CN112201456A - 电感组件及其制作方法 - Google Patents

电感组件及其制作方法 Download PDF

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Publication number
CN112201456A
CN112201456A CN202010645958.1A CN202010645958A CN112201456A CN 112201456 A CN112201456 A CN 112201456A CN 202010645958 A CN202010645958 A CN 202010645958A CN 112201456 A CN112201456 A CN 112201456A
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CN
China
Prior art keywords
magnetic element
winding
circuit board
blind hole
pad
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Pending
Application number
CN202010645958.1A
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English (en)
Inventor
黄立湘
王泽东
缪桦
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Shennan Circuit Co Ltd
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Shennan Circuit Co Ltd
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Publication date
Application filed by Shennan Circuit Co Ltd filed Critical Shennan Circuit Co Ltd
Priority to PCT/CN2020/127010 priority Critical patent/WO2022007269A1/zh
Priority to EP20944045.2A priority patent/EP4181159A4/en
Publication of CN112201456A publication Critical patent/CN112201456A/zh
Priority to US18/150,777 priority patent/US20230154665A1/en
Pending legal-status Critical Current

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    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
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    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
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    • H05K3/46—Manufacturing multilayer circuits
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Abstract

本发明提供一种电感组件及其制作方法，包括：线路板，所述线路板上设置有槽体；磁性元件，嵌入于所述槽体中；其中，所述磁性元件上设置有沿所述磁性元件厚度方向环绕所述磁性元件的绕线，所述绕线与所述线路板电连接。以此实现埋入式电感组件的制作，实现产品的小型化。

Description

电感组件及其制作方法
技术领域
本申请涉及电感埋入技术领域，特别是涉及一种电感组件及其制作方法。
背景技术
混合集成电路正在步入将系统芯片、微传感器、微执行器和外围薄膜无源元件集成在一起进行系统封装的阶段，封装技术对系统采用独特的方式，能够缩小体积庞大的线路板连通许多元器件的尺寸。无源器件(电容、电感、电阻等)在线路板中占到元件数目的70％到90％，占基板面积的70％到80％，如果线路板无源器件隐埋技术被广泛应用，产品的尺寸缩小的幅度预计将缩小几十倍。
如今线路板设计中电感被大量应用，形成的无源滤波电路主要起调信号、滤波的作用。电源部分的电感组件占用电源表面40％以上的面积，不利于产品的小型化设计。
发明内容
本申请主要提供一种电感组件及其制作方法，以实现埋入式电感组件的制作，实现产品的小型化。
为解决上述技术问题，本发明提供的第一个技术方案是：提供一种电感组件，包括：线路板，所述线路板上设置有槽体；磁性元件，嵌入于所述槽体中；其中，所述磁性元件上设置有沿所述磁性元件厚度方向环绕所述磁性元件的绕线，所述绕线与所述线路板电连接。
其中，电感组件还包括：磁芯；所述磁性组件为环形，且所述磁芯的轴向方向垂直于所述线路板的平面方向；所述线路板对应所述磁性组件的环形部分设置有第一通孔；所述磁芯插入所述第一通孔且与所述线路板的两表面平齐；其中，所述磁芯与所述磁性元件之间及所述磁性元件与所述槽体之间填充有第一绝缘层。
其中，所述磁性元件的垂直于所述线路板的厚度方向的表面上设置有第一焊盘及第二焊盘；所述第一焊盘与所述绕线的输入端电连接，所述第二焊盘与所述绕线的输出端电连接。
其中，所述第一焊盘及所述第二焊盘对应所述线路板的位置具有第一盲孔及第二盲孔；所述线路板上设置有线路图像层；所述第一盲孔及所述第二盲孔的侧壁具有导电层；所述第一焊盘通过所述第一盲孔与所述线路图像层电连接，以将所述绕线的输入端与所述线路图形层电连接；所述第二焊盘通过所述第二盲孔与所述线路图形层电连接，以将所述绕线的输出端与所述线路图形层电连接。
其中，所述第一焊盘及所述第二焊盘位于所述磁性元件的同一表面；或所述第一焊盘及所述第二焊盘位于所述磁性元件的相对两表面。
其中，所述槽体不贯穿所述线路板的两表面。
其中，所述磁性元件上涂覆有第二绝缘层，所述绕线位于所述第二绝缘层的表面，所述绕线材料为铜。
为解决上述技术问题，本发明提供的第二个技术方案为：提供一种电感组件的制作方法，包括：提供线路板，所述线路板上设置有槽体；在所述磁性元件上设置沿所述磁性元件厚度方向环绕所述磁性元件的绕线；将所述磁性元件嵌入于所述槽体中并进行高温；其中，所述绕线与所述线路板电连接。
其中，所述磁性元件为环形；所述在所述磁性元件上设置沿所述磁性元件厚度方向环绕所述磁性元件的绕线的步骤包括：在所述磁性元件上设置第二绝缘层；在所述第二绝缘层上进行电镀，形成沿所述磁性元件厚度方向环绕的绕线；在所述磁性元件垂直于所述厚度方向的表面上设置连接所述绕线的输入端的第一焊盘，及连接所述绕线的输出端的第二焊盘；所述将所述磁性元件嵌入于所述槽体中并进行高温压合；其中，所述绕线与所述线路板电连接的步骤还包括：在所述线路板对应所述磁性元件的环形部分设置第一通孔；在所述第一通孔中设置磁芯；其中，所述磁芯与所述磁性元件之间填充有第一绝缘层。
其中，所述线路板包括线路图形层；所述将所述磁性元件嵌入于所述槽体中并进行高温；其中，所述绕线与所述线路板电连接的步骤之后，还包括：在所述线路板对应所述第一焊盘的位置处设置第一盲孔，及在所述线路板对应所述第二焊盘的位置处设置第二盲孔；在所述第一盲孔及第二盲孔中设置导电层，以将所述绕线的输入端、输出端与所述线路图形层电连接。
区别于现有技术，本申请通过设置线路板，在线路板上设置有槽体；将磁性元件嵌入于槽体中；其中，磁性元件上设置有沿磁性元件厚度方向环绕磁性元件的绕线，绕线与所述线路板电连接。以此实现埋入式电感组件的制作，实现产品的小型化。
附图说明
图1是本发明电感组件的第一实施例的结构示意图；
图2是本发明电感组件的第二实施例的结构示意图；
图3是本发明电感组件的磁性元件的第一实施例的结构示意图；
图4是本发明电感组件的磁性元件的第二实施例的流程示意图；
图5是本发明电感组件的制作方法的第一实施例的流程示意图；
图6是本发明电感组件的制作方法的第二实施例的流程示意图。
具体实施方式
下面将结合本申请实施方式中的附图，对本申请实施方式中的技术方案进行清楚、完整地描述，显然，所描述的实施方式仅仅是本申请一部分实施方式，而不是全部实施方式。基于本申请中的实施方式，本领域普通技术人员在没有做出创造性的劳动前提下所获得的所有其他实施方式，都属于本申请保护的范围。
请参见图1，为本申请电感组件的第一实施例的结构示意图。包括：线路板11、磁性元件13。其中，线路板11上设置有槽体12，磁性元件13设置于槽体12中，在磁性元件13设置于槽体12中时，磁性元件13的轴向方向与线路板11的平面方向垂直。槽体12不贯穿线路板11的两表面。在一具体实施例中，线路板11包括芯板111及半固化片112，其中，芯板111为覆铜板，即为制作线路板11的基础材料，包括基材板及覆盖在所述基材板上的铜箔，所述基材板由纸基板、玻纤布基板、合成纤维布基板、无纺布基板、复合基板等材料浸以树脂，制成粘结片，由多张粘结片组合制成，在制作好的基材板单面或双面覆以铜箔，再进行热压固化以制成覆铜板。在一实施例中，芯板111的两表面的铜箔上可以具有线路图形层，也可以不具有线路图形层，具体按要求设置，在此不做限定。半固化片112为层压时的层间粘结层，具体地，所述半固化片112主要由树脂和增强材料组成，在制作多层线路板时，通常采用玻纤布做增强材料，将其浸渍上树脂胶液，再经热处理预烘制成薄片，其加热加压下会软化，冷却后会固化，且具有黏性，在高温压合过程中能将相邻的两层黏合。
其中，磁性元件13为环形，其可以为如图3所示的圆环形，还可以为如图4所示的方环形，还可以为其他形状的环形，在此不做限定。
磁性元件13上设置有沿磁性元件13厚度方向环绕磁性元件13的绕线131，绕线131的材料为铜，其是通过电镀形成的，具有输入端及输出端，且输入端及输出端均连接焊盘。在一实施例中，绕线131大于3圈。具体地，如图3及图4所示，绕线131的输入端连接第一焊盘132，绕线131的输出端连接第二焊盘133。磁性元件13位于槽体12中，且磁性元件13与槽体12之间具有第一绝缘层14。其中，第一绝缘层14为在高温压合时，半固化片融化流入进而填充的。
其中，线路板11包括线路图形层，具体地，线路图形层位于芯板的表面，在将磁性元件13嵌入于槽体12中后，需要将磁性元件13上的绕线131与线路板11的线路图形层电连接，因此线路板11对应第一焊盘132及第二焊盘133的位置处设置有第一盲孔16及第二盲孔17。
在一具体实施例中，磁性元件13上的第一焊盘132及第二焊盘133可以设置于磁性元件13的同一表面，还可以设置于磁性元件13的相对两表面。具体地，在第一焊盘132及第二焊盘133如图3及图4所示的设置于磁性元件13的同一表面时，第一盲孔16及第二盲孔17可以设置为如图2所示的位置。在第一焊盘132及第二焊盘133设置于磁性元件13的相对两表面时，第一盲孔16及第二盲孔17可以设置为如图1所述的位置。只要第一盲孔16及第二盲孔17能够实现将绕线131的输入端及输出端与线路板11的线路图形层电连接即可，具体位置在此不做限定。可以理解的，若要使第一盲孔16及第二盲孔17具有导电性，第一盲孔16及第二盲孔17的侧壁具有导电层(图未示)。
在一实施例中，磁性元件13的表面还覆盖有第二绝缘层(图未示)，第二绝缘层可以为聚酰亚胺，其能够保护磁性元件13，绕线131通过电镀设置在第二绝缘层表面。
在一实施例中，磁性元件13的材料可以为锰锌合金、镍锌合金等。绕线131、第一焊盘132、第二焊盘133的材料为铜。
本实施例所示的电感组件，在线路板11中嵌入磁性元件13，且磁性元件13上设置有绕线131，绕线131与线路板11的线路图形层电连接，以此实现埋入式电感组件的制作，实现产品的小型化。
请参见图2，为本发明电感组件的第二实施例的结构示意图。与图1所示的第一实施例相比，区别在于，本实施中的电感组件还包括磁芯15，在本实施例中，线路板11对应磁性元件13的环形部分设置有第一通孔18，磁芯15插入第一通孔18中且与线路板11的两表面平齐。其中，磁芯15在插入第一通孔18中时穿过磁性元件13的环形部，且磁芯15与磁性元件13的环形部具有第一绝缘层14，与第一实施例相同，第一绝缘层14是进行高温压合时流入的半固化片融化物质。
本实施例中，在磁性元件13中间设置磁芯，以进一步提高磁场，进而提高电感组件的性能。
请参见图5，为本发明电感组件的制作方法的第一实施例的流程示意图。包括：
步骤S51：提供线路板，所述线路板上设置有槽体。
其中，线路板由芯板及半固化片制成。在制作线路板时，根据要求在线路板的指定位置设置槽体。
其中，芯板为覆铜板，即为制作线路板的基础材料，包括基材板及覆盖在所述基材板上的铜箔，所述基材板由纸基板、玻纤布基板、合成纤维布基板、无纺布基板、复合基板等材料浸以树脂，制成粘结片，由多张粘结片组合制成，在制作好的基材板单面或双面覆以铜箔，再进行热压固化以制成覆铜板。在一实施例中，芯板的两表面的铜箔上可以具有线路图形层，也可以不具有线路图形层，具体按要求设置，在此不做限定。半固化片为层压时的层间粘结层，具体地，所述半固化片主要由树脂和增强材料组成，在制作多层线路板时，通常采用玻纤布做增强材料，将其浸渍上树脂胶液，再经热处理预烘制成薄片，其加热加压下会软化，冷却后会固化，且具有黏性，在高温压合过程中能将相邻的两层黏合。
步骤S52：在磁性元件上设置沿磁性元件厚度方向环绕所述磁性元件的绕线。
其中，磁性元件为环形，具体可以为圆环形，还可以为方环形，在此不做限定。在磁性元件上设置环绕磁性元件的绕线，具体地，在磁性元件的周围进行电镀，以形成环绕磁性元件的金属绕线。具体地，绕线沿磁性元件的厚度方向开始缠绕。
步骤S53：将磁性元件嵌入于槽体中并进行高温压合；其中，绕线与所述线路板电连接。
将磁性元件设置于槽体中，并进行高温压合，具体地，在将芯板及半固化片准备好，并开槽后，将磁性元件放置在槽体中，然后按照要求将芯板及半固化片进行堆叠，进行高温压合。在压合过程中，半固化片会融化成第一绝缘层，进而填充磁性元件与槽体之间的间隙。
本实施例所示的电感组件的制作方法，以实现埋入式电感组件的制作，进而实现产品的小型化。
请参见图6，为本发明电感组件的制作方法的第一实施例的流程示意图。与图5所示的第一实施例相比，区别在于，包括：
步骤S61：在磁性元件上设置第二绝缘层。
在磁性元件上涂覆第二绝缘层，具体地，第二绝缘层材料为聚酰亚胺。磁性元件的材料为锰锌合金、镍锌合金中一种或任意组合。
步骤S62：在第二绝缘层上进行电镀，形成沿磁性元件厚度方向环绕的绕线。
在第二绝缘层的表面进行电镀，进而形成环绕磁性元件的绕线，具体地，绕线包括输入端及输出端，且沿磁性元件的厚度方向环绕磁性元件。在一实施例中，绕线需要大于等于3圈。
步骤S63：在磁性元件垂直于厚度方向的表面上设置连接绕线的输入端的第一焊盘，及连接绕线的输出端的第二焊盘。
在磁性元件的输入端及输出端位置处设置连接输入端及输出端的第一焊盘及第二焊盘。具体地，可采用电镀的方式在制作绕线时，同时将第一焊盘及第二焊盘制作完成。
步骤S64：在线路板对应磁性元件的环形部分设置第一通孔。
具体地，在将磁性元件埋入线路板中后，在线路板对应磁性元件的环形部的位置处设置贯穿线路板的第一通孔。第一通孔的直径小于磁性元件的环形部的直径。
步骤S65：在第一通孔中设置磁芯；其中，磁芯与磁性元件之间填充有第一绝缘层。
将磁芯设置于第一通孔中，在一具体实施例中，在将磁芯设置于第一通孔中后，为保证磁芯与线路板粘合，将线路板在进行高温压合，此时半固化片融化将磁芯与磁性元件之间的额缝隙填充，以形成第二绝缘层。
步骤S66：在线路板对应第一焊盘的位置处设置第一盲孔，及在线路板对应第二焊盘的位置处设置第二盲孔。
具体地，在将磁芯设置好后，在线路板对应磁性元件的第一焊盘及第二焊盘的位置处设置第一盲孔及第二盲孔，第一盲孔及第二盲孔用于将线路板上的线路图形层与绕线的输入端及输出端电连接。具体地，第一盲孔及第二盲孔的位置可根据第一焊盘及第二焊盘的位置进行确定，其可以设置在线路板的同一侧，还可以设置在线路板的相对两侧。具体不做限定。
步骤S67：在第一盲孔及第二盲孔中设置导电层，以将绕线的输入端、输出端与线路图形层电连接。
为了使第一盲孔及第二盲孔具有导电性，在制作好第一盲孔及第二盲孔后，在第一盲孔及第二盲孔的侧壁设置导电层。
本发明提供的电感组件及其制作方法，通过在线路板上开设槽体，在槽体中嵌入磁性元件，磁性元件上设置有绕线，以此实现埋入式电感组件的制作，实现产品的小型化。
以上仅为本申请的实施方式，并非因此限制本申请的专利范围，凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (10)

1.一种电感组件，其特征在于，包括：
线路板，所述线路板上设置有槽体；
磁性元件，嵌入于所述槽体中；
其中，所述磁性元件上设置有沿所述磁性元件厚度方向环绕所述磁性元件的绕线，所述绕线与所述线路板电连接。
2.根据权利要求1所述的电感组件，其特征在于，还包括：磁芯；
所述磁性元件为环形，且所述磁芯的轴向方向垂直于所述线路板的平面方向；所述线路板对应所述磁性组件的环形部分设置有第一通孔；所述磁芯插入所述第一通孔且与所述线路板的两表面平齐；
其中，所述磁芯与所述磁性元件之间及所述磁性元件与所述槽体之间填充有第一绝缘层。
3.根据权利要求2所述的电感组件，其特征在于，所述磁性元件的垂直于所述线路板的厚度方向的表面上设置有第一焊盘及第二焊盘；
所述第一焊盘与所述绕线的输入端电连接，所述第二焊盘与所述绕线的输出端电连接。
4.根据权利要求3所述的电感组件，其特征在于，所述第一焊盘及所述第二焊盘对应所述线路板的位置具有第一盲孔及第二盲孔；
所述线路板上设置有线路图像层；
所述第一盲孔及所述第二盲孔的侧壁具有导电层；
所述第一焊盘通过所述第一盲孔与所述线路图像层电连接，以将所述绕线的输入端与所述线路图形层电连接；
所述第二焊盘通过所述第二盲孔与所述线路图形层电连接，以将所述绕线的输出端与所述线路图形层电连接。
5.根据权利要求4所述的电感组件，其特征在于，所述第一焊盘及所述第二焊盘位于所述磁性元件的同一表面；或
所述第一焊盘及所述第二焊盘位于所述磁性元件的相对两表面。
6.根据权利要求1所述的电感组件，其特征在于，所述槽体未贯穿所述线路板的相对两表面。
7.根据权利要求1所述的电感组件，其特征在于，所述磁性元件上涂覆有第二绝缘层，所述绕线位于所述第二绝缘层的表面，所述绕线材料为铜。
8.一种电感组件的制作方法，其特征在于，包括：
提供线路板，所述线路板上设置有槽体；
在所述磁性元件上设置沿所述磁性元件厚度方向环绕所述磁性元件的绕线；
将所述磁性元件嵌入于所述槽体中并进行高温；其中，所述绕线与所述线路板电连接。
9.根据权利要求8所述的制作方法，其特征在于，所述磁性元件为环形；
所述在所述磁性元件上设置沿所述磁性元件厚度方向环绕所述磁性元件的绕线的步骤包括：
在所述磁性元件上设置第二绝缘层；
在所述第二绝缘层上进行电镀，形成沿所述磁性元件厚度方向环绕的绕线；
在所述磁性元件垂直于所述厚度方向的表面上设置连接所述绕线的输入端的第一焊盘，及连接所述绕线的输出端的第二焊盘；
所述将所述磁性元件嵌入于所述槽体中并进行高温压合；其中，所述绕线与所述线路板电连接的步骤还包括：
在所述线路板对应所述磁性元件的环形部分设置第一通孔；
在所述第一通孔中设置磁芯；其中，所述磁芯与所述磁性元件之间填充有第一绝缘层。
10.根据权利要求9所述的制作方法，其特征在于，所述线路板包括线路图形层；
所述将所述磁性元件嵌入于所述槽体中并进行高温；其中，所述绕线与所述线路板电连接的步骤之后，还包括：
在所述线路板对应所述第一焊盘的位置处设置第一盲孔，及在所述线路板对应所述第二焊盘的位置处设置第二盲孔；
在所述第一盲孔及所述第二盲孔中设置导电层，以将所述绕线的输入端、输出端与所述线路图形层电连接。
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