JPS57116799A - Method for copper plating - Google Patents
Method for copper platingInfo
- Publication number
- JPS57116799A JPS57116799A JP226481A JP226481A JPS57116799A JP S57116799 A JPS57116799 A JP S57116799A JP 226481 A JP226481 A JP 226481A JP 226481 A JP226481 A JP 226481A JP S57116799 A JPS57116799 A JP S57116799A
- Authority
- JP
- Japan
- Prior art keywords
- thiourea
- steel material
- deriv
- sulfuric acid
- pickling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Abstract
PURPOSE: To obtain a copper plating layer of good adhesive strength by electrolytically pickling a steel material in an aq. sulfuric acid which contg. thiourea or its deriv. without using cyanide harmful for sanitation then electroplating the same in a copper sulfate bath.
CONSTITUTION: About 0.005W0.5g/lthiourea or deriv. of thiourea such as aryl thiourea is added into an aq. sulfuric acid contg. about 20W100g/l sulfuric acid, and with a steel material as cathode, an electrolytic pickling treatment is accomplished at about 10W40°C, about 10W500A/dm2 current density and for about 0.5W10sec electricity conduction time. Immediately after this without washing by water, the steel material is electroplated with a copper sulfate plating bath similar to that by known methods. The thiourea or its deriv. electrostatically charges to ⊕ in the pickling bath, sticks and coats the surface of the steel material electrically in the electrolytic pickling stage, prevents replacement plating reaction in the electroplating stage and improves the adhesive strength of the copper plating layer considerably.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP226481A JPS57116799A (en) | 1981-01-09 | 1981-01-09 | Method for copper plating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP226481A JPS57116799A (en) | 1981-01-09 | 1981-01-09 | Method for copper plating |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57116799A true JPS57116799A (en) | 1982-07-20 |
Family
ID=11524505
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP226481A Pending JPS57116799A (en) | 1981-01-09 | 1981-01-09 | Method for copper plating |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57116799A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1919266A2 (en) | 1998-09-14 | 2008-05-07 | Ibiden Co., Ltd. | Electroless plating solution, electroless plating process, and printed circuit board |
CN114790563A (en) * | 2022-04-29 | 2022-07-26 | 河北工业大学 | Corrosion-resistant super-hydrophobic copper-nickel composite coating and preparation method and application thereof |
WO2022170803A1 (en) * | 2021-02-10 | 2022-08-18 | 张志梁 | Electroplating solution for steel substrate direct cyanide-free plating under strong acidic conditions, and preparation method therefor |
-
1981
- 1981-01-09 JP JP226481A patent/JPS57116799A/en active Pending
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1919266A2 (en) | 1998-09-14 | 2008-05-07 | Ibiden Co., Ltd. | Electroless plating solution, electroless plating process, and printed circuit board |
EP1923489A2 (en) | 1998-09-14 | 2008-05-21 | Ibiden Co., Ltd. | A multilayer printed circuit board and a process for manufacturing the same |
EP1923488A2 (en) | 1998-09-14 | 2008-05-21 | Ibiden Co., Ltd. | A process for manufacturing a multilayer printed circuit board |
EP1923488A3 (en) * | 1998-09-14 | 2009-05-27 | Ibiden Co., Ltd. | A process for manufacturing a multilayer printed circuit board |
US7691189B2 (en) | 1998-09-14 | 2010-04-06 | Ibiden Co., Ltd. | Printed wiring board and its manufacturing method |
US7827680B2 (en) | 1998-09-14 | 2010-11-09 | Ibiden Co., Ltd. | Electroplating process of electroplating an elecrically conductive sustrate |
US8065794B2 (en) | 1998-09-14 | 2011-11-29 | Ibiden Co., Ltd. | Printed wiring board and its manufacturing method |
WO2022170803A1 (en) * | 2021-02-10 | 2022-08-18 | 张志梁 | Electroplating solution for steel substrate direct cyanide-free plating under strong acidic conditions, and preparation method therefor |
CN114790563A (en) * | 2022-04-29 | 2022-07-26 | 河北工业大学 | Corrosion-resistant super-hydrophobic copper-nickel composite coating and preparation method and application thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0498436A3 (en) | Process for zinc electroplating of aluminum strip | |
MY112930A (en) | Method of surface-roughening treatment of copper foil | |
GB630165A (en) | Improvements in or relating to electroplating | |
JPS57116799A (en) | Method for copper plating | |
IE820347L (en) | Apparatus for electrodeposition | |
US3616288A (en) | Cement-lined metal pipe with improved bond between pipe and lining | |
JPS56112493A (en) | Chrome plating method | |
US2418970A (en) | Process of electrolytically depositing iron and iron alloys | |
JPS6479393A (en) | Production of zinc-chromium electroplated steel sheet | |
KR860001221A (en) | Metal Plating Method of Stainless Steel | |
JPS57152488A (en) | Pretreatment of ti or ti alloy for electroplating | |
US3207680A (en) | Method of electrodepositing iridium | |
JPS56298A (en) | Plating method | |
JPS57158395A (en) | Method and apparatus for preventing plating on back side in electroplating | |
JPS57152490A (en) | Surface treatment of copper foil | |
US3436322A (en) | Plating apparatus and process | |
Merony et al. | Method for Plating Copper on Steel Rods | |
SE9103061D0 (en) | NICKEL ELECTROPLATING PROCESS WITH REDUCED NICKEL ION BUILDUP | |
JPS5732395A (en) | Method for plating on iron or steel | |
JPS57140883A (en) | Electroplating method for wire for welding with copper sulfate | |
JPS5518540A (en) | Surface-treating method for magnesium or magnesium alloy | |
JPS57126991A (en) | Anodic etching method in hard chromium plating | |
Leroy | Method and Apparatus for Electroless Plating | |
GB567428A (en) | Improvements in and relating to the electrodeposition of silver | |
Kline | Cyanide-Free Copper Electroplating Process |