DE69519894D1 - Photodetektor-Bauelement und Verfahren zu seiner Herstellung - Google Patents
Photodetektor-Bauelement und Verfahren zu seiner HerstellungInfo
- Publication number
- DE69519894D1 DE69519894D1 DE69519894T DE69519894T DE69519894D1 DE 69519894 D1 DE69519894 D1 DE 69519894D1 DE 69519894 T DE69519894 T DE 69519894T DE 69519894 T DE69519894 T DE 69519894T DE 69519894 D1 DE69519894 D1 DE 69519894D1
- Authority
- DE
- Germany
- Prior art keywords
- production
- photodetector component
- photodetector
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4237—Welding
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- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
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- H01L2224/37001—Core members of the connector
- H01L2224/37099—Material
- H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H01L2224/4903—Connectors having different sizes, e.g. different diameters
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
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- H01L2924/01015—Phosphorus [P]
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- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H01L2924/1203—Rectifying Diode
- H01L2924/12033—Gunn diode
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- H01L2924/1305—Bipolar Junction Transistor [BJT]
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- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
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Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Light Receiving Elements (AREA)
- Optical Couplings Of Light Guides (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6126973A JP3047735B2 (ja) | 1994-05-16 | 1994-05-16 | 光受信モジュ−ルとその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69519894D1 true DE69519894D1 (de) | 2001-02-22 |
DE69519894T2 DE69519894T2 (de) | 2001-06-07 |
Family
ID=14948485
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69519894T Expired - Fee Related DE69519894T2 (de) | 1994-05-16 | 1995-05-02 | Photodetektor-Bauelement und Verfahren zu seiner Herstellung |
Country Status (7)
Country | Link |
---|---|
US (1) | US5610395A (de) |
EP (1) | EP0684651B1 (de) |
JP (1) | JP3047735B2 (de) |
KR (1) | KR0167628B1 (de) |
CA (1) | CA2148894C (de) |
DE (1) | DE69519894T2 (de) |
TW (1) | TW275169B (de) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3436009B2 (ja) * | 1996-07-31 | 2003-08-11 | 住友電気工業株式会社 | 光半導体素子 |
JP3830583B2 (ja) * | 1996-08-15 | 2006-10-04 | 富士通株式会社 | 光半導体アセンブリ |
US5870517A (en) * | 1997-10-07 | 1999-02-09 | Integrated Device Technology, Inc. | Package including self-aligned laser diode and method of aligning a laser diode |
US5977567A (en) | 1998-01-06 | 1999-11-02 | Lightlogic, Inc. | Optoelectronic assembly and method of making the same |
US6511236B1 (en) | 1999-09-07 | 2003-01-28 | Intel Corporation | Optoelectronic assembly and method for fabricating the same |
US6207950B1 (en) | 1999-01-11 | 2001-03-27 | Lightlogic, Inc. | Optical electronic assembly having a flexure for maintaining alignment between optical elements |
US6585427B2 (en) | 1999-01-11 | 2003-07-01 | Intel Corporation | Flexure coupled to a substrate for maintaining the optical fibers in alignment |
DE19923417A1 (de) * | 1999-05-21 | 2000-11-30 | Tyco Electronics Logistics Ag | Diodenhaltevorrichtung |
US6252726B1 (en) | 1999-09-02 | 2001-06-26 | Lightlogic, Inc. | Dual-enclosure optoelectronic packages |
US6540412B2 (en) * | 2000-02-10 | 2003-04-01 | Sumitomo Electric Industries, Ltd. | Optical transceiver |
JP4187376B2 (ja) * | 2000-02-16 | 2008-11-26 | ローム株式会社 | 受光増幅装置 |
TW502492B (en) * | 2000-05-30 | 2002-09-11 | Alps Electric Co Ltd | Electronic circuit unit |
DE10064599A1 (de) * | 2000-12-18 | 2002-07-04 | Infineon Technologies Ag | Sende-/Empfangsmodul für eine bidirektionale optische Nachrichten-und Signalübertragung |
JP3996780B2 (ja) * | 2001-03-21 | 2007-10-24 | シャープ株式会社 | 半導体レーザ装置およびその製造方法 |
DE10120692B4 (de) * | 2001-04-27 | 2004-02-12 | Siemens Ag | Montageanordnung von elektrischen und/oder elektronischen Bauteilen auf einer Leiterplatte |
JP2002329873A (ja) * | 2001-05-01 | 2002-11-15 | Mitsubishi Electric Corp | 半導体モジュールおよび半導体装置 |
US7359646B2 (en) | 2001-09-14 | 2008-04-15 | Finisar Corporation | Transmitter and/or receiver arrangement of optical signal transmission |
DE10154834A1 (de) * | 2001-11-08 | 2003-05-22 | Daimler Chrysler Ag | Stecker und Steckeraufnahme für ein optoelektronisches Steckersystem |
JP2003163403A (ja) * | 2001-11-29 | 2003-06-06 | Mitsubishi Electric Corp | 光素子モジュール |
JP2004088046A (ja) | 2002-06-25 | 2004-03-18 | Sumitomo Electric Ind Ltd | 光受信器及びその製造方法 |
US7224910B2 (en) * | 2002-10-25 | 2007-05-29 | Gennum Corporation | Direct attach optical receiver module and method of testing |
TWI247144B (en) * | 2003-12-05 | 2006-01-11 | Ind Tech Res Inst | Receiving optical subassembly |
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JP2007201213A (ja) | 2006-01-27 | 2007-08-09 | Opnext Japan Inc | 光受信モジュール |
WO2007098433A2 (en) * | 2006-02-17 | 2007-08-30 | Finisar Corporation | Discrete bootstrapping in an optical receiver to prevent signal feedback |
EP2003689B1 (de) * | 2007-06-15 | 2019-06-12 | Schott AG | Kopfstück, insbesondere für elektronische Gehäuse |
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JPH05243587A (ja) * | 1992-02-28 | 1993-09-21 | Toshiba Corp | 受光デバイス |
-
1994
- 1994-05-16 JP JP6126973A patent/JP3047735B2/ja not_active Expired - Lifetime
-
1995
- 1995-05-02 EP EP19950302974 patent/EP0684651B1/de not_active Expired - Lifetime
- 1995-05-02 DE DE69519894T patent/DE69519894T2/de not_active Expired - Fee Related
- 1995-05-08 CA CA002148894A patent/CA2148894C/en not_active Expired - Lifetime
- 1995-05-11 KR KR1019950011519A patent/KR0167628B1/ko not_active IP Right Cessation
- 1995-05-15 US US08/439,669 patent/US5610395A/en not_active Expired - Lifetime
- 1995-05-15 TW TW84104778A patent/TW275169B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR950033539A (ko) | 1995-12-26 |
CA2148894C (en) | 1999-05-11 |
KR0167628B1 (ko) | 1999-04-15 |
DE69519894T2 (de) | 2001-06-07 |
JP3047735B2 (ja) | 2000-06-05 |
US5610395A (en) | 1997-03-11 |
EP0684651B1 (de) | 2001-01-17 |
TW275169B (de) | 1996-05-01 |
CA2148894A1 (en) | 1995-11-17 |
EP0684651A2 (de) | 1995-11-29 |
JPH07312430A (ja) | 1995-11-28 |
EP0684651A3 (de) | 1997-04-02 |
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