JP2006525682A - 高出力固体発光素子パッケージ - Google Patents
高出力固体発光素子パッケージ Download PDFInfo
- Publication number
- JP2006525682A JP2006525682A JP2006513442A JP2006513442A JP2006525682A JP 2006525682 A JP2006525682 A JP 2006525682A JP 2006513442 A JP2006513442 A JP 2006513442A JP 2006513442 A JP2006513442 A JP 2006513442A JP 2006525682 A JP2006525682 A JP 2006525682A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- light source
- emitting device
- light
- encapsulant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/853—Encapsulations characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/858—Means for heat extraction or cooling
- H10H20/8581—Means for heat extraction or cooling characterised by their material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US46719303P | 2003-04-30 | 2003-04-30 | |
| PCT/US2004/013256 WO2004100279A2 (en) | 2003-04-30 | 2004-04-28 | High-power solid state light emitter package |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011248746A Division JP2012064962A (ja) | 2003-04-30 | 2011-11-14 | 高出力固体発光素子パッケージ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006525682A true JP2006525682A (ja) | 2006-11-09 |
| JP2006525682A5 JP2006525682A5 (enExample) | 2007-05-10 |
Family
ID=33435034
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006513442A Pending JP2006525682A (ja) | 2003-04-30 | 2004-04-28 | 高出力固体発光素子パッケージ |
| JP2011248746A Pending JP2012064962A (ja) | 2003-04-30 | 2011-11-14 | 高出力固体発光素子パッケージ |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011248746A Pending JP2012064962A (ja) | 2003-04-30 | 2011-11-14 | 高出力固体発光素子パッケージ |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9666772B2 (enExample) |
| EP (3) | EP2264798B1 (enExample) |
| JP (2) | JP2006525682A (enExample) |
| KR (1) | KR101148332B1 (enExample) |
| CN (2) | CN101556985B (enExample) |
| CA (1) | CA2523544A1 (enExample) |
| TW (2) | TWI487149B (enExample) |
| WO (1) | WO2004100279A2 (enExample) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006202952A (ja) * | 2005-01-20 | 2006-08-03 | Shin Etsu Chem Co Ltd | シリコーン封止型led |
| JP2008159705A (ja) * | 2006-12-21 | 2008-07-10 | Matsushita Electric Works Ltd | 発光装置 |
| WO2008096714A1 (ja) * | 2007-02-05 | 2008-08-14 | Nikon Corporation | 樹脂封止発光素子、平面状光源及びそれらの製造方法、並びに液晶表示装置 |
| JP2013542618A (ja) * | 2011-10-10 | 2013-11-21 | チェオル ジュ、ジャエ | Ledパッケージの製造方法 |
| JP2013542617A (ja) * | 2011-10-10 | 2013-11-21 | チェオル ジュ、ジャエ | Ledパッケージ |
| JP2015035438A (ja) * | 2013-08-07 | 2015-02-19 | 日亜化学工業株式会社 | 発光装置 |
| JP2015079854A (ja) * | 2013-10-17 | 2015-04-23 | 日亜化学工業株式会社 | 発光装置 |
| KR101621688B1 (ko) * | 2013-05-28 | 2016-05-17 | 미쓰비시덴키 가부시키가이샤 | 점 광원, 면형 광원장치 및 표시장치 |
| JP2017201731A (ja) * | 2017-08-22 | 2017-11-09 | 日亜化学工業株式会社 | 発光装置 |
Families Citing this family (178)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7800121B2 (en) | 2002-08-30 | 2010-09-21 | Lumination Llc | Light emitting diode component |
| US7224000B2 (en) * | 2002-08-30 | 2007-05-29 | Lumination, Llc | Light emitting diode component |
| US7479662B2 (en) | 2002-08-30 | 2009-01-20 | Lumination Llc | Coated LED with improved efficiency |
| US10340424B2 (en) | 2002-08-30 | 2019-07-02 | GE Lighting Solutions, LLC | Light emitting diode component |
| JP2006525682A (ja) | 2003-04-30 | 2006-11-09 | クリー インコーポレイテッド | 高出力固体発光素子パッケージ |
| US7005679B2 (en) | 2003-05-01 | 2006-02-28 | Cree, Inc. | Multiple component solid state white light |
| US7777235B2 (en) * | 2003-05-05 | 2010-08-17 | Lighting Science Group Corporation | Light emitting diodes with improved light collimation |
| US6803607B1 (en) * | 2003-06-13 | 2004-10-12 | Cotco Holdings Limited | Surface mountable light emitting device |
| US6995402B2 (en) * | 2003-10-03 | 2006-02-07 | Lumileds Lighting, U.S., Llc | Integrated reflector cup for a light emitting device mount |
| JP3987485B2 (ja) * | 2003-12-25 | 2007-10-10 | セイコーエプソン株式会社 | 光源装置及びプロジェクタ |
| US7355284B2 (en) * | 2004-03-29 | 2008-04-08 | Cree, Inc. | Semiconductor light emitting devices including flexible film having therein an optical element |
| KR100623024B1 (ko) * | 2004-06-10 | 2006-09-19 | 엘지전자 주식회사 | 고출력 led 패키지 |
| WO2006059828A1 (en) * | 2004-09-10 | 2006-06-08 | Seoul Semiconductor Co., Ltd. | Light emitting diode package having multiple molding resins |
| US7748873B2 (en) * | 2004-10-07 | 2010-07-06 | Seoul Semiconductor Co., Ltd. | Side illumination lens and luminescent device using the same |
| US7352011B2 (en) * | 2004-11-15 | 2008-04-01 | Philips Lumileds Lighting Company, Llc | Wide emitting lens for LED useful for backlighting |
| US7452737B2 (en) * | 2004-11-15 | 2008-11-18 | Philips Lumileds Lighting Company, Llc | Molded lens over LED die |
| US7858408B2 (en) * | 2004-11-15 | 2010-12-28 | Koninklijke Philips Electronics N.V. | LED with phosphor tile and overmolded phosphor in lens |
| US7344902B2 (en) * | 2004-11-15 | 2008-03-18 | Philips Lumileds Lighting Company, Llc | Overmolded lens over LED die |
| KR100580753B1 (ko) * | 2004-12-17 | 2006-05-15 | 엘지이노텍 주식회사 | 발광소자 패키지 |
| US9793247B2 (en) | 2005-01-10 | 2017-10-17 | Cree, Inc. | Solid state lighting component |
| US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
| US7821023B2 (en) | 2005-01-10 | 2010-10-26 | Cree, Inc. | Solid state lighting component |
| JP4876685B2 (ja) * | 2005-04-15 | 2012-02-15 | 旭硝子株式会社 | ガラス封止発光素子の製造方法 |
| WO2006112417A1 (ja) | 2005-04-15 | 2006-10-26 | Asahi Glass Company, Limited | ガラス封止発光素子、ガラス封止発光素子付き回路基板およびそれらの製造方法 |
| US8669572B2 (en) | 2005-06-10 | 2014-03-11 | Cree, Inc. | Power lamp package |
| KR101232505B1 (ko) * | 2005-06-30 | 2013-02-12 | 엘지디스플레이 주식회사 | 발광다이오드 패키지 제조방법, 백라이트 유닛 및액정표시장치 |
| KR100592508B1 (ko) * | 2005-07-15 | 2006-06-26 | 한국광기술원 | 비콘 모양의 기판을 구비한 고출력 발광 다이오드 패키지 |
| JP4925346B2 (ja) * | 2005-07-25 | 2012-04-25 | パナソニック株式会社 | 発光装置 |
| JP2007059857A (ja) * | 2005-07-25 | 2007-03-08 | Matsushita Electric Ind Co Ltd | 発光モジュール及び投映型表示装置 |
| DE102005052356A1 (de) * | 2005-09-30 | 2007-04-12 | Osram Opto Semiconductors Gmbh | Beleuchtungseinheit mit Lumineszenzdiodenchip und Lichtleiter, Verfahren zum Herstellen einer Beleuchtungseinheit und LCD-Display |
| JP2009513021A (ja) * | 2005-10-24 | 2009-03-26 | スリーエム イノベイティブ プロパティズ カンパニー | 成形された封入材を有する発光デバイスの製造方法 |
| US7595515B2 (en) * | 2005-10-24 | 2009-09-29 | 3M Innovative Properties Company | Method of making light emitting device having a molded encapsulant |
| KR20090009772A (ko) | 2005-12-22 | 2009-01-23 | 크리 엘이디 라이팅 솔루션즈, 인크. | 조명 장치 |
| US7675145B2 (en) * | 2006-03-28 | 2010-03-09 | Cree Hong Kong Limited | Apparatus, system and method for use in mounting electronic elements |
| JP2007273562A (ja) * | 2006-03-30 | 2007-10-18 | Toshiba Corp | 半導体発光装置 |
| US8748915B2 (en) | 2006-04-24 | 2014-06-10 | Cree Hong Kong Limited | Emitter package with angled or vertical LED |
| EP2017899A4 (en) * | 2006-04-24 | 2010-06-30 | Asahi Glass Co Ltd | LIGHT-EMITTING COMPONENT |
| EP3422425B1 (en) | 2006-04-24 | 2022-02-23 | CreeLED, Inc. | Side-view surface mount white led |
| US11210971B2 (en) | 2009-07-06 | 2021-12-28 | Cree Huizhou Solid State Lighting Company Limited | Light emitting diode display with tilted peak emission pattern |
| US7635915B2 (en) | 2006-04-26 | 2009-12-22 | Cree Hong Kong Limited | Apparatus and method for use in mounting electronic elements |
| US7521727B2 (en) * | 2006-04-26 | 2009-04-21 | Rohm And Haas Company | Light emitting device having improved light extraction efficiency and method of making same |
| US20070269586A1 (en) * | 2006-05-17 | 2007-11-22 | 3M Innovative Properties Company | Method of making light emitting device with silicon-containing composition |
| US7655486B2 (en) * | 2006-05-17 | 2010-02-02 | 3M Innovative Properties Company | Method of making light emitting device with multilayer silicon-containing encapsulant |
| KR100705552B1 (ko) * | 2006-06-30 | 2007-04-09 | 서울반도체 주식회사 | 발광 다이오드 |
| DE102007021042A1 (de) * | 2006-07-24 | 2008-01-31 | Samsung Electro-Mechanics Co., Ltd., Suwon | Leuchtdiodenmodul für Lichtquellenreihe |
| US8735920B2 (en) * | 2006-07-31 | 2014-05-27 | Cree, Inc. | Light emitting diode package with optical element |
| US20080029720A1 (en) | 2006-08-03 | 2008-02-07 | Intematix Corporation | LED lighting arrangement including light emitting phosphor |
| US8367945B2 (en) | 2006-08-16 | 2013-02-05 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
| US8092735B2 (en) | 2006-08-17 | 2012-01-10 | 3M Innovative Properties Company | Method of making a light emitting device having a molded encapsulant |
| KR101258227B1 (ko) * | 2006-08-29 | 2013-04-25 | 서울반도체 주식회사 | 발광 소자 |
| US7842960B2 (en) | 2006-09-06 | 2010-11-30 | Lumination Llc | Light emitting packages and methods of making same |
| JP5372766B2 (ja) * | 2006-11-15 | 2013-12-18 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | 光取り出し効率の高い球形led |
| US7889421B2 (en) * | 2006-11-17 | 2011-02-15 | Rensselaer Polytechnic Institute | High-power white LEDs and manufacturing method thereof |
| KR100834925B1 (ko) | 2006-12-22 | 2008-06-03 | (주) 아모센스 | 반도체 패키지의 제조방법 |
| US9711703B2 (en) | 2007-02-12 | 2017-07-18 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
| JP2008205170A (ja) * | 2007-02-20 | 2008-09-04 | Nec Lighting Ltd | 発光半導体デバイス |
| JP5179766B2 (ja) * | 2007-03-08 | 2013-04-10 | スタンレー電気株式会社 | 半導体発光装置およびその製造方法 |
| US11114594B2 (en) | 2007-08-24 | 2021-09-07 | Creeled, Inc. | Light emitting device packages using light scattering particles of different size |
| DE102007049799A1 (de) * | 2007-09-28 | 2009-04-02 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
| US8866169B2 (en) | 2007-10-31 | 2014-10-21 | Cree, Inc. | LED package with increased feature sizes |
| USD615504S1 (en) | 2007-10-31 | 2010-05-11 | Cree, Inc. | Emitter package |
| US10256385B2 (en) | 2007-10-31 | 2019-04-09 | Cree, Inc. | Light emitting die (LED) packages and related methods |
| USD633631S1 (en) | 2007-12-14 | 2011-03-01 | Cree Hong Kong Limited | Light source of light emitting diode |
| US9431589B2 (en) | 2007-12-14 | 2016-08-30 | Cree, Inc. | Textured encapsulant surface in LED packages |
| USD634863S1 (en) | 2008-01-10 | 2011-03-22 | Cree Hong Kong Limited | Light source of light emitting diode |
| KR101028852B1 (ko) * | 2008-03-26 | 2011-04-12 | 서울반도체 주식회사 | 사이드뷰 led 패키지 및 이를 포함하는 백라이트 모듈 |
| CN101562221A (zh) * | 2008-04-18 | 2009-10-21 | 富准精密工业(深圳)有限公司 | 侧面发光二极管 |
| US8049230B2 (en) | 2008-05-16 | 2011-11-01 | Cree Huizhou Opto Limited | Apparatus and system for miniature surface mount devices |
| JP5336775B2 (ja) * | 2008-06-11 | 2013-11-06 | パナソニック株式会社 | 発光装置 |
| KR101490862B1 (ko) * | 2008-09-23 | 2015-02-09 | 주식회사 아모센스 | 엘이디 패키지 및 그 엘이디 패키지의 제조 방법 |
| US9425172B2 (en) | 2008-10-24 | 2016-08-23 | Cree, Inc. | Light emitter array |
| US8791471B2 (en) | 2008-11-07 | 2014-07-29 | Cree Hong Kong Limited | Multi-chip light emitting diode modules |
| US8390193B2 (en) * | 2008-12-31 | 2013-03-05 | Intematix Corporation | Light emitting device with phosphor wavelength conversion |
| US8368112B2 (en) | 2009-01-14 | 2013-02-05 | Cree Huizhou Opto Limited | Aligned multiple emitter package |
| TWI413284B (zh) * | 2009-02-24 | 2013-10-21 | 財團法人工業技術研究院 | 發光二極體封裝結構 |
| TWI469402B (zh) * | 2009-02-24 | 2015-01-11 | Ind Tech Res Inst | 發光二極體封裝結構 |
| US8692274B2 (en) | 2009-02-24 | 2014-04-08 | Industrial Technology Research Institute | Light emitting diode package structure |
| US8576406B1 (en) | 2009-02-25 | 2013-11-05 | Physical Optics Corporation | Luminaire illumination system and method |
| CN101866995B (zh) * | 2009-04-16 | 2012-08-08 | 财团法人工业技术研究院 | 发光二极管封装结构 |
| US8101955B2 (en) * | 2009-04-17 | 2012-01-24 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | PLCC package with a reflector cup surrounded by an encapsulant |
| US8089075B2 (en) * | 2009-04-17 | 2012-01-03 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | LFCC package with a reflector cup surrounded by a single encapsulant |
| US8415692B2 (en) | 2009-07-06 | 2013-04-09 | Cree, Inc. | LED packages with scattering particle regions |
| US8598809B2 (en) | 2009-08-19 | 2013-12-03 | Cree, Inc. | White light color changing solid state lighting and methods |
| US9000466B1 (en) | 2010-08-23 | 2015-04-07 | Soraa, Inc. | Methods and devices for light extraction from a group III-nitride volumetric LED using surface and sidewall roughening |
| US8207554B2 (en) * | 2009-09-11 | 2012-06-26 | Soraa, Inc. | System and method for LED packaging |
| US8933644B2 (en) | 2009-09-18 | 2015-01-13 | Soraa, Inc. | LED lamps with improved quality of light |
| US9293667B2 (en) | 2010-08-19 | 2016-03-22 | Soraa, Inc. | System and method for selected pump LEDs with multiple phosphors |
| WO2011037877A1 (en) | 2009-09-25 | 2011-03-31 | Cree, Inc. | Lighting device with low glare and high light level uniformity |
| US8593040B2 (en) | 2009-10-02 | 2013-11-26 | Ge Lighting Solutions Llc | LED lamp with surface area enhancing fins |
| US8575642B1 (en) | 2009-10-30 | 2013-11-05 | Soraa, Inc. | Optical devices having reflection mode wavelength material |
| USD636743S1 (en) * | 2009-12-22 | 2011-04-26 | Panasonic Corporation | Light-emitting diode |
| TWD144346S (zh) * | 2009-12-22 | 2011-12-21 | 松下電器產業股份有限公司 | 發光二極體 |
| USD636741S1 (en) * | 2009-12-22 | 2011-04-26 | Panasonic Corporation | Light-emitting diode |
| USD636742S1 (en) * | 2009-12-22 | 2011-04-26 | Panasonic Corporation | Light-emitting diode |
| KR100993072B1 (ko) * | 2010-01-11 | 2010-11-08 | 엘지이노텍 주식회사 | 발광 소자, 발광 소자 제조방법 및 발광 소자 패키지 |
| US10147850B1 (en) | 2010-02-03 | 2018-12-04 | Soraa, Inc. | System and method for providing color light sources in proximity to predetermined wavelength conversion structures |
| US8905588B2 (en) | 2010-02-03 | 2014-12-09 | Sorra, Inc. | System and method for providing color light sources in proximity to predetermined wavelength conversion structures |
| KR101647796B1 (ko) * | 2010-04-06 | 2016-08-12 | 엘지이노텍 주식회사 | 발광 소자 및 그 제조방법 |
| USD642141S1 (en) * | 2010-06-22 | 2011-07-26 | Panasonic Corporation | Light emitting diode |
| USD650342S1 (en) * | 2010-06-22 | 2011-12-13 | Panasonic Corporation | Light emitting diode |
| USD646235S1 (en) * | 2010-06-22 | 2011-10-04 | Panasonic Corporation | Light emitting diode |
| USD645420S1 (en) * | 2010-06-22 | 2011-09-20 | Panasonic Corporation | Light emitting diode |
| USD650341S1 (en) * | 2010-06-22 | 2011-12-13 | Panasonic Corporation | Light emitting diode |
| USD645419S1 (en) * | 2010-06-22 | 2011-09-20 | Panasonic Corporation | Light emitting diode |
| USD649943S1 (en) * | 2010-07-07 | 2011-12-06 | Panasonic Corporation | Light emitting diode |
| USD649944S1 (en) * | 2010-07-07 | 2011-12-06 | Panasonic Corporation | Light emitting diode |
| USD642143S1 (en) * | 2010-07-07 | 2011-07-26 | Panasonic Corporation | Light emitting diode |
| USD642142S1 (en) * | 2010-07-07 | 2011-07-26 | Panasonic Corporation | Light emitting diode |
| US9293678B2 (en) * | 2010-07-15 | 2016-03-22 | Micron Technology, Inc. | Solid-state light emitters having substrates with thermal and electrical conductivity enhancements and method of manufacture |
| USD680504S1 (en) | 2010-07-30 | 2013-04-23 | Nichia Corporation | Light emitting diode |
| US9546765B2 (en) | 2010-10-05 | 2017-01-17 | Intematix Corporation | Diffuser component having scattering particles |
| US8455882B2 (en) | 2010-10-15 | 2013-06-04 | Cree, Inc. | High efficiency LEDs |
| US8896235B1 (en) | 2010-11-17 | 2014-11-25 | Soraa, Inc. | High temperature LED system using an AC power source |
| US8541951B1 (en) | 2010-11-17 | 2013-09-24 | Soraa, Inc. | High temperature LED system using an AC power source |
| US9048396B2 (en) | 2012-06-11 | 2015-06-02 | Cree, Inc. | LED package with encapsulant having planar surfaces |
| US10147853B2 (en) | 2011-03-18 | 2018-12-04 | Cree, Inc. | Encapsulant with index matched thixotropic agent |
| JP2012238830A (ja) * | 2011-05-09 | 2012-12-06 | Lumirich Co Ltd | 発光ダイオード素子 |
| USD720310S1 (en) | 2011-06-17 | 2014-12-30 | Soraa, Inc. | Triangular semiconductor die |
| US12666769B2 (en) | 2011-06-28 | 2026-06-23 | Korrus, Inc. | System and method for selected pump LEDs with multiple phosphors |
| US9488324B2 (en) | 2011-09-02 | 2016-11-08 | Soraa, Inc. | Accessories for LED lamp systems |
| US9115868B2 (en) | 2011-10-13 | 2015-08-25 | Intematix Corporation | Wavelength conversion component with improved protective characteristics for remote wavelength conversion |
| US8564004B2 (en) | 2011-11-29 | 2013-10-22 | Cree, Inc. | Complex primary optics with intermediate elements |
| US8668366B2 (en) * | 2011-12-07 | 2014-03-11 | Tsmc Solid State Lighting Ltd. | Energy star compliant LED lamp |
| TW201338642A (zh) * | 2012-03-14 | 2013-09-16 | 華新麗華股份有限公司 | 承載發光二極體之基板及該基板之製造方法 |
| TWI528596B (zh) * | 2012-03-16 | 2016-04-01 | 鴻海精密工業股份有限公司 | 發光二極體封裝結構及其製造方法 |
| KR101461154B1 (ko) * | 2012-08-24 | 2014-11-12 | 주식회사 씨티랩 | 반도체 소자 구조물을 제조하는 방법 |
| US8985794B1 (en) | 2012-04-17 | 2015-03-24 | Soraa, Inc. | Providing remote blue phosphors in an LED lamp |
| US9500355B2 (en) | 2012-05-04 | 2016-11-22 | GE Lighting Solutions, LLC | Lamp with light emitting elements surrounding active cooling device |
| US10347609B2 (en) * | 2012-05-04 | 2019-07-09 | Micron Technology, Inc. | Solid-state transducer assemblies with remote converter material for improved light extraction efficiency and associated systems and methods |
| US20130328074A1 (en) * | 2012-06-11 | 2013-12-12 | Cree, Inc. | Led package with multiple element light source and encapsulant having planar surfaces |
| US20130329429A1 (en) * | 2012-06-11 | 2013-12-12 | Cree, Inc. | Emitter package with integrated mixing chamber |
| US10424702B2 (en) * | 2012-06-11 | 2019-09-24 | Cree, Inc. | Compact LED package with reflectivity layer |
| US9887327B2 (en) * | 2012-06-11 | 2018-02-06 | Cree, Inc. | LED package with encapsulant having curved and planar surfaces |
| US10468565B2 (en) | 2012-06-11 | 2019-11-05 | Cree, Inc. | LED package with multiple element light source and encapsulant having curved and/or planar surfaces |
| TW201411892A (zh) * | 2012-09-14 | 2014-03-16 | 隆達電子股份有限公司 | 發光二極體 |
| US9978904B2 (en) | 2012-10-16 | 2018-05-22 | Soraa, Inc. | Indium gallium nitride light emitting devices |
| US20140159084A1 (en) * | 2012-12-12 | 2014-06-12 | Cree, Inc. | Led dome with improved color spatial uniformity |
| US9761763B2 (en) | 2012-12-21 | 2017-09-12 | Soraa, Inc. | Dense-luminescent-materials-coated violet LEDs |
| US20140185269A1 (en) | 2012-12-28 | 2014-07-03 | Intermatix Corporation | Solid-state lamps utilizing photoluminescence wavelength conversion components |
| US10355182B2 (en) | 2013-03-13 | 2019-07-16 | Lumileds Llc | Encapsulated LED lens with bottom reflectors |
| TWI627371B (zh) * | 2013-03-15 | 2018-06-21 | 英特曼帝克司公司 | 光致發光波長轉換組件 |
| USD735683S1 (en) * | 2013-05-03 | 2015-08-04 | Cree, Inc. | LED package |
| CA2911523C (en) | 2013-05-10 | 2018-10-02 | Abl Ip Holding Llc | Silicone optics |
| CN104241262B (zh) | 2013-06-14 | 2020-11-06 | 惠州科锐半导体照明有限公司 | 发光装置以及显示装置 |
| US8994033B2 (en) | 2013-07-09 | 2015-03-31 | Soraa, Inc. | Contacts for an n-type gallium and nitrogen substrate for optical devices |
| TW201505134A (zh) * | 2013-07-25 | 2015-02-01 | 菱生精密工業股份有限公司 | 光學模組的封裝結構 |
| US9461024B2 (en) | 2013-08-01 | 2016-10-04 | Cree, Inc. | Light emitter devices and methods for light emitting diode (LED) chips |
| USD758976S1 (en) * | 2013-08-08 | 2016-06-14 | Cree, Inc. | LED package |
| US9976710B2 (en) | 2013-10-30 | 2018-05-22 | Lilibrand Llc | Flexible strip lighting apparatus and methods |
| US9419189B1 (en) | 2013-11-04 | 2016-08-16 | Soraa, Inc. | Small LED source with high brightness and high efficiency |
| USD746240S1 (en) * | 2013-12-30 | 2015-12-29 | Cree, Inc. | LED package |
| US9601670B2 (en) | 2014-07-11 | 2017-03-21 | Cree, Inc. | Method to form primary optic with variable shapes and/or geometries without a substrate |
| KR102222580B1 (ko) * | 2014-07-30 | 2021-03-05 | 삼성전자주식회사 | 발광 소자 패키지 및 이를 포함하는 표시 장치 |
| US10622522B2 (en) | 2014-09-05 | 2020-04-14 | Theodore Lowes | LED packages with chips having insulated surfaces |
| CN104296072A (zh) * | 2014-10-09 | 2015-01-21 | 青岛海信电器股份有限公司 | 一种发光器件及背光源 |
| USD762184S1 (en) * | 2014-11-13 | 2016-07-26 | Mitsubishi Electric Corporation | Light emitting diode |
| USD826871S1 (en) * | 2014-12-11 | 2018-08-28 | Cree, Inc. | Light emitting diode device |
| US9696199B2 (en) | 2015-02-13 | 2017-07-04 | Taiwan Biophotonic Corporation | Optical sensor |
| US9953797B2 (en) | 2015-09-28 | 2018-04-24 | General Electric Company | Flexible flat emitter for X-ray tubes |
| US10132476B2 (en) | 2016-03-08 | 2018-11-20 | Lilibrand Llc | Lighting system with lens assembly |
| JP1566954S (enExample) * | 2016-04-28 | 2017-01-16 | ||
| TWI583086B (zh) * | 2016-07-18 | 2017-05-11 | 華星光通科技股份有限公司 | 光發射器散熱結構及包含其的光發射器 |
| CN106520050A (zh) * | 2016-10-26 | 2017-03-22 | 安徽飞达电气科技有限公司 | 一种电容器灌封材料 |
| DE102016125909A1 (de) * | 2016-12-30 | 2018-07-05 | Osram Opto Semiconductors Gmbh | Bauteil und Anschlussträger |
| US12388056B1 (en) | 2017-01-27 | 2025-08-12 | Korrus, Inc. | Linear lighting systems and processes |
| CN110998880A (zh) | 2017-01-27 | 2020-04-10 | 莉莉布兰德有限责任公司 | 具有高显色指数和均匀平面照明的照明系统 |
| US20180328552A1 (en) | 2017-03-09 | 2018-11-15 | Lilibrand Llc | Fixtures and lighting accessories for lighting devices |
| JP1588923S (enExample) * | 2017-03-15 | 2017-10-23 | ||
| US20190267526A1 (en) * | 2018-02-26 | 2019-08-29 | Semicon Light Co., Ltd. | Semiconductor Light Emitting Devices And Method Of Manufacturing The Same |
| CN114981592B (zh) | 2018-05-01 | 2024-08-09 | 克鲁斯有限公司 | 具有中央硅酮模块的照明系统及装置 |
| CN114364913B (zh) | 2018-12-17 | 2025-10-28 | 克鲁斯有限公司 | 符合ac驱动功率的条带照明系统 |
| JP7226131B2 (ja) * | 2019-06-25 | 2023-02-21 | 豊田合成株式会社 | 発光装置及びその製造方法 |
| JP7460898B2 (ja) * | 2020-04-24 | 2024-04-03 | 日亜化学工業株式会社 | 発光装置 |
| US11592166B2 (en) | 2020-05-12 | 2023-02-28 | Feit Electric Company, Inc. | Light emitting device having improved illumination and manufacturing flexibility |
| WO2021241188A1 (ja) * | 2020-05-25 | 2021-12-02 | 京セラ株式会社 | 発光装置および表示装置 |
| CN111554788A (zh) * | 2020-06-10 | 2020-08-18 | 广西欣亿光电科技有限公司 | 一种数码专用的led封装结构及生产工艺 |
| US11876042B2 (en) | 2020-08-03 | 2024-01-16 | Feit Electric Company, Inc. | Omnidirectional flexible light emitting device |
| TWI894592B (zh) * | 2022-08-11 | 2025-08-21 | 美商科銳Led公司 | 具有單一透鏡結構的固態發光構件 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS508494A (enExample) * | 1973-05-21 | 1975-01-28 | ||
| JPH09153646A (ja) * | 1995-09-27 | 1997-06-10 | Toshiba Corp | 光半導体装置およびその製造方法 |
| JP2000353826A (ja) * | 1999-06-09 | 2000-12-19 | Sanyo Electric Co Ltd | 混成集積回路装置および光照射装置 |
| JP2002299699A (ja) * | 2001-03-30 | 2002-10-11 | Sumitomo Electric Ind Ltd | 発光装置およびその製造方法 |
| JP2003124522A (ja) * | 2001-10-09 | 2003-04-25 | Citizen Electronics Co Ltd | 発光ダイオード |
Family Cites Families (316)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2127239A5 (enExample) * | 1971-03-01 | 1972-10-13 | Radiotechnique Compelec | |
| JPS5371375A (en) | 1976-12-08 | 1978-06-24 | Schumacher Nihon Kk | Filter for high pressure gas |
| JPS5722581Y2 (enExample) * | 1979-08-21 | 1982-05-17 | ||
| US4476620A (en) * | 1979-10-19 | 1984-10-16 | Matsushita Electric Industrial Co., Ltd. | Method of making a gallium nitride light-emitting diode |
| DE3128187A1 (de) * | 1981-07-16 | 1983-02-03 | Joachim 8068 Pfaffenhofen Sieg | Opto-elektronisches bauelement |
| JPS6016175A (ja) | 1983-07-07 | 1985-01-26 | Toshiba Corp | 制御整流器のデイジタル制御装置 |
| JPS6132483A (ja) | 1984-07-24 | 1986-02-15 | Kimura Denki Kk | Ledを用いた球状発光体 |
| JPS6194362A (ja) | 1984-10-15 | 1986-05-13 | Mitsubishi Electric Corp | サイリスタ装置 |
| JPS61144890A (ja) | 1984-12-19 | 1986-07-02 | Stanley Electric Co Ltd | Ledランプのレンズの製造方法 |
| JPS6214481A (ja) | 1985-07-12 | 1987-01-23 | Saamobonitsuku:Kk | 集熱媒体装置 |
| JPS62143942A (ja) | 1985-12-18 | 1987-06-27 | Taihoo Kogyo Kk | 防曇材 |
| JP2520423B2 (ja) | 1987-06-29 | 1996-07-31 | エヌティエヌ株式会社 | 潤滑性ゴム組成物 |
| US4866005A (en) | 1987-10-26 | 1989-09-12 | North Carolina State University | Sublimation of silicon carbide to produce large, device quality single crystals of silicon carbide |
| JPH01230274A (ja) | 1987-11-13 | 1989-09-13 | Iwasaki Electric Co Ltd | 発光ダイオード |
| US5094185A (en) * | 1987-11-24 | 1992-03-10 | Lumel, Inc. | Electroluminescent lamps and phosphors |
| JPH01139664A (ja) | 1987-11-27 | 1989-06-01 | Sanken Kagaku Kk | 溶剤型粘着剤 |
| JPH0770755B2 (ja) * | 1988-01-21 | 1995-07-31 | 三菱化学株式会社 | 高輝度led用エピタキシャル基板及びその製造方法 |
| JPH01287973A (ja) | 1988-05-13 | 1989-11-20 | Takiron Co Ltd | ドットマトリックス発光表示体 |
| US4912532A (en) * | 1988-08-26 | 1990-03-27 | Hewlett-Packard Company | Electro-optical device with inverted transparent substrate and method for making same |
| US5087949A (en) * | 1989-06-27 | 1992-02-11 | Hewlett-Packard Company | Light-emitting diode with diagonal faces |
| EP0405757A3 (en) | 1989-06-27 | 1991-01-30 | Hewlett-Packard Company | High efficiency light-emitting diode |
| US5103271A (en) * | 1989-09-28 | 1992-04-07 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device and method of fabricating the same |
| US4946547A (en) * | 1989-10-13 | 1990-08-07 | Cree Research, Inc. | Method of preparing silicon carbide surfaces for crystal growth |
| JPH0644567B2 (ja) | 1989-12-18 | 1994-06-08 | 株式会社日立製作所 | 半導体形状の改善方法 |
| JPH04555A (ja) | 1990-04-17 | 1992-01-06 | Matsushita Electric Ind Co Ltd | データ処理装置 |
| US5226052A (en) * | 1990-05-08 | 1993-07-06 | Rohm, Ltd. | Laser diode system for cutting off the environment from the laser diode |
| JPH0428269A (ja) * | 1990-05-23 | 1992-01-30 | Fujikura Ltd | Ledベアチップの実装構造 |
| US5200022A (en) * | 1990-10-03 | 1993-04-06 | Cree Research, Inc. | Method of improving mechanically prepared substrate surfaces of alpha silicon carbide for deposition of beta silicon carbide thereon and resulting product |
| JP2765256B2 (ja) | 1991-04-10 | 1998-06-11 | 日立電線株式会社 | 発光ダイオード |
| JPH06275866A (ja) | 1993-03-19 | 1994-09-30 | Fujitsu Ltd | ポーラス半導体発光装置と製造方法 |
| JPH05327012A (ja) | 1992-05-15 | 1993-12-10 | Sanyo Electric Co Ltd | 炭化ケイ素発光ダイオード |
| JP3269668B2 (ja) | 1992-09-18 | 2002-03-25 | 株式会社日立製作所 | 太陽電池 |
| US5298767A (en) | 1992-10-06 | 1994-03-29 | Kulite Semiconductor Products, Inc. | Porous silicon carbide (SiC) semiconductor device |
| JPH06177427A (ja) | 1992-12-03 | 1994-06-24 | Rohm Co Ltd | 発光ダイオードランプ |
| US5376580A (en) * | 1993-03-19 | 1994-12-27 | Hewlett-Packard Company | Wafer bonding of light emitting diode layers |
| US5834570A (en) * | 1993-06-08 | 1998-11-10 | Nippon Steel Chemical Co., Ltd. | Epoxy resin composition |
| JPH077180A (ja) | 1993-06-16 | 1995-01-10 | Sanyo Electric Co Ltd | 発光素子 |
| GB9320291D0 (en) | 1993-10-01 | 1993-11-17 | Brown John H | Optical directing devices for light emitting diodes |
| JPH08148280A (ja) * | 1994-04-14 | 1996-06-07 | Toshiba Corp | 半導体装置およびその製造方法 |
| JP2994219B2 (ja) * | 1994-05-24 | 1999-12-27 | シャープ株式会社 | 半導体デバイスの製造方法 |
| EP0705856A2 (en) * | 1994-10-07 | 1996-04-10 | Shell Internationale Researchmaatschappij B.V. | Epoxy resin composition for semiconductor encapsulation |
| JP3127195B2 (ja) | 1994-12-06 | 2001-01-22 | シャープ株式会社 | 発光デバイスおよびその製造方法 |
| US5614734A (en) * | 1995-03-15 | 1997-03-25 | Yale University | High efficency LED structure |
| JP3792268B2 (ja) | 1995-05-23 | 2006-07-05 | ローム株式会社 | チップタイプ発光装置の製造方法 |
| JPH0983018A (ja) | 1995-09-11 | 1997-03-28 | Nippon Denyo Kk | 発光ダイオードユニット |
| US5851449A (en) * | 1995-09-27 | 1998-12-22 | Kabushiki Kaisha Toshiba | Method for manufacturing a surface-mounted type optical semiconductor device |
| JPH09138402A (ja) | 1995-11-15 | 1997-05-27 | Kouha:Kk | 液晶表示装置照明用ledバックライト装置 |
| JP3311914B2 (ja) | 1995-12-27 | 2002-08-05 | 株式会社シチズン電子 | チップ型発光ダイオード |
| US5985687A (en) | 1996-04-12 | 1999-11-16 | The Regents Of The University Of California | Method for making cleaved facets for lasers fabricated with gallium nitride and other noncubic materials |
| US20040239243A1 (en) | 1996-06-13 | 2004-12-02 | Roberts John K. | Light emitting assembly |
| US6550949B1 (en) * | 1996-06-13 | 2003-04-22 | Gentex Corporation | Systems and components for enhancing rear vision from a vehicle |
| US5803579A (en) | 1996-06-13 | 1998-09-08 | Gentex Corporation | Illuminator assembly incorporating light emitting diodes |
| JPH1012929A (ja) | 1996-06-25 | 1998-01-16 | Hitachi Cable Ltd | 発光ダイオードの実装構造 |
| DE19638667C2 (de) * | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
| EP2282354B1 (de) * | 1996-06-26 | 2013-09-11 | OSRAM Opto Semiconductors GmbH | Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
| TW383508B (en) | 1996-07-29 | 2000-03-01 | Nichia Kagaku Kogyo Kk | Light emitting device and display |
| DE19640594B4 (de) * | 1996-10-01 | 2016-08-04 | Osram Gmbh | Bauelement |
| JPH10163535A (ja) | 1996-11-27 | 1998-06-19 | Kasei Optonix Co Ltd | 白色発光素子 |
| JP3065263B2 (ja) | 1996-12-27 | 2000-07-17 | 日亜化学工業株式会社 | 発光装置及びそれを用いたled表示器 |
| ATE464586T1 (de) | 1997-02-13 | 2010-04-15 | Honeywell Int Inc | Beleuchtungssystem mit wiederverwendung des lichts zur erhöhung der helligkeit |
| JPH10233532A (ja) | 1997-02-21 | 1998-09-02 | Houshin Kagaku Sangiyoushiyo:Kk | 発光ダイオード |
| JP3985065B2 (ja) | 1997-05-14 | 2007-10-03 | 忠弘 大見 | 多孔質シリコン基板の形成方法及び多孔質シリコン基板の形成装置 |
| US5939732A (en) * | 1997-05-22 | 1999-08-17 | Kulite Semiconductor Products, Inc. | Vertical cavity-emitting porous silicon carbide light-emitting diode device and preparation thereof |
| US6784463B2 (en) | 1997-06-03 | 2004-08-31 | Lumileds Lighting U.S., Llc | III-Phospide and III-Arsenide flip chip light-emitting devices |
| JPH1126808A (ja) | 1997-07-09 | 1999-01-29 | Matsushita Electric Ind Co Ltd | 発光素子およびその製造方法 |
| US5847507A (en) * | 1997-07-14 | 1998-12-08 | Hewlett-Packard Company | Fluorescent dye added to epoxy of light emitting diode lens |
| JP3663281B2 (ja) | 1997-07-15 | 2005-06-22 | ローム株式会社 | 半導体発光素子 |
| US7014336B1 (en) * | 1999-11-18 | 2006-03-21 | Color Kinetics Incorporated | Systems and methods for generating and modulating illumination conditions |
| JPH11224960A (ja) * | 1997-11-19 | 1999-08-17 | Unisplay Sa | Ledランプ並びにledチップ |
| JPH11177129A (ja) | 1997-12-16 | 1999-07-02 | Rohm Co Ltd | チップ型led、ledランプおよびledディスプレイ |
| US6071795A (en) * | 1998-01-23 | 2000-06-06 | The Regents Of The University Of California | Separation of thin films from transparent substrates by selective optical processing |
| US6184544B1 (en) * | 1998-01-29 | 2001-02-06 | Rohm Co., Ltd. | Semiconductor light emitting device with light reflective current diffusion layer |
| JPH11220178A (ja) * | 1998-01-30 | 1999-08-10 | Rohm Co Ltd | 半導体発光装置 |
| DE19813269A1 (de) * | 1998-03-25 | 1999-09-30 | Hoechst Diafoil Gmbh | Siegelfähige Polyesterfolie mit hoher Sauerstoffbarriere, Verfahren zu ihrer Herstellung und ihre Verwendung |
| JP3704941B2 (ja) | 1998-03-30 | 2005-10-12 | 日亜化学工業株式会社 | 発光装置 |
| JP4319265B2 (ja) * | 1998-04-22 | 2009-08-26 | 株式会社デンソー | 厚膜回路基板の焼成方法 |
| DE19829197C2 (de) | 1998-06-30 | 2002-06-20 | Siemens Ag | Strahlungsaussendendes und/oder -empfangendes Bauelement |
| US6225647B1 (en) * | 1998-07-27 | 2001-05-01 | Kulite Semiconductor Products, Inc. | Passivation of porous semiconductors for improved optoelectronic device performance and light-emitting diode based on same |
| US5959316A (en) | 1998-09-01 | 1999-09-28 | Hewlett-Packard Company | Multiple encapsulation of phosphor-LED devices |
| EP1115163A4 (en) | 1998-09-10 | 2001-12-05 | Rohm Co Ltd | Semiconductor light-emitting device and method for manufacturing the same |
| JP3525061B2 (ja) | 1998-09-25 | 2004-05-10 | 株式会社東芝 | 半導体発光素子の製造方法 |
| JP4366016B2 (ja) | 1998-09-28 | 2009-11-18 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 照明装置 |
| US6274924B1 (en) | 1998-11-05 | 2001-08-14 | Lumileds Lighting, U.S. Llc | Surface mountable LED package |
| US6429583B1 (en) | 1998-11-30 | 2002-08-06 | General Electric Company | Light emitting device with ba2mgsi2o7:eu2+, ba2sio4:eu2+, or (srxcay ba1-x-y)(a1zga1-z)2sr:eu2+phosphors |
| JP3469484B2 (ja) | 1998-12-24 | 2003-11-25 | 株式会社東芝 | 半導体発光素子およびその製造方法 |
| US6744800B1 (en) * | 1998-12-30 | 2004-06-01 | Xerox Corporation | Method and structure for nitride based laser diode arrays on an insulating substrate |
| JP2000208822A (ja) * | 1999-01-11 | 2000-07-28 | Matsushita Electronics Industry Corp | 半導体発光装置 |
| US6212213B1 (en) * | 1999-01-29 | 2001-04-03 | Agilent Technologies, Inc. | Projector light source utilizing a solid state green light source |
| US20010042866A1 (en) | 1999-02-05 | 2001-11-22 | Carrie Carter Coman | Inxalygazn optical emitters fabricated via substrate removal |
| US6320206B1 (en) * | 1999-02-05 | 2001-11-20 | Lumileds Lighting, U.S., Llc | Light emitting devices having wafer bonded aluminum gallium indium nitride structures and mirror stacks |
| US6521916B2 (en) | 1999-03-15 | 2003-02-18 | Gentex Corporation | Radiation emitter device having an encapsulant with different zones of thermal conductivity |
| US6258699B1 (en) * | 1999-05-10 | 2001-07-10 | Visual Photonics Epitaxy Co., Ltd. | Light emitting diode with a permanent subtrate of transparent glass or quartz and the method for manufacturing the same |
| US6222207B1 (en) * | 1999-05-24 | 2001-04-24 | Lumileds Lighting, U.S. Llc | Diffusion barrier for increased mirror reflectivity in reflective solderable contacts on high power LED chip |
| EP1059678A2 (en) * | 1999-06-09 | 2000-12-13 | Sanyo Electric Co., Ltd. | Hybrid integrated circuit device |
| US6548832B1 (en) * | 1999-06-09 | 2003-04-15 | Sanyo Electric Co., Ltd. | Hybrid integrated circuit device |
| TW502458B (en) | 1999-06-09 | 2002-09-11 | Toshiba Corp | Bonding type semiconductor substrate, semiconductor light emission element and manufacturing method thereof |
| US6489637B1 (en) * | 1999-06-09 | 2002-12-03 | Sanyo Electric Co., Ltd. | Hybrid integrated circuit device |
| JP2001000043A (ja) | 1999-06-18 | 2001-01-09 | Mitsubishi Chemicals Corp | 栽培用光源 |
| EP1107321A4 (en) * | 1999-06-23 | 2006-08-30 | Citizen Electronics | LIGHT-EMITTING DIODE |
| DE19931689A1 (de) * | 1999-07-08 | 2001-01-11 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Optoelektronische Bauteilgruppe |
| DE19952932C1 (de) * | 1999-11-03 | 2001-05-03 | Osram Opto Semiconductors Gmbh | LED-Weißlichtquelle mit breitbandiger Anregung |
| US6513949B1 (en) * | 1999-12-02 | 2003-02-04 | Koninklijke Philips Electronics N.V. | LED/phosphor-LED hybrid lighting systems |
| EP2270883A3 (en) | 1999-12-03 | 2015-09-30 | Cree, Inc. | Enhanced light extraction in LEDs through the use of internal and external optical elements |
| US6350041B1 (en) * | 1999-12-03 | 2002-02-26 | Cree Lighting Company | High output radial dispersing lamp using a solid state light source |
| US6410942B1 (en) * | 1999-12-03 | 2002-06-25 | Cree Lighting Company | Enhanced light extraction through the use of micro-LED arrays |
| JP4125848B2 (ja) * | 1999-12-17 | 2008-07-30 | ローム株式会社 | ケース付チップ型発光装置 |
| JP2001177153A (ja) | 1999-12-17 | 2001-06-29 | Sharp Corp | 発光装置 |
| US6573537B1 (en) * | 1999-12-22 | 2003-06-03 | Lumileds Lighting, U.S., Llc | Highly reflective ohmic contacts to III-nitride flip-chip LEDs |
| US6486499B1 (en) | 1999-12-22 | 2002-11-26 | Lumileds Lighting U.S., Llc | III-nitride light-emitting device with increased light generating capability |
| JP2000315826A (ja) | 2000-01-01 | 2000-11-14 | Nichia Chem Ind Ltd | 発光装置及びその形成方法、砲弾型発光ダイオード、チップタイプled |
| JP3696021B2 (ja) | 2000-01-20 | 2005-09-14 | 三洋電機株式会社 | 光照射装置 |
| TW465123B (en) | 2000-02-02 | 2001-11-21 | Ind Tech Res Inst | High power white light LED |
| HK1041367A1 (en) * | 2000-02-09 | 2002-07-05 | Nippon Leiz Corporation | light source |
| JP2001223388A (ja) * | 2000-02-09 | 2001-08-17 | Nippon Leiz Co Ltd | 光源装置 |
| DE10008583A1 (de) * | 2000-02-24 | 2001-09-13 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines optisch transparenten Substrates und Verfahren zum Herstellen eines lichtemittierenden Halbleiterchips |
| US6538371B1 (en) * | 2000-03-27 | 2003-03-25 | The General Electric Company | White light illumination system with improved color output |
| JP4060511B2 (ja) * | 2000-03-28 | 2008-03-12 | パイオニア株式会社 | 窒化物半導体素子の分離方法 |
| US7319247B2 (en) | 2000-04-26 | 2008-01-15 | Osram Gmbh | Light emitting-diode chip and a method for producing same |
| US20020011192A1 (en) * | 2000-05-09 | 2002-01-31 | Yuji Tachizuka | Moisture conditioning building material and its production method |
| US6534346B2 (en) | 2000-05-16 | 2003-03-18 | Nippon Electric Glass Co., Ltd. | Glass and glass tube for encapsulating semiconductors |
| US6577073B2 (en) * | 2000-05-31 | 2003-06-10 | Matsushita Electric Industrial Co., Ltd. | Led lamp |
| JP4386693B2 (ja) | 2000-05-31 | 2009-12-16 | パナソニック株式会社 | Ledランプおよびランプユニット |
| JP2001345485A (ja) * | 2000-06-02 | 2001-12-14 | Toyoda Gosei Co Ltd | 発光装置 |
| GB0015898D0 (en) * | 2000-06-28 | 2000-08-23 | Oxley Dev Co Ltd | Light |
| US6562648B1 (en) * | 2000-08-23 | 2003-05-13 | Xerox Corporation | Structure and method for separation and transfer of semiconductor thin films onto dissimilar substrate materials |
| JP2002076443A (ja) | 2000-08-29 | 2002-03-15 | Citizen Electronics Co Ltd | Ledチップ用反射カップ |
| DE10042947A1 (de) * | 2000-08-31 | 2002-03-21 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Halbleiterbauelement auf GaN-Basis |
| US6345903B1 (en) * | 2000-09-01 | 2002-02-12 | Citizen Electronics Co., Ltd. | Surface-mount type emitting diode and method of manufacturing same |
| JP2002141556A (ja) | 2000-09-12 | 2002-05-17 | Lumileds Lighting Us Llc | 改良された光抽出効果を有する発光ダイオード |
| JP3466144B2 (ja) | 2000-09-22 | 2003-11-10 | 士郎 酒井 | 半導体の表面を荒くする方法 |
| JP4565723B2 (ja) | 2000-09-26 | 2010-10-20 | ローム株式会社 | 半導体発光装置 |
| US6429460B1 (en) * | 2000-09-28 | 2002-08-06 | United Epitaxy Company, Ltd. | Highly luminous light emitting device |
| US6998281B2 (en) | 2000-10-12 | 2006-02-14 | General Electric Company | Solid state lighting device with reduced form factor including LED with directional emission and package with microoptics |
| KR100549249B1 (ko) * | 2000-10-20 | 2006-02-03 | 죠스케 나카다 | 발광 또는 수광용 반도체 장치 및 그 제조 방법 |
| JP4091261B2 (ja) * | 2000-10-31 | 2008-05-28 | 株式会社東芝 | 半導体発光素子及びその製造方法 |
| WO2002041364A2 (en) | 2000-11-16 | 2002-05-23 | Emcore Corporation | Led packages having improved light extraction |
| JP5110744B2 (ja) | 2000-12-21 | 2012-12-26 | フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー | 発光装置及びその製造方法 |
| AT410266B (de) | 2000-12-28 | 2003-03-25 | Tridonic Optoelectronics Gmbh | Lichtquelle mit einem lichtemittierenden element |
| US6930737B2 (en) | 2001-01-16 | 2005-08-16 | Visteon Global Technologies, Inc. | LED backlighting system |
| JP2002217450A (ja) | 2001-01-22 | 2002-08-02 | Sanken Electric Co Ltd | 半導体発光素子及びその製造方法 |
| MY145695A (en) | 2001-01-24 | 2012-03-30 | Nichia Corp | Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same |
| US6791119B2 (en) | 2001-02-01 | 2004-09-14 | Cree, Inc. | Light emitting diodes including modifications for light extraction |
| JP2002261333A (ja) * | 2001-03-05 | 2002-09-13 | Toyoda Gosei Co Ltd | 発光装置 |
| JP3830083B2 (ja) | 2001-03-07 | 2006-10-04 | スタンレー電気株式会社 | 半導体装置およびその製造方法 |
| JP4430264B2 (ja) | 2001-03-19 | 2010-03-10 | 日亜化学工業株式会社 | 表面実装型発光装置 |
| US6468824B2 (en) | 2001-03-22 | 2002-10-22 | Uni Light Technology Inc. | Method for forming a semiconductor device having a metallic substrate |
| US6833566B2 (en) * | 2001-03-28 | 2004-12-21 | Toyoda Gosei Co., Ltd. | Light emitting diode with heat sink |
| JP2003115204A (ja) | 2001-10-04 | 2003-04-18 | Toyoda Gosei Co Ltd | 遮光反射型デバイス及び光源 |
| JP2002289923A (ja) | 2001-03-28 | 2002-10-04 | Toyoda Gosei Co Ltd | 発光ダイオード及びその製造方法 |
| JP4101468B2 (ja) * | 2001-04-09 | 2008-06-18 | 豊田合成株式会社 | 発光装置の製造方法 |
| US6686676B2 (en) * | 2001-04-30 | 2004-02-03 | General Electric Company | UV reflectors and UV-based light sources having reduced UV radiation leakage incorporating the same |
| US6616862B2 (en) * | 2001-05-21 | 2003-09-09 | General Electric Company | Yellow light-emitting halophosphate phosphors and light sources incorporating the same |
| JP3940596B2 (ja) * | 2001-05-24 | 2007-07-04 | 松下電器産業株式会社 | 照明光源 |
| JP3767420B2 (ja) | 2001-05-29 | 2006-04-19 | 豊田合成株式会社 | 発光素子 |
| US6946788B2 (en) | 2001-05-29 | 2005-09-20 | Toyoda Gosei Co., Ltd. | Light-emitting element |
| JP4789350B2 (ja) | 2001-06-11 | 2011-10-12 | シチズン電子株式会社 | 発光ダイオードの製造方法 |
| JP4098568B2 (ja) | 2001-06-25 | 2008-06-11 | 株式会社東芝 | 半導体発光素子及びその製造方法 |
| JP2003017756A (ja) | 2001-06-28 | 2003-01-17 | Toyoda Gosei Co Ltd | 発光ダイオード |
| DE10131698A1 (de) | 2001-06-29 | 2003-01-30 | Osram Opto Semiconductors Gmbh | Oberflächenmontierbares strahlungsemittierendes Bauelement und Verfahren zu dessen Herstellung |
| JP3548735B2 (ja) * | 2001-06-29 | 2004-07-28 | 士郎 酒井 | 窒化ガリウム系化合物半導体の製造方法 |
| JP2003037297A (ja) | 2001-07-25 | 2003-02-07 | Sanyo Electric Co Ltd | 光照射装置とその製造方法及びその光照射装置を用いた照明装置 |
| JP2003036707A (ja) | 2001-07-25 | 2003-02-07 | Sanyo Electric Co Ltd | 照明装置とその製造方法 |
| JP2003110146A (ja) | 2001-07-26 | 2003-04-11 | Matsushita Electric Works Ltd | 発光装置 |
| JP4122737B2 (ja) | 2001-07-26 | 2008-07-23 | 松下電工株式会社 | 発光装置の製造方法 |
| TW552726B (en) * | 2001-07-26 | 2003-09-11 | Matsushita Electric Works Ltd | Light emitting device in use of LED |
| US20030030063A1 (en) * | 2001-07-27 | 2003-02-13 | Krzysztof Sosniak | Mixed color leds for auto vanity mirrors and other applications where color differentiation is critical |
| JP2003046117A (ja) | 2001-07-30 | 2003-02-14 | Kyocera Corp | 半導体発光素子の製造方法 |
| JP4147755B2 (ja) | 2001-07-31 | 2008-09-10 | 日亜化学工業株式会社 | 発光装置とその製造方法 |
| DE10137641A1 (de) | 2001-08-03 | 2003-02-20 | Osram Opto Semiconductors Gmbh | Hybrid-LED |
| TW506145B (en) | 2001-10-04 | 2002-10-11 | United Epitaxy Co Ltd | High Luminescence LED having transparent substrate flip-chip type LED die |
| US6498355B1 (en) | 2001-10-09 | 2002-12-24 | Lumileds Lighting, U.S., Llc | High flux LED array |
| US6610598B2 (en) | 2001-11-14 | 2003-08-26 | Solidlite Corporation | Surface-mounted devices of light-emitting diodes with small lens |
| US6552495B1 (en) * | 2001-12-19 | 2003-04-22 | Koninklijke Philips Electronics N.V. | Adaptive control system and method with spatial uniform color metric for RGB LED based white light illumination |
| JP4077312B2 (ja) | 2001-12-28 | 2008-04-16 | 株式会社東芝 | 発光素子の製造方法および発光素子 |
| TW520616B (en) | 2001-12-31 | 2003-02-11 | Ritdisplay Corp | Manufacturing method of organic surface light emitting device |
| US6480389B1 (en) * | 2002-01-04 | 2002-11-12 | Opto Tech Corporation | Heat dissipation structure for solid-state light emitting device package |
| JP3802424B2 (ja) | 2002-01-15 | 2006-07-26 | 株式会社東芝 | 半導体発光素子及びその製造方法 |
| US6936855B1 (en) * | 2002-01-16 | 2005-08-30 | Shane Harrah | Bendable high flux LED array |
| JP3782357B2 (ja) | 2002-01-18 | 2006-06-07 | 株式会社東芝 | 半導体発光素子の製造方法 |
| CN101383393B (zh) | 2002-01-28 | 2013-03-20 | 日亚化学工业株式会社 | 具有支持衬底的氮化物半导体器件及其制造方法 |
| JP2003234509A (ja) | 2002-02-08 | 2003-08-22 | Citizen Electronics Co Ltd | 発光ダイオード |
| CN2535926Y (zh) | 2002-02-08 | 2003-02-12 | 陈巧 | 发光二极管封装结构 |
| KR200277135Y1 (ko) | 2002-03-04 | 2002-05-30 | 주식회사 토우그린 | 레이저 안개등 |
| US6716654B2 (en) | 2002-03-12 | 2004-04-06 | Opto Tech Corporation | Light-emitting diode with enhanced brightness and method for fabricating the same |
| SG185827A1 (en) * | 2002-03-22 | 2012-12-28 | Nichia Corp | Nitride phosphor and production process thereof, and light emitting device |
| JP2003347601A (ja) | 2002-05-28 | 2003-12-05 | Matsushita Electric Works Ltd | 発光ダイオード照明装置 |
| JP3707688B2 (ja) | 2002-05-31 | 2005-10-19 | スタンレー電気株式会社 | 発光装置およびその製造方法 |
| JP2004031856A (ja) | 2002-06-28 | 2004-01-29 | Sumitomo Electric Ind Ltd | ZnSe系発光装置およびその製造方法 |
| JP4197109B2 (ja) | 2002-08-06 | 2008-12-17 | 静雄 藤田 | 照明装置 |
| US7244965B2 (en) | 2002-09-04 | 2007-07-17 | Cree Inc, | Power surface mount light emitting die package |
| JP3991961B2 (ja) | 2002-09-05 | 2007-10-17 | 日亜化学工業株式会社 | 側面発光型発光装置 |
| TWI292961B (en) | 2002-09-05 | 2008-01-21 | Nichia Corp | Semiconductor device and an optical device using the semiconductor device |
| JP4349782B2 (ja) | 2002-09-11 | 2009-10-21 | 東芝ライテック株式会社 | Led照明装置 |
| TW546859B (en) | 2002-09-20 | 2003-08-11 | Formosa Epitaxy Inc | Structure and manufacturing method of GaN light emitting diode |
| JP2004119839A (ja) | 2002-09-27 | 2004-04-15 | Toshiba Corp | 光半導体装置及びその製造方法 |
| JP2004127988A (ja) | 2002-09-30 | 2004-04-22 | Toyoda Gosei Co Ltd | 白色発光装置 |
| US6784460B2 (en) * | 2002-10-10 | 2004-08-31 | Agilent Technologies, Inc. | Chip shaping for flip-chip light emitting diode |
| US7009199B2 (en) * | 2002-10-22 | 2006-03-07 | Cree, Inc. | Electronic devices having a header and antiparallel connected light emitting diodes for producing light from AC current |
| JP4277508B2 (ja) | 2002-10-28 | 2009-06-10 | パナソニック電工株式会社 | 半導体発光装置 |
| TW569479B (en) * | 2002-12-20 | 2004-01-01 | Ind Tech Res Inst | White-light LED applying omnidirectional reflector |
| US7091653B2 (en) * | 2003-01-27 | 2006-08-15 | 3M Innovative Properties Company | Phosphor based light sources having a non-planar long pass reflector |
| JP2004238441A (ja) | 2003-02-04 | 2004-08-26 | Nitto Denko Corp | 光半導体素子封止用樹脂 |
| US6786390B2 (en) | 2003-02-04 | 2004-09-07 | United Epitaxy Company Ltd. | LED stack manufacturing method and its structure thereof |
| US6936857B2 (en) * | 2003-02-18 | 2005-08-30 | Gelcore, Llc | White light LED device |
| JP2004266124A (ja) | 2003-03-03 | 2004-09-24 | Matsushita Electric Ind Co Ltd | 半導体発光装置 |
| JP4182783B2 (ja) * | 2003-03-14 | 2008-11-19 | 豊田合成株式会社 | Ledパッケージ |
| JP4504662B2 (ja) * | 2003-04-09 | 2010-07-14 | シチズン電子株式会社 | Ledランプ |
| US6964507B2 (en) | 2003-04-25 | 2005-11-15 | Everbrite, Llc | Sign illumination system |
| DE10319274A1 (de) * | 2003-04-29 | 2004-12-02 | Osram Opto Semiconductors Gmbh | Lichtquelle |
| JP2006525682A (ja) | 2003-04-30 | 2006-11-09 | クリー インコーポレイテッド | 高出力固体発光素子パッケージ |
| US7005679B2 (en) * | 2003-05-01 | 2006-02-28 | Cree, Inc. | Multiple component solid state white light |
| US6869812B1 (en) * | 2003-05-13 | 2005-03-22 | Heng Liu | High power AllnGaN based multi-chip light emitting diode |
| JP2004356116A (ja) | 2003-05-26 | 2004-12-16 | Citizen Electronics Co Ltd | 発光ダイオード |
| JP5142523B2 (ja) | 2003-06-04 | 2013-02-13 | チェオル ユー,ミュング | 縦型構造複合半導体装置 |
| JP4374913B2 (ja) | 2003-06-05 | 2009-12-02 | 日亜化学工業株式会社 | 発光装置 |
| JP3878579B2 (ja) | 2003-06-11 | 2007-02-07 | ローム株式会社 | 光半導体装置 |
| JP4085899B2 (ja) | 2003-06-30 | 2008-05-14 | 日立エーアイシー株式会社 | 発光デバイス用基板および発光デバイス |
| DE102004001312B4 (de) | 2003-07-25 | 2010-09-30 | Seoul Semiconductor Co., Ltd. | Chip-Leuchtdiode und Verfahren zu ihrer Herstellung |
| JP4360858B2 (ja) | 2003-07-29 | 2009-11-11 | シチズン電子株式会社 | 表面実装型led及びそれを用いた発光装置 |
| US6923002B2 (en) | 2003-08-28 | 2005-08-02 | General Electric Company | Combustion liner cap assembly for combustion dynamics reduction |
| US6806112B1 (en) | 2003-09-22 | 2004-10-19 | National Chung-Hsing University | High brightness light emitting diode |
| EP1670073B1 (en) | 2003-09-30 | 2014-07-02 | Kabushiki Kaisha Toshiba | Light emitting device |
| US6972438B2 (en) | 2003-09-30 | 2005-12-06 | Cree, Inc. | Light emitting diode with porous SiC substrate and method for fabricating |
| JP2005109212A (ja) | 2003-09-30 | 2005-04-21 | Stanley Electric Co Ltd | 半導体発光装置 |
| KR20050034936A (ko) | 2003-10-10 | 2005-04-15 | 삼성전기주식회사 | 형광체를 이용한 파장변환형 발광 다이오드 패키지 및제조방법 |
| JP2005123238A (ja) | 2003-10-14 | 2005-05-12 | Matsushita Electric Ind Co Ltd | 半導体発光装置の製造方法および半導体発光装置 |
| US20050082562A1 (en) * | 2003-10-15 | 2005-04-21 | Epistar Corporation | High efficiency nitride based light emitting device |
| JP4458804B2 (ja) * | 2003-10-17 | 2010-04-28 | シチズン電子株式会社 | 白色led |
| US6841804B1 (en) * | 2003-10-27 | 2005-01-11 | Formosa Epitaxy Incorporation | Device of white light-emitting diode |
| JP4590905B2 (ja) | 2003-10-31 | 2010-12-01 | 豊田合成株式会社 | 発光素子および発光装置 |
| JP2005142311A (ja) | 2003-11-06 | 2005-06-02 | Tzu-Chi Cheng | 発光装置 |
| JP4124102B2 (ja) | 2003-11-12 | 2008-07-23 | 松下電工株式会社 | 多重反射防止構造を備えた発光素子とその製造方法 |
| JP4148264B2 (ja) | 2003-11-19 | 2008-09-10 | 日亜化学工業株式会社 | 半導体素子及びその製造方法 |
| JP2005166937A (ja) | 2003-12-02 | 2005-06-23 | Toyoda Gosei Co Ltd | 発光装置 |
| JP2005166941A (ja) | 2003-12-02 | 2005-06-23 | Matsushita Electric Ind Co Ltd | 発光装置およびその製造方法、並びにその発光装置を用いた照明モジュールと照明装置 |
| JP2005191530A (ja) | 2003-12-03 | 2005-07-14 | Sumitomo Electric Ind Ltd | 発光装置 |
| JP2005167079A (ja) | 2003-12-04 | 2005-06-23 | Toyoda Gosei Co Ltd | 発光装置 |
| US7095056B2 (en) * | 2003-12-10 | 2006-08-22 | Sensor Electronic Technology, Inc. | White light emitting device and method |
| JP4289144B2 (ja) | 2003-12-15 | 2009-07-01 | シチズン電子株式会社 | 発光ダイオード |
| US7066623B2 (en) * | 2003-12-19 | 2006-06-27 | Soo Ghee Lee | Method and apparatus for producing untainted white light using off-white light emitting diodes |
| JP2005191192A (ja) | 2003-12-25 | 2005-07-14 | Kyocera Corp | 発光素子搭載用基板および発光装置 |
| JP4637478B2 (ja) | 2003-12-26 | 2011-02-23 | 日本パイオニクス株式会社 | 気相成長装置 |
| JP4622253B2 (ja) | 2004-01-22 | 2011-02-02 | 日亜化学工業株式会社 | 発光デバイス及びその製造方法 |
| JP4530739B2 (ja) | 2004-01-29 | 2010-08-25 | 京セラ株式会社 | 発光素子搭載用基板および発光装置 |
| JP2005268770A (ja) * | 2004-02-19 | 2005-09-29 | Matsushita Electric Ind Co Ltd | 白色発光素子及び白色光源 |
| JP2005266124A (ja) | 2004-03-17 | 2005-09-29 | Sharp Corp | 粉体排出装置及び画像形成装置 |
| US7009285B2 (en) | 2004-03-19 | 2006-03-07 | Lite-On Technology Corporation | Optoelectronic semiconductor component |
| US7517728B2 (en) | 2004-03-31 | 2009-04-14 | Cree, Inc. | Semiconductor light emitting devices including a luminescent conversion element |
| US7419912B2 (en) | 2004-04-01 | 2008-09-02 | Cree, Inc. | Laser patterning of light emitting devices |
| JP2005294736A (ja) | 2004-04-05 | 2005-10-20 | Stanley Electric Co Ltd | 半導体発光装置の製造方法 |
| JP4228303B2 (ja) | 2004-04-12 | 2009-02-25 | 住友電気工業株式会社 | 半導体発光素子搭載部材と、それを用いた半導体発光装置 |
| US7777241B2 (en) | 2004-04-15 | 2010-08-17 | The Trustees Of Boston University | Optical devices featuring textured semiconductor layers |
| JP4665209B2 (ja) | 2004-04-15 | 2011-04-06 | スタンレー電気株式会社 | 平面照射型led |
| JP4128564B2 (ja) | 2004-04-27 | 2008-07-30 | 松下電器産業株式会社 | 発光装置 |
| US7315119B2 (en) | 2004-05-07 | 2008-01-01 | Avago Technologies Ip (Singapore) Pte Ltd | Light-emitting device having a phosphor particle layer with specific thickness |
| KR100658700B1 (ko) | 2004-05-13 | 2006-12-15 | 서울옵토디바이스주식회사 | Rgb 발광소자와 형광체를 조합한 발광장치 |
| KR100586968B1 (ko) | 2004-05-28 | 2006-06-08 | 삼성전기주식회사 | Led 패키지 및 이를 구비한 액정표시장치용 백라이트어셈블리 |
| JP2005353816A (ja) | 2004-06-10 | 2005-12-22 | Olympus Corp | 発光デバイス、発光デバイスの製造方法、発光デバイスを用いた照明装置、及び、プロジェクタ |
| CN100483757C (zh) | 2004-06-18 | 2009-04-29 | 皇家飞利浦电子股份有限公司 | Led和具有led的系统及led的制备方法 |
| US7795623B2 (en) | 2004-06-30 | 2010-09-14 | Cree, Inc. | Light emitting devices having current reducing structures and methods of forming light emitting devices having current reducing structures |
| US7255469B2 (en) * | 2004-06-30 | 2007-08-14 | 3M Innovative Properties Company | Phosphor based illumination system having a light guide and an interference reflector |
| WO2006006555A1 (ja) | 2004-07-12 | 2006-01-19 | Rohm Co., Ltd. | 半導体発光素子 |
| TWI274209B (en) * | 2004-07-16 | 2007-02-21 | Chi Lin Technology Co Ltd | Light emitting diode and backlight module having light emitting diode |
| JP2006036930A (ja) | 2004-07-27 | 2006-02-09 | Nitto Denko Corp | 光半導体素子封止用樹脂 |
| JP4817629B2 (ja) | 2004-09-15 | 2011-11-16 | 京セラ株式会社 | 発光素子およびその発光素子を用いた照明装置 |
| KR100524098B1 (ko) | 2004-09-10 | 2005-10-26 | 럭스피아 주식회사 | 반도체 발광장치 및 그 제조방법 |
| US7217583B2 (en) | 2004-09-21 | 2007-05-15 | Cree, Inc. | Methods of coating semiconductor light emitting elements by evaporating solvent from a suspension |
| US8513686B2 (en) | 2004-09-22 | 2013-08-20 | Cree, Inc. | High output small area group III nitride LEDs |
| US8174037B2 (en) | 2004-09-22 | 2012-05-08 | Cree, Inc. | High efficiency group III nitride LED with lenticular surface |
| US7633097B2 (en) * | 2004-09-23 | 2009-12-15 | Philips Lumileds Lighting Company, Llc | Growth of III-nitride light emitting devices on textured substrates |
| CN100487931C (zh) | 2004-09-27 | 2009-05-13 | 松下电器产业株式会社 | 半导体发光元件及其制造方法和安装方法、发光器件 |
| JP2006114909A (ja) | 2004-10-14 | 2006-04-27 | Agilent Technol Inc | フラッシュ・モジュール |
| US7419839B2 (en) | 2004-11-12 | 2008-09-02 | Philips Lumileds Lighting Company, Llc | Bonding an optical element to a light emitting device |
| US7462502B2 (en) * | 2004-11-12 | 2008-12-09 | Philips Lumileds Lighting Company, Llc | Color control by alteration of wavelength converting element |
| US7858408B2 (en) | 2004-11-15 | 2010-12-28 | Koninklijke Philips Electronics N.V. | LED with phosphor tile and overmolded phosphor in lens |
| US7344902B2 (en) * | 2004-11-15 | 2008-03-18 | Philips Lumileds Lighting Company, Llc | Overmolded lens over LED die |
| KR100638666B1 (ko) * | 2005-01-03 | 2006-10-30 | 삼성전기주식회사 | 질화물 반도체 발광소자 |
| US7413918B2 (en) | 2005-01-11 | 2008-08-19 | Semileds Corporation | Method of making a light emitting diode |
| JP2006216717A (ja) | 2005-02-02 | 2006-08-17 | Harvatek Corp | ウエハーレベル電気光学半導体組立構造およびその製造方法 |
| JP4715227B2 (ja) | 2005-02-21 | 2011-07-06 | パナソニック株式会社 | 半導体発光装置の製造方法 |
| EP1861876A1 (en) | 2005-03-24 | 2007-12-05 | Tir Systems Ltd. | Solid-state lighting device package |
| JP2006278675A (ja) | 2005-03-29 | 2006-10-12 | Toshiba Corp | 半導体発光装置 |
| US7244630B2 (en) | 2005-04-05 | 2007-07-17 | Philips Lumileds Lighting Company, Llc | A1InGaP LED having reduced temperature dependence |
| WO2006112417A1 (ja) * | 2005-04-15 | 2006-10-26 | Asahi Glass Company, Limited | ガラス封止発光素子、ガラス封止発光素子付き回路基板およびそれらの製造方法 |
| US8101498B2 (en) | 2005-04-21 | 2012-01-24 | Pinnington Thomas Henry | Bonded intermediate substrate and method of making same |
| TWM277882U (en) | 2005-05-31 | 2005-10-11 | Sheng-Li Yang | Diffusion type light source structure |
| JP2006339362A (ja) | 2005-06-01 | 2006-12-14 | Ngk Spark Plug Co Ltd | 発光素子実装用配線基板 |
| US7348212B2 (en) | 2005-09-13 | 2008-03-25 | Philips Lumileds Lighting Company Llc | Interconnects for semiconductor light emitting devices |
| KR100638868B1 (ko) | 2005-06-20 | 2006-10-27 | 삼성전기주식회사 | 금속 반사 층을 형성한 엘이디 패키지 및 그 제조 방법 |
| JP2007005091A (ja) | 2005-06-22 | 2007-01-11 | Mitsubishi Rayon Co Ltd | 線状発光素子アレイ |
| JP2007080885A (ja) | 2005-09-09 | 2007-03-29 | New Japan Chem Co Ltd | 光半導体用封止剤、光半導体及びその製造方法 |
| DE102006032416A1 (de) | 2005-09-29 | 2007-04-05 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Bauelement |
| JP4863682B2 (ja) | 2005-10-17 | 2012-01-25 | 日東電工株式会社 | 光半導体素子封止用シート |
| US7514721B2 (en) | 2005-11-29 | 2009-04-07 | Koninklijke Philips Electronics N.V. | Luminescent ceramic element for a light emitting device |
| US7213940B1 (en) * | 2005-12-21 | 2007-05-08 | Led Lighting Fixtures, Inc. | Lighting device and lighting method |
| WO2007073001A1 (en) | 2005-12-22 | 2007-06-28 | Showa Denko K.K. | Light-emitting diode and method for fabricant thereof |
| KR20090009772A (ko) | 2005-12-22 | 2009-01-23 | 크리 엘이디 라이팅 솔루션즈, 인크. | 조명 장치 |
| JP2007180430A (ja) | 2005-12-28 | 2007-07-12 | Toshiba Lighting & Technology Corp | 発光ダイオード装置 |
| EP2112699B1 (de) | 2006-02-23 | 2020-05-06 | ALLOS Semiconductors GmbH | Nitridhalbleiter-Bauelement und Verfahren zu seiner Herstellung |
| JP5357379B2 (ja) | 2006-02-23 | 2013-12-04 | パナソニック株式会社 | 発光装置 |
| US7682850B2 (en) | 2006-03-17 | 2010-03-23 | Philips Lumileds Lighting Company, Llc | White LED for backlight with phosphor plates |
| US7364338B2 (en) * | 2006-03-29 | 2008-04-29 | Tpo Displays Corp. | Systems for providing backlight module with stacked light source |
| JP2007273763A (ja) | 2006-03-31 | 2007-10-18 | Sony Corp | 半導体装置およびその製造方法 |
| EP3422425B1 (en) * | 2006-04-24 | 2022-02-23 | CreeLED, Inc. | Side-view surface mount white led |
| TWI306674B (en) | 2006-04-28 | 2009-02-21 | Delta Electronics Inc | Light emitting apparatus |
| US8080828B2 (en) | 2006-06-09 | 2011-12-20 | Philips Lumileds Lighting Company, Llc | Low profile side emitting LED with window layer and phosphor layer |
| US7626210B2 (en) | 2006-06-09 | 2009-12-01 | Philips Lumileds Lighting Company, Llc | Low profile side emitting LED |
| KR100809210B1 (ko) | 2006-07-10 | 2008-02-29 | 삼성전기주식회사 | 고출력 led 패키지 및 그 제조방법 |
| JP4458116B2 (ja) | 2007-05-30 | 2010-04-28 | 住友電気工業株式会社 | エピタキシャル層成長用iii族窒化物半導体層貼り合わせ基板および半導体デバイス |
| DE102007046743A1 (de) | 2007-09-28 | 2009-04-02 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement sowie Verfahren zu dessen Herstellung |
| US20090173958A1 (en) * | 2008-01-04 | 2009-07-09 | Cree, Inc. | Light emitting devices with high efficiency phospor structures |
| JP5388666B2 (ja) * | 2008-04-21 | 2014-01-15 | キヤノン株式会社 | 面発光レーザ |
| JP5371375B2 (ja) | 2008-10-30 | 2013-12-18 | 三菱レイヨン・テキスタイル株式会社 | ワイピング用布帛 |
| US20110018013A1 (en) * | 2009-07-21 | 2011-01-27 | Koninklijke Philips Electronics N.V. | Thin-film flip-chip series connected leds |
| WO2011143197A2 (en) | 2010-05-13 | 2011-11-17 | Cree, Inc. | Lighting device and method of making |
| US9240395B2 (en) | 2010-11-30 | 2016-01-19 | Cree Huizhou Opto Limited | Waterproof surface mount device package and method |
-
2004
- 2004-04-28 JP JP2006513442A patent/JP2006525682A/ja active Pending
- 2004-04-28 EP EP10185698.7A patent/EP2264798B1/en not_active Expired - Lifetime
- 2004-04-28 EP EP10185708.4A patent/EP2270887B1/en not_active Expired - Lifetime
- 2004-04-28 CA CA002523544A patent/CA2523544A1/en not_active Abandoned
- 2004-04-28 WO PCT/US2004/013256 patent/WO2004100279A2/en not_active Ceased
- 2004-04-28 EP EP04750926.0A patent/EP1620903B1/en not_active Expired - Lifetime
- 2004-04-28 KR KR1020057020463A patent/KR101148332B1/ko not_active Expired - Lifetime
- 2004-04-28 CN CN200910137491.3A patent/CN101556985B/zh not_active Expired - Lifetime
- 2004-04-28 CN CNB2004800170562A patent/CN100502062C/zh not_active Expired - Lifetime
- 2004-04-29 US US10/836,743 patent/US9666772B2/en not_active Expired - Fee Related
- 2004-04-30 TW TW101138314A patent/TWI487149B/zh not_active IP Right Cessation
- 2004-04-30 TW TW093112133A patent/TWI484665B/zh not_active IP Right Cessation
-
2011
- 2011-11-14 JP JP2011248746A patent/JP2012064962A/ja active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS508494A (enExample) * | 1973-05-21 | 1975-01-28 | ||
| JPH09153646A (ja) * | 1995-09-27 | 1997-06-10 | Toshiba Corp | 光半導体装置およびその製造方法 |
| JP2000353826A (ja) * | 1999-06-09 | 2000-12-19 | Sanyo Electric Co Ltd | 混成集積回路装置および光照射装置 |
| JP2002299699A (ja) * | 2001-03-30 | 2002-10-11 | Sumitomo Electric Ind Ltd | 発光装置およびその製造方法 |
| JP2003124522A (ja) * | 2001-10-09 | 2003-04-25 | Citizen Electronics Co Ltd | 発光ダイオード |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006202952A (ja) * | 2005-01-20 | 2006-08-03 | Shin Etsu Chem Co Ltd | シリコーン封止型led |
| JP2008159705A (ja) * | 2006-12-21 | 2008-07-10 | Matsushita Electric Works Ltd | 発光装置 |
| WO2008096714A1 (ja) * | 2007-02-05 | 2008-08-14 | Nikon Corporation | 樹脂封止発光素子、平面状光源及びそれらの製造方法、並びに液晶表示装置 |
| JPWO2008096714A1 (ja) * | 2007-02-05 | 2010-05-20 | 株式会社ニコン | 樹脂封止発光素子、平面状光源及びそれらの製造方法、並びに液晶表示装置 |
| JP2013542618A (ja) * | 2011-10-10 | 2013-11-21 | チェオル ジュ、ジャエ | Ledパッケージの製造方法 |
| JP2013542617A (ja) * | 2011-10-10 | 2013-11-21 | チェオル ジュ、ジャエ | Ledパッケージ |
| KR101621688B1 (ko) * | 2013-05-28 | 2016-05-17 | 미쓰비시덴키 가부시키가이샤 | 점 광원, 면형 광원장치 및 표시장치 |
| US9638852B2 (en) | 2013-05-28 | 2017-05-02 | Mitsubishi Electric Corporation | Point light source, planar light source device, and display device |
| JP2015035438A (ja) * | 2013-08-07 | 2015-02-19 | 日亜化学工業株式会社 | 発光装置 |
| JP2015079854A (ja) * | 2013-10-17 | 2015-04-23 | 日亜化学工業株式会社 | 発光装置 |
| JP2017201731A (ja) * | 2017-08-22 | 2017-11-09 | 日亜化学工業株式会社 | 発光装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| CA2523544A1 (en) | 2004-11-18 |
| EP2270887B1 (en) | 2020-01-22 |
| KR101148332B1 (ko) | 2012-05-25 |
| EP2264798A1 (en) | 2010-12-22 |
| EP2270887A1 (en) | 2011-01-05 |
| EP1620903B1 (en) | 2017-08-16 |
| US9666772B2 (en) | 2017-05-30 |
| CN101556985B (zh) | 2017-06-09 |
| WO2004100279A2 (en) | 2004-11-18 |
| CN1809934A (zh) | 2006-07-26 |
| WO2004100279A3 (en) | 2005-12-01 |
| US20040227149A1 (en) | 2004-11-18 |
| CN101556985A (zh) | 2009-10-14 |
| TWI484665B (zh) | 2015-05-11 |
| KR20060015543A (ko) | 2006-02-17 |
| CN100502062C (zh) | 2009-06-17 |
| TWI487149B (zh) | 2015-06-01 |
| JP2012064962A (ja) | 2012-03-29 |
| EP1620903A2 (en) | 2006-02-01 |
| TW201306326A (zh) | 2013-02-01 |
| EP2264798B1 (en) | 2020-10-14 |
| TW200501458A (en) | 2005-01-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9666772B2 (en) | High powered light emitter packages with compact optics | |
| US20070205425A1 (en) | Semiconductor light-emitting device | |
| JP5271509B2 (ja) | 気泡なくレンズを配置するための内部メニスカスを備えた発光ダイオードパッケージ要素 | |
| US8283691B2 (en) | Light emitting device package and a lighting device | |
| JP5746877B2 (ja) | 電力表面取り付けの発光ダイ・パッケージ | |
| JP5634657B2 (ja) | オプトエレクトロニクス素子を製作する方法 | |
| JP5750040B2 (ja) | オプトエレクトロニクス半導体コンポーネント | |
| TWI382561B (zh) | 附有反射透鏡之功率發光二極體封裝及其製造方法 | |
| JP4254669B2 (ja) | 発光装置 | |
| JP2007311445A (ja) | 半導体発光装置及びその製造方法 | |
| JP2006237609A (ja) | 半導体発光素子およびその製造方法 | |
| JP2006509373A (ja) | 1つの小さい設置面積を有するledパッケージダイ | |
| JP2008521236A (ja) | 発光体、及び前記発光体を製造する方法 | |
| JP5126127B2 (ja) | 発光装置の製造方法 | |
| KR20090103292A (ko) | Led 패키지 | |
| JP2008172140A (ja) | ハウジングと上部の硬質保護材の間に緩衝材を持つ発光装置 | |
| JP3963188B2 (ja) | 発光装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070312 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070312 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100608 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20100608 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20100907 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20100914 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20101001 |
|
| RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20101001 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20101015 |
|
| RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20101019 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101108 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110512 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20110812 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20110819 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20110912 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20110920 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20111012 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20111019 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20111114 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20120830 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130104 |
|
| A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20130111 |
|
| A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20130215 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20130611 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20130614 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20130716 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20130719 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20131209 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20140515 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20140520 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20140616 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20140619 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20140716 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20140723 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140815 |