CN213280225U - 埋入式电路板、设备或传感组件 - Google Patents

埋入式电路板、设备或传感组件 Download PDF

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Publication number
CN213280225U
CN213280225U CN202021322905.8U CN202021322905U CN213280225U CN 213280225 U CN213280225 U CN 213280225U CN 202021322905 U CN202021322905 U CN 202021322905U CN 213280225 U CN213280225 U CN 213280225U
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layer
metal layer
circuit board
substrate
embedded
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黄立湘
王泽东
缪桦
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Shennan Circuit Co Ltd
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Shennan Circuit Co Ltd
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    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/188—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component
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    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/143—Masks therefor
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    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/32—Insulating of coils, windings, or parts thereof
    • H01F27/324—Insulation between coil and core, between different winding sections, around the coil; Other insulation structures
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    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
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    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
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    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
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    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
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    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
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    • H05K3/46—Manufacturing multilayer circuits
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Abstract

本申请涉及电路板技术领域，具体公开了一种埋入式电路板、设备或传感组件，该埋入式电路板包括：基板，开设有槽体；电子器件，嵌设在槽体内，其中电子器件的一侧表面上设置有焊盘，焊盘端面与基板的同侧表面平齐；金属层，至少覆盖在焊盘上，其中金属层突出于基板的同侧表面。通过上述方式，本申请能够根据用户要求对基板上的焊盘进行二次加工，进而制造出满足用户不同的产品性能要求的埋入式电路板。

Description

埋入式电路板、设备或传感组件
技术领域
本申请涉及电路板技术领域，特别是涉及一种埋入式电路板、设备或传感组件。
背景技术
众所周知的，导电性能最好的几个金属分别为银、铜、金、铝。在电子行业中，特别是电路板行业中，以上几种导电性能最佳的金属中，成本高昂的金和银在电路板行业中极少被使用，现有半导体厂商通常将铝箔作为电子器件的焊盘材料以快速散去电子器件工作时产生的热量，并将铜箔作为铜线路层材料。
但本申请的发明人在长期的研发过程中，发现焊接铝箔焊盘与铜线路层时，容易得到铝铜合金，而铝铜合金电阻大，会造成电路板的工作能耗高和发热量大，进而严重影响电路板产品的稳定性，无法满足用户不同的产品性能要求。
实用新型内容
本申请提供一种埋入式电路板、设备或传感组件，能够根据用户要求对基板上的焊盘进行二次加工，进而制造出满足用户不同的产品性能要求的埋入式电路板。
一方面，本申请提供了一种埋入式电路板，埋入式电路板包括：基板，开设有槽体；电子器件，嵌设在槽体内，其中电子器件的一侧表面上设置有焊盘，焊盘端面与基板的同侧表面平齐；金属层，至少覆盖在焊盘上，其中金属层突出于基板的同侧表面。
第二方面，本申请提供了一种移动设备、汽车设备、基站设备或传感组件，其特征在于，包括如前述的埋入式电路板。
本申请提供的技术方案可以达到以下有益效果：
本申请通过在基板靠近焊盘的一侧表面形成金属层；对金属层进行图案化，以得到焊盘上覆盖有金属层的电路板，通过根据用户要求对基板上的焊盘进行二次加工，进而制造出满足用户不同的产品性能要求的埋入式电路板，例如在铝箔焊盘上形成一层隔离金属层，再在隔离金属层上形成铜线路层，进而避免铝箔焊盘与铜线路层直接焊接而形成大电阻的铝铜合金，达到对电子器件较好散热的效果，制造出满足用户散热要求的埋入式电路板。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。其中：
图1是本申请埋入式电路板的制造方法第一实施例的流程示意图；
图2是图1中步骤S20的流程示意图；
图3是图1中步骤S30的流程示意图；
图4是本申请埋入式电路板的制造方法第二实施例的流程示意图；
图5是本申请埋入式电路板的制造方法第三实施例的流程示意图；
图6是本申请埋入式电路板的制造方法第四实施例的流程示意图；
图7是本申请埋入式电路板第一实施例的结构示意图；
图8是本申请埋入式电路板第二实施例的结构示意图；
图9是本申请埋入式电路板第三实施例的结构示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性的劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请实施例中所有方向性指示(诸如上、下、左、右、前、后……)仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。此外，术语“包括”和“具有”以及它们任何变形，意图在于覆盖不排他的包含。例如包含了一系列步骤或单元的过程、方法、没有限定于已列出的步骤或单元，而是可选地还包括没有列出的步骤或单元，或可选地还包括对于这些过程、方法、固有的其它步骤或单元。
参阅图1，本申请提出一种埋入式电路板的制造方法，该方法包括以下步骤：
S10：提供一基板。基板中嵌设有一电子器件，其中，电子器件的一侧表面上设置有焊盘，焊盘端面与基板的同侧表面平齐。
具体地，基板可以为单层板或者多层板，该单层板可以为无铜芯板或者覆铜板，多层板可以是多个无铜芯板或者覆铜板采用层压处理方式直接制成。基板选用无铜芯板的目的是将埋入式电路板的厚度加厚，以足够厚度埋入电子器件。当然，基板也可选用覆铜板，覆铜板上可以设置线路以进行电路连接。
基板中开设有一槽体，电子器件嵌设在槽体中。其中槽体的尺寸可根据所需埋入的电子器件的大小而定。通常情况下，设置槽体的尺寸大于电子器件的尺寸。具体地，槽体沿基板的厚度方向上的尺寸可大于电子器件的尺寸，这样在后续处理时，基板可以对电子器件形成保护，减小电子器件在处理过程中受到的压力。槽体沿与基板的厚度方向垂直的方向上的尺寸可大于电子器件的尺寸，便于电子器件无损精确地埋入槽体中。
电子器件的一侧表面上设置有焊盘，焊盘端面与基板的同侧表面平齐。该焊盘用于连接电子器件以及埋入式电路板中的线路层。
S20：在基板靠近焊盘的一侧表面形成金属层。
采用溅射工艺、蒸镀工艺、电镀工艺或化学气相沉积工艺在基板靠近焊盘的一侧表面形成金属层。
S30：对金属层进行图案化，以得到焊盘上覆盖有金属层的电路板，其中焊盘上的金属层突出于基板的同侧表面。
通过光刻、湿法刻蚀或干法刻蚀工艺对金属层进行图案化，以形成如图6或图7所示的图案化后的金属层，该金属层至少覆盖焊盘，并突出于基板的同侧表面。
本申请通过在基板靠近焊盘的一侧表面形成金属层。对金属层进行图案化，以得到焊盘上覆盖有金属层的电路板，通过根据用户要求对基板上的焊盘进行二次加工，进而制造出满足用户不同的产品性能要求的埋入式电路板，例如在铝箔焊盘上形成一层隔离金属层，再在隔离金属层上形成铜线路层，进而避免铝箔焊盘与铜线路层直接焊接而形成大电阻的铝铜合金，达到对电子器件较好散热的效果，制造出满足用户散热要求的埋入式电路板。
在一实施例中，焊盘上的金属层突出基板的同侧表面超过5um。优选地，焊盘上的金属层突出基板的同侧表面5-13um。更优选地，焊盘上的金属层突出基板的同侧表面8um。
参阅图2，其中，上述步骤S20包括：
S21：对基板邻近焊盘的一侧表面进行溅射，以在基板上形成覆盖焊盘的第一金属层。
其中，上述焊盘的材料为铝。采用溅射工艺、蒸镀工艺、电镀工艺或化学气相沉积工艺于基板邻近焊盘的一侧表面上形成覆盖焊盘的第一金属层。上述第一金属层的材料为钛，第一金属层的厚度为0.1-0.2um。
S22：对第一金属层进行溅射，以在第一金属层上形成第二金属层。
采用溅射工艺、蒸镀工艺、电镀工艺或化学气相沉积工艺于第一金属层上形成第二金属层。上述第二金属层的材料为铜，第二金属层的厚度为0.3-0.8um，导电性好、化学性质稳定。
S23：在第二金属层上电镀形成第三金属层。
采用溅射工艺、蒸镀工艺、电镀工艺或化学气相沉积工艺于第二金属层上形成第三金属层。上述第三金属层的材料为铜，第三金属层的厚度为5-11um，导电性好、化学性质稳定。
本实施例中，通过在铝箔焊盘上形成一层隔离钛层，再在隔离钛层上形成铜线路层，进而避免铝箔焊盘与铜线路层直接焊接而形成大电阻的铝铜合金，达到对电子器件较好散热的效果，制造出满足用户散热要求的埋入式电路板。
参阅图3，其中，上述步骤S30包括：
S24：在第二层金属层背向第一金属层的一侧进行贴掩膜。
在第二层金属层上进行掩膜制作，仅在第二层金属层背向第一金属层的一表面形成掩膜，制作后的掩膜遮盖在第二层金属层背向焊盘的一表面上。
S25：对掩膜上的预设曝光区域曝光，并显影除去掩膜上的预设未曝光区域，以留下掩膜上的预设曝光区域作为后续电镀步骤的可移除掩膜。
掩膜包括预设曝光区域及预设未曝光区域，该预设未曝光区域覆盖与焊盘对应的第二金属层。该步骤中，当对预设曝光区域进行曝光之后，可以使用显影液对预设未曝光区域进行显影处理，从而去除预设未曝光区域的掩膜，以保留掩膜上的预设曝光区域。
S26：在第二金属层以及掩膜的预设曝光区域上电镀形成第三金属层。
采用溅射工艺、蒸镀工艺、电镀工艺或化学气相沉积工艺于在第二金属层以及掩膜上的预设曝光区域上形成第三金属层。上述第三金属层的材料为铜，第三金属层的厚度为5-11um，导电性好、化学性质稳定。
S27：移除剩余的掩膜以及设置在掩膜的预设曝光区域上的第三金属层。
剥离剩余的掩膜，并移除设置在掩膜的预设曝光区域上的第三金属层。
S28：对金属层进行蚀刻，以去除覆盖焊盘以外区域的第一金属层和第二金属层，得到焊盘上覆盖有第三金属层的电路板。
对整板的金属层进行蚀刻，由于与焊盘对应的区域上设有第一金属层、第二金属层、第三金属层，因此，与焊盘对应的区域上的金属层比较厚，在蚀刻后会保留至少一部分第三金属层。而焊盘以外的区域仅覆盖第一金属层、第二金属层，因此，该焊盘以外的区域上的金属层比较薄。
在步骤S28中，覆盖焊盘以外的区域的第一金属层、第二金属层均被蚀刻去除，最后仅剩余覆盖与焊盘对应的区域的金属层作为线路层。
参阅图4，其中，上述步骤S30包括：
S31：在金属层背向焊盘的一表面进行贴掩膜。
在金属层上进行掩膜制作，仅在金属层背向焊盘的一表面形成掩膜，制作后的掩膜遮盖在金属层背向焊盘的一表面上。
S32：对掩膜上的预设曝光区域曝光，并显影除去掩膜上的预设未曝光区域，以留下掩膜上的预设曝光区域作为后续蚀刻步骤的保护掩膜。
掩膜包括预设曝光区域及预设未曝光区域，该步骤中，当对预设曝光区域进行曝光之后，可以使用显影液对预设未曝光区域进行显影处理，从而去除预设未曝光区域的掩膜，以保留掩膜上的预设曝光区域，该预设曝光区域覆盖与焊盘对应的金属层。
S33：对金属层进行蚀刻，以去除覆盖焊盘以外区域的金属层。
可以是利用预设曝光区域作为掩膜板，使用光刻、干法蚀刻或湿法蚀刻将焊盘以外区域所对应的金属层蚀刻掉，留下与焊盘对应的金属层。
S34：除去剩余的掩膜，得到焊盘上覆盖有金属层的电路板。
剥离剩余的掩膜，得到焊盘上覆盖有金属层的电路板。
参阅图5，其中，上述步骤S30之后，该方法还包括：
S40：在基板远离金属层的一侧上依次层叠设置第一外层介质层以及第一外层线路层。
S50：在金属层远离基板的一侧上依次层叠设置第二外层介质层以及第二外层线路层。
S60：压合第一外层线路层、第一外层介质层、基板、金属层、第二外层介质层以及第二外层线路层，以固定第一外层线路层、基板、金属层以及第二外层线路层。
具体地，将基板放置于专用模具内，并将第一外层介质层、第二外层介质层分别敷设于基板的上下两面，将第一外层线路层设置在第一外层介质层上，将第二外层线路层设置在第二外层介质层上。对第一外层线路层、第一外层介质层、基板、金属层、第二外层介质层以及第二外层线路层进行压合，其中，第一外层介质层、第二外层介质层熔融，进而将基板与第一外层线路层、第二外层线路层粘合在一起。
上述第一外层介质层、第二外层介质层为树脂、硅胶中的一种绝缘材料或任意组合。
具体地，树脂是指受热后有软化或熔融范围，软化时在外力作用下有流动倾向，常温下是固态、半固态，有时也可以是液态的有机聚合物。树脂可以为环氧树脂、有机硅树脂、聚酰亚胺树脂、酚醛树脂、聚氨酯、丙烯酸树脂等胶黏剂体系。硅胶是一种无色透明液体，能够在150℃以上高温下进行硫化，固化时具有一定的透气性及弹性，主要具有耐温特性、耐候性、电气绝缘性、生理惰性、低表面张力和低表面能。
进一步地，第一外层介质层、第二外层介质层的材料可以是高散热材料、磁性材料或者低传输损耗的材料。当第一外层介质层、第二外层介质层的材料是高散热材料时，可以提高埋入式电路板的散热性能，当第一外层介质层、第二外层介质层的材料是磁性材料时，可以起到电磁屏蔽的作用，当第一外层介质层、第二外层介质层的材料是低传输损耗的材料时，有利于射频信号、高频信号的传输。
参阅图6，其中，上述步骤S60之后，该方法还包括：
S70：对第二外层线路层以及第二外层介质层进行激光打孔，以形成贯通对第二外层线路层以及介质层的激光通孔。
S80：在激光通孔内填入导电柱，其中导电柱接触第二金属层，以使电子器件通过焊盘、金属层以及导电柱与第二外层线路层电连接。
参阅图7，本申请实施例提供一种埋入式电路板100，埋入式电路板100包括：基板10、电子器件20以及金属层30。基板10开设有槽体101，电子器件20嵌设在槽体101内，其中电子器件20的一侧表面上设置有焊盘40，焊盘40端面与基板10的同侧表面平齐。金属层30至少覆盖在焊盘40上，其中金属层30突出于基板10的同侧表面。
具体地，基板10可以为单层板或者多层板，该单层板可以为无铜芯板或者覆铜板，多层板可以是多个无铜芯板或者覆铜板采用层压处理方式直接制成。基板10选用无铜芯板的目的是将埋入式电路板100的厚度加厚，以足够厚度埋入电子器件20。当然，基板10也可选用覆铜板，覆铜板上可以设置线路以进行电路连接。
基板10中开设有一槽体101，电子器件20嵌设在槽体101中。其中槽体101的尺寸可根据所需埋入的电子器件20的大小而定。通常情况下，设置槽体101的尺寸大于电子器件20的尺寸。具体地，槽体101沿基板10的厚度方向上的尺寸可大于电子器件20的尺寸，这样在后续处理时，基板10可以对电子器件20形成保护，减小电子器件20在处理过程中受到的压力。槽体101沿与基板10的厚度方向垂直的方向上的尺寸可大于电子器件20的尺寸，便于电子器件20无损精确地埋入槽体101中。电子器件20的一侧表面上设置有焊盘40，焊盘40端面与基板10的同侧表面平齐。该焊盘40用于连接电子器件20以及埋入式电路板100中的线路层。
在一实施例中，焊盘40上的金属层30突出基板10的同侧表面超过5um。优选地，焊盘40上的金属层30突出基板10的同侧表面5-13um(例如3um、5um、9um或13um)。更优选地，焊盘40上的金属层30突出基板10的同侧表面8um。
在一实施例中，金属层30包括依次层叠在焊盘40上的第一金属层30A、第二金属层30B以及第三金属层30C。其中，第一金属层30A的厚度为0.1-0.2um(例如0.1um、0.12um、0.16um或0.2um)，第二金属层30B的厚度为0.3-0.8um(例如0.3um、0.5um、0.7um或0.8um)，第三金属层30C的厚度为5-11um(例如5um、7um、9um或11um)。
其中，第二金属层30B的材料与第三金属层30C的材料相同。进一步地，焊盘40的材料为铝，第一金属层30A的材料为钛，第二金属层30B的材料为铜，第三金属层30C的材料为铜。
本实施例中，通过在铝箔焊盘40上形成一层隔离钛层，再在隔离钛层上形成铜线路层，进而避免铝箔焊盘40与铜线路层直接焊接而形成大电阻的铝铜合金，达到对电子器件20较好散热的效果，制造出满足用户散热要求的埋入式电路板100。
其中，埋入式电路板100还包括：第一外层线路层50、第二外层线路层60、第一外层介质层71以及第二外层介质层72。第一外层线路层50和第二外层线路层60设置在基板10的相对两侧，且第二外层线路层60覆盖金属层30，第一外层介质层71设置在第一外层线路层50与基板10之间，第二外层介质层72设置在第二外层线路层60与基板10之间。
上述第一外层介质层71、第二外层介质层72为树脂、硅胶中的一种绝缘材料或任意组合。具体地，树脂是指受热后有软化或熔融范围，软化时在外力作用下有流动倾向，常温下是固态、半固态，有时也可以是液态的有机聚合物。树脂可以为环氧树脂、有机硅树脂、聚酰亚胺树脂、酚醛树脂、聚氨酯、丙烯酸树脂等胶黏剂体系。硅胶是一种无色透明液体，能够在150℃以上高温下进行硫化，固化时具有一定的透气性及弹性，主要具有耐温特性、耐候性、电气绝缘性、生理惰性、低表面张力和低表面能。
进一步地，第一外层介质层71、第二外层介质层72的材料可以是高散热材料、磁性材料或者低传输损耗的材料。当第一外层介质层71、第二外层介质层72的材料是高散热材料时，可以提高埋入式电路板100的散热性能，当第一外层介质层71、第二外层介质层72的材料是磁性材料时，可以起到电磁屏蔽的作用，当第一外层介质层71、第二外层介质层72的材料是低传输损耗的材料时，有利于射频信号、高频信号的传输。
可选地，设置至少一个元器件(图未示)在第一外层线路层50、远离基板10的一侧上和/或第二外层线路层60远离基板10的一侧上，元器件通过第一外层线路层50和/或第二外层线路层60实现与电子器件20的电连接，其中，元器件可以是芯片、电容元件、电阻元件中的一种或几种。
进一步地，埋入式电路板100还包括：贯穿第一外层介质层71、基板10以及第二外层介质层72的导电孔80。金属层30还覆盖在基板10的与焊盘40端面平齐的同侧表面，且金属层30连接导电孔80，以使电子器件20依序通过焊盘40、金属层30以及导电孔80电连接至第一外层线路层50和/或第二外层线路层60。
具体地，可以对第一外层介质层71、基板10以及第二外层介质层72的对应位置进行图形化处理，以在第一外层介质层71、基板10以及第二外层介质层72开设贯穿孔，对贯穿孔进行沉铜电镀，以在贯穿孔的内壁上形成导电层，得到导电孔80，进而实现电子器件20依序通过焊盘40、金属层30以及导电孔80电连接至第一外层线路层50和/或第二外层线路层60。
参阅图8，在一实施例中，金属层30仅覆盖在焊盘40上，埋入式电路板100还包括：贯穿第二外层线路层60以及第二外层介质层72的激光通孔，其中，激光通孔内填有导电柱90，导电柱90电连接金属层30以及第二外层线路层60，以使电子器件20依序通过焊盘40、金属层30以及导电柱90电连接至第二外层线路层60。
具体地，在第二外层线路层60以及第二外层介质层72的对应位置处均设置激光通孔，并在激光通孔中设置导电柱90，电子器件20依序通过焊盘40依序通过焊盘40、金属层30以及导电柱90电连接至第二外层线路层60。
进一步地，埋入式电路板100还包括：贯穿第一外层介质层71、基板10以及第二外层介质层72的导电孔80，以使电子器件20依序通过焊盘40、金属层30、导电柱90、第二外层线路层60以及导电孔80电连接至第一外层线路层50。
参阅图9，在一实施例中，基板10包括依次交替层叠的若干层子体110和若干层介质层120，其中，若干层子体110和若干层介质层120中开设有用于嵌设电子器件20的槽体101。
具体地，子体110可以是无铜芯板或者覆铜板，子体110选用无铜芯板的目的是将埋入式电路板100的厚度加厚，以足够厚度埋入电子器件20。当然，子体110也可选用覆铜板，覆铜板上可以设置线路以进行电路连接。
相邻子体110之间设有介质层120，其中，压合时，至少部分介质层120流入电子器件20与槽体101的侧壁之间并接触电子器件20，进而将各层子体110以及电子器件20粘合在一起。
本申请还提供一种如上述实施例的埋入式电路板100在移动设备、汽车设备、基站设备或传感组件中的应用。
本申请还提供一种移动设备、汽车设备、基站设备或传感组件，包括如上述实施例的埋入式电路板100。
以上所述仅为本申请的实施方式，并非因此限制本申请的专利范围，凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (14)

1.一种埋入式电路板，其特征在于，所述埋入式电路板包括：
基板，开设有槽体；
电子器件，嵌设在所述槽体内，其中所述电子器件的一侧表面上设置有焊盘，所述焊盘端面与所述基板的同侧表面平齐；
金属层，至少覆盖在所述焊盘上，其中所述金属层突出于所述基板的同侧表面。
2.根据权利要求1所述的埋入式电路板，其特征在于，
所述焊盘上的所述金属层突出所述基板的同侧表面超过5um。
3.根据权利要求2所述的埋入式电路板，其特征在于，
所述焊盘上的所述金属层突出所述基板的同侧表面5-13um。
4.根据权利要求3所述的埋入式电路板，其特征在于，
所述焊盘上的所述金属层突出所述基板的同侧表面8um。
5.根据权利要求1所述的埋入式电路板，其特征在于，
所述金属层包括依次层叠在所述焊盘上的第一金属层、第二金属层以及第三金属层。
6.根据权利要求5所述的埋入式电路板，其特征在于，
所述第二金属层的材料与所述第三金属层的材料相同。
7.根据权利要求5所述的埋入式电路板，其特征在于，
所述焊盘的材料为铝；
所述第一金属层的材料为钛；
所述第二金属层的材料为铜；
所述第三金属层的材料为铜。
8.根据权利要求5所述的埋入式电路板，其特征在于，
所述第一金属层的厚度为0.1-0.2um；
所述第二金属层的厚度为0.3-0.8um；
所述第三金属层的厚度为5-11um。
9.根据权利要求1所述的埋入式电路板，其特征在于，所述埋入式电路板还包括：
设置在所述基板相对两侧的第一外层线路层和第二外层线路层，且所述第二外层线路层覆盖所述金属层；
第一外层介质层，设置在所述第一外层线路层与所述基板之间；
第二外层介质层，设置在所述第二外层线路层与所述基板之间。
10.根据权利要求9所述的埋入式电路板，其特征在于，所述埋入式电路板还包括：贯穿所述第一外层介质层、所述基板以及所述第二外层介质层的导电孔；
所述金属层还覆盖在所述基板的与所述焊盘端面平齐的同侧表面，且所述金属层连接所述导电孔，以使所述电子器件依序通过所述焊盘、所述金属层以及所述导电孔电连接至所述第一外层线路层和/或所述第二外层线路层。
11.根据权利要求9所述的埋入式电路板，其特征在于，所述金属层仅覆盖在所述焊盘上，所述埋入式电路板还包括：
贯穿所述第二外层线路层以及所述第二外层介质层的激光通孔，其中，所述激光通孔内填有导电柱，所述导电柱电连接所述金属层以及所述第二外层线路层，以使所述电子器件依序通过所述焊盘、所述金属层以及所述导电柱电连接至所述第二外层线路层。
12.根据权利要求11所述的埋入式电路板，其特征在于，所述埋入式电路板还包括：
贯穿所述第一外层介质层、所述基板以及所述第二外层介质层的导电孔，以使所述电子器件依序通过所述焊盘、所述金属层、所述导电柱、所述第二外层线路层以及所述导电孔电连接至所述第一外层线路层。
13.根据权利要求1所述的埋入式电路板，其特征在于，所述基板包括依次交替层叠的若干层子体和若干层介质层，其中，所述若干层子体和所述若干层介质层中开设有用于嵌设所述电子器件的所述槽体。
14.一种移动设备、汽车设备、基站设备或传感组件，其特征在于，包括如上述权利要求1-13任一项所述的埋入式电路板。
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CN202010645381.4A Pending CN112203412A (zh) 2019-07-07 2020-07-07 埋入式电路板、电子装置
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CN202010645946.9A Pending CN112203433A (zh) 2019-07-07 2020-07-07 埋入式电路板的制造方法、埋入式电路板以及应用
CN202021318375.XU Active CN213403656U (zh) 2019-07-07 2020-07-07 线路板
CN202021329677.7U Active CN213280231U (zh) 2019-07-07 2020-07-07 埋入式电路板、移动设备以及传感组件
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CN202021329565.1U Active CN213586434U (zh) 2019-07-07 2020-07-07 一种埋入式电路板
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