JP5315616B2 - 発光装置、バックライト用白色発光体、及び画像表示装置 - Google Patents

発光装置、バックライト用白色発光体、及び画像表示装置 Download PDF

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JP5315616B2
JP5315616B2 JP2007030442A JP2007030442A JP5315616B2 JP 5315616 B2 JP5315616 B2 JP 5315616B2 JP 2007030442 A JP2007030442 A JP 2007030442A JP 2007030442 A JP2007030442 A JP 2007030442A JP 5315616 B2 JP5315616 B2 JP 5315616B2
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phosphor
light
emitting device
phosphors
emission
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JP2008088399A (ja
JP2008088399A5 (enExample
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正彦 吉野
千里 三浦
直人 木島
直之 小室
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Mitsubishi Chemical Corp
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Mitsubishi Chemical Corp
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    • C—CHEMISTRY; METALLURGY
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    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/7734—Aluminates
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
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    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
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    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
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    • C09K11/77348—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
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    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
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    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • H10H20/80—Constructional details
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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
  • Vessels And Coating Films For Discharge Lamps (AREA)
JP2007030442A 2006-02-10 2007-02-09 発光装置、バックライト用白色発光体、及び画像表示装置 Expired - Fee Related JP5315616B2 (ja)

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JP2007030442A JP5315616B2 (ja) 2006-02-10 2007-02-09 発光装置、バックライト用白色発光体、及び画像表示装置

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JP2006034393 2006-02-10
JP2006034393 2006-02-10
JP2006243165 2006-09-07
JP2006243165 2006-09-07
JP2007030442A JP5315616B2 (ja) 2006-02-10 2007-02-09 発光装置、バックライト用白色発光体、及び画像表示装置

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JP2008021183A Division JP2008156656A (ja) 2006-02-10 2008-01-31 蛍光体及びその製造方法、蛍光体含有組成物、発光装置、並びに画像表示装置及び照明装置
JP2008334914A Division JP4283336B2 (ja) 2006-02-10 2008-12-26 蛍光体及びその製造方法、蛍光体含有組成物、発光装置、並びに画像表示装置及び照明装置

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JP2008088399A JP2008088399A (ja) 2008-04-17
JP2008088399A5 JP2008088399A5 (enExample) 2008-07-24
JP5315616B2 true JP5315616B2 (ja) 2013-10-16

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JP2008021183A Pending JP2008156656A (ja) 2006-02-10 2008-01-31 蛍光体及びその製造方法、蛍光体含有組成物、発光装置、並びに画像表示装置及び照明装置
JP2008334914A Expired - Fee Related JP4283336B2 (ja) 2006-02-10 2008-12-26 蛍光体及びその製造方法、蛍光体含有組成物、発光装置、並びに画像表示装置及び照明装置

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JP2008334914A Expired - Fee Related JP4283336B2 (ja) 2006-02-10 2008-12-26 蛍光体及びその製造方法、蛍光体含有組成物、発光装置、並びに画像表示装置及び照明装置

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US (1) US20100164365A1 (enExample)
EP (1) EP1995294A4 (enExample)
JP (3) JP5315616B2 (enExample)
KR (1) KR101184957B1 (enExample)
CN (1) CN101379164B (enExample)
TW (1) TWI435927B (enExample)
WO (1) WO2007091687A1 (enExample)

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US10312419B2 (en) 2017-05-02 2019-06-04 Samsung Electronics Co., Ltd. White light emitting devices

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WO2008133077A1 (ja) * 2007-04-18 2008-11-06 Mitsubishi Chemical Corporation 無機化合物の製造方法、蛍光体、蛍光体含有組成物、発光装置、照明装置及び画像表示装置
JP5578597B2 (ja) 2007-09-03 2014-08-27 独立行政法人物質・材料研究機構 蛍光体及びその製造方法、並びにそれを用いた発光装置
JP2009064842A (ja) * 2007-09-04 2009-03-26 Sumitomo Metal Electronics Devices Inc セラミックス焼結体およびそれを用いた基板およびそれを用いた発光素子搭載用パッケージおよびそれを用いた発光装置
JP5374855B2 (ja) * 2007-10-19 2013-12-25 三菱化学株式会社 蛍光体含有組成物の製造方法
JP5374857B2 (ja) * 2007-10-23 2013-12-25 三菱化学株式会社 蛍光体含有組成物の製造方法、及び半導体発光デバイスの製造方法
JP5228441B2 (ja) * 2007-10-29 2013-07-03 三菱化学株式会社 集積型発光源およびその製造方法
JP2009111099A (ja) * 2007-10-29 2009-05-21 Mitsubishi Chemicals Corp 集積型発光源およびその製造方法
JP2009111100A (ja) * 2007-10-29 2009-05-21 Mitsubishi Chemicals Corp 集積型発光源およびその製造方法
JP5228442B2 (ja) * 2007-10-29 2013-07-03 三菱化学株式会社 集積型発光源およびその製造方法
JP2009161576A (ja) * 2007-12-28 2009-07-23 Mitsubishi Chemicals Corp 蛍光体及びそれを用いた発光装置
US20110116520A1 (en) * 2008-07-07 2011-05-19 Koninklijke Philips Electronics N.V. Eye-safe laser-based lighting
KR20110050552A (ko) * 2008-09-04 2011-05-13 바이엘 머티리얼사이언스 아게 발광 소자 및 그의 제조 방법
KR101519985B1 (ko) * 2008-09-11 2015-05-15 삼성디스플레이 주식회사 광원 모듈 및 이를 갖는 표시장치
EP2163593A1 (en) * 2008-09-15 2010-03-17 Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. Production of nitride-based phosphors
JP5641384B2 (ja) 2008-11-28 2014-12-17 独立行政法人物質・材料研究機構 表示装置用照明装置及び表示装置
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WO2010114061A1 (ja) * 2009-03-31 2010-10-07 三菱化学株式会社 蛍光体、蛍光体の製造方法、蛍光体含有組成物、発光装置、照明装置及び画像表示装置
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