KR101901761B1 - 기억 장치 - Google Patents
기억 장치 Download PDFInfo
- Publication number
- KR101901761B1 KR101901761B1 KR1020187013071A KR20187013071A KR101901761B1 KR 101901761 B1 KR101901761 B1 KR 101901761B1 KR 1020187013071 A KR1020187013071 A KR 1020187013071A KR 20187013071 A KR20187013071 A KR 20187013071A KR 101901761 B1 KR101901761 B1 KR 101901761B1
- Authority
- KR
- South Korea
- Prior art keywords
- memory cell
- transistor
- oxide semiconductor
- electrode
- driving circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
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- H01L27/10802—
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
- G11C5/025—Geometric lay-out considerations of storage- and peripheral-blocks in a semiconductor storage device
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/403—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh
- G11C11/404—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh with one charge-transfer gate, e.g. MOS transistor, per cell
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
- G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
- G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
- G11C11/409—Read-write [R-W] circuits
- G11C11/4097—Bit-line organisation, e.g. bit-line layout, folded bit lines
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C8/00—Arrangements for selecting an address in a digital store
- G11C8/08—Word line control circuits, e.g. drivers, boosters, pull-up circuits, pull-down circuits, precharging circuits, for word lines
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- H01L27/10873—
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- H01L27/10885—
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- H01L27/10891—
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
- H10B12/05—Making the transistor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/20—DRAM devices comprising floating-body transistors, e.g. floating-body cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/48—Data lines or contacts therefor
- H10B12/482—Bit lines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/48—Data lines or contacts therefor
- H10B12/488—Word lines
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Thin Film Transistor (AREA)
- Semiconductor Memories (AREA)
- Dram (AREA)
- Electrodes Of Semiconductors (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Recrystallisation Techniques (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2010-204090 | 2010-09-13 | ||
| JP2010204090 | 2010-09-13 | ||
| JP2011108899 | 2011-05-14 | ||
| JPJP-P-2011-108899 | 2011-05-14 | ||
| PCT/JP2011/070095 WO2012036001A1 (en) | 2010-09-13 | 2011-08-30 | Memory device |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020137008591A Division KR20130119421A (ko) | 2010-09-13 | 2011-08-30 | 기억 장치 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020187026561A Division KR101941143B1 (ko) | 2010-09-13 | 2011-08-30 | 기억 장치 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20180052781A KR20180052781A (ko) | 2018-05-18 |
| KR101901761B1 true KR101901761B1 (ko) | 2018-11-08 |
Family
ID=45806590
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020187013071A Expired - Fee Related KR101901761B1 (ko) | 2010-09-13 | 2011-08-30 | 기억 장치 |
| KR1020137008591A Ceased KR20130119421A (ko) | 2010-09-13 | 2011-08-30 | 기억 장치 |
| KR1020187026561A Expired - Fee Related KR101941143B1 (ko) | 2010-09-13 | 2011-08-30 | 기억 장치 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020137008591A Ceased KR20130119421A (ko) | 2010-09-13 | 2011-08-30 | 기억 장치 |
| KR1020187026561A Expired - Fee Related KR101941143B1 (ko) | 2010-09-13 | 2011-08-30 | 기억 장치 |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US9042161B2 (enExample) |
| JP (4) | JP2012256821A (enExample) |
| KR (3) | KR101901761B1 (enExample) |
| DE (1) | DE112011103061T5 (enExample) |
| TW (3) | TWI539452B (enExample) |
| WO (1) | WO2012036001A1 (enExample) |
Families Citing this family (68)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012029638A1 (en) | 2010-09-03 | 2012-03-08 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP2012256821A (ja) * | 2010-09-13 | 2012-12-27 | Semiconductor Energy Lab Co Ltd | 記憶装置 |
| TWI574259B (zh) | 2010-09-29 | 2017-03-11 | 半導體能源研究所股份有限公司 | 半導體記憶體裝置和其驅動方法 |
| TWI619230B (zh) | 2011-01-14 | 2018-03-21 | 半導體能源研究所股份有限公司 | 半導體記憶裝置 |
| TWI564890B (zh) | 2011-01-26 | 2017-01-01 | 半導體能源研究所股份有限公司 | 記憶體裝置及半導體裝置 |
| JP6000560B2 (ja) | 2011-02-02 | 2016-09-28 | 株式会社半導体エネルギー研究所 | 半導体メモリ装置 |
| TWI520273B (zh) | 2011-02-02 | 2016-02-01 | 半導體能源研究所股份有限公司 | 半導體儲存裝置 |
| CN103022012B (zh) * | 2011-09-21 | 2017-03-01 | 株式会社半导体能源研究所 | 半导体存储装置 |
| JP6059968B2 (ja) * | 2011-11-25 | 2017-01-11 | 株式会社半導体エネルギー研究所 | 半導体装置、及び液晶表示装置 |
| US8981367B2 (en) | 2011-12-01 | 2015-03-17 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP6081171B2 (ja) | 2011-12-09 | 2017-02-15 | 株式会社半導体エネルギー研究所 | 記憶装置 |
| US10002968B2 (en) | 2011-12-14 | 2018-06-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device including the same |
| JP6105266B2 (ja) | 2011-12-15 | 2017-03-29 | 株式会社半導体エネルギー研究所 | 記憶装置 |
| WO2013147743A1 (en) * | 2012-03-26 | 2013-10-03 | Intel Corporation | Three dimensional memory control circuitry |
| JP6250883B2 (ja) * | 2013-03-01 | 2017-12-20 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP6438727B2 (ja) * | 2013-10-11 | 2018-12-19 | 株式会社半導体エネルギー研究所 | 半導体装置および半導体装置の作製方法 |
| WO2015060133A1 (en) * | 2013-10-22 | 2015-04-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US9558791B2 (en) * | 2013-12-05 | 2017-01-31 | Taiwan Semiconductor Manufacturing Company Limited | Three-dimensional static random access memory device structures |
| WO2015097593A1 (en) * | 2013-12-27 | 2015-07-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US9716100B2 (en) * | 2014-03-14 | 2017-07-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, method for driving semiconductor device, and electronic device |
| JP6635670B2 (ja) | 2014-04-11 | 2020-01-29 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| WO2015170220A1 (en) * | 2014-05-09 | 2015-11-12 | Semiconductor Energy Laboratory Co., Ltd. | Memory device and electronic device |
| JP6580863B2 (ja) * | 2014-05-22 | 2019-09-25 | 株式会社半導体エネルギー研究所 | 半導体装置、健康管理システム |
| JP6616102B2 (ja) * | 2014-05-23 | 2019-12-04 | 株式会社半導体エネルギー研究所 | 記憶装置及び電子機器 |
| DE112014006711B4 (de) | 2014-05-30 | 2021-01-21 | Semiconductor Energy Laboratory Co., Ltd. | Halbleitervorrichtung, Herstellungsverfahren dafür und elektronische Vorrichtung |
| JP5940691B1 (ja) * | 2015-02-04 | 2016-06-29 | ウィンボンド エレクトロニクス コーポレーション | 電圧生成回路、半導体装置およびフラッシュメモリ |
| US9711224B2 (en) * | 2015-03-13 | 2017-07-18 | Micron Technology, Inc. | Devices including memory arrays, row decoder circuitries and column decoder circuitries |
| JP6734263B2 (ja) * | 2015-04-27 | 2020-08-05 | ソニーセミコンダクタソリューションズ株式会社 | メモリシステム |
| US9728243B2 (en) * | 2015-05-11 | 2017-08-08 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device or electronic component including the same |
| US10424671B2 (en) | 2015-07-29 | 2019-09-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, circuit board, and electronic device |
| US9749567B2 (en) | 2015-11-29 | 2017-08-29 | United Microelectronics Corp. | Operating method of image sensor |
| KR102579920B1 (ko) | 2015-12-17 | 2023-09-18 | 삼성전자주식회사 | 씨오피 구조를 갖는 메모리 장치 및 이를 포함하는 메모리 패키지 |
| US9721663B1 (en) * | 2016-02-18 | 2017-08-01 | Sandisk Technologies Llc | Word line decoder circuitry under a three-dimensional memory array |
| JP6517720B2 (ja) * | 2016-03-16 | 2019-05-22 | 東芝メモリ株式会社 | 半導体記憶装置 |
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| US10037294B2 (en) * | 2016-05-20 | 2018-07-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, electronic component, and electronic device |
| KR102583770B1 (ko) | 2016-09-12 | 2023-10-06 | 삼성디스플레이 주식회사 | 메모리 트랜지스터 및 이를 갖는 표시장치 |
| JP6721696B2 (ja) * | 2016-09-23 | 2020-07-15 | キオクシア株式会社 | メモリデバイス |
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| US20200006328A1 (en) * | 2017-02-10 | 2020-01-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| DE112018003263T5 (de) | 2017-06-27 | 2020-03-12 | Semiconductor Energy Laboratory Co., Ltd. | Speichervorrichtung |
| JP7328146B2 (ja) | 2017-09-06 | 2023-08-16 | 株式会社半導体エネルギー研究所 | 記憶装置及び電子機器 |
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| JP2020047644A (ja) | 2018-09-14 | 2020-03-26 | キオクシア株式会社 | 半導体装置 |
| TW202537448A (zh) | 2019-01-25 | 2025-09-16 | 日商半導體能源研究所股份有限公司 | 半導體裝置及包括該半導體裝置的電子裝置 |
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| TWI735860B (zh) * | 2019-04-08 | 2021-08-11 | 華邦電子股份有限公司 | 記憶元件的製造方法 |
| WO2020222068A1 (ja) | 2019-04-30 | 2020-11-05 | 株式会社半導体エネルギー研究所 | 冗長メモリセルを有する記憶装置、半導体装置、および、電子機器 |
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| US11217291B2 (en) * | 2019-07-11 | 2022-01-04 | Micron Technology, Inc. | Circuitry borrowing for memory arrays |
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| JP2021089972A (ja) * | 2019-12-04 | 2021-06-10 | キオクシア株式会社 | 半導体記憶装置 |
| JP2021108307A (ja) * | 2019-12-27 | 2021-07-29 | キオクシア株式会社 | 半導体記憶装置 |
| CN113451270B (zh) * | 2020-03-25 | 2023-12-05 | 长鑫存储技术有限公司 | 位线结构和半导体存储器 |
| CN116018644A (zh) | 2020-09-06 | 2023-04-25 | 株式会社半导体能源研究所 | 半导体装置及电子设备 |
| CN112599528B (zh) * | 2020-12-14 | 2022-07-12 | 武汉新芯集成电路制造有限公司 | 半导体器件及其制备方法 |
| US20240147708A1 (en) | 2021-05-10 | 2024-05-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US20240251567A1 (en) | 2021-05-28 | 2024-07-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| KR20240014278A (ko) * | 2022-07-25 | 2024-02-01 | 삼성전자주식회사 | 반도체 장치 및 제조 방법 |
| WO2024028680A1 (ja) | 2022-08-02 | 2024-02-08 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| CN116723695A (zh) * | 2023-06-06 | 2023-09-08 | 福建省晋华集成电路有限公司 | 存储器结构 |
| US12444455B2 (en) * | 2023-06-06 | 2025-10-14 | Fujian Jinhua Integrated Circuit Co., Ltd. | Memory structure |
Citations (2)
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- 2011-08-30 KR KR1020187013071A patent/KR101901761B1/ko not_active Expired - Fee Related
- 2011-08-30 KR KR1020137008591A patent/KR20130119421A/ko not_active Ceased
- 2011-08-30 KR KR1020187026561A patent/KR101941143B1/ko not_active Expired - Fee Related
- 2011-08-30 DE DE112011103061T patent/DE112011103061T5/de active Pending
- 2011-09-06 TW TW100132084A patent/TWI539452B/zh active
- 2011-09-06 TW TW106142155A patent/TW201824273A/zh unknown
- 2011-09-06 TW TW105110327A patent/TWI627629B/zh active
- 2011-09-12 US US13/230,184 patent/US9042161B2/en active Active
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2015
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2016
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2015146422A (ja) | 2015-08-13 |
| JP2018082189A (ja) | 2018-05-24 |
| US20160163374A1 (en) | 2016-06-09 |
| TW201638947A (zh) | 2016-11-01 |
| TW201824273A (zh) | 2018-07-01 |
| US20120063208A1 (en) | 2012-03-15 |
| JP2016187047A (ja) | 2016-10-27 |
| JP2012256821A (ja) | 2012-12-27 |
| KR101941143B1 (ko) | 2019-01-22 |
| DE112011103061T5 (de) | 2013-07-04 |
| TWI627629B (zh) | 2018-06-21 |
| TW201218200A (en) | 2012-05-01 |
| KR20180105264A (ko) | 2018-09-27 |
| JP5957551B2 (ja) | 2016-07-27 |
| US9042161B2 (en) | 2015-05-26 |
| JP6483794B2 (ja) | 2019-03-13 |
| KR20180052781A (ko) | 2018-05-18 |
| KR20130119421A (ko) | 2013-10-31 |
| US9263116B2 (en) | 2016-02-16 |
| TWI539452B (zh) | 2016-06-21 |
| JP6263230B2 (ja) | 2018-01-17 |
| WO2012036001A1 (en) | 2012-03-22 |
| US20150255141A1 (en) | 2015-09-10 |
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