JP6799705B2 - 積層背面照射型spadアレイ - Google Patents
積層背面照射型spadアレイ Download PDFInfo
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- JP6799705B2 JP6799705B2 JP2020095891A JP2020095891A JP6799705B2 JP 6799705 B2 JP6799705 B2 JP 6799705B2 JP 2020095891 A JP2020095891 A JP 2020095891A JP 2020095891 A JP2020095891 A JP 2020095891A JP 6799705 B2 JP6799705 B2 JP 6799705B2
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Description
この特許協力条約特許出願は、2016年9月23日に出願された「Back−Illuminated SPAD Image Sensor」と題する米国仮特許出願第62/398,712号、及び2016年9月23日に出願された「Back−Illuminated SPAD Image Sensor」と題する米国仮特許出願第62/398,709号に対する優先権を主張し、これらの内容は、それらの全体が参照により本明細書に組み込まれている。
第1のコンタクトパッド710は、カソード領域706の中心の下に位置するように描かれているが、これは必須ではない。第1のコンタクトパッド710は、SPAD活性領域内の任意の好適な場所に置かれてもよい。
Claims (20)
- 背面照射型単一光子アバランシェダイオード(SPAD)画像センサであって、
単一光子アバランシェダイオード(SPAD)領域を含むウェハを備え、
前記SPAD領域は、
前記ウェハの前面に隣接して配置され、第1のドーパント型を含むカソード領域と、
後縁部ドーパント濃度勾配及び側縁部ドーパント濃度勾配を含むアノード勾配領域と、
前記カソード領域と前記後縁部ドーパント濃度勾配との間に位置するアノードアバランシェ領域と、を備え、
前記アノード勾配領域及び前記アノードアバランシェ領域は、第2のドーパント型を有し、
前記後縁部ドーパント濃度勾配は、前記ウェハの背面と前記アノードアバランシェ領域との間で延在し、前記背面を介して入射する光の光子によって生成された電荷キャリアを、前記アノードアバランシェ領域に導き、
前記側縁部ドーパント濃度勾配は、前記アノード勾配領域の側部から前記アノード勾配領域の内部へ延在し、電荷キャリアを、前記アノード勾配領域の内部へ導く、ように構成されている、背面照射型SPAD画像センサ。 - 前記ウェハは、センサウェハであり、
前記背面照射型SPAD画像センサは、回路ウェハをさらに備え、
前記回路ウェハは、第1のウェハ間コネクタを介して前記SPAD領域に結合された電圧源を備え、
前記電圧源は、前記SPAD領域に逆バイアス電圧を供給し、前記カソード領域と前記アノード勾配領域との間に逆バイアスを提供するように構成されている、請求項1に記載の背面照射型SPAD画像センサ。 - 前記カソード領域内のアバランシェ領域及び前記アノードアバランシェ領域に隣接するガードリングをさらに備え、
前記ガードリングは、前記第1のドーパント型にドープされ、前記ガードリングのドーパント濃度は、前記カソード領域のドーパント濃度より低い、請求項1に記載の背面照射型SPAD画像センサ。 - 前記カソード領域の面積は、前記アノードアバランシェ領域の面積と等しい、請求項3に記載の背面照射型SPAD画像センサ。
- 前記アノード勾配領域内の空乏領域は、前記後縁部ドーパント濃度勾配及び前記側縁部ドーパント濃度勾配によって形作られるように構成されている、請求項1に記載の背面照射型SPAD画像センサ。
- 前記カソード領域と前記アノード勾配領域との間に逆バイアスが印加されたとき、前記空乏領域が、前記アノード勾配領域内に形成されるように構成される、請求項5に記載の背面照射型SPAD画像センサ。
- 背面照射型単一光子アバランシェダイオード(SPAD)画像センサであって、
SPAD領域を備えるセンサウェハと、回路ウェハと、を備え、
前記SPAD領域は、
前記センサウェハの前面に隣接して配置され、前記回路ウェハと面するカソード領域と、
前記センサウェハの背面に隣接するアノード勾配領域と、
前記カソード領域と前記アノード勾配領域との間に位置するアノードアバランシェ領域と、を備え、
前記アノード勾配領域は、
前記センサウェハの背面を横切って延在する側縁部と、
前記側縁部に隣接して横方向に配置された内部と、
前記側縁部から前記内部へ延在する側縁部ドーパント濃度勾配と、を備え、
前記アノード勾配領域は、前記センサウェハの前記背面を介して入射する光の少なくとも1つの光子に反応して、前記アノード勾配領域の前記側縁部に隣接して生成された電荷キャリアを、前記側縁部から前記アノード勾配領域の前記内部へ導くようにドープされている、背面照射型SPAD画像センサ。 - 前記アノード勾配領域は、前記センサウェハの前記背面と、前記アノードアバランシェ領域との間で延在する後縁部ドーパント濃度勾配を備え、
前記後縁部ドーパント濃度勾配は、前記センサウェハの前記背面を介して入射する光の少なくとも1つの光子に反応して生成された電荷キャリアを前記アノードアバランシェ領域の方へ向けるように構成されている、請求項7に記載の背面照射型SPAD画像センサ。 - 前記アノード勾配領域内の空乏領域は、前記後縁部ドーパント濃度勾配及び前記側縁部ドーパント濃度勾配によって形作られるように構成されている、請求項8に記載の背面照射型SPAD画像センサ。
- 前記アノード勾配領域は、前記アノードアバランシェ領域で使用されるドーパント型の低い濃度でドープされる、請求項8に記載の背面照射型SPAD画像センサ。
- 前記SPAD領域は、前記アノードアバランシェ領域に隣接するガードリングをさらに備え、
前記カソード領域及び前記ガードリングは、同じドーパント型でドープされ、
前記ガードリングの前記ドーパント型の第1の濃度は、前記カソード領域の前記ドーパント型の第2の濃度より低い、請求項7に記載の背面照射型SPAD画像センサ。 - 前記ガードリングの前記ドーパント型の第1の濃度が前記カソード領域の前記ドーパント型の第2の濃度より低いことは、前記カソード領域と前記アノードアバランシェ領域との間に形成されたアバランシェ領域の縁部に、低い電界を生成する、請求項11に記載の背面照射型SPAD画像センサ。
- 背面照射型単一光子アバランシェダイオード(SPAD)画像センサ及びプロセッサを備える電子デバイスであって、
前記背面照射型単一光子アバランシェダイオード(SPAD)画像センサは、センサウェハと、前記センサウェハの下に配置された回路ウェハと、を備え、
前記センサウェハは、第1のSPAD領域及び第2のSPAD領域を備え、
前記第1及び第2のSPAD領域の各々は、
前記センサウェハの前面に隣接して配置されたカソード領域と、
前記カソード領域の上に位置するアノードアバランシェ領域と、
アノード勾配領域であって、
前記センサウェハの背面と前記アノードアバランシェ領域との間で延在し、前記背面を介して入射する光の光子によって生成された電荷キャリアを、前記アノードアバランシェ領域に導く後縁部ドーパント濃度勾配と、
前記アノード勾配領域の側部から前記アノード勾配領域の内部へ延在し、前記アノード勾配領域の内部の方へ電荷キャリアを向ける側縁部ドーパント濃度勾配と、を含むアノード勾配領域と、を備え
前記プロセッサは、
前記第1のSPAD領域又は前記第2のSPAD領域のアバランシェ電流の検出を示す前記回路ウェハからの信号を受信し、
受信した前記信号に基づいて、前記センサウェハの前記背面を介して受信した光子の飛行時間を判定するように構成されている、電子デバイス。 - 前記回路ウェハは、
第1のウェハ間コネクタを介して前記第1のSPAD領域に結合され、第2のウェハ間コネクタを介して前記第2のSPAD領域に結合された電圧源であって、前記第1及び第2のSPAD領域に高逆バイアス電圧レベルを提供するように構成された、電圧源と、
第3のウェハ間コネクタを介して各カソード領域に結合された出力回路と、を備える、請求項13に記載の電子デバイス。 - 前記電圧源は、前記第1のウェハ間コネクタを介して前記第1のSPAD領域に電圧を供給し、前記第2のウェハ間コネクタを介して前記第2のSPAD領域に電圧を供給するように構成されている、請求項14に記載の電子デバイス。
- 前記第1のSPAD領域及び前記第2のSPAD領域は、それぞれ、前記カソード領域と前記アノードアバランシェ領域との間に形成されたアバランシェ領域に隣接するガードリングを含み、
前記カソード領域及び前記ガードリングは、同じドーパント型でドープされ、前記ガードリングの前記ドーパント型の第1の濃度は、前記カソード領域の前記ドーパント型の第2の濃度より低い、請求項13に記載の電子デバイス。 - 前記カソード領域及び前記アノードアバランシェ領域の面積は、同じ面積を有する、請求項16に記載の電子デバイス。
- 前記アノード勾配領域は、前記アノードアバランシェ領域で使用されるドーパント型の低い濃度でドープされる、請求項13に記載の電子デバイス。
- 前記アノード勾配領域内の空乏領域は、前記後縁部ドーパント濃度勾配及び前記側縁部ドーパント濃度勾配によって形作られるように構成されている、請求項13に記載の電子デバイス。
- 前記背面照射型SPAD画像センサは、前記第1のSPAD領域と前記第2のSPAD領域との間にディープトレンチ分離をさらに備え、前記ディープトレンチ分離は、前記前面から前記背面を通って延在する、請求項13に記載の電子デバイス。
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