DE69404588D1 - Elektronisches Bauelement und Verfahren zu seiner Herstellung - Google Patents

Elektronisches Bauelement und Verfahren zu seiner Herstellung

Info

Publication number
DE69404588D1
DE69404588D1 DE69404588T DE69404588T DE69404588D1 DE 69404588 D1 DE69404588 D1 DE 69404588D1 DE 69404588 T DE69404588 T DE 69404588T DE 69404588 T DE69404588 T DE 69404588T DE 69404588 D1 DE69404588 D1 DE 69404588D1
Authority
DE
Germany
Prior art keywords
production
electronic component
electronic
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69404588T
Other languages
English (en)
Other versions
DE69404588T2 (de
Inventor
Daizo Ando
Syuji Kondo
Kunihiko Oishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP5227044A external-priority patent/JPH0786867A/ja
Priority claimed from JP22704593A external-priority patent/JP2998510B2/ja
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE69404588D1 publication Critical patent/DE69404588D1/de
Publication of DE69404588T2 publication Critical patent/DE69404588T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/058—Holders; Supports for surface acoustic wave devices
    • H03H9/059—Holders; Supports for surface acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16237—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
DE69404588T 1993-09-13 1994-09-13 Elektronisches Bauelement und Verfahren zu seiner Herstellung Expired - Lifetime DE69404588T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP5227044A JPH0786867A (ja) 1993-09-13 1993-09-13 電子部品とその製造方法
JP22704593A JP2998510B2 (ja) 1993-09-13 1993-09-13 電子部品とその製造方法

Publications (2)

Publication Number Publication Date
DE69404588D1 true DE69404588D1 (de) 1997-09-04
DE69404588T2 DE69404588T2 (de) 1997-11-27

Family

ID=26527479

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69404588T Expired - Lifetime DE69404588T2 (de) 1993-09-13 1994-09-13 Elektronisches Bauelement und Verfahren zu seiner Herstellung

Country Status (5)

Country Link
US (1) US5872331A (de)
EP (1) EP0643482B1 (de)
KR (1) KR0171921B1 (de)
CN (1) CN1063894C (de)
DE (1) DE69404588T2 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07221589A (ja) * 1994-01-31 1995-08-18 Matsushita Electric Ind Co Ltd 電子部品とその製造方法
SE511926C2 (sv) * 1997-04-16 1999-12-20 Ericsson Telefon Ab L M Skärmningshölje jämte förfarande för framställning och användning av ett skärmningshölje samt mobiltelefon med skärmningshölje
DE19806550B4 (de) 1998-02-17 2004-07-22 Epcos Ag Elektronisches Bauelement, insbesondere mit akustischen Oberflächenwellen arbeitendes Bauelement - OFW-Bauelement
DE19806818C1 (de) 1998-02-18 1999-11-04 Siemens Matsushita Components Verfahren zur Herstellung eines elektronischen Bauelements, insbesondere eines mit akustischen Oberflächenwllen arbeitenden OFW-Bauelements
JP3109477B2 (ja) * 1998-05-26 2000-11-13 日本電気株式会社 マルチチップモジュール
US6121672A (en) * 1998-11-03 2000-09-19 Utmc Microelectronic Systems Inc. Raised pedestal radiation shield for sensitive electronics
KR100418550B1 (ko) * 1998-12-29 2004-02-11 가부시끼가이샤 도시바 탄성표면파 장치
WO2001095486A1 (en) * 2000-06-06 2001-12-13 Sawtek Inc. System and method for array processing of surface acoustic wave devices
US6649832B1 (en) * 2001-08-31 2003-11-18 Cypress Semiconductor Corporation Apparatus and method for coupling with components in a surface mount package
US6930364B2 (en) * 2001-09-13 2005-08-16 Silicon Light Machines Corporation Microelectronic mechanical system and methods
US6877209B1 (en) 2002-08-28 2005-04-12 Silicon Light Machines, Inc. Method for sealing an active area of a surface acoustic wave device on a wafer
US6846423B1 (en) 2002-08-28 2005-01-25 Silicon Light Machines Corporation Wafer-level seal for non-silicon-based devices
JP4229122B2 (ja) 2003-05-26 2009-02-25 株式会社村田製作所 圧電電子部品、およびその製造方法、通信機
JP2004357094A (ja) * 2003-05-30 2004-12-16 Fujitsu Media Device Kk 電子部品及びパッケージ
WO2005099088A1 (en) * 2004-03-26 2005-10-20 Cypress Semiconductor Corp. Integrated circuit having one or more conductive devices formed over a saw and/or mems device
TWI238483B (en) * 2004-09-01 2005-08-21 Phoenix Prec Technology Corp Semiconductor electrical connecting structure and method for fabricating the same
US20090115642A1 (en) * 2007-10-31 2009-05-07 Tetsuji Omura Device actuated by key operations
JP5025425B2 (ja) * 2007-10-31 2012-09-12 三洋電機株式会社 携帯機器
US8247888B2 (en) * 2009-04-28 2012-08-21 Dai Nippon Printing Co., Ltd. Semiconductor device and method for manufacturing metallic shielding plate
CN111742622B (zh) * 2018-03-02 2023-09-29 株式会社村田制作所 多层陶瓷基板以及多层陶瓷基板的制造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3706840A (en) * 1971-05-10 1972-12-19 Intersil Inc Semiconductor device packaging
JPS5478692A (en) * 1977-12-05 1979-06-22 Matsushima Kogyo Co Ltd Crystal vibrator
JPS60170316A (ja) * 1984-02-14 1985-09-03 Nitto Electric Ind Co Ltd 気密封止型水晶発振子
US4639631A (en) * 1985-07-01 1987-01-27 Motorola, Inc. Electrostatically sealed piezoelectric device
JPH0815152B2 (ja) * 1986-01-27 1996-02-14 三菱電機株式会社 半導体装置及びその製造方法
JPS63241941A (ja) * 1987-03-30 1988-10-07 Toshiba Corp 貼設電子装置
US5103290A (en) * 1989-06-16 1992-04-07 General Electric Company Hermetic package having a lead extending through an aperture in the package lid and packaged semiconductor chip
US5166773A (en) * 1989-07-03 1992-11-24 General Electric Company Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid
JPH0340510A (ja) * 1989-07-06 1991-02-21 Murata Mfg Co Ltd 弾性表面波装置
DE69115799T2 (de) * 1990-08-28 1996-07-11 Ibm Herstellung von Halbleiterpackungen
DE69232277T2 (de) * 1991-09-12 2002-08-08 Matsushita Electric Ind Co Ltd Elektroakustische hybride integrierte Schaltung und Methode zu deren Herstellung
JPH10501656A (ja) * 1992-01-27 1998-02-10 ハリス・コーポレーション 半導体デバイス及びその量産方法
US5545845A (en) * 1994-11-21 1996-08-13 Dsc Communications Corporation Transportable weathertight EMI shielded cabinet structure

Also Published As

Publication number Publication date
KR0171921B1 (ko) 1999-03-30
KR950010727A (ko) 1995-04-28
DE69404588T2 (de) 1997-11-27
CN1104817A (zh) 1995-07-05
EP0643482A1 (de) 1995-03-15
CN1063894C (zh) 2001-03-28
EP0643482B1 (de) 1997-07-30
US5872331A (en) 1999-02-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8320 Willingness to grant licences declared (paragraph 23)