SG100674A1 - Semiconductor device and manufacturing method of the same - Google Patents
Semiconductor device and manufacturing method of the sameInfo
- Publication number
- SG100674A1 SG100674A1 SG200102293A SG200102293A SG100674A1 SG 100674 A1 SG100674 A1 SG 100674A1 SG 200102293 A SG200102293 A SG 200102293A SG 200102293 A SG200102293 A SG 200102293A SG 100674 A1 SG100674 A1 SG 100674A1
- Authority
- SG
- Singapore
- Prior art keywords
- bumps
- adhesive layer
- semiconductor chip
- semiconductor device
- electrical connection
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 6
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000012790 adhesive layer Substances 0.000 abstract 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 239000004840 adhesive resin Substances 0.000 abstract 1
- 229920006223 adhesive resin Polymers 0.000 abstract 1
- 239000011889 copper foil Substances 0.000 abstract 1
- 229920001169 thermoplastic Polymers 0.000 abstract 1
- 239000004416 thermosoftening plastic Substances 0.000 abstract 1
Classifications
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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- Condensed Matter Physics & Semiconductors (AREA)
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Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2000123306A JP3597754B2 (ja) | 2000-04-24 | 2000-04-24 | 半導体装置及びその製造方法 |
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SG100674A1 true SG100674A1 (en) | 2003-12-26 |
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SG200102293A SG100674A1 (en) | 2000-04-24 | 2001-04-24 | Semiconductor device and manufacturing method of the same |
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JP2000022027A (ja) | 1998-06-29 | 2000-01-21 | Sony Corp | 半導体装置、その製造方法およびパッケージ用基板 |
JP2000058587A (ja) | 1998-08-12 | 2000-02-25 | Fujitsu Ltd | 半導体装置及びその製造方法 |
US6181569B1 (en) * | 1999-06-07 | 2001-01-30 | Kishore K. Chakravorty | Low cost chip size package and method of fabricating the same |
JP2001284382A (ja) | 2000-03-28 | 2001-10-12 | Nec Corp | はんだバンプ形成方法、フリップチップ実装方法及び実装構造体 |
-
2000
- 2000-04-24 JP JP2000123306A patent/JP3597754B2/ja not_active Expired - Lifetime
-
2001
- 2001-04-19 EP EP01109690A patent/EP1150347A2/en not_active Withdrawn
- 2001-04-23 US US09/839,298 patent/US6791195B2/en not_active Expired - Lifetime
- 2001-04-24 SG SG200102293A patent/SG100674A1/en unknown
- 2001-04-24 TW TW090109843A patent/TW501208B/zh not_active IP Right Cessation
- 2001-04-24 CN CN01109597A patent/CN1320964A/zh active Pending
- 2001-04-24 KR KR10-2001-0022093A patent/KR100384260B1/ko active IP Right Grant
-
2002
- 2002-03-28 US US10/107,367 patent/US20020132463A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5783870A (en) * | 1995-03-16 | 1998-07-21 | National Semiconductor Corporation | Method for connecting packages of a stacked ball grid array structure |
US6005292A (en) * | 1996-08-05 | 1999-12-21 | International Business Machines Corporation | Lead-free interconnection for electronic devices |
US6285081B1 (en) * | 1999-07-13 | 2001-09-04 | Micron Technology, Inc. | Deflectable interconnect |
Also Published As
Publication number | Publication date |
---|---|
US20020132463A1 (en) | 2002-09-19 |
JP3597754B2 (ja) | 2004-12-08 |
US6791195B2 (en) | 2004-09-14 |
KR20010104626A (ko) | 2001-11-26 |
TW501208B (en) | 2002-09-01 |
KR100384260B1 (ko) | 2003-05-16 |
US20010036711A1 (en) | 2001-11-01 |
JP2001308140A (ja) | 2001-11-02 |
EP1150347A2 (en) | 2001-10-31 |
CN1320964A (zh) | 2001-11-07 |
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