DE69833756D1 - Elektronisches bauelement und verfahren zu seiner herstellung - Google Patents
Elektronisches bauelement und verfahren zu seiner herstellungInfo
- Publication number
- DE69833756D1 DE69833756D1 DE69833756T DE69833756T DE69833756D1 DE 69833756 D1 DE69833756 D1 DE 69833756D1 DE 69833756 T DE69833756 T DE 69833756T DE 69833756 T DE69833756 T DE 69833756T DE 69833756 D1 DE69833756 D1 DE 69833756D1
- Authority
- DE
- Germany
- Prior art keywords
- production
- electronic component
- electronic
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
- Y10T29/435—Solid dielectric type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17142697 | 1997-06-27 | ||
JP9171426A JP3067698B2 (ja) | 1997-06-27 | 1997-06-27 | 積層セラミック電子部品の製造方法 |
PCT/JP1998/002881 WO1999000808A1 (fr) | 1997-06-27 | 1998-06-26 | Composant electronique et son procede de fabrication |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69833756D1 true DE69833756D1 (de) | 2006-05-04 |
DE69833756T2 DE69833756T2 (de) | 2006-11-02 |
Family
ID=15922922
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69833756T Expired - Fee Related DE69833756T2 (de) | 1997-06-27 | 1998-06-26 | Elektronisches bauelement und verfahren zu seiner herstellung |
Country Status (5)
Country | Link |
---|---|
US (1) | US6118647A (de) |
EP (1) | EP0953997B1 (de) |
JP (1) | JP3067698B2 (de) |
DE (1) | DE69833756T2 (de) |
WO (1) | WO1999000808A1 (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001118731A (ja) * | 1999-10-19 | 2001-04-27 | Murata Mfg Co Ltd | チップ型複合電子部品およびその製造方法 |
US7054136B2 (en) * | 2002-06-06 | 2006-05-30 | Avx Corporation | Controlled ESR low inductance multilayer ceramic capacitor |
JP5259107B2 (ja) * | 2007-03-22 | 2013-08-07 | 株式会社村田製作所 | 積層セラミック電子部品およびその製造方法 |
JP4992523B2 (ja) * | 2007-04-06 | 2012-08-08 | 株式会社村田製作所 | 積層セラミック電子部品およびその製造方法 |
US7859823B2 (en) * | 2007-06-08 | 2010-12-28 | Murata Manufacturing Co., Ltd. | Multi-layered ceramic electronic component |
DE102007043098A1 (de) * | 2007-09-10 | 2009-03-12 | Epcos Ag | Verfahren zur Herstellung eines Vielschichtbauelements |
US8468664B2 (en) * | 2008-05-22 | 2013-06-25 | Greatbatch Ltd. | Process for manufacturing EMI filters utilizing counter-bored capacitors to facilitate solder re-flow |
US20110052473A1 (en) * | 2009-08-25 | 2011-03-03 | Tdk Corporation | Method of manufacturing active material |
JP5444944B2 (ja) * | 2009-08-25 | 2014-03-19 | Tdk株式会社 | 活物質及び活物質の製造方法 |
JP5482062B2 (ja) * | 2009-09-29 | 2014-04-23 | Tdk株式会社 | 薄膜コンデンサ及び薄膜コンデンサの製造方法 |
KR101922863B1 (ko) * | 2011-05-31 | 2018-11-28 | 삼성전기 주식회사 | 적층형 세라믹 전자부품 및 그 제조방법 |
US9076600B2 (en) * | 2012-03-27 | 2015-07-07 | Tdk Corporation | Thin film capacitor |
US9030800B2 (en) | 2012-03-29 | 2015-05-12 | Tdk Corporation | Thin film capacitor |
DE102012105318A1 (de) * | 2012-06-19 | 2013-12-19 | Epcos Ag | Verfahren zur Herstellung eines keramischen Bauelements und ein keramisches Bauelement |
JP6520085B2 (ja) | 2014-12-05 | 2019-05-29 | Tdk株式会社 | 薄膜キャパシタ |
JP2017162956A (ja) | 2016-03-09 | 2017-09-14 | 株式会社村田製作所 | 電子部品及びその製造方法 |
JP6487364B2 (ja) * | 2016-03-30 | 2019-03-20 | 太陽誘電株式会社 | 積層セラミック電子部品の製造方法 |
TWI628678B (zh) | 2016-04-21 | 2018-07-01 | Tdk 股份有限公司 | 電子零件 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58173823A (ja) * | 1982-04-05 | 1983-10-12 | 株式会社村田製作所 | 積層コンデンサ |
JPH03129809A (ja) * | 1989-10-16 | 1991-06-03 | Tdk Corp | 積層型セラミックチップコンデンサおよびその製造方法 |
JPH0670936B2 (ja) * | 1990-03-19 | 1994-09-07 | 三菱マテリアル株式会社 | 積層セラミックコンデンサ |
JP2970110B2 (ja) * | 1991-09-13 | 1999-11-02 | 松下電器産業株式会社 | 積層セラミックコンデンサの製造方法 |
DE19542365A1 (de) * | 1995-11-14 | 1997-05-15 | Philips Patentverwaltung | Verfahren zur Herstellung eines vielschichtigen keramischen Elektronikbauteils |
EP0777242A3 (de) * | 1995-11-29 | 1999-12-01 | Matsushita Electric Industrial Co., Ltd | Keramisches elektronisches Bauteil und Verfahren zu dessen Herstellung |
-
1997
- 1997-06-27 JP JP9171426A patent/JP3067698B2/ja not_active Expired - Lifetime
-
1998
- 1998-06-26 US US09/242,129 patent/US6118647A/en not_active Expired - Fee Related
- 1998-06-26 WO PCT/JP1998/002881 patent/WO1999000808A1/ja active IP Right Grant
- 1998-06-26 DE DE69833756T patent/DE69833756T2/de not_active Expired - Fee Related
- 1998-06-26 EP EP98929719A patent/EP0953997B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP3067698B2 (ja) | 2000-07-17 |
EP0953997A1 (de) | 1999-11-03 |
WO1999000808A1 (fr) | 1999-01-07 |
US6118647A (en) | 2000-09-12 |
JPH1116764A (ja) | 1999-01-22 |
EP0953997A4 (de) | 2004-06-09 |
EP0953997B1 (de) | 2006-03-08 |
DE69833756T2 (de) | 2006-11-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |