JP5840540B2 - 白色照明装置 - Google Patents
白色照明装置 Download PDFInfo
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- JP5840540B2 JP5840540B2 JP2012058152A JP2012058152A JP5840540B2 JP 5840540 B2 JP5840540 B2 JP 5840540B2 JP 2012058152 A JP2012058152 A JP 2012058152A JP 2012058152 A JP2012058152 A JP 2012058152A JP 5840540 B2 JP5840540 B2 JP 5840540B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
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- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/61—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing fluorine, chlorine, bromine, iodine or unspecified halogen elements
- C09K11/615—Halogenides
- C09K11/616—Halogenides with alkali or alkaline earth metals
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77342—Silicates
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
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- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77348—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
- C09K11/7774—Aluminates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
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Description
Aa(M1−s,Mns)Fb・・・(1)
(ここで、Aは、K(カリウム)及びCs(セシウム)であり、MはSi(シリコン)、チタン(Ti)から選ばれる少なくとも1種の元素であり、a、bおよびsは、1.7≦a≦2.1、5.3≦b≦6.3、0<s≦0.05を満たす数値である。)
(Y1−u−v,Gdu, Cev)c(Al1−w,Gaw)5Od・・・(2)
(ここで、c、d、u、vおよびwは、2.8≦c≦3.2、11.5≦d≦12.5、0≦u≦0.2、0.02≦v≦0.15、0≦w≦0.3を満たす数値であり、且つ、Gd又はGaのいずれか一方を含有する。)
625nm≦λp≦635nm、15nm≦EWW≦45nm、40%≦η≦75%の特性を備え、上記緑・黄色蛍光体が、
545nm≦λp≦565nm、90nm≦FWHM≦125nm、70%≦η≦90%の特性を備える。
Aa(M1−s,Mns)Fb・・・(1)
ここで、Aは、K(カリウム)、Cs(セシウム)から選ばれる少なくとも1種の元素であり、MはSi(シリコン)、チタン(Ti)から選ばれる少なくとも1種の元素であり、a、bおよびsは、1.7≦a≦2.1、5.3≦b≦6.3、0<s≦0.05を満たす数値である。
M+AMnO4+HF→A2MF6:Mn+MnO2+H2O+O2
MO2+AMnO4+HF→A2MF6:Mn+MnO2+H2O+O2
(Y1−u−v,Gdu, Cev)c(Al1−w,Gaw)5Od・・・(2)
ここで、c、d、u、vおよびwは、2.8≦c≦3.2、11.5≦d≦12.5、 0≦u≦0.2、0.02≦v≦0.15、0≦w≦0.3を満たす数値である。
ここで、e、f、x、yおよびzは、1.9≦e≦2.1、3.6≦f≦4.1、0.15≦x≦0.4、0≦y≦0.1、0<z≦0.15を満たす数値である。
また、CASN蛍光体やSCASN蛍光体の励起スペクトルは発光スペクトルのすそ付近まで広がっている。そのために、青色の励起光を吸収し、発光した緑・黄色蛍光体の発光をCASN蛍光体やSCASN蛍光体が再度吸収し、発光する、再吸収現象を避けることができず、この再吸収現象によっても白色照明装置の発光効率は低下してしまう。
128 蛍光体層
Claims (4)
- 430nm以上460nm以下の波長領域にピーク波長を有する発光素子と、
前記発光素子上に形成され、赤色蛍光体と緑・黄色蛍光体とを含む蛍光体層とを備え、
蛍光体のピーク波長をλp、蛍光体から発せられる光のスペクトルの半値幅をFWHM、蛍光体から発せられる光のスペクトルの有効波長幅をEWW、蛍光体の外部量子効率をηとする場合に、
前記赤色蛍光体が、
625nm≦λp≦635nm、15nm≦EWW≦45nm、40%≦η≦75%の特性を有し、
前記緑・黄色蛍光体が、
545nm≦λp≦565nm、90nm≦FWHM≦125nm、70%≦η≦90%の特性を有し、
前記赤色蛍光体は、下記一般式(1)で表される組成を備え、前記緑・黄色蛍光体は、下記一般式(2)で表わされる組成を備えることを特徴とする白色照明装置。
Aa(M1−s,Mns)Fb・・・(1)
(ここで、Aは、K(カリウム)及びCs(セシウム)であり、MはSi(シリコン)、チタン(Ti)から選ばれる少なくとも1種の元素であり、a、bおよびsは、1.7≦a≦2.1、5.3≦b≦6.3、0<s≦0.05を満たす数値である。)
(Y1−u−v,Gdu, Cev)c(Al1−w,Gaw)5Od・・・(2)
(ここで、c、d、u、vおよびwは、2.8≦c≦3.2、11.5≦d≦12.5、0≦u≦0.2、0.02≦v≦0.15、0≦w≦0.3を満たす数値であり、且つ、Gd又はGaのいずれか一方を含有する。) - 前記緑・黄色蛍光体が、90nm≦FWHM≦110nm、かつ、75%≦ηの特性を有することを特徴とする請求項1記載の白色照明装置。
- 前記赤色蛍光体の内部量子効率η’が60%以上であることを特徴とする請求項1又は請求項2記載の白色照明装置。
- 前記緑色・黄色蛍光体の内部量子効率η’が85%以上であることを特徴とする請求項1ないし請求項3いずれか一項記載の白色照明装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012058152A JP5840540B2 (ja) | 2012-03-15 | 2012-03-15 | 白色照明装置 |
US13/644,440 US8907558B2 (en) | 2012-03-15 | 2012-10-04 | White light emitting device with red and green-yellow phosphor |
EP17156452.9A EP3188262B1 (en) | 2012-03-15 | 2013-03-08 | White light emitting device |
EP13760389.0A EP2827392B1 (en) | 2012-03-15 | 2013-03-08 | White light emitting device |
PCT/JP2013/056479 WO2013137144A1 (ja) | 2012-03-15 | 2013-03-08 | 白色照明装置 |
CN201380006901.5A CN104094425B (zh) | 2012-03-15 | 2013-03-08 | 白色照明装置 |
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JP2012058152A JP5840540B2 (ja) | 2012-03-15 | 2012-03-15 | 白色照明装置 |
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JP2013189588A JP2013189588A (ja) | 2013-09-26 |
JP5840540B2 true JP5840540B2 (ja) | 2016-01-06 |
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US (1) | US8907558B2 (ja) |
EP (2) | EP3188262B1 (ja) |
JP (1) | JP5840540B2 (ja) |
CN (1) | CN104094425B (ja) |
WO (1) | WO2013137144A1 (ja) |
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Also Published As
Publication number | Publication date |
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US8907558B2 (en) | 2014-12-09 |
EP2827392B1 (en) | 2017-08-02 |
JP2013189588A (ja) | 2013-09-26 |
WO2013137144A1 (ja) | 2013-09-19 |
CN104094425A (zh) | 2014-10-08 |
EP2827392A4 (en) | 2015-10-21 |
EP3188262A1 (en) | 2017-07-05 |
EP2827392A1 (en) | 2015-01-21 |
US20130241396A1 (en) | 2013-09-19 |
CN104094425B (zh) | 2017-03-01 |
EP3188262B1 (en) | 2018-12-12 |
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