Electronics N.V. | Tri-color white light led lamp |
Family Cites Families (48)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3544482A (en) * | 1968-03-15 | 1970-12-01 | Sylvania Electric Prod | Europium and manganese activated alkaline earth silicate phosphors |
| JP2841377B2 (ja) | 1988-08-25 | 1998-12-24 | 住友化学工業株式会社 | 位相差板 |
| JPH07119410B2 (ja) | 1989-02-09 | 1995-12-20 | 日亜化学工業株式会社 | 極小球形の二酸化ケイ素を付着した蛍光体の製造方法 |
| JPH07119411B2 (ja) | 1989-03-08 | 1995-12-20 | 日亜化学工業株式会社 | 球形の二酸化ケイ素を付着した蛍光体の製造方法 |
| JP2884702B2 (ja) | 1989-12-26 | 1999-04-19 | 化成オプトニクス株式会社 | 螢光体及びその製造方法 |
| JP3094113B2 (ja) | 1990-05-25 | 2000-10-03 | 住友化学工業株式会社 | 位相差板およびその製造方法 |
| JPH06314593A (ja) | 1993-03-05 | 1994-11-08 | Japan Synthetic Rubber Co Ltd | エレクトロルミネッセンス素子 |
| JP3168850B2 (ja) | 1993-12-22 | 2001-05-21 | 住友化学工業株式会社 | 位相差フィルムの製造方法 |
| JPH08315820A (ja) * | 1995-05-11 | 1996-11-29 | Petoca:Kk | 二次電池負極材用炭素繊維及びその製造方法 |
| CN1065897C (zh) * | 1996-09-04 | 2001-05-16 | 北京电力电子新技术研究开发中心 | 一种翡翠绿色稀土荧光粉及其配制方法 |
| US6278135B1 (en) * | 1998-02-06 | 2001-08-21 | General Electric Company | Green-light emitting phosphors and light sources using the same |
| US6294800B1 (en) * | 1998-02-06 | 2001-09-25 | General Electric Company | Phosphors for white light generation from UV emitting diodes |
| US6099754A (en) * | 1998-03-31 | 2000-08-08 | Sarnoff Corporation | Long persistence red phosphors |
| US6071432A (en) * | 1998-03-31 | 2000-06-06 | Sarnoff Corporation | Long persistence red phosphors |
| US6429583B1 (en) * | 1998-11-30 | 2002-08-06 | General Electric Company | Light emitting device with ba2mgsi2o7:eu2+, ba2sio4:eu2+, or (srxcay ba1-x-y)(a1zga1-z)2sr:eu2+phosphors |
| US6621211B1 (en) * | 2000-05-15 | 2003-09-16 | General Electric Company | White light emitting phosphor blends for LED devices |
| US6466135B1 (en) * | 2000-05-15 | 2002-10-15 | General Electric Company | Phosphors for down converting ultraviolet light of LEDs to blue-green light |
| JP2002169025A (ja) | 2000-07-21 | 2002-06-14 | Sumitomo Chem Co Ltd | 異方性散乱フィルムおよびそれを用いた液晶表示装置 |
| DE10036940A1 (de) * | 2000-07-28 | 2002-02-07 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Lumineszenz-Konversions-LED |
| TWI228535B (en) * | 2000-09-29 | 2005-03-01 | Sumitomo Chemical Co | Fluorescent substances for vacuum ultraviolet radiation excited light-emitting devices |
| DE10051242A1 (de) | 2000-10-17 | 2002-04-25 | Philips Corp Intellectual Pty | Lichtemittierende Vorrichtung mit beschichtetem Leuchtstoff |
| AT410266B (de) * | 2000-12-28 | 2003-03-25 | Tridonic Optoelectronics Gmbh | Lichtquelle mit einem lichtemittierenden element |
| JP2003029030A (ja) | 2001-07-12 | 2003-01-29 | Sumitomo Chem Co Ltd | 異方性散乱フィルムおよびそれを用いた液晶表示装置 |
| WO2003021691A1 (en) * | 2001-09-03 | 2003-03-13 | Matsushita Electric Industrial Co., Ltd. | Semiconductor light emitting device, light emitting apparatus and production method for semiconductor light emitting device |
| KR100894372B1 (ko) * | 2001-10-01 | 2009-04-22 | 파나소닉 주식회사 | 반도체 발광소자와 이를 이용한 발광장치 |
| TWI285672B (en) * | 2001-12-19 | 2007-08-21 | Sumitomo Chemical Co | Method for producing silicate phosphor |
| CN101420004B (zh) * | 2002-02-15 | 2012-07-04 | 三菱化学株式会社 | 光发射器件及使用其的照明器 |
| JP2004115633A (ja) * | 2002-09-25 | 2004-04-15 | Matsushita Electric Ind Co Ltd | 珪酸塩蛍光体およびそれを用いた発光装置 |
| JP4725008B2 (ja) | 2003-09-11 | 2011-07-13 | 日亜化学工業株式会社 | 発光装置、発光素子用蛍光体および発光素子用蛍光体の製造方法 |
| JP2004300247A (ja) | 2003-03-31 | 2004-10-28 | Mitsubishi Chemicals Corp | 蛍光体及びそれを用いた発光装置、並びに照明装置 |
| US7026755B2 (en) * | 2003-08-07 | 2006-04-11 | General Electric Company | Deep red phosphor for general illumination applications |
| JP4337468B2 (ja) * | 2003-08-13 | 2009-09-30 | 三菱化学株式会社 | 発光装置及び照明装置ならびに画像表示装置 |
| JP4617890B2 (ja) * | 2004-01-16 | 2011-01-26 | 三菱化学株式会社 | 蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置 |
| US7608200B2 (en) * | 2004-01-16 | 2009-10-27 | Mitsubishi Chemical Corporation | Phosphor and including the same, light emitting apparatus, illuminating apparatus and image display |
| JP4617889B2 (ja) * | 2004-01-16 | 2011-01-26 | 三菱化学株式会社 | 蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置 |
| US7573072B2 (en) * | 2004-03-10 | 2009-08-11 | Lumination Llc | Phosphor and blends thereof for use in LEDs |
| EP2113549B1 (en) * | 2004-04-27 | 2011-12-28 | Panasonic Corporation | Phosphor composition and light-emitting device using the same |
| JP2005336450A (ja) * | 2004-04-27 | 2005-12-08 | Matsushita Electric Ind Co Ltd | 蛍光体組成物とその製造方法、並びにその蛍光体組成物を用いた発光装置 |
| JP4904471B2 (ja) | 2004-07-07 | 2012-03-28 | 東日本旅客鉄道株式会社 | 経路誘導システム |
| JP4619157B2 (ja) | 2004-07-08 | 2011-01-26 | 日東電工株式会社 | 衝撃試験装置及び衝撃試験方法 |
| JP4150362B2 (ja) | 2004-07-21 | 2008-09-17 | 松下電器産業株式会社 | ランプ用蛍光体の製造方法 |
| JP2006034393A (ja) | 2004-07-23 | 2006-02-09 | Konica Minolta Medical & Graphic Inc | 医用画像記録装置 |
| US20060027785A1 (en) * | 2004-08-04 | 2006-02-09 | Intematix Corporation | Novel silicate-based yellow-green phosphors |
| US7311858B2 (en) * | 2004-08-04 | 2007-12-25 | Intematix Corporation | Silicate-based yellow-green phosphors |
| JP4836429B2 (ja) * | 2004-10-18 | 2011-12-14 | 株式会社東芝 | 蛍光体およびこれを用いた発光装置 |
| JP4669698B2 (ja) | 2004-12-24 | 2011-04-13 | 信越化学工業株式会社 | レジスト材料及びパターン形成方法 |
| JP2006243165A (ja) | 2005-03-01 | 2006-09-14 | Ricoh Co Ltd | 現像装置、及び画像形成装置 |
| JP4631583B2 (ja) | 2005-07-29 | 2011-02-16 | 東レ株式会社 | ラミネート用積層ポリエステルフィルムおよびポリエステル樹脂ラミネート金属板 |
-
2007
- 2007-02-09 KR KR1020087021668A patent/KR101184957B1/ko not_active Expired - Fee Related
- 2007-02-09 WO PCT/JP2007/052405 patent/WO2007091687A1/ja not_active Ceased
- 2007-02-09 JP JP2007030442A patent/JP5315616B2/ja not_active Expired - Fee Related
- 2007-02-09 US US12/278,790 patent/US20100164365A1/en not_active Abandoned
- 2007-02-09 TW TW096105577A patent/TWI435927B/zh not_active IP Right Cessation
- 2007-02-09 CN CN200780004816XA patent/CN101379164B/zh not_active Expired - Fee Related
- 2007-02-09 EP EP07714017A patent/EP1995294A4/en not_active Withdrawn
-
2008
- 2008-01-31 JP JP2008021183A patent/JP2008156656A/ja active Pending
- 2008-12-26 JP JP2008334914A patent/JP4283336B2/ja not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050200271A1 (en) * | 2002-03-25 | 2005-09-15 | Koninklijke Philips Electronics N.V. | Tri-color white light led lamp |
| WO2004111156A1 (en) | 2003-05-17 | 2004-12-23 | Phosphortech Corporation | Light emitting devices having silicate fluorescent phosphors |
Non-Patent Citations (1)
| Title |
|---|
| 논문 Journal of Alloys and Compounds 402 (2005) 246-250* |
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| US20100164365A1 (en) | 2010-07-01 |
| EP1995294A1 (en) | 2008-11-26 |
| EP1995294A4 (en) | 2012-06-06 |
| JP5315616B2 (ja) | 2013-10-16 |
| WO2007091687A1 (ja) | 2007-08-16 |
| KR20080091295A (ko) | 2008-10-09 |
| JP4283336B2 (ja) | 2009-06-24 |
| JP2008088399A (ja) | 2008-04-17 |
| JP2008156656A (ja) | 2008-07-10 |
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