JPS57116799A - Method for copper plating - Google Patents

Method for copper plating

Info

Publication number
JPS57116799A
JPS57116799A JP226481A JP226481A JPS57116799A JP S57116799 A JPS57116799 A JP S57116799A JP 226481 A JP226481 A JP 226481A JP 226481 A JP226481 A JP 226481A JP S57116799 A JPS57116799 A JP S57116799A
Authority
JP
Japan
Prior art keywords
thiourea
steel material
deriv
sulfuric acid
pickling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP226481A
Other languages
Japanese (ja)
Inventor
Toshio Fukuzuka
Kazutoshi Shimogoori
Masaaki Urai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Priority to JP226481A priority Critical patent/JPS57116799A/en
Publication of JPS57116799A publication Critical patent/JPS57116799A/en
Pending legal-status Critical Current

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  • Electroplating And Plating Baths Therefor (AREA)

Abstract

PURPOSE: To obtain a copper plating layer of good adhesive strength by electrolytically pickling a steel material in an aq. sulfuric acid which contg. thiourea or its deriv. without using cyanide harmful for sanitation then electroplating the same in a copper sulfate bath.
CONSTITUTION: About 0.005W0.5g/lthiourea or deriv. of thiourea such as aryl thiourea is added into an aq. sulfuric acid contg. about 20W100g/l sulfuric acid, and with a steel material as cathode, an electrolytic pickling treatment is accomplished at about 10W40°C, about 10W500A/dm2 current density and for about 0.5W10sec electricity conduction time. Immediately after this without washing by water, the steel material is electroplated with a copper sulfate plating bath similar to that by known methods. The thiourea or its deriv. electrostatically charges to ⊕ in the pickling bath, sticks and coats the surface of the steel material electrically in the electrolytic pickling stage, prevents replacement plating reaction in the electroplating stage and improves the adhesive strength of the copper plating layer considerably.
COPYRIGHT: (C)1982,JPO&Japio
JP226481A 1981-01-09 1981-01-09 Method for copper plating Pending JPS57116799A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP226481A JPS57116799A (en) 1981-01-09 1981-01-09 Method for copper plating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP226481A JPS57116799A (en) 1981-01-09 1981-01-09 Method for copper plating

Publications (1)

Publication Number Publication Date
JPS57116799A true JPS57116799A (en) 1982-07-20

Family

ID=11524505

Family Applications (1)

Application Number Title Priority Date Filing Date
JP226481A Pending JPS57116799A (en) 1981-01-09 1981-01-09 Method for copper plating

Country Status (1)

Country Link
JP (1) JPS57116799A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1919266A2 (en) 1998-09-14 2008-05-07 Ibiden Co., Ltd. Electroless plating solution, electroless plating process, and printed circuit board
CN114790563A (en) * 2022-04-29 2022-07-26 河北工业大学 Corrosion-resistant super-hydrophobic copper-nickel composite coating and preparation method and application thereof
WO2022170803A1 (en) * 2021-02-10 2022-08-18 张志梁 Electroplating solution for steel substrate direct cyanide-free plating under strong acidic conditions, and preparation method therefor

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1919266A2 (en) 1998-09-14 2008-05-07 Ibiden Co., Ltd. Electroless plating solution, electroless plating process, and printed circuit board
EP1923489A2 (en) 1998-09-14 2008-05-21 Ibiden Co., Ltd. A multilayer printed circuit board and a process for manufacturing the same
EP1923488A2 (en) 1998-09-14 2008-05-21 Ibiden Co., Ltd. A process for manufacturing a multilayer printed circuit board
EP1923488A3 (en) * 1998-09-14 2009-05-27 Ibiden Co., Ltd. A process for manufacturing a multilayer printed circuit board
US7691189B2 (en) 1998-09-14 2010-04-06 Ibiden Co., Ltd. Printed wiring board and its manufacturing method
US7827680B2 (en) 1998-09-14 2010-11-09 Ibiden Co., Ltd. Electroplating process of electroplating an elecrically conductive sustrate
US8065794B2 (en) 1998-09-14 2011-11-29 Ibiden Co., Ltd. Printed wiring board and its manufacturing method
WO2022170803A1 (en) * 2021-02-10 2022-08-18 张志梁 Electroplating solution for steel substrate direct cyanide-free plating under strong acidic conditions, and preparation method therefor
CN114790563A (en) * 2022-04-29 2022-07-26 河北工业大学 Corrosion-resistant super-hydrophobic copper-nickel composite coating and preparation method and application thereof

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