DE69931272D1 - Gedruckte leiterplatte und verfahren zu deren herstellung - Google Patents

Gedruckte leiterplatte und verfahren zu deren herstellung

Info

Publication number
DE69931272D1
DE69931272D1 DE69931272T DE69931272T DE69931272D1 DE 69931272 D1 DE69931272 D1 DE 69931272D1 DE 69931272 T DE69931272 T DE 69931272T DE 69931272 T DE69931272 T DE 69931272T DE 69931272 D1 DE69931272 D1 DE 69931272D1
Authority
DE
Germany
Prior art keywords
production
printed pcb
pcb
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69931272T
Other languages
English (en)
Other versions
DE69931272T2 (de
Inventor
Honchin En
Tohru Nakai
Takeo Oki
Naohiro Hirose
Kouta Noda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP25985498A external-priority patent/JP4388611B2/ja
Priority claimed from JP28343598A external-priority patent/JP2000101246A/ja
Priority claimed from JP33120098A external-priority patent/JP4117951B2/ja
Priority claimed from JP33449998A external-priority patent/JP2000165046A/ja
Priority claimed from JP36296298A external-priority patent/JP4094143B2/ja
Priority claimed from JP9591699A external-priority patent/JP4236327B2/ja
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Application granted granted Critical
Publication of DE69931272D1 publication Critical patent/DE69931272D1/de
Publication of DE69931272T2 publication Critical patent/DE69931272T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/40—Coatings including alternating layers following a pattern, a periodic or defined repetition
    • C23C28/42—Coatings including alternating layers following a pattern, a periodic or defined repetition characterized by the composition of the alternating layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/625—Discontinuous layers, e.g. microcracked layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0215—Metallic fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0353—Making conductive layer thin, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1492—Periodical treatments, e.g. pulse plating of through-holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
DE69931272T 1998-09-14 1999-09-14 Gedruckte leiterplatte und verfahren zu deren herstellung Expired - Lifetime DE69931272T2 (de)

Applications Claiming Priority (15)

Application Number Priority Date Filing Date Title
JP25985498 1998-09-14
JP25985498A JP4388611B2 (ja) 1998-09-14 1998-09-14 銅被膜からなる配線を有するプリント配線板およびその製造方法、並びに銅被膜からなる回路を有する回路板
JP28343598 1998-09-17
JP28343598A JP2000101246A (ja) 1998-09-17 1998-09-17 多層ビルドアップ配線板及び多層ビルドアップ配線板の製造方法
JP28892598 1998-09-24
JP28892598 1998-09-24
JP33120098 1998-11-20
JP33120098A JP4117951B2 (ja) 1998-11-20 1998-11-20 多層プリント配線板の製造方法及び多層プリント配線板
JP33449998A JP2000165046A (ja) 1998-09-24 1998-11-25 多層ビルドアップ配線板
JP33449998 1998-11-25
JP36296298A JP4094143B2 (ja) 1998-12-21 1998-12-21 多層プリント配線板の製造方法
JP36296298 1998-12-21
JP9591699A JP4236327B2 (ja) 1999-04-02 1999-04-02 無電解めっき液、無電解めっき方法、プリント配線板の製造方法およびプリント配線板
JP9591699 1999-04-02
PCT/JP1999/005003 WO2000016597A1 (en) 1998-09-14 1999-09-14 Printed wiring board and its manufacturing method

Publications (2)

Publication Number Publication Date
DE69931272D1 true DE69931272D1 (de) 2006-06-14
DE69931272T2 DE69931272T2 (de) 2007-03-15

Family

ID=27565567

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69931272T Expired - Lifetime DE69931272T2 (de) 1998-09-14 1999-09-14 Gedruckte leiterplatte und verfahren zu deren herstellung

Country Status (6)

Country Link
US (4) US7230188B1 (de)
EP (8) EP1667506B1 (de)
KR (1) KR100815668B1 (de)
DE (1) DE69931272T2 (de)
MY (4) MY144573A (de)
WO (1) WO2000016597A1 (de)

Families Citing this family (184)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY144573A (en) 1998-09-14 2011-10-14 Ibiden Co Ltd Printed circuit board and method for its production
JP3736607B2 (ja) * 2000-01-21 2006-01-18 セイコーエプソン株式会社 半導体装置及びその製造方法、回路基板並びに電子機器
TW511405B (en) * 2000-12-27 2002-11-21 Matsushita Electric Ind Co Ltd Device built-in module and manufacturing method thereof
JP4148895B2 (ja) * 2001-10-16 2008-09-10 新光電気工業株式会社 ホールの銅めっき方法
US6908784B1 (en) * 2002-03-06 2005-06-21 Micron Technology, Inc. Method for fabricating encapsulated semiconductor components
JP4488684B2 (ja) 2002-08-09 2010-06-23 イビデン株式会社 多層プリント配線板
CN101471323B (zh) * 2002-08-09 2011-08-03 揖斐电株式会社 多层印刷线路板
JP2006525660A (ja) * 2003-05-01 2006-11-09 クイーン　メアリー　アンド　ウェストフィールド　カレッジ ケース型熱管理素子およびその製造方法
KR100520961B1 (ko) * 2003-05-30 2005-10-17 엘지전자 주식회사 인쇄회로기판의 제조방법
US20040259375A1 (en) * 2003-06-17 2004-12-23 Derderian Garo J. Removal of metal oxidation
WO2005017617A1 (en) 2003-07-17 2005-02-24 Honeywell International Inc. Planarization films for advanced microelectronic applications and devices and methods of production thereof
US20070202255A1 (en) * 2003-09-29 2007-08-30 Tomoyuki Shinoda Titanium Or Titanium Alloy Adhesive Resin Composition Prepreg And Composite Material
KR100557549B1 (ko) * 2003-12-29 2006-03-03 삼성전기주식회사 플립칩 범프 패드 형성 방법 및 그 구조
CN101848597A (zh) * 2004-02-04 2010-09-29 揖斐电株式会社 多层印刷电路板
US8338087B2 (en) * 2004-03-03 2012-12-25 Advanced Technology Materials, Inc Composition and process for post-etch removal of photoresist and/or sacrificial anti-reflective material deposited on a substrate
JP2005286273A (ja) * 2004-03-31 2005-10-13 Sohki:Kk 回路基板、回路基板の製造方法、電子デバイス、電子デバイスの製造方法
TWI255491B (en) * 2004-03-31 2006-05-21 Sanyo Electric Co Substrate for mounting elements, manufacturing method therefor and semiconductor device using the same
US7972491B2 (en) * 2004-04-15 2011-07-05 Hitachi Metals, Ltd. Method for imparting hydrogen resistance to articles
DE602005022650D1 (de) 2004-04-26 2010-09-16 Rohm & Haas Elect Mat Verbessertes Plattierungsverfahren
US20050251777A1 (en) * 2004-05-05 2005-11-10 International Business Machines Corporation Method and structure for implementing enhanced electronic packaging and PCB layout with diagonal vias
GB2414864A (en) * 2004-06-01 2005-12-07 Nokia Corp Detecting short circuits
CN100417313C (zh) * 2004-06-29 2008-09-03 台湾吉德门国际股份有限公司 提升电路板制程良率的方法
JP2006049804A (ja) * 2004-07-07 2006-02-16 Shinko Electric Ind Co Ltd 配線基板の製造方法
JP4992428B2 (ja) * 2004-09-24 2012-08-08 イビデン株式会社 めっき方法及びめっき装置
FI20041525A (fi) * 2004-11-26 2006-03-17 Imbera Electronics Oy Elektroniikkamoduuli ja menetelmä sen valmistamiseksi
WO2006080073A1 (ja) * 2005-01-27 2006-08-03 Matsushita Electric Industrial Co., Ltd. 多層回路基板の製造方法、多層回路基板
JP2006216711A (ja) * 2005-02-02 2006-08-17 Ibiden Co Ltd 多層プリント配線板
JP2006216713A (ja) 2005-02-02 2006-08-17 Ibiden Co Ltd 多層プリント配線板
JP2006216712A (ja) * 2005-02-02 2006-08-17 Ibiden Co Ltd 多層プリント配線板
US7237334B2 (en) * 2005-08-18 2007-07-03 Intel Corporation Method of providing a printed circuit board using laser assisted metallization and patterning of a microelectronic substrate
TWI275186B (en) * 2005-10-17 2007-03-01 Phoenix Prec Technology Corp Method for manufacturing semiconductor package
US7570082B2 (en) * 2006-08-15 2009-08-04 International Business Machines Corporation Voltage comparator apparatus and method having improved kickback and jitter characteristics
KR100879794B1 (ko) * 2006-12-22 2009-01-22 삼성전기주식회사 진동모터용 정류자, 진동모터 및 이에 사용되는 도금액
JP4840132B2 (ja) * 2006-12-26 2011-12-21 株式会社デンソー 多層基板の製造方法
JP4902558B2 (ja) * 2007-01-31 2012-03-21 三洋電機株式会社 半導体モジュールの製造方法
US8250751B2 (en) * 2007-02-20 2012-08-28 Ddi Global Corp. Method of manufacturing a printed circuit board
JP2008218552A (ja) * 2007-03-01 2008-09-18 Nec Corp 電子部品の実装基板および実装方法
JP4383487B2 (ja) * 2007-03-19 2009-12-16 古河電気工業株式会社 金属張積層体及び金属張積層体の製造方法
US7969005B2 (en) * 2007-04-27 2011-06-28 Sanyo Electric Co., Ltd. Packaging board, rewiring, roughened conductor for semiconductor module of a portable device, and manufacturing method therefor
US20080271995A1 (en) * 2007-05-03 2008-11-06 Sergey Savastiouk Agitation of electrolytic solution in electrodeposition
TW200906263A (en) * 2007-05-29 2009-02-01 Matsushita Electric Ind Co Ltd Circuit board and method for manufacturing the same
US7923645B1 (en) * 2007-06-20 2011-04-12 Amkor Technology, Inc. Metal etch stop fabrication method and structure
US8440916B2 (en) 2007-06-28 2013-05-14 Intel Corporation Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method
US8877565B2 (en) * 2007-06-28 2014-11-04 Intel Corporation Method of forming a multilayer substrate core structure using sequential microvia laser drilling and substrate core structure formed according to the method
EP2170028A4 (de) * 2007-07-10 2011-07-20 Ibiden Co Ltd Verdrahtungssubstrat und verfahren zu seiner herstellung
KR100841987B1 (ko) * 2007-07-10 2008-06-27 삼성전기주식회사 다층 인쇄회로기판 제조방법
US8044306B2 (en) 2007-07-11 2011-10-25 Ibiden Co., Ltd. Wiring board and method of manufacturing the same
US8192815B2 (en) 2007-07-13 2012-06-05 Apple Inc. Methods and systems for forming a dual layer housing
US20090090634A1 (en) * 2007-10-03 2009-04-09 Sifco Selective Plating Method of plating metal onto titanium
US8112884B2 (en) * 2007-10-08 2012-02-14 Honeywell International Inc. Method for providing an efficient thermal transfer through a printed circuit board
JP2009099624A (ja) * 2007-10-12 2009-05-07 Fujitsu Ltd 配線基板およびその製造方法
TWI450666B (zh) * 2007-11-22 2014-08-21 Ajinomoto Kk 多層印刷配線板之製造方法及多層印刷配線板
KR20090067249A (ko) * 2007-12-21 2009-06-25 삼성전기주식회사 인쇄회로기판 및 그 제조방법
KR101070798B1 (ko) * 2008-01-15 2011-10-06 삼성전기주식회사 인쇄회로기판 및 그 제조방법
US8315043B2 (en) * 2008-01-24 2012-11-20 Apple Inc. Methods and systems for forming housings from multi-layer materials
US11266014B2 (en) 2008-02-14 2022-03-01 Metrospec Technology, L.L.C. LED lighting systems and method
US8007286B1 (en) 2008-03-18 2011-08-30 Metrospec Technology, Llc Circuit boards interconnected by overlapping plated through holes portions
US8143631B2 (en) 2008-03-06 2012-03-27 Metrospec Technology Llc Layered structure for use with high power light emitting diode systems
US8851356B1 (en) 2008-02-14 2014-10-07 Metrospec Technology, L.L.C. Flexible circuit board interconnection and methods
US10334735B2 (en) 2008-02-14 2019-06-25 Metrospec Technology, L.L.C. LED lighting systems and methods
US8646637B2 (en) * 2008-04-18 2014-02-11 Apple Inc. Perforated substrates for forming housings
US20090289032A1 (en) * 2008-05-23 2009-11-26 General Electric Company Method and kit for surface preparation
US8367304B2 (en) 2008-06-08 2013-02-05 Apple Inc. Techniques for marking product housings
WO2010013611A1 (ja) * 2008-07-30 2010-02-04 住友ベークライト株式会社 無電解銅メッキ方法、プリント配線板、プリント配線板製造方法、半導体装置
US8132321B2 (en) * 2008-08-13 2012-03-13 Unimicron Technology Corp. Method for making embedded circuit structure
US7776741B2 (en) 2008-08-18 2010-08-17 Novellus Systems, Inc. Process for through silicon via filing
US7943862B2 (en) * 2008-08-20 2011-05-17 Electro Scientific Industries, Inc. Method and apparatus for optically transparent via filling
US9006028B2 (en) * 2008-09-12 2015-04-14 Ananda H. Kumar Methods for forming ceramic substrates with via studs
JP5033192B2 (ja) * 2008-09-30 2012-09-26 イビデン株式会社 多層プリント配線板、及び、多層プリント配線板の製造方法
KR100990546B1 (ko) * 2008-12-08 2010-10-29 삼성전기주식회사 비아 단부에 매립된 도금패턴을 갖는 인쇄회로기판 및 이의제조방법
US20100159273A1 (en) 2008-12-24 2010-06-24 John Benjamin Filson Method and Apparatus for Forming a Layered Metal Structure with an Anodized Surface
US7811918B1 (en) * 2009-01-09 2010-10-12 The United States Of America As Represented By The Secretary Of The Navy Electric current induced liquid metal flow and metallic conformal coating of conductive templates
US8592691B2 (en) * 2009-02-27 2013-11-26 Ibiden Co., Ltd. Printed wiring board
JP2010238691A (ja) * 2009-03-30 2010-10-21 Fujitsu Ltd 中継部材およびプリント基板ユニット
JP5240293B2 (ja) * 2009-04-02 2013-07-17 株式会社村田製作所 回路基板
US8513792B2 (en) * 2009-04-10 2013-08-20 Intel Corporation Package-on-package interconnect stiffener
CN102415222B (zh) * 2009-04-24 2015-02-04 住友电气工业株式会社 用于印刷布线板的基板、印刷布线板及其制造方法
US9884342B2 (en) * 2009-05-19 2018-02-06 Apple Inc. Techniques for marking product housings
US9173336B2 (en) 2009-05-19 2015-10-27 Apple Inc. Techniques for marking product housings
US8426959B2 (en) * 2009-08-19 2013-04-23 Samsung Electronics Co., Ltd. Semiconductor package and method of manufacturing the same
US8663806B2 (en) 2009-08-25 2014-03-04 Apple Inc. Techniques for marking a substrate using a physical vapor deposition material
JP5428667B2 (ja) * 2009-09-07 2014-02-26 日立化成株式会社 半導体チップ搭載用基板の製造方法
US9109295B2 (en) * 2009-10-12 2015-08-18 Novellus Systems, Inc. Electrolyte concentration control system for high rate electroplating
US10472730B2 (en) 2009-10-12 2019-11-12 Novellus Systems, Inc. Electrolyte concentration control system for high rate electroplating
US8809733B2 (en) 2009-10-16 2014-08-19 Apple Inc. Sub-surface marking of product housings
US9845546B2 (en) 2009-10-16 2017-12-19 Apple Inc. Sub-surface marking of product housings
US20110089039A1 (en) * 2009-10-16 2011-04-21 Michael Nashner Sub-Surface Marking of Product Housings
US10071583B2 (en) * 2009-10-16 2018-09-11 Apple Inc. Marking of product housings
WO2011052211A1 (ja) 2009-10-30 2011-05-05 パナソニック電工株式会社 回路基板及び回路基板に部品が実装された半導体装置
US9332642B2 (en) * 2009-10-30 2016-05-03 Panasonic Corporation Circuit board
JP2011096900A (ja) * 2009-10-30 2011-05-12 Fujitsu Ltd 導電体およびプリント配線板並びにそれらの製造方法
KR101089986B1 (ko) * 2009-12-24 2011-12-05 삼성전기주식회사 캐리어기판, 그의 제조방법, 이를 이용한 인쇄회로기판 및 그의 제조방법
WO2011086972A1 (ja) * 2010-01-15 2011-07-21 Jx日鉱日石金属株式会社 電子回路及びその形成方法並びに電子回路形成用銅張積層板
US8628836B2 (en) 2010-03-02 2014-01-14 Apple Inc. Method and apparatus for bonding metals and composites
US8489158B2 (en) 2010-04-19 2013-07-16 Apple Inc. Techniques for marking translucent product housings
JP2011243790A (ja) * 2010-05-19 2011-12-01 Panasonic Electric Works Co Ltd 配線方法、並びに、表面に配線が設けられた構造物、半導体装置、配線基板、メモリカード、電気デバイス、モジュール及び多層回路基板
KR20110139462A (ko) * 2010-06-23 2011-12-29 삼성전기주식회사 절연수지 조성물 및 이를 이용하여 제조된 인쇄회로기판
US8518826B2 (en) 2010-07-13 2013-08-27 Lam Research Corporation Metallization processes, mixtures, and electronic devices
TWI436713B (zh) * 2010-07-26 2014-05-01 Via Tech Inc 線路基板、線路基板製程
US8947892B1 (en) 2010-08-16 2015-02-03 The Boeing Company Electronic device protection
US8847380B2 (en) * 2010-09-17 2014-09-30 Tessera, Inc. Staged via formation from both sides of chip
US8756803B2 (en) * 2010-09-22 2014-06-24 Ibiden Co., Ltd. Method for manufacturing printed wiring board
US9545043B1 (en) * 2010-09-28 2017-01-10 Rockwell Collins, Inc. Shielding encapsulation for electrical circuitry
US8724285B2 (en) 2010-09-30 2014-05-13 Apple Inc. Cosmetic conductive laser etching
JP5602584B2 (ja) * 2010-10-28 2014-10-08 新光電気工業株式会社 配線基板及びその製造方法
DE102011011139B4 (de) * 2011-02-14 2023-01-19 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung zumindest eines optoelektronischen Halbleiterbauelements und optoelektronisches Halbleiterbauelement
JP2012174758A (ja) * 2011-02-18 2012-09-10 Fujifilm Corp 多層基板の製造方法、デスミア処理方法
US20120248001A1 (en) 2011-03-29 2012-10-04 Nashner Michael S Marking of Fabric Carrying Case for Portable Electronic Device
US9280183B2 (en) 2011-04-01 2016-03-08 Apple Inc. Advanced techniques for bonding metal to plastic
CN102892252B (zh) * 2011-07-19 2015-08-05 联滔电子有限公司 三维电路的制造方法
TWI445474B (zh) * 2011-11-18 2014-07-11 Chuan Ling Hu Manufacturing method of plastic metallized three - dimensional line
US9117730B2 (en) * 2011-12-29 2015-08-25 Ibiden Co., Ltd. Printed wiring board and method for manufacturing printed wiring board
US8879266B2 (en) * 2012-05-24 2014-11-04 Apple Inc. Thin multi-layered structures providing rigidity and conductivity
US10071584B2 (en) 2012-07-09 2018-09-11 Apple Inc. Process for creating sub-surface marking on plastic parts
KR101992352B1 (ko) * 2012-09-25 2019-06-24 삼성전자주식회사 반도체 장치
CN103717009A (zh) * 2012-10-08 2014-04-09 苏州卓融水处理科技有限公司 一种无核封装基板种子层附着力的方法
JP5352748B1 (ja) * 2012-10-26 2013-11-27 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔、それを用いた銅張積層板、プリント配線板、プリント回路板、及び、プリント配線板の製造方法
JP5358739B1 (ja) * 2012-10-26 2013-12-04 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔、それを用いた銅張積層板、プリント配線板、プリント回路板、及び、プリント配線板の製造方法
TWI449620B (zh) * 2012-11-20 2014-08-21 Univ Nat Taiwan Science Tech 鎳／銦／錫／銅多層結構之製造方法
WO2014094841A1 (en) * 2012-12-19 2014-06-26 Telefonaktiebolaget L M Ericsson (Publ) Planar transformer
US9312222B2 (en) * 2013-03-12 2016-04-12 Taiwan Semiconductor Manufacturing Co., Ltd. Patterning approach for improved via landing profile
US9434197B2 (en) 2013-06-18 2016-09-06 Apple Inc. Laser engraved reflective surface structures
US9314871B2 (en) 2013-06-18 2016-04-19 Apple Inc. Method for laser engraved reflective surface structures
JP6266907B2 (ja) * 2013-07-03 2018-01-24 新光電気工業株式会社 配線基板及び配線基板の製造方法
US9663867B2 (en) * 2013-07-15 2017-05-30 United Technologies Corporation Plated instrumentation probes and sensors
CN103429012B (zh) * 2013-08-02 2016-01-13 北大方正集团有限公司 一种pcb板上的背钻孔的制备方法以及pcb板
CN104349609A (zh) * 2013-08-08 2015-02-11 北大方正集团有限公司 印刷线路板及其制作方法
KR101548421B1 (ko) * 2013-08-27 2015-08-28 삼성전기주식회사 다층인쇄회로기판의 제조방법
US10076032B2 (en) 2014-03-20 2018-09-11 Sumitomo Electric Industries, Ltd. Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board
CN106134298B (zh) 2014-03-27 2019-02-22 住友电气工业株式会社 印刷线路板用基板、印刷线路板以及制造印刷线路板用基板的方法
JP2015213124A (ja) * 2014-05-02 2015-11-26 イビデン株式会社 パッケージ基板
US9398703B2 (en) * 2014-05-19 2016-07-19 Sierra Circuits, Inc. Via in a printed circuit board
JP5823005B1 (ja) * 2014-08-29 2015-11-25 Jx日鉱日石金属株式会社 キャリア付銅箔の製造方法、銅張積層板の製造方法、プリント配線板の製造方法、及び、電子機器及びキャリア付銅箔
DE102014218300B3 (de) * 2014-09-12 2016-01-07 Evonik Degussa Gmbh Verfahren zur Herstellung strukturierter Beschichtungen, strukturierte Beschichtung und ihre Verwendung
JP6585434B2 (ja) * 2014-10-06 2019-10-02 株式会社荏原製作所 めっき方法
US10154598B2 (en) 2014-10-13 2018-12-11 Rohm And Haas Electronic Materials Llc Filling through-holes
US9433101B2 (en) * 2014-10-16 2016-08-30 International Business Machines Corporation Substrate via filling
CN105657988B (zh) * 2014-11-21 2019-04-23 宏启胜精密电子(秦皇岛)有限公司 柔性电路板及其制作方法
US10076028B2 (en) 2015-01-22 2018-09-11 Sumitomo Electric Industries, Ltd. Substrate for printed circuit board, printed circuit board, and method for producing printed circuit board
JP6328575B2 (ja) * 2015-02-23 2018-05-23 東京エレクトロン株式会社 触媒層形成方法、触媒層形成システムおよび記憶媒体
JP6641717B2 (ja) * 2015-04-08 2020-02-05 日立化成株式会社 多層配線基板の製造方法
CN104812179B (zh) * 2015-04-21 2017-12-01 深圳崇达多层线路板有限公司 一种印刷电路板的孔铜制备工艺及印刷电路板
US10182499B2 (en) * 2015-11-09 2019-01-15 The University Of Memphis Research Foundation Multilayer additive printed circuit
WO2017090161A1 (ja) * 2015-11-26 2017-06-01 近藤　和夫 酸性銅めっき液、酸性銅めっき物および半導体デバイスの製造方法
JP2017136711A (ja) * 2016-02-02 2017-08-10 セイコーエプソン株式会社 配線基板、ｍｅｍｓデバイス、液体噴射ヘッド及び液体噴射装置
US10519557B2 (en) * 2016-02-12 2019-12-31 Macdermid Enthone Inc. Leveler compositions for use in copper deposition in manufacture of microelectronics
CN105721749B (zh) * 2016-02-24 2020-07-24 宁波舜宇光电信息有限公司 摄像模组及其电气支架和线路板组件及制造方法
WO2017146873A1 (en) * 2016-02-26 2017-08-31 Applied Materials, Inc. Enhanced plating bath and additive chemistries for cobalt plating
US10727081B2 (en) * 2016-07-01 2020-07-28 Mitsubishi Gas Chemical Company, Inc. Method for manufacturing package substrate for mounting a semiconductor device, and method for manufacturing semiconductor device mounting substrate
US10849233B2 (en) 2017-07-10 2020-11-24 Catlam, Llc Process for forming traces on a catalytic laminate
US10349520B2 (en) 2017-06-28 2019-07-09 Catlam, Llc Multi-layer circuit board using interposer layer and conductive paste
US10765012B2 (en) 2017-07-10 2020-09-01 Catlam, Llc Process for printed circuit boards using backing foil
US10692735B2 (en) 2017-07-28 2020-06-23 Lam Research Corporation Electro-oxidative metal removal in through mask interconnect fabrication
US20200006135A1 (en) * 2017-07-31 2020-01-02 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Method and Plater Arrangement for Failure-Free Copper Filling of a Hole in a Component Carrier
KR102069659B1 (ko) 2017-08-31 2020-01-23 해성디에스 주식회사 반도체 패키지 기판 제조방법 및 이를 이용하여 제조된 반도체 패키지 기판
US10827624B2 (en) 2018-03-05 2020-11-03 Catlam, Llc Catalytic laminate with conductive traces formed during lamination
KR20200130361A (ko) * 2018-03-09 2020-11-18 가부시키가이샤 아리사와 세이사쿠쇼 적층체 및 그의 제조 방법
US10999917B2 (en) 2018-09-20 2021-05-04 Apple Inc. Sparse laser etch anodized surface for cosmetic grounding
US10849200B2 (en) 2018-09-28 2020-11-24 Metrospec Technology, L.L.C. Solid state lighting circuit with current bias and method of controlling thereof
CN109729639B (zh) * 2018-12-24 2020-11-20 奥特斯科技(重庆)有限公司 在无芯基板上包括柱体的部件承载件
US11342256B2 (en) * 2019-01-24 2022-05-24 Applied Materials, Inc. Method of fine redistribution interconnect formation for advanced packaging applications
US10903157B2 (en) * 2019-03-08 2021-01-26 Skc Co., Ltd. Semiconductor device having a glass substrate core layer
WO2020215225A1 (zh) * 2019-04-23 2020-10-29 庆鼎精密电子（淮安）有限公司 电路板及其制作方法
IT201900006740A1 (it) * 2019-05-10 2020-11-10 Applied Materials Inc Procedimenti di strutturazione di substrati
IT201900006736A1 (it) 2019-05-10 2020-11-10 Applied Materials Inc Procedimenti di fabbricazione di package
US11931855B2 (en) 2019-06-17 2024-03-19 Applied Materials, Inc. Planarization methods for packaging substrates
CN112312671B (zh) * 2019-07-30 2024-03-12 宏恒胜电子科技（淮安）有限公司 电路板以及电路板的制备方法
CN114303447A (zh) * 2019-08-19 2022-04-08 德国艾托特克有限两合公司 制备含以铜填充的微通孔的高密度互连印刷电路板的方法
CN112752429B (zh) * 2019-10-31 2022-08-16 鹏鼎控股(深圳)股份有限公司 多层线路板及其制作方法
US11862546B2 (en) 2019-11-27 2024-01-02 Applied Materials, Inc. Package core assembly and fabrication methods
US11257790B2 (en) 2020-03-10 2022-02-22 Applied Materials, Inc. High connectivity device stacking
US11454884B2 (en) 2020-04-15 2022-09-27 Applied Materials, Inc. Fluoropolymer stamp fabrication method
US11400545B2 (en) 2020-05-11 2022-08-02 Applied Materials, Inc. Laser ablation for package fabrication
US11232951B1 (en) 2020-07-14 2022-01-25 Applied Materials, Inc. Method and apparatus for laser drilling blind vias
US11676832B2 (en) 2020-07-24 2023-06-13 Applied Materials, Inc. Laser ablation system for package fabrication
US11393747B2 (en) * 2020-08-31 2022-07-19 Advanced Semiconductor Engineering, Inc. Substrate structure having roughned upper surface of conductive layer
US11692049B2 (en) 2020-09-18 2023-07-04 Ford Global Technologies, Llc Additively manufactured thermoset polymers for metal plating and metal plated parts formed therefrom
US11521937B2 (en) 2020-11-16 2022-12-06 Applied Materials, Inc. Package structures with built-in EMI shielding
US11404318B2 (en) 2020-11-20 2022-08-02 Applied Materials, Inc. Methods of forming through-silicon vias in substrates for advanced packaging
CN112739022A (zh) * 2020-12-22 2021-04-30 江西志博信科技股份有限公司 一种hdi技术应用印刷电路板的工艺
US11705365B2 (en) 2021-05-18 2023-07-18 Applied Materials, Inc. Methods of micro-via formation for advanced packaging
CN113267659B (zh) * 2021-05-18 2024-06-21 上海泽丰半导体科技有限公司 Ate测试板及ate测试板的制造方法
CN114007343B (zh) * 2021-10-22 2024-05-17 深圳明阳电路科技股份有限公司 一种印刷电路板电厚金、印刷电路板及其制造方法
CN114678208B (zh) * 2022-04-02 2023-06-20 电子科技大学 一种全树脂片式电感的制作方法

Family Cites Families (101)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1163114B (de) * 1962-02-13 1964-02-13 Dehydag Gmbh Galvanische Metallbaeder
US3322881A (en) * 1964-08-19 1967-05-30 Jr Frederick W Schneble Multilayer printed circuit assemblies
US3350498A (en) * 1965-01-04 1967-10-31 Intellux Inc Multilayer circuit and method of making the same
CH422933A (fr) * 1965-03-12 1966-10-31 Gen Protection Establishment Paratonnerre à grande puissance ionisante
GB1288992A (de) * 1970-06-22 1972-09-13
US3716462A (en) 1970-10-05 1973-02-13 D Jensen Copper plating on zinc and its alloys
JPS493833A (de) 1972-05-04 1974-01-14
JPS547267B2 (de) * 1973-09-21 1979-04-05
NL7402422A (nl) 1974-02-22 1975-08-26 Philips Nv Universele verkoperingsoplossing.
US3977884A (en) 1975-01-02 1976-08-31 Shipley Company, Inc. Metal plating solution
JPS574116B2 (de) 1975-02-07 1982-01-25
US4265943A (en) 1978-11-27 1981-05-05 Macdermid Incorporated Method and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ions
US4324589A (en) 1979-02-05 1982-04-13 Shipley Company Inc. Solute monitoring process
EP0060294B1 (de) * 1980-09-15 1985-12-27 Shipley Company Inc. Verfahren zum stromlosen abscheiden eines legierungsüberzuges
JPS57116799A (en) * 1981-01-09 1982-07-20 Kobe Steel Ltd Method for copper plating
EP0117258B1 (de) * 1983-02-23 1987-05-20 Ibm Deutschland Gmbh Verfahren zur Herstellung von haftfesten Metallschichten auf Kunststoffsubstraten
JPS6070183A (ja) 1983-09-28 1985-04-20 C Uyemura & Co Ltd 化学銅めっき方法
US4528259A (en) * 1983-11-10 1985-07-09 Sullivan Donald F Printed wiring boards with solder mask over bare copper wires having large area thickened circuit pad connections
KR890004583B1 (ko) 1984-06-29 1989-11-16 히다찌가세이고오교 가부시끼가이샤 금속표면 처리공정
US5047114A (en) * 1984-11-02 1991-09-10 Amp-Akzo Corporation Process for the production of metal clad thermoplastic base materials and printed circuits on thermoplastic base materials
JPS628514A (ja) 1985-07-05 1987-01-16 昭和電工株式会社 電解コンデンサ−
JPH079069B2 (ja) * 1986-03-12 1995-02-01 ブラザー工業株式会社 機械的性質の優れた銅被膜の形成方法
US4908242A (en) 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
JPS63126297A (ja) * 1986-11-14 1988-05-30 イビデン株式会社 多層プリント配線板並びにそれの製造方法と無電解めっき用絶縁剤
JPS63158156A (ja) 1987-07-31 1988-07-01 Konpon:Kk カレンダ−ロ−ルを用いた高粘度樹脂シ−トの製造方法及びその装置
GB8801827D0 (en) * 1988-01-27 1988-02-24 Jct Controls Ltd Improvements in electrochemical processes
JPH0684544B2 (ja) * 1988-04-12 1994-10-26 株式会社ジャパンエナジー 無電解銅めっき液
DE3913966B4 (de) 1988-04-28 2005-06-02 Ibiden Co., Ltd., Ogaki Klebstoffdispersion zum stromlosen Plattieren, sowie Verwendung zur Herstellung einer gedruckten Schaltung
JP2947415B2 (ja) 1988-07-12 1999-09-13 三菱瓦斯化学株式会社 薄銅箔張回路基板の製造法
JPH0230769A (ja) * 1988-07-18 1990-02-01 Hitachi Chem Co Ltd 無電解めっき用前処理液
JPH0628941B2 (ja) * 1988-09-20 1994-04-20 株式会社日立製作所 回路基板及びその製造方法
JPH0793499B2 (ja) * 1989-01-10 1995-10-09 キヤノン株式会社 レーザーを用いた孔加工方法
JPH0734505B2 (ja) 1989-01-18 1995-04-12 イビデン株式会社 多層プリント配線板およびその製造方法
US5200271A (en) * 1989-02-22 1993-04-06 Idemitsu Petrochemical Co., Ltd. Polyarylene sulfide resin compositions and molded articles
JPH02238691A (ja) * 1989-03-10 1990-09-20 Hitachi Condenser Co Ltd プリント配線板の製造方法
JPH033296A (ja) * 1989-05-30 1991-01-09 Asahi Chem Ind Co Ltd 配線基板の製造方法
JP2714862B2 (ja) * 1989-08-11 1998-02-16 日東電工株式会社 免疫学的測定法
JP3098022B2 (ja) * 1990-06-14 2000-10-10 荏原ユージライト株式会社 局所析出皮膜形成方法
JPH0455555A (ja) 1990-06-25 1992-02-24 Misawa Homes Co Ltd 建物の手摺支柱の設置構造
US5243142A (en) * 1990-08-03 1993-09-07 Hitachi Aic Inc. Printed wiring board and process for producing the same
JP2874330B2 (ja) * 1990-11-07 1999-03-24 日本電気株式会社 多層印刷配線板の製造方法
US5344893A (en) * 1991-07-23 1994-09-06 Ibiden Co., Ltd. Epoxy/amino powder resin adhesive for printed circuit board
JP2620169B2 (ja) 1991-08-12 1997-06-11 株式会社三井ハイテック 電気めっき用の電源装置
JP2658661B2 (ja) * 1991-09-18 1997-09-30 日本電気株式会社 多層印刷配線板の製造方法
JPH05148662A (ja) 1991-11-28 1993-06-15 Hitachi Chem Co Ltd 無電解銅めつき液
JPH05287583A (ja) * 1992-04-07 1993-11-02 Okuno Chem Ind Co Ltd 非導電性材料表面に電気メッキ層を直接形成する方法
JPH06164149A (ja) * 1992-04-22 1994-06-10 Cmk Corp 多層プリント配線板の製造方法
JPH0621648A (ja) 1992-07-03 1994-01-28 Nec Toyama Ltd 印刷配線板の製造方法
DE4225961C5 (de) * 1992-08-06 2011-01-27 Atotech Deutschland Gmbh Vorrichtung zur Galvanisierung, insbesondere Verkupferung, flacher platten- oder bogenförmiger Gegenstände
JPH06112649A (ja) * 1992-09-24 1994-04-22 Mitsubishi Gas Chem Co Inc 多層プリント板の層間接続の製造方法
JPH06132629A (ja) 1992-10-20 1994-05-13 Mitsubishi Electric Corp プリント配線板の製造方法
US5306336A (en) * 1992-11-20 1994-04-26 Monsanto Company Sulfate-free electroless copper plating baths
JPH06275959A (ja) * 1993-03-22 1994-09-30 Hitachi Ltd 多層配線基板とその製造方法および両面プリント配線板の製造方法
JPH06302963A (ja) * 1993-04-13 1994-10-28 Tokuyama Soda Co Ltd 多層回路基板及びその製造方法
JPH06314883A (ja) * 1993-04-28 1994-11-08 Ibiden Co Ltd 多層プリント配線基板及びその製造方法
US5519177A (en) 1993-05-19 1996-05-21 Ibiden Co., Ltd. Adhesives, adhesive layers for electroless plating and printed circuit boards
JP3202840B2 (ja) * 1993-06-01 2001-08-27 日本シイエムケイ株式会社 多層プリント配線板
JP3632981B2 (ja) 1993-08-16 2005-03-30 株式会社東芝 多層配線基板および多層配線装置の製造方法
JPH07106769A (ja) * 1993-10-08 1995-04-21 Ibiden Co Ltd 電子部品搭載用多層基板の製造方法
US5419926A (en) * 1993-11-22 1995-05-30 Lilly London, Inc. Ammonia-free deposition of copper by disproportionation
JPH07283538A (ja) * 1994-04-14 1995-10-27 Ibiden Co Ltd 多層プリント配線板の製造方法
JPH07283539A (ja) 1994-04-14 1995-10-27 Sony Corp ビルドアップ多層プリント配線板
JP2513158B2 (ja) * 1994-05-25 1996-07-03 日本電気株式会社 プリント配線板の製造方法
JPH07336017A (ja) * 1994-06-08 1995-12-22 Hitachi Ltd 電流反転電解法による薄膜回路製造方法ならびにそれを用いた薄膜回路基板、薄膜多層回路基板および電子回路装置
JPH08153971A (ja) 1994-11-28 1996-06-11 Nec Home Electron Ltd 多層プリント配線基板及びその製造方法
JP3290041B2 (ja) * 1995-02-17 2002-06-10 インターナショナル・ビジネス・マシーンズ・コーポレーション 多層プリント基板、多層プリント基板の製造方法
US5780143A (en) * 1995-03-01 1998-07-14 Tokuyama Corporation Circuit board
JPH08264372A (ja) 1995-03-17 1996-10-11 Taiyo Yuden Co Ltd 無電解メッキ膜付電子部品の製造方法
JP3099175B2 (ja) * 1995-05-24 2000-10-16 東京特殊電線株式会社 電解による成膜方法
JP2889516B2 (ja) 1995-09-08 1999-05-10 株式会社ダイワ工業 多層配線基板の製造方法
US5699613A (en) * 1995-09-25 1997-12-23 International Business Machines Corporation Fine dimension stacked vias for a multiple layer circuit board structure
EP1318708B1 (de) * 1995-10-23 2004-10-20 Ibiden Co., Ltd. Harzfüllstoff und mehrschichtige Leiterplatte
JP3447029B2 (ja) * 1995-11-07 2003-09-16 イビデン株式会社 プリント配線板製造方法
US6010768A (en) * 1995-11-10 2000-01-04 Ibiden Co., Ltd. Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler
JPH09172261A (ja) * 1995-12-20 1997-06-30 Nippon Avionics Co Ltd 多層プリント配線板の製造方法
JPH09199855A (ja) * 1996-01-17 1997-07-31 Sony Corp 多層配線基板の製造方法
JP2765550B2 (ja) * 1996-01-23 1998-06-18 日本電気株式会社 多層配線基板、および多層配線基板の製造方法
JP3560299B2 (ja) * 1996-03-13 2004-09-02 三井金属鉱業株式会社 ヴィアホール付き多層プリント配線板
JP3944921B2 (ja) 1996-04-05 2007-07-18 日立化成工業株式会社 多層配線板の製造方法
JPH09289375A (ja) * 1996-04-23 1997-11-04 Kyocera Corp 多層配線基板
JP3580638B2 (ja) 1996-05-29 2004-10-27 京セラ株式会社 配線基板及びその製造方法
JP3785223B2 (ja) * 1996-06-10 2006-06-14 エルナー株式会社 多層プリント配線板の製造方法
JPH104254A (ja) 1996-06-14 1998-01-06 Ibiden Co Ltd プリント配線板の製造方法
JPH1063540A (ja) * 1996-08-19 1998-03-06 Nippon Denki Musen Denshi Kk 信号入力回路
JP3108024B2 (ja) 1996-08-22 2000-11-13 株式会社野田スクリーン ビルドアップ配線基板の製造方法
JPH10107436A (ja) 1996-09-27 1998-04-24 Ibiden Co Ltd プリント配線板とその製造方法
US6103992A (en) * 1996-11-08 2000-08-15 W. L. Gore & Associates, Inc. Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias
EP1796446B1 (de) * 1996-11-20 2011-05-11 Ibiden Co., Ltd. Leiterplatten
JPH10242639A (ja) 1996-12-19 1998-09-11 Ibiden Co Ltd 多層プリント配線板およびその製造方法
JPH10209604A (ja) 1997-01-17 1998-08-07 Hitachi Ltd プリント配線基板の製造方法並びにそれに用いる粗化液及び粗化液の調製方法
JP3259906B2 (ja) 1997-04-15 2002-02-25 イビデン株式会社 無電解めっき用接着剤およびプリント配線板
DE69811908T2 (de) 1997-04-15 2003-09-04 Ibiden Co Ltd Klebstoff zur stromlosen plattierung, ausgangszusammensetzung zur herstellung des klebstoffes zur stromlosen plattierung, und leiterplatte
IT1291604B1 (it) * 1997-04-18 1999-01-11 De Nora Spa Anodo per l'evoluzione di ossigeno in elettroliti contenenti fluoruri o loro derivati
US6225396B1 (en) * 1997-12-29 2001-05-01 Kyocera Corporation Resin composite and process for producing the same
MY144573A (en) 1998-09-14 2011-10-14 Ibiden Co Ltd Printed circuit board and method for its production
US6793796B2 (en) * 1998-10-26 2004-09-21 Novellus Systems, Inc. Electroplating process for avoiding defects in metal features of integrated circuit devices
US6214445B1 (en) * 1998-12-25 2001-04-10 Ngk Spark Plug Co., Ltd. Printed wiring board, core substrate, and method for fabricating the core substrate
KR100556818B1 (ko) 1999-05-13 2006-03-10 이비덴 가부시키가이샤 다층 프린트 배선판 및 그 제조방법
US6224737B1 (en) * 1999-08-19 2001-05-01 Taiwan Semiconductor Manufacturing Company Method for improvement of gap filling capability of electrochemical deposition of copper
JP4055555B2 (ja) 2002-11-12 2008-03-05 日産自動車株式会社 車両用空調装置
US7405146B2 (en) * 2006-01-24 2008-07-29 Kinsus Interconnect Technology Corp. Electroplating method by transmitting electric current from a ball side

Also Published As

Publication number Publication date
EP1667505A1 (de) 2006-06-07
EP1667506A1 (de) 2006-06-07
US8065794B2 (en) 2011-11-29
KR20060101562A (ko) 2006-09-25
EP1919266A2 (de) 2008-05-07
EP1667504B1 (de) 2012-02-01
MY128333A (en) 2007-01-31
US7691189B2 (en) 2010-04-06
US20040134682A1 (en) 2004-07-15
EP1667506B1 (de) 2012-02-01
US20070266886A1 (en) 2007-11-22
EP1923488A3 (de) 2009-05-27
US20090145652A1 (en) 2009-06-11
EP1117283A1 (de) 2001-07-18
US7827680B2 (en) 2010-11-09
EP1117283A4 (de) 2004-06-23
DE69931272T2 (de) 2007-03-15
EP1919266A3 (de) 2009-08-05
EP1923489A3 (de) 2009-05-27
MY144503A (en) 2011-09-30
EP1667507B1 (de) 2012-02-01
EP1923488A2 (de) 2008-05-21
EP1117283B1 (de) 2006-05-10
MY144574A (en) 2011-10-14
KR100815668B1 (ko) 2008-03-20
WO2000016597A1 (en) 2000-03-23
MY144573A (en) 2011-10-14
EP1667504A1 (de) 2006-06-07
EP1923489A2 (de) 2008-05-21
US7230188B1 (en) 2007-06-12
EP1667507A1 (de) 2006-06-07

Similar Documents

Publication Publication Date Title
DE69931272D1 (de) Gedruckte leiterplatte und verfahren zu deren herstellung
DE69937153D1 (de) Gedruckte leiterplatte und verfahren zu deren herstellung
DE69839486D1 (de) Gedruckte leiterplatte und verfahren zu deren herstellung
DE69839882D1 (de) Mehrschichtige gedruckte leiterplatte und verfahren zu deren herstellung
DE69934130D1 (de) Gedruckte leiterplatte und verfahren zu ihrer herstellung
DE69636010D1 (de) Gedruckte schaltungsplatte und verfahren zu deren herstellung
DE69931212D1 (de) Leiterplatte und Verfahren zu deren Herstellung
DE69939221D1 (de) Mehrschichtige leiterplatte und verfahren zu deren herstellung
DE60031949D1 (de) Leiterplatte und verfahren zu ihrer herstellung
DE69938182D1 (de) Mehrschichtige leiterplatte und verfahren zu deren herstellung
DE69934050D1 (de) Gedruckte Leiterplatte und Verfahren zu deren Herstellung
DE60126555D1 (de) Leiterplatte und Verfahren zu deren Herstellung
DE69941054D1 (de) Isosorbid enthaltende poyester und verfahren zu deren herstellung
DE59809806D1 (de) Chemische mikroreaktoren und verfahren zu deren herstellung
ATE551940T1 (de) Mehrschichtfolie und verfahren zu deren herstellung
DE69431723D1 (de) Leiterplatte und verfahren zu deren herstellung
DE69924980D1 (de) Feuerverzögernde konzentrate und verfahren zu deren herstellung
DE69815126D1 (de) Pyrimidinderivate und verfahren zu deren herstellung
ATE279506T1 (de) Tabletten und verfahren zu deren herstellung
DE69833799D1 (de) Klebefolie und verfahren zu deren herstellung
DE69908445D1 (de) Verbindungswerkstoff für elektronische Bauteile, elektronische Bauteile und Verfahren zu deren Herstellung
DE59410240D1 (de) Folienleiterplatten und verfahren zu deren herstellung
DE60032067D1 (de) Mehrschichtige Leiterplatte und Verfahren zu deren Herstellung
DE69713845T2 (de) Druckvorrichtung und verfahren zu deren herstellung
DE69833756D1 (de) Elektronisches bauelement und verfahren zu seiner herstellung

Legal Events

Date Code Title Description
8364 No opposition during term of opposition