JP2010532792A - オプトエレクトロニクスデバイス用の組成物、層、及びフィルム、並びにこれらの使用 - Google Patents

オプトエレクトロニクスデバイス用の組成物、層、及びフィルム、並びにこれらの使用 Download PDF

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JP2010532792A
JP2010532792A JP2010503141A JP2010503141A JP2010532792A JP 2010532792 A JP2010532792 A JP 2010532792A JP 2010503141 A JP2010503141 A JP 2010503141A JP 2010503141 A JP2010503141 A JP 2010503141A JP 2010532792 A JP2010532792 A JP 2010532792A
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Prior art keywords
optoelectronic device
transistor
composition
film
silicon
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Ceased
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JP2010503141A
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English (en)
Japanese (ja)
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JP2010532792A5 (enExample
Inventor
クリシュナムアシー，アヒラ
ケネディ，ジョセフ
スピアー，リチャード
イエロワガ，デボラ
スミス，ピーター
パルマー，ベン
カツァネス，ロナルド
タッカー，マイケル
ゲブレブラン，アマヌエル
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Honeywell International Inc
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Honeywell International Inc
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Priority claimed from US11/784,966 external-priority patent/US20080157065A1/en
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Publication of JP2010532792A publication Critical patent/JP2010532792A/ja
Publication of JP2010532792A5 publication Critical patent/JP2010532792A5/ja
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
    • H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
    • H01L21/02137—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC the material comprising alkyl silsesquioxane, e.g. MSQ
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
    • H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02203—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being porous
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
    • H01L21/02208—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
    • H01L21/02214—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen
    • H01L21/02216—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Electroluminescent Light Sources (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Thin Film Transistor (AREA)
  • Liquid Crystal (AREA)
  • Formation Of Insulating Films (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Silicon Polymers (AREA)
JP2010503141A 2007-04-10 2008-04-08 オプトエレクトロニクスデバイス用の組成物、層、及びフィルム、並びにこれらの使用 Ceased JP2010532792A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/784,966 US20080157065A1 (en) 2004-08-03 2007-04-10 Compositions, layers and films for optoelectronic devices, methods of production and uses thereof
US12/027,113 US8901268B2 (en) 2004-08-03 2008-02-06 Compositions, layers and films for optoelectronic devices, methods of production and uses thereof
PCT/US2008/059612 WO2008124711A1 (en) 2007-04-10 2008-04-08 Compositions, layers and films for optoelectronic devices, methods of production and uses thereof

Related Child Applications (1)

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JP2014136560A Division JP6322068B2 (ja) 2007-04-10 2014-07-02 オプトエレクトロニクスデバイス用の組成物、層、及びフィルム、並びにこれらの使用

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Publication Number Publication Date
JP2010532792A true JP2010532792A (ja) 2010-10-14
JP2010532792A5 JP2010532792A5 (enExample) 2011-05-19

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JP2010503141A Ceased JP2010532792A (ja) 2007-04-10 2008-04-08 オプトエレクトロニクスデバイス用の組成物、層、及びフィルム、並びにこれらの使用
JP2014136560A Active JP6322068B2 (ja) 2007-04-10 2014-07-02 オプトエレクトロニクスデバイス用の組成物、層、及びフィルム、並びにこれらの使用
JP2016234396A Pending JP2017110193A (ja) 2007-04-10 2016-12-01 オプトエレクトロニクスデバイス用の組成物、層、及びフィルム、並びにこれらの使用

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JP2016234396A Pending JP2017110193A (ja) 2007-04-10 2016-12-01 オプトエレクトロニクスデバイス用の組成物、層、及びフィルム、並びにこれらの使用

Country Status (5)

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US (1) US8901268B2 (enExample)
JP (3) JP2010532792A (enExample)
KR (2) KR101494614B1 (enExample)
TW (2) TWI588211B (enExample)
WO (1) WO2008124711A1 (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009302087A (ja) * 2008-06-10 2009-12-24 Tokyo Ohka Kogyo Co Ltd Ｔｆｔ平坦化膜形成用組成物及び表示装置
JP2014208838A (ja) * 2007-04-10 2014-11-06 ハネウェル・インターナショナル・インコーポレーテッド オプトエレクトロニクスデバイス用の組成物、層、及びフィルム、並びにこれらの使用
JP2015012194A (ja) * 2013-06-28 2015-01-19 日亜化学工業株式会社 発光装置
US9728685B2 (en) 2013-02-28 2017-08-08 Nichia Corporation Light emitting device and lighting device including same
JP2017198939A (ja) * 2016-04-28 2017-11-02 エルジー ディスプレイ カンパニー リミテッド 電気光学パネル
JP2018516998A (ja) * 2015-04-13 2018-06-28 ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． オプトエレクトロニクス用途のためのポリシロキサン製剤及びコーティング
JP2020507917A (ja) * 2017-01-20 2020-03-12 ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． 間隙充填誘電材料
JPWO2020166692A1 (ja) * 2019-02-14 2021-12-23 ダウ・東レ株式会社 オルガノポリシロキサン硬化物フィルム、その用途、製造方法および製造装置

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* Cited by examiner, † Cited by third party
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TWI400534B (zh) * 2009-07-15 2013-07-01 Chunghwa Picture Tubes Ltd 薄膜電晶體光感測器以及製作氟矽氧碳氫化合物介電層之方法
JP5423706B2 (ja) * 2010-03-15 2014-02-19 三菱化学株式会社 有機電界発光素子の製造方法、有機電界発光素子、有機ｅｌ照明、及び有機ｅｌ表示装置
KR101592297B1 (ko) * 2011-09-30 2016-02-05 후지필름 가부시키가이샤 경화성 수지 조성물, 광학 부재 세트, 그 제조 방법, 이것을 사용한 고체 촬상 소자
US20130236681A1 (en) * 2012-03-06 2013-09-12 Chang Min Lee Photocurable composition, barrier layer including the same, and encapsulated apparatus including the same
TWI477874B (zh) 2012-03-28 2015-03-21 E Ink Holdings Inc 顯示裝置及其製作方法
WO2014014542A2 (en) 2012-04-27 2014-01-23 Burning Bush Group High performance silicon based coating compositions
US10138381B2 (en) 2012-05-10 2018-11-27 Burning Bush Group, Llc High performance silicon based thermal coating compositions
US9991463B2 (en) * 2012-06-14 2018-06-05 Universal Display Corporation Electronic devices with improved shelf lives
JP6158921B2 (ja) 2012-07-03 2017-07-05 バーニング ブッシュ グループ、 エルエルシー 高性能ケイ素系コーティング組成物
JP2014086286A (ja) * 2012-10-24 2014-05-12 Samsung Display Co Ltd 発光素子及びそれを備える表示装置
KR101947166B1 (ko) * 2012-11-19 2019-02-13 삼성디스플레이 주식회사 기판 및 상기 기판을 포함하는 표시장치
WO2015009509A1 (en) 2013-07-14 2015-01-22 Cardiac Pacemakers, Inc. Multi-electrode lead with backing for mecho/baroreceptor stimulation
KR102267780B1 (ko) 2013-08-12 2021-06-23 쓰리엠 이노베이티브 프로퍼티즈 컴파니 광 추출 필름을 갖는 방사 용품
KR102092706B1 (ko) * 2013-09-02 2020-04-16 삼성디스플레이 주식회사 조성물, 상기 조성물을 포함하는 유기 발광 표시 장치 및 상기 유기 발광 표시 장치의 제조 방법
US9006355B1 (en) 2013-10-04 2015-04-14 Burning Bush Group, Llc High performance silicon-based compositions
US9839785B2 (en) 2013-12-13 2017-12-12 Cardiac Pacemakers, Inc. Surgical instrument for implanting leads for baroreceptor stimulation therapy
US10029091B2 (en) 2014-02-20 2018-07-24 Cardiac Pacemakers, Inc. Apparatus for baroreceptor stimulation therapy
JP6357835B2 (ja) * 2014-03-31 2018-07-18 ソニー株式会社 発光素子、光源装置およびプロジェクタ
CN106463480B (zh) * 2014-05-12 2019-03-15 环球展览公司 屏障组合物和性质
US20150366467A1 (en) 2014-06-19 2015-12-24 Cardiac Pacemakers, Inc. Baroreceptor mapping system
US10658554B2 (en) 2014-06-19 2020-05-19 Inkron Oy LED lamp with siloxane particle material
US9572975B2 (en) 2014-09-02 2017-02-21 Cardiac Pacemakers, Inc. Paddle leads configured for suture fixation
WO2016044353A1 (en) 2014-09-16 2016-03-24 Cardiac Pacemakers, Inc. Paddle leads having asymmetric electrode configurations
JP6061057B1 (ja) * 2015-06-15 2017-01-18 住友化学株式会社 有機ｅｌ素子の製造方法
KR101993037B1 (ko) * 2015-12-21 2019-09-30 성균관대학교산학협력단 고분자 나노무기입자 복합체 다층 박막 및 이의 제조 방법
TWI674045B (zh) * 2016-01-19 2019-10-01 財團法人工業技術研究院 軟性基板修補結構、其製造方法以及軟性基板的檢測及修補方法
CN106997845B (zh) * 2016-01-19 2022-01-11 财团法人工业技术研究院 柔性衬底修补结构、制造方法及检测修补方法
US20170260419A1 (en) * 2016-03-14 2017-09-14 Honeywell International Inc. Polysiloxane formulations and coatings for optoelectronic applications, methods of production, and uses thereof
WO2017177154A1 (en) * 2016-04-08 2017-10-12 Max Analytical Technologies, Inc. Method for identification and quantification of siloxanes in gaseous stream
EP3626802B1 (en) * 2017-09-14 2024-12-25 Sumitomo Chemical Company, Limited Method for producing liquid composition
US11015082B2 (en) * 2017-12-19 2021-05-25 Honeywell International Inc. Crack-resistant polysiloxane dielectric planarizing compositions, methods and films
US10947412B2 (en) 2017-12-19 2021-03-16 Honeywell International Inc. Crack-resistant silicon-based planarizing compositions, methods and films
CN111383880B (zh) * 2018-12-27 2023-03-31 中微半导体设备(上海)股份有限公司 一种等离子体处理器的安装结构及相应的等离子体处理器
CN111416039A (zh) * 2019-01-07 2020-07-14 纽多维有限公司 制剂和层
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CN114156232B (zh) * 2021-11-30 2025-04-22 中国科学院长春光学精密机械与物理研究所 硅基狭缝结构及其制备方法

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0632342A (ja) * 1992-07-09 1994-02-08 Asahi Breweries Ltd ガラス容器の擦り傷遮蔽剤および擦り傷が遮蔽されたガラス容器
JPH0665347A (ja) * 1992-08-17 1994-03-08 Showa Denko Kk 硬化性樹脂組成物および該組成物から形成された硬化樹脂膜
JPH06329911A (ja) * 1993-05-18 1994-11-29 Showa Denko Kk コーティング用組成物
JPH08319422A (ja) * 1995-05-26 1996-12-03 Kanegafuchi Chem Ind Co Ltd ラダー型ポリシロキサンを主成分とする成形体の作製方法
JP2003113310A (ja) * 2001-10-05 2003-04-18 Kanegafuchi Chem Ind Co Ltd 光学材料用組成物、電子材料用組成物、光学材料、電子材料、発光ダイオード及びその製造方法
JP2004004733A (ja) * 2002-04-15 2004-01-08 Sharp Corp 感放射線性樹脂組成物、パターン状絶縁性被膜の形成方法、アクティブマトリクス基板およびそれを備えた平面表示装置、並びに平面表示装置の製造方法
JP2004359756A (ja) * 2003-06-03 2004-12-24 Wacker Asahikasei Silicone Co Ltd Ｌｅｄ用封止剤組成物
JP2005145795A (ja) * 2003-11-19 2005-06-09 Central Glass Co Ltd 膜状有機無機ハイブリッドガラス状物質及びその製造方法
JP2006178466A (ja) * 2004-12-22 2006-07-06 Rohm & Haas Electronic Materials Llc 光学乾燥フィルム及び乾燥フィルムを有する光学デバイス形成方法
JP2006241407A (ja) * 2005-03-07 2006-09-14 Shin Etsu Chem Co Ltd プライマー組成物及びそれを用いた電気電子部品
JP2007510761A (ja) * 2003-10-07 2007-04-26 ハネウエル・インターナシヨナル・インコーポレーテツド 集積回路用途の被覆およびハードマスク組成物、これらの製造方法および使用
JP2008248239A (ja) * 2007-03-08 2008-10-16 Toray Ind Inc シロキサン樹脂組成物、それを用いた硬化膜および光学デバイス

Family Cites Families (214)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA586038A (en) * 1956-03-26 1959-10-27 General Electric Company Organopolysiloxane resins
US3294737A (en) 1963-12-23 1966-12-27 Gen Electric Organopolysiloxanes
US3547766A (en) 1966-11-25 1970-12-15 Du Pont Laminated article
JPS5125070B2 (enExample) 1972-07-11 1976-07-28
US4107133A (en) 1974-01-14 1978-08-15 Dainippon Ink & Chemicals, Inc. Colored polyethylene molding compositions
GB1604414A (en) * 1977-07-27 1981-12-09 Raychem Ltd Silicone resin
US4302503A (en) 1978-05-17 1981-11-24 Libbey-Owens-Ford Company Architectural spandrel
JPS59109565A (ja) 1982-12-16 1984-06-25 Fujitsu Ltd コ−テイング樹脂溶液およびその製造方法
US4590117A (en) * 1983-03-10 1986-05-20 Toray Industries, Inc. Transparent material having antireflective coating
JPS6078670A (ja) * 1983-10-06 1985-05-04 Toshiba Silicone Co Ltd 透明基体と耐摩耗性保護面との干渉縞防止方法
DE3678652D1 (de) * 1985-03-07 1991-05-16 Hughes Aircraft Co Polysiloxanschutzlack fuer ionen- und elektronenstrahl-lithographie.
JPS6243424A (ja) 1985-08-20 1987-02-25 Shin Etsu Chem Co Ltd シルセスキオキサン乳濁液の製造方法
US4746693A (en) * 1986-12-12 1988-05-24 Rca Corporation Polyalkylsilsesquioxane coating composition
JPS63191868A (ja) * 1987-02-05 1988-08-09 Showa Denko Kk コ−テイング剤
JPS63218948A (ja) 1987-03-06 1988-09-12 Nippon Telegr & Teleph Corp <Ntt> レジスト材料
US4962996A (en) 1987-09-11 1990-10-16 Raychem Corporation Protected fiber optic waveguide
JP2603291B2 (ja) * 1988-04-19 1997-04-23 東芝シリコーン株式会社 第４級アンモニウム基含有シリコーン樹脂微粉末
JPH02103052A (ja) * 1988-10-12 1990-04-16 Showa Denko Kk 微細加工方法
JP2718231B2 (ja) * 1990-01-10 1998-02-25 三菱電機株式会社 高純度末端ヒドロキシフェニルラダーシロキサンプレポリマーの製造方法および高純度末端ヒドロキシフェニルラダーポリシロキサンの製造方法
US5116637A (en) * 1990-06-04 1992-05-26 Dow Corning Corporation Amine catalysts for the low temperature conversion of silica precursors to silica
JP2517785B2 (ja) 1990-08-02 1996-07-24 信越化学工業株式会社 含浸性防水剤組成物
US5082758A (en) * 1990-08-31 1992-01-21 Xerox Corporation Toner and developer compositions with charge enhancing additives
US5152834A (en) 1990-09-14 1992-10-06 Ncr Corporation Spin-on glass composition
US5100503A (en) 1990-09-14 1992-03-31 Ncr Corporation Silica-based anti-reflective planarizing layer
US5340644A (en) 1990-10-05 1994-08-23 Hercules Incorporated Organosilicon compositions
JP2712817B2 (ja) * 1990-11-15 1998-02-16 信越化学工業株式会社 ポリオルガノシロキサン樹脂の製造方法
JP2991786B2 (ja) 1990-11-22 1999-12-20 三菱電機株式会社 シリコーン樹脂組成物
US5165955A (en) 1991-05-28 1992-11-24 Dow Corning Corporation Method of depositing a coating containing silicon and oxygen
JPH04371651A (ja) * 1991-06-21 1992-12-24 Showa Denko Kk 建築用内外装粗面保護剤及び同剤による保護方法
JPH0570738A (ja) * 1991-09-11 1993-03-23 Kawaken Fine Chem Co Ltd コーテイング組成物
JPH0597478A (ja) * 1991-10-04 1993-04-20 Nippon Sheet Glass Co Ltd 撥水性ガラス物品およびその製造方法
US5227334A (en) 1991-10-31 1993-07-13 Micron Technology, Inc. LPCVD process for depositing titanium nitride (tin) films and silicon substrates produced thereby
US5387480A (en) * 1993-03-08 1995-02-07 Dow Corning Corporation High dielectric constant coatings
US6336859B2 (en) 1993-03-31 2002-01-08 Progressive Games, Inc. Method for progressive jackpot gaming
US5320868A (en) 1993-09-13 1994-06-14 Dow Corning Corporation Method of forming SI-O containing coatings
US5441765A (en) 1993-09-22 1995-08-15 Dow Corning Corporation Method of forming Si-O containing coatings
US5460911A (en) 1994-03-14 1995-10-24 Xerox Corporation Electrophotographic imaging member free of reflection interference
AU3460095A (en) 1994-06-30 1996-01-25 Hitachi Chemical Company, Ltd. Material for forming silica-base coated insulation film, process for producing the material, silica-base insulation film, semiconductor device, and process for producing the device
US5858547A (en) * 1994-07-06 1999-01-12 Alliedsignal, Inc. Novolac polymer planarization films for microelectronic structures
JP3542185B2 (ja) * 1995-02-02 2004-07-14 ダウ コーニング アジア株式会社 シリコーンレジン、これを含む組成物およびその硬化方法
US6607991B1 (en) 1995-05-08 2003-08-19 Electron Vision Corporation Method for curing spin-on dielectric films utilizing electron beam radiation
US5635240A (en) 1995-06-19 1997-06-03 Dow Corning Corporation Electronic coating materials using mixed polymers
JP3824334B2 (ja) * 1995-08-07 2006-09-20 東京応化工業株式会社 シリカ系被膜形成用塗布液及び被膜形成方法
US6117360A (en) 1995-09-11 2000-09-12 Chisso Corporation Liquid crystal composition and liquid crystal display device
US5693701A (en) * 1995-10-26 1997-12-02 Dow Corning Corporation Tamper-proof electronic coatings
JPH09278901A (ja) * 1996-02-16 1997-10-28 Kanegafuchi Chem Ind Co Ltd シルセスキオキサンラダーポリマー予備硬化物及びそれを用いた成形体作製方法
US6040053A (en) * 1996-07-19 2000-03-21 Minnesota Mining And Manufacturing Company Coating composition having anti-reflective and anti-fogging properties
US5767014A (en) 1996-10-28 1998-06-16 International Business Machines Corporation Integrated circuit and process for its manufacture
US6020410A (en) * 1996-10-29 2000-02-01 Alliedsignal Inc. Stable solution of a silsesquioxane or siloxane resin and a silicone solvent
US5922299A (en) 1996-11-26 1999-07-13 Battelle Memorial Institute Mesoporous-silica films, fibers, and powders by evaporation
JPH10161315A (ja) 1996-12-05 1998-06-19 Nippon Steel Chem Co Ltd アルカリ可溶性感光性樹脂組成物
JP3415741B2 (ja) 1997-03-31 2003-06-09 東レ・ダウコーニング・シリコーン株式会社 電気絶縁性薄膜形成用組成物および電気絶縁性薄膜の形成方法
US5776559A (en) 1997-04-11 1998-07-07 Woolford; Esther Electric Christmas tree
US6218497B1 (en) * 1997-04-21 2001-04-17 Alliedsignal Inc. Organohydridosiloxane resins with low organic content
US6143855A (en) * 1997-04-21 2000-11-07 Alliedsignal Inc. Organohydridosiloxane resins with high organic content
US6048804A (en) * 1997-04-29 2000-04-11 Alliedsignal Inc. Process for producing nanoporous silica thin films
US20010024685A1 (en) 1997-06-19 2001-09-27 Boulton Jonathan M. Method for forming a protective coating and substrates coated with the same
US5962067A (en) 1997-09-09 1999-10-05 Lucent Technologies Inc. Method for coating an article with a ladder siloxane polymer and coated article
US6090448A (en) 1997-10-31 2000-07-18 Alliedsignal Inc. Polyol-based precursors for producing nanoporous silica thin films
US6126733A (en) 1997-10-31 2000-10-03 Alliedsignal Inc. Alcohol based precursors for producing nanoporous silica thin films
US5953627A (en) 1997-11-06 1999-09-14 International Business Machines Corporation Process for manufacture of integrated circuit device
US6042994A (en) * 1998-01-20 2000-03-28 Alliedsignal Inc. Nanoporous silica dielectric films modified by electron beam exposure and having low dielectric constant and low water content
US6177199B1 (en) * 1999-01-07 2001-01-23 Alliedsignal Inc. Dielectric films from organohydridosiloxane resins with low organic content
US6218020B1 (en) * 1999-01-07 2001-04-17 Alliedsignal Inc. Dielectric films from organohydridosiloxane resins with high organic content
TWI234787B (en) 1998-05-26 2005-06-21 Tokyo Ohka Kogyo Co Ltd Silica-based coating film on substrate and coating solution therefor
US6022812A (en) * 1998-07-07 2000-02-08 Alliedsignal Inc. Vapor deposition routes to nanoporous silica
US6335296B1 (en) 1998-08-06 2002-01-01 Alliedsignal Inc. Deposition of nanoporous silica films using a closed cup coater
US6037275A (en) * 1998-08-27 2000-03-14 Alliedsignal Inc. Nanoporous silica via combined stream deposition
JP3773664B2 (ja) * 1998-09-11 2006-05-10 三菱電機株式会社 駆動制御装置、モジュール、および、複合モジュール
US6140254A (en) 1998-09-18 2000-10-31 Alliedsignal Inc. Edge bead removal for nanoporous dielectric silica coatings
US6231989B1 (en) * 1998-11-20 2001-05-15 Dow Corning Corporation Method of forming coatings
US6506831B2 (en) * 1998-12-20 2003-01-14 Honeywell International Inc. Novolac polymer planarization films with high temperature stability
US6329017B1 (en) 1998-12-23 2001-12-11 Battelle Memorial Institute Mesoporous silica film from a solution containing a surfactant and methods of making same
US6383466B1 (en) * 1998-12-28 2002-05-07 Battelle Memorial Institute Method of dehydroxylating a hydroxylated material and method of making a mesoporous film
KR20010101419A (ko) 1999-01-07 2001-11-14 크리스 로저 에이취. 유기히드리도실록산 수지로부터 생성된 유전막
US6210856B1 (en) * 1999-01-27 2001-04-03 International Business Machines Corporation Resist composition and process of forming a patterned resist layer on a substrate
JP3543669B2 (ja) * 1999-03-31 2004-07-14 信越化学工業株式会社 絶縁膜形成用塗布液及び絶縁膜の形成方法
US6204202B1 (en) * 1999-04-14 2001-03-20 Alliedsignal, Inc. Low dielectric constant porous films
US6509259B1 (en) 1999-06-09 2003-01-21 Alliedsignal Inc. Process of using siloxane dielectric films in the integration of organic dielectric films in electronic devices
US6268457B1 (en) * 1999-06-10 2001-07-31 Allied Signal, Inc. Spin-on glass anti-reflective coatings for photolithography
WO2000077575A1 (en) 1999-06-10 2000-12-21 Alliedsignal Inc. Spin-on-glass anti-reflective coatings for photolithography
US6824879B2 (en) 1999-06-10 2004-11-30 Honeywell International Inc. Spin-on-glass anti-reflective coatings for photolithography
WO2003044078A1 (en) 2001-11-15 2003-05-30 Honeywell International Inc. Anti-reflective coatings for photolithography and methods of preparation thereof
US6318124B1 (en) 1999-08-23 2001-11-20 Alliedsignal Inc. Nanoporous silica treated with siloxane polymers for ULSI applications
JP4248098B2 (ja) 1999-09-20 2009-04-02 東京応化工業株式会社 反射防止膜形成用組成物及びレジストパターンの形成方法
US20040089238A1 (en) 1999-10-04 2004-05-13 Jerome Birnbaum Vacuum/gas phase reactor for dehydroxylation and alkylation of porous silica
US6472076B1 (en) 1999-10-18 2002-10-29 Honeywell International Inc. Deposition of organosilsesquioxane films
JP2001152023A (ja) * 1999-11-25 2001-06-05 Jsr Corp 膜形成用組成物
US6592980B1 (en) 1999-12-07 2003-07-15 Air Products And Chemicals, Inc. Mesoporous films having reduced dielectric constants
US6365266B1 (en) * 1999-12-07 2002-04-02 Air Products And Chemicals, Inc. Mesoporous films having reduced dielectric constants
JP4195773B2 (ja) * 2000-04-10 2008-12-10 Ｊｓｒ株式会社 層間絶縁膜形成用組成物、層間絶縁膜の形成方法およびシリカ系層間絶縁膜
US20030157340A1 (en) 2000-02-01 2003-08-21 Jsr Corporation Process for producing silica-based film, silica-based film, insulating film, and semiconductor device
US6902771B2 (en) 2000-02-01 2005-06-07 Jsr Corporation Process for producing silica-based film, silica-based film, insulating film, and semiconductor device
US20030104225A1 (en) 2000-02-01 2003-06-05 Jsr Corporation Process for producing silica-based film, silica-based film, insulating film, and semiconductor device
JP2001242803A (ja) * 2000-02-29 2001-09-07 Sony Corp 表示装置及びその製造方法
US6576568B2 (en) 2000-04-04 2003-06-10 Applied Materials, Inc. Ionic additives for extreme low dielectric constant chemical formulations
US7265062B2 (en) 2000-04-04 2007-09-04 Applied Materials, Inc. Ionic additives for extreme low dielectric constant chemical formulations
US7128976B2 (en) * 2000-04-10 2006-10-31 Jsr Corporation Composition for film formation, method of film formation, and silica-based film
US6891237B1 (en) * 2000-06-27 2005-05-10 Lucent Technologies Inc. Organic semiconductor device having an active dielectric layer comprising silsesquioxanes
US6368400B1 (en) 2000-07-17 2002-04-09 Honeywell International Absorbing compounds for spin-on-glass anti-reflective coatings for photolithography
JP2002043423A (ja) * 2000-07-24 2002-02-08 Tokyo Ohka Kogyo Co Ltd 被膜の処理方法およびこの方法を用いた半導体素子の製造方法
JP3772077B2 (ja) * 2000-09-27 2006-05-10 株式会社東芝 パターン形成方法
KR100382955B1 (ko) * 2000-10-10 2003-05-09 엘지.필립스 엘시디 주식회사 액정표시장치용 어레이기판과 그 제조방법
JP2002129103A (ja) 2000-10-23 2002-05-09 Jsr Corp 膜形成用組成物および絶縁膜形成用材料
JP4632522B2 (ja) * 2000-11-30 2011-02-16 Ｎｅｃ液晶テクノロジー株式会社 反射型液晶表示装置の製造方法
US7026053B2 (en) * 2001-01-29 2006-04-11 Jsr Corporation Process for producing silica-based film, silica-based film, insulating film, and semiconductor device
JP2002235037A (ja) 2001-02-13 2002-08-23 Jsr Corp 膜形成用組成物の製造方法、膜形成用組成物、膜の形成方法およびシリカ系膜
KR100496420B1 (ko) * 2001-03-02 2005-06-17 삼성에스디아이 주식회사 2층구조의 소오스/드레인 전극을 갖는 박막 트랜지스터 및그의 제조방법과 이를 이용한 액티브 매트릭스형 표시소자및 그의 제조방법
JP4545973B2 (ja) 2001-03-23 2010-09-15 富士通株式会社 シリコン系組成物、低誘電率膜、半導体装置および低誘電率膜の製造方法
JP3908552B2 (ja) * 2001-03-29 2007-04-25 Ｎｅｃ液晶テクノロジー株式会社 液晶表示装置及びその製造方法
US6599995B2 (en) 2001-05-01 2003-07-29 Korea Institute Of Science And Technology Polyalkylaromaticsilsesquioxane and preparation method thereof
KR100744955B1 (ko) * 2001-05-21 2007-08-02 엘지.필립스 엘시디 주식회사 횡전계방식 액정표시장치용 어레이기판과 그 제조방법
JP2003025510A (ja) * 2001-07-16 2003-01-29 Shin Etsu Chem Co Ltd 反射防止性及び耐擦傷性を有する多層積層体
DE10135640A1 (de) 2001-07-21 2003-02-06 Covion Organic Semiconductors Lösungen organischer Halbleiter
US6596404B1 (en) 2001-07-26 2003-07-22 Dow Corning Corporation Siloxane resins
JP2003064307A (ja) 2001-08-28 2003-03-05 Hitachi Chem Co Ltd シリカ系被膜、シリカ系被膜形成用組成物、シリカ系被膜の製造方法及び電子部品
JP4972834B2 (ja) 2001-08-28 2012-07-11 日立化成工業株式会社 シロキサン樹脂
DE10151264A1 (de) 2001-10-17 2003-04-30 Degussa Aminoalkylalkoxysiloxanhaltige Gemische, deren Herstellung und deren Verwendung
US6617609B2 (en) 2001-11-05 2003-09-09 3M Innovative Properties Company Organic thin film transistor with siloxane polymer interface
KR20040075866A (ko) 2001-11-15 2004-08-30 허니웰 인터내셔날 인코포레이티드 포토리소그래피용 스핀-온 무반사 코팅
KR100818678B1 (ko) 2001-11-16 2008-04-01 허니웰 인터내셔널 인코포레이티드 포토리소그라피용 스핀온 유리 반사 방지 피막
KR100635042B1 (ko) * 2001-12-14 2006-10-17 삼성에스디아이 주식회사 전면전극을 구비한 평판표시장치 및 그의 제조방법
JP2003183575A (ja) 2001-12-20 2003-07-03 Mitsui Chemicals Inc 保存安定性に優れる多孔質シリカフィルム形成用塗布液、該塗布液の製造方法、並びに、均一なメソ孔が規則的に配列された多孔質シリカフィルムの製造方法、該多孔質シリカフィルムおよびその用途
KR100652046B1 (ko) * 2001-12-22 2006-11-30 엘지.필립스 엘시디 주식회사 액정표시소자 및 그 제조방법
TW200401944A (en) 2002-02-01 2004-02-01 Seiko Epson Corp Circuit substrate, electro-optical device and electronic appliances
US7687590B2 (en) * 2002-02-27 2010-03-30 Hitachi Chemical Company, Ltd. Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts
WO2003072668A1 (fr) 2002-02-27 2003-09-04 Hitachi Chemical Co., Ltd. Composition permettant de former un film de revetement a base de silice, film de revetement a base de silice, procede de preparation associe et parties electroniques
US7682701B2 (en) 2002-02-27 2010-03-23 Hitachi Chemical Co., Ltd. Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts
JP4110797B2 (ja) 2002-02-27 2008-07-02 日立化成工業株式会社 シリカ系被膜形成用組成物、シリカ系被膜の製造方法及び電子部品
JP2005519345A (ja) 2002-03-04 2005-06-30 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 短波長イメージング用ネガ型フォトレジスト
JP3966026B2 (ja) 2002-03-06 2007-08-29 日立化成工業株式会社 シリカ系被膜形成用組成物、シリカ系被膜及びその製造方法、並びに電子部品
US6984476B2 (en) 2002-04-15 2006-01-10 Sharp Kabushiki Kaisha Radiation-sensitive resin composition, forming process for forming patterned insulation film, active matrix board and flat-panel display device equipped with the same, and process for producing flat-panel display device
US6730454B2 (en) 2002-04-16 2004-05-04 International Business Machines Corporation Antireflective SiO-containing compositions for hardmask layer
WO2003102096A1 (en) 2002-06-04 2003-12-11 Fujitsu Limited Antibacterial and anti-staining paint for building materia l and building material coated therewith
JP3631236B2 (ja) 2002-07-12 2005-03-23 東京応化工業株式会社 シリカ系有機被膜の製造方法
KR100489590B1 (ko) * 2002-09-19 2005-05-16 엘지.필립스 엘시디 주식회사 투과형 유기전계발광 소자 및 그의 제조방법
KR100860523B1 (ko) * 2002-10-11 2008-09-26 엘지디스플레이 주식회사 횡전계방식 액정 표시 소자 및 그 제조방법
JP2004212946A (ja) 2002-10-21 2004-07-29 Rohm & Haas Electronic Materials Llc Ｓｉポリマー含有フォトレジスト
JP2004161875A (ja) 2002-11-13 2004-06-10 Shin Etsu Chem Co Ltd 多孔質膜形成用組成物、多孔質膜とその製造方法、層間絶縁間膜及び半導体装置
EP1434068A3 (en) * 2002-12-02 2004-07-28 Shipley Company, L.L.C. Methods of forming waveguides that are rounded in cross section and waveguides formed therefrom
TWI230292B (en) * 2002-12-09 2005-04-01 Lg Philips Lcd Co Ltd Array substrate having color filter on thin film transistor structure for LCD device and method of fabricating the same
US7133088B2 (en) * 2002-12-23 2006-11-07 Lg.Philips Lcd Co., Ltd. Liquid crystal display device and method of fabricating the same
KR100887671B1 (ko) * 2002-12-23 2009-03-11 엘지디스플레이 주식회사 액정표시장치용 어레이기판과 그 제조방법
KR20040061292A (ko) * 2002-12-30 2004-07-07 엘지.필립스 엘시디 주식회사 액정표시소자 제조방법
KR101040687B1 (ko) 2003-01-25 2011-06-10 허니웰 인터내셔널 인코포레이티드 손상된 유전체 물질 및 막의 보상 및 회복
JP4463200B2 (ja) * 2003-03-12 2010-05-12 株式会社ミツカングループ本社 酢酸菌のアルコール脱水素酵素遺伝子
US20040180011A1 (en) * 2003-03-13 2004-09-16 Wacker Chemical Corporation Cosmetic formulation comprising alkyl phenyl silsesquioxane resins
JP3674041B2 (ja) 2003-03-13 2005-07-20 日立化成工業株式会社 シリカ系被膜形成用組成物、シリカ系被膜及びその形成方法、並びにシリカ系被膜を備える電子部品
JP2004307694A (ja) 2003-04-09 2004-11-04 Shin Etsu Chem Co Ltd 多孔質膜形成用組成物、多孔質膜の製造方法、多孔質膜、層間絶縁膜及び半導体装置。
KR100645682B1 (ko) 2003-04-17 2006-11-13 주식회사 엘지화학 유기실록산 수지 및 이를 이용한 절연막
US7060637B2 (en) 2003-05-12 2006-06-13 Micron Technology, Inc. Methods of forming intermediate semiconductor device structures using spin-on, photopatternable, interlayer dielectric materials
KR100519948B1 (ko) * 2003-05-20 2005-10-10 엘지.필립스 엘시디 주식회사 비정질 실리콘의 결정화 공정 및 이를 이용한 스위칭 소자
US7202013B2 (en) * 2003-06-03 2007-04-10 Shin-Etsu Chemical Co., Ltd. Antireflective film material, and antireflective film and pattern formation method using the same
KR100507967B1 (ko) 2003-07-01 2005-08-10 삼성전자주식회사 실록산계 수지 및 이를 이용한 반도체 층간 절연막
KR100504291B1 (ko) * 2003-07-14 2005-07-27 삼성전자주식회사 게르마늄을 포함하는 실록산계 수지 및 이를 이용한반도체 층간 절연막 형성 방법
US7109519B2 (en) 2003-07-15 2006-09-19 3M Innovative Properties Company Bis(2-acenyl)acetylene semiconductors
JP2005099693A (ja) 2003-09-05 2005-04-14 Hitachi Chem Co Ltd 反射防止膜形成用組成物及びそれを用いた反射防止膜の製造方法、光学部品、太陽電池ユニット
US7622399B2 (en) * 2003-09-23 2009-11-24 Silecs Oy Method of forming low-k dielectrics using a rapid curing process
WO2005036270A1 (ja) 2003-10-07 2005-04-21 Hitachi Chemical Co., Ltd. 放射線硬化性組成物、その保存方法、硬化膜形成方法、パターン形成方法、パターン使用方法、電子部品及び光導波路
KR20050040275A (ko) * 2003-10-28 2005-05-03 삼성전자주식회사 절연막 형성용 조성물 및 이를 이용한 절연막 또는 절연막패턴의 형성방법
JP4447283B2 (ja) 2003-11-05 2010-04-07 東京応化工業株式会社 シリカ系被膜形成用塗布液
JP2005139265A (ja) 2003-11-05 2005-06-02 Tokyo Ohka Kogyo Co Ltd シリカ系被膜形成用塗布液
US8053159B2 (en) 2003-11-18 2011-11-08 Honeywell International Inc. Antireflective coatings for via fill and photolithography applications and methods of preparation thereof
US7470634B2 (en) 2003-11-24 2008-12-30 Samsung Electronics Co., Ltd. Method for forming interlayer dielectric film for semiconductor device by using polyhedral molecular silsesquioxane
TWI237892B (en) * 2004-01-13 2005-08-11 Ind Tech Res Inst Method of forming thin-film transistor devices with electro-static discharge protection
US7172913B2 (en) * 2004-03-19 2007-02-06 Samsung Electronics Co., Ltd. Thin film transistor array panel and manufacturing method thereof
JP4494061B2 (ja) 2004-03-30 2010-06-30 東京応化工業株式会社 ポジ型レジスト組成物
KR100569220B1 (ko) 2004-04-06 2006-04-10 한국과학기술원 플라즈마 디스플레이 패널용 유전체 조성물
TWI367686B (en) 2004-04-07 2012-07-01 Semiconductor Energy Lab Light emitting device, electronic device, and television device
US7067841B2 (en) * 2004-04-22 2006-06-27 E. I. Du Pont De Nemours And Company Organic electronic devices
US7177000B2 (en) * 2004-05-18 2007-02-13 Automotive Systems Laboratory, Inc. Liquid crystal display cell structure and manufacture process of a liquid crystal display comprising an opening formed through the color filter and partially the buffer layer
US8901268B2 (en) * 2004-08-03 2014-12-02 Ahila Krishnamoorthy Compositions, layers and films for optoelectronic devices, methods of production and uses thereof
US7015061B2 (en) * 2004-08-03 2006-03-21 Honeywell International Inc. Low temperature curable materials for optical applications
JP2006045352A (ja) 2004-08-04 2006-02-16 Hitachi Chem Co Ltd シリカ系被膜形成用組成物、シリカ系被膜及びその形成方法並びにシリカ系被膜を備える電子部品
KR20060020830A (ko) * 2004-09-01 2006-03-07 삼성코닝 주식회사 계면활성제를 템플릿으로 이용한 저유전성 메조포러스박막의 제조방법
US20060047034A1 (en) * 2004-09-02 2006-03-02 Haruaki Sakurai Composition for forming silica-based film, method of forming silica-based film, and electronic component provided with silica-based film
KR100699996B1 (ko) * 2004-09-02 2007-03-26 삼성에스디아이 주식회사 회로 측정용 패드를 포함하는 유기전계발광표시장치와 그제조방법
JP5143334B2 (ja) 2004-09-07 2013-02-13 日立化成工業株式会社 シリカ系被膜形成用組成物、シリカ系被膜及びその形成方法、並びにシリカ系被膜を備える電子部品
JP2005042118A (ja) 2004-09-07 2005-02-17 Hitachi Chem Co Ltd シリカ系被膜形成用組成物、シリカ系被膜の製造方法及び電子部品
JP2005105282A (ja) 2004-10-15 2005-04-21 Hitachi Chem Co Ltd シリカ系被膜形成用組成物、シリカ系被膜及びその形成方法、並びにシリカ系被膜を備える電子部品
JP2005105281A (ja) 2004-10-15 2005-04-21 Hitachi Chem Co Ltd シリカ系被膜形成用組成物、シリカ系被膜及びその形成方法、並びにシリカ系被膜を備える電子部品
JP2005105283A (ja) 2004-10-27 2005-04-21 Hitachi Chem Co Ltd シリカ系被膜形成用組成物、シリカ系被膜及びその形成方法、並びにシリカ系被膜を備える電子部品
JP2005072615A (ja) 2004-10-29 2005-03-17 Hitachi Chem Co Ltd シリカ系被膜形成用組成物、シリカ系被膜、シリカ系被膜の製造方法及び電子部品
JP2005105284A (ja) 2004-10-29 2005-04-21 Hitachi Chem Co Ltd シリカ系被膜形成用組成物、シリカ系被膜、シリカ系被膜の製造方法及び電子部品
JP5143335B2 (ja) 2004-11-12 2013-02-13 日立化成工業株式会社 シリカ系被膜形成用組成物、シリカ系被膜及びその形成方法、並びにシリカ系被膜を備える電子部品
JP2005136429A (ja) 2004-11-12 2005-05-26 Hitachi Chem Co Ltd シリカ系被膜形成用組成物、シリカ系被膜及びその形成方法、並びにシリカ系被膜を備える電子部品
JP2006183029A (ja) 2004-11-30 2006-07-13 Hitachi Chem Co Ltd シリカ系被膜形成用組成物、シリカ系被膜の形成方法、シリカ系被膜、及び、電子部品
JP2006183028A (ja) 2004-11-30 2006-07-13 Hitachi Chem Co Ltd シリカ系被膜形成用組成物、シリカ系被膜の形成方法、シリカ系被膜、及び、電子部品
KR20060068348A (ko) 2004-12-16 2006-06-21 삼성코닝 주식회사 실록산계 중합체 및 상기 중합체를 이용한 절연막 제조방법
US20060132459A1 (en) 2004-12-20 2006-06-22 Huddleston Wyatt A Interpreting an image
US20080260956A1 (en) 2004-12-21 2008-10-23 Haruaki Sakurai Film, Silica Film and Method of Forming the Same, Composition for Forming Silica Film, and Electronic Part
JP2006213908A (ja) 2004-12-21 2006-08-17 Hitachi Chem Co Ltd シリカ系被膜形成用組成物、シリカ系被膜の形成方法、シリカ系被膜、及び、電子部品
JP2006182811A (ja) 2004-12-24 2006-07-13 Tokyo Ohka Kogyo Co Ltd シリカ系被膜形成用塗布液
KR101119141B1 (ko) 2005-01-20 2012-03-19 삼성코닝정밀소재 주식회사 폴리머 나노 입자를 포함하는 저유전 박막 형성용 조성물및 이를 이용한 저유전 박막의 제조방법
JP2006249181A (ja) 2005-03-09 2006-09-21 Fuji Photo Film Co Ltd 絶縁材料形成用組成物の製造方法、絶縁材料形成用組成物およびこれを用いた絶縁膜
KR20060134304A (ko) * 2005-06-22 2006-12-28 삼성전자주식회사 액정 표시 장치
US20070004587A1 (en) * 2005-06-30 2007-01-04 Intel Corporation Method of forming metal on a substrate using a Ruthenium-based catalyst
JP4860953B2 (ja) * 2005-07-08 2012-01-25 富士通株式会社 シリカ系被膜形成用材料、シリカ系被膜及びその製造方法、多層配線及びその製造方法、並びに、半導体装置及びその製造方法
KR20070010618A (ko) * 2005-07-19 2007-01-24 삼성전자주식회사 표시 장치 및 박막 트랜지스터 표시판
JP4677937B2 (ja) * 2005-07-20 2011-04-27 セイコーエプソン株式会社 膜パターンの形成方法、デバイス、電気光学装置、電子機器、及びアクティブマトリクス基板の製造方法
KR101209046B1 (ko) * 2005-07-27 2012-12-06 삼성디스플레이 주식회사 박막트랜지스터 기판과 박막트랜지스터 기판의 제조방법
US20070023864A1 (en) * 2005-07-28 2007-02-01 International Business Machines Corporation Methods of fabricating bipolar transistor for improved isolation, passivation and critical dimension control
KR20070014281A (ko) * 2005-07-28 2007-02-01 삼성전자주식회사 액정 표시 장치
KR20070014579A (ko) * 2005-07-29 2007-02-01 삼성전자주식회사 유기 박막 트랜지스터 표시판 및 그 제조 방법
KR20070015314A (ko) * 2005-07-30 2007-02-02 삼성전자주식회사 액정표시장치 및 그의 제조 방법
KR100683791B1 (ko) * 2005-07-30 2007-02-20 삼성에스디아이 주식회사 박막 트랜지스터 기판 및 이를 구비한 평판 디스플레이장치
JP4039446B2 (ja) * 2005-08-02 2008-01-30 エプソンイメージングデバイス株式会社 電気光学装置及び電子機器
KR101237011B1 (ko) * 2005-08-02 2013-02-26 삼성디스플레이 주식회사 액정 표시 장치
KR101247698B1 (ko) * 2005-08-05 2013-03-26 삼성디스플레이 주식회사 액정 표시 장치
TW200710521A (en) * 2005-08-05 2007-03-16 Samsung Electronics Co Ltd Liquid crystal display
KR101240644B1 (ko) * 2005-08-09 2013-03-11 삼성디스플레이 주식회사 박막 트랜지스터 표시판
KR20070019457A (ko) * 2005-08-12 2007-02-15 삼성전자주식회사 박막 트랜지스터 표시판 및 이를 포함하는 액정표시장치
TWI340607B (en) * 2005-08-12 2011-04-11 Au Optronics Corp Organic electroluminescent display panel and fabricating method thereof
JP2009539143A (ja) 2006-06-01 2009-11-12 ライト レゾナンス テクノロジーズ リミテッド ライアビリティー カンパニー 光フィルタ／モジュレータ及びフィルタ／モジュレータのアレイ

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0632342A (ja) * 1992-07-09 1994-02-08 Asahi Breweries Ltd ガラス容器の擦り傷遮蔽剤および擦り傷が遮蔽されたガラス容器
JPH0665347A (ja) * 1992-08-17 1994-03-08 Showa Denko Kk 硬化性樹脂組成物および該組成物から形成された硬化樹脂膜
JPH06329911A (ja) * 1993-05-18 1994-11-29 Showa Denko Kk コーティング用組成物
JPH08319422A (ja) * 1995-05-26 1996-12-03 Kanegafuchi Chem Ind Co Ltd ラダー型ポリシロキサンを主成分とする成形体の作製方法
JP2003113310A (ja) * 2001-10-05 2003-04-18 Kanegafuchi Chem Ind Co Ltd 光学材料用組成物、電子材料用組成物、光学材料、電子材料、発光ダイオード及びその製造方法
JP2004004733A (ja) * 2002-04-15 2004-01-08 Sharp Corp 感放射線性樹脂組成物、パターン状絶縁性被膜の形成方法、アクティブマトリクス基板およびそれを備えた平面表示装置、並びに平面表示装置の製造方法
JP2004359756A (ja) * 2003-06-03 2004-12-24 Wacker Asahikasei Silicone Co Ltd Ｌｅｄ用封止剤組成物
JP2007510761A (ja) * 2003-10-07 2007-04-26 ハネウエル・インターナシヨナル・インコーポレーテツド 集積回路用途の被覆およびハードマスク組成物、これらの製造方法および使用
JP2005145795A (ja) * 2003-11-19 2005-06-09 Central Glass Co Ltd 膜状有機無機ハイブリッドガラス状物質及びその製造方法
JP2006178466A (ja) * 2004-12-22 2006-07-06 Rohm & Haas Electronic Materials Llc 光学乾燥フィルム及び乾燥フィルムを有する光学デバイス形成方法
JP2006241407A (ja) * 2005-03-07 2006-09-14 Shin Etsu Chem Co Ltd プライマー組成物及びそれを用いた電気電子部品
JP2008248239A (ja) * 2007-03-08 2008-10-16 Toray Ind Inc シロキサン樹脂組成物、それを用いた硬化膜および光学デバイス

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014208838A (ja) * 2007-04-10 2014-11-06 ハネウェル・インターナショナル・インコーポレーテッド オプトエレクトロニクスデバイス用の組成物、層、及びフィルム、並びにこれらの使用
JP2009302087A (ja) * 2008-06-10 2009-12-24 Tokyo Ohka Kogyo Co Ltd Ｔｆｔ平坦化膜形成用組成物及び表示装置
US9728685B2 (en) 2013-02-28 2017-08-08 Nichia Corporation Light emitting device and lighting device including same
JP2015012194A (ja) * 2013-06-28 2015-01-19 日亜化学工業株式会社 発光装置
JP2018516998A (ja) * 2015-04-13 2018-06-28 ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． オプトエレクトロニクス用途のためのポリシロキサン製剤及びコーティング
US10544329B2 (en) 2015-04-13 2020-01-28 Honeywell International Inc. Polysiloxane formulations and coatings for optoelectronic applications
JP2017198939A (ja) * 2016-04-28 2017-11-02 エルジー ディスプレイ カンパニー リミテッド 電気光学パネル
JP2020507917A (ja) * 2017-01-20 2020-03-12 ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． 間隙充填誘電材料
JP2022068349A (ja) * 2017-01-20 2022-05-09 ハネウェル・インターナショナル・インコーポレーテッド 間隙充填誘電材料
JP7289950B2 (ja) 2017-01-20 2023-06-12 ハネウェル・インターナショナル・インコーポレーテッド 間隙充填誘電材料
JPWO2020166692A1 (ja) * 2019-02-14 2021-12-23 ダウ・東レ株式会社 オルガノポリシロキサン硬化物フィルム、その用途、製造方法および製造装置
JP7485497B2 (ja) 2019-02-14 2024-05-16 ダウ・東レ株式会社 オルガノポリシロキサン硬化物フィルム、その用途、製造方法および製造装置

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