DE69519894T2 - Photodetektor-Bauelement und Verfahren zu seiner Herstellung - Google Patents

Photodetektor-Bauelement und Verfahren zu seiner Herstellung

Info

Publication number
DE69519894T2
DE69519894T2 DE1995619894 DE69519894T DE69519894T2 DE 69519894 T2 DE69519894 T2 DE 69519894T2 DE 1995619894 DE1995619894 DE 1995619894 DE 69519894 T DE69519894 T DE 69519894T DE 69519894 T2 DE69519894 T2 DE 69519894T2
Authority
DE
Germany
Prior art keywords
production
photodetector component
photodetector
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE1995619894
Other languages
English (en)
Other versions
DE69519894D1 (de
Inventor
Naoki Nishiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=14948485&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69519894(T2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Application granted granted Critical
Publication of DE69519894D1 publication Critical patent/DE69519894D1/de
Publication of DE69519894T2 publication Critical patent/DE69519894T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
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    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4237—Welding
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    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
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    • H01L2224/37099—Material
    • H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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    • H01L2224/401—Disposition
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    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
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    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
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    • H01L2224/732—Location after the connecting process
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    • H01L2224/73265—Layer and wire connectors
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Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Light Receiving Elements (AREA)
  • Optical Couplings Of Light Guides (AREA)
DE1995619894 1994-05-16 1995-05-02 Photodetektor-Bauelement und Verfahren zu seiner Herstellung Expired - Fee Related DE69519894T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6126973A JP3047735B2 (ja) 1994-05-16 1994-05-16 光受信モジュ−ルとその製造方法

Publications (2)

Publication Number Publication Date
DE69519894D1 DE69519894D1 (de) 2001-02-22
DE69519894T2 true DE69519894T2 (de) 2001-06-07

Family

ID=14948485

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1995619894 Expired - Fee Related DE69519894T2 (de) 1994-05-16 1995-05-02 Photodetektor-Bauelement und Verfahren zu seiner Herstellung

Country Status (7)

Country Link
US (1) US5610395A (de)
EP (1) EP0684651B1 (de)
JP (1) JP3047735B2 (de)
KR (1) KR0167628B1 (de)
CA (1) CA2148894C (de)
DE (1) DE69519894T2 (de)
TW (1) TW275169B (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10064599A1 (de) * 2000-12-18 2002-07-04 Infineon Technologies Ag Sende-/Empfangsmodul für eine bidirektionale optische Nachrichten-und Signalübertragung

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JP3436009B2 (ja) * 1996-07-31 2003-08-11 住友電気工業株式会社 光半導体素子
JP3830583B2 (ja) * 1996-08-15 2006-10-04 富士通株式会社 光半導体アセンブリ
US5870517A (en) * 1997-10-07 1999-02-09 Integrated Device Technology, Inc. Package including self-aligned laser diode and method of aligning a laser diode
US5977567A (en) 1998-01-06 1999-11-02 Lightlogic, Inc. Optoelectronic assembly and method of making the same
US6585427B2 (en) 1999-01-11 2003-07-01 Intel Corporation Flexure coupled to a substrate for maintaining the optical fibers in alignment
US6511236B1 (en) 1999-09-07 2003-01-28 Intel Corporation Optoelectronic assembly and method for fabricating the same
US6207950B1 (en) 1999-01-11 2001-03-27 Lightlogic, Inc. Optical electronic assembly having a flexure for maintaining alignment between optical elements
DE19923417A1 (de) * 1999-05-21 2000-11-30 Tyco Electronics Logistics Ag Diodenhaltevorrichtung
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CA2148894C (en) 1999-05-11
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DE69519894D1 (de) 2001-02-22
EP0684651A2 (de) 1995-11-29
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EP0684651B1 (de) 2001-01-17
JP3047735B2 (ja) 2000-06-05
CA2148894A1 (en) 1995-11-17
EP0684651A3 (de) 1997-04-02
KR950033539A (ko) 1995-12-26
US5610395A (en) 1997-03-11
KR0167628B1 (ko) 1999-04-15

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