WO2023272644A1 - 一种电子组件、电压调节模块以及稳压器件 - Google Patents

一种电子组件、电压调节模块以及稳压器件 Download PDF

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Publication number
WO2023272644A1
WO2023272644A1 PCT/CN2021/103812 CN2021103812W WO2023272644A1 WO 2023272644 A1 WO2023272644 A1 WO 2023272644A1 CN 2021103812 W CN2021103812 W CN 2021103812W WO 2023272644 A1 WO2023272644 A1 WO 2023272644A1
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WO
WIPO (PCT)
Prior art keywords
electronic component
electrical connection
connection terminal
hole
substrate
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Application number
PCT/CN2021/103812
Other languages
English (en)
French (fr)
Inventor
黄立湘
董晋
缪桦
Original Assignee
深南电路股份有限公司
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Application filed by 深南电路股份有限公司 filed Critical 深南电路股份有限公司
Priority to PCT/CN2021/103812 priority Critical patent/WO2023272644A1/zh
Priority to US17/477,534 priority patent/US11711893B2/en
Publication of WO2023272644A1 publication Critical patent/WO2023272644A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/1053—Mounted components directly electrically connected to each other, i.e. not via the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10651—Component having two leads, e.g. resistor, capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10939—Lead of component used as a connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10962—Component not directly connected to the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components

Definitions

  • the present application relates to the technical field of electronic component production technology, in particular to an electronic component, a voltage regulation module and a voltage stabilizing device.
  • the inventors of the present application have found through long-term research that, in the above-mentioned related art, usually a plurality of electronic components are tiled on the same level, which often makes the area occupied by the electronic components on the same level larger, which is not conducive to the planning and arrangement.
  • the present application provides an electronic component, a voltage regulation module and a voltage stabilizing device, so as to solve the above-mentioned problems existing in the electronic component in the prior art.
  • the first technical solution adopted by this application provides an electronic component, which includes: a substrate with a first surface and a second surface opposite to each other; a first electronic component embedded in the substrate, It is also provided with a first electrical connection terminal connected to the first surface of the substrate and a second electrical connection terminal connected to the second surface; the second electronic component is arranged on the second surface of the substrate, and is electrically connected to the second electrical connection terminal Connection; wherein, the second electronic component and the first electronic component form a stack in a first direction, and the first direction intersects both the first surface and the second surface of the substrate.
  • the present application can provide an electronic component in which the second electronic component and the first electronic component are stacked in the first direction, thereby reducing the distance between the first electronic component and the second electronic component in the second direction intersecting the first direction.
  • the area occupied by the direction is a part of the direction.
  • the first electronic component of the electronic assembly is a passive electronic component
  • the second electronic component includes an active electronic component
  • the first electronic component of the electronic component is an inductance component
  • the second electronic component includes a switch component
  • the substrate of the electronic component is provided with a containing groove
  • the first electronic component is placed in the containing groove, and is electrically connected with the outside through the first electrical connection terminal.
  • the first surface of the substrate of the electronic component is provided with a first conductive layer
  • the second surface of the substrate is provided with a second conductive layer
  • the substrate is also provided with a first conductive hole connected to the first conductive layer and connected to the second conductive layer.
  • the first electrical connection terminal is connected to the first conductive layer through the first conductive hole
  • the second electrical connection terminal is connected to the second conductive layer through the second conductive hole.
  • the first electrical connection terminal and the second electrical connection terminal of the electronic component are respectively arranged on the first surface and the second surface of the first electronic component, and the first surface and the second surface of the first electronic component
  • the two sides are the two sides opposite to the first direction
  • the first conductive hole is opened along one end of the first direction, and is electrically connected with the first electrical connection terminal
  • the second conductive hole is opened along the other end of the first direction, and is connected with the first electrical connection terminal.
  • the second electrical connection terminal is electrically connected.
  • the first electrical connection terminal and the second electrical connection terminal of the electronic component are respectively formed by the third surface and the fourth surface of the first electronic component, the first surface and the second surface of the first electronic component Leading out from the opposite sides of the second direction, the second direction intersects the first direction, the first conductive hole is opened along one end of the first direction, and is electrically connected to the first electrical connection terminal; the second conductive hole is along the first direction The other end is opened and electrically connected to the second electrical connection terminal.
  • the substrate of the electronic component is provided with a first through hole and a second through hole, the first electrical connection terminal is connected to the first conductive hole through the first through hole, and the second electrical connection terminal is connected to the first conductive hole through the second through hole.
  • first through hole and the second through hole of the electronic component are arranged at one end of the first electronic component along the second direction and the other end of the first electronic component along the second direction, and the first electrical connection terminal passes through the first The through hole is connected to the first conductive hole, and the second electrical connection terminal is connected to the second conductive hole through the second through hole; wherein, the distance between the first through hole and the second through hole and the first electronic component is greater than or equal to 200um.
  • the voltage regulation module includes: a circuit board, a conductive pattern layer is provided on the surface of the circuit board, and a An electronic component electrically connected to the conductive pattern layer, the electronic component is such as the electronic component provided by the first technical solution; wherein, the second electronic component, the first electronic component and the circuit board are sequentially stacked in the first direction, and the first The direction intersects both the first surface and the second surface of the substrate.
  • a groove is provided on a side of the circuit board of the voltage regulating module close to the first surface, and the groove is used for partially accommodating the substrate.
  • the bottom surface of the groove of the voltage regulating module is provided with a conductive pattern layer for electrical connection with the first electrical connection terminal.
  • another technical solution adopted by the present application is to provide a voltage stabilizing device, which includes the above-mentioned electronic components.
  • the present application can provide an electronic component, and the second electronic component and the first electronic component are stacked in the first direction, thereby reducing the size of the first electronic component and the second electronic component.
  • the area of the electronic component in the second direction intersecting with the first direction improves the heat dissipation efficiency of the second electronic component.
  • Fig. 1 is a schematic structural diagram of an electronic component in an embodiment of the present application
  • Fig. 2 is a specific structural schematic diagram of the electronic assembly in Fig. 1;
  • Fig. 3 is another specific structural schematic diagram of the electronic assembly in Fig. 1;
  • Fig. 4 is a schematic structural diagram of an electronic component in another embodiment of the present application.
  • Fig. 5 is a specific structural schematic diagram of the substrate in Fig. 1;
  • Fig. 6 is a schematic diagram of a specific structure when blind holes are arranged inside the substrate in Fig. 5;
  • Fig. 7 is another specific structural diagram of the components inside the substrate in Fig. 5;
  • FIG. 8 is a schematic structural view of a through hole provided inside the substrate in FIG. 7;
  • FIG. 9 is a schematic structural diagram of a voltage regulation module in another embodiment of the present application.
  • Fig. 10 is a specific structural schematic diagram of the voltage regulation module in Fig. 9;
  • FIG. 11 is a schematic structural diagram of a voltage stabilizing device in another embodiment of the present application.
  • FIG. 1 is a schematic structural diagram of an electronic component in an embodiment of the present application.
  • the first technical solution adopted in the present application provides an electronic component 100.
  • the electronic component 100 includes: a substrate 11, a first electronic Components 14 and second electronic components 2, wherein the first electronic component 14 is embedded in the substrate 11, the first electronic component 14 is provided with an electrical connection terminal 15, and the first electronic component 14 in the substrate 11 is connected to the first electronic component 15 through the electrical connection terminal 15.
  • the two electronic components 2 are electrically connected.
  • the substrate 11 is a package, and is provided with a first surface 12 and a second surface 13 facing away from each other. According to the first surface 12 and the second surface 13 facing away, a first direction AB is further set.
  • the first direction AB can be The vertical direction common to those skilled in the art can also be other directions that are specifically set according to needs, wherein A is one end of the first direction AB, and B is the other end of the first direction AB, so as to determine the components of the electronic assembly 100 Arrangement and planning provide the basis for directional division.
  • the first electronic component 14 is embedded in the substrate 11 , and has a first electrical connection terminal 151 connected to the first surface 12 of the substrate 11 and a second electrical connection terminal 152 connected to the second surface 13 .
  • the embedment of the first electronic component 14 can be conventionally buried in the substrate 11, then filled with a medium, and then expose the electrical connection terminal 15 to realize the electrical connection of the second electronic component 2 and the electronic assembly 100.
  • the position of the first electronic component 14 in the substrate will be adjusted through the electrical connection terminal 15, so that the first electronic component 14 can be embedded in the substrate 11 smoothly, and then the first electronic component 14 is filled with a medium, and then the electrical connection terminal 15 is exposed to realize the electrical connection of the second electronic component 2 and external circuits other than the electronic component 100.
  • this Persons skilled in the art may also use common embedding methods to embed the first electronic component 14 in the substrate 11 , which is not limited here.
  • the second electronic component 2 of the electronic assembly 100 is arranged on the second surface 13 of the substrate 11 and is electrically connected to the second electrical connection terminal 152;
  • the second electrical connection terminal 152 realizes the electrical connection with the first electronic component 14, and the second surface 13 on the substrate 11 can also be spot-connected with conductive solder, and the second electrical connection terminal 152 of the first electronic component 14 is connected to the second electrical connection terminal 152 of the first electronic component 14 through the conductive solder.
  • the electrical connection of the second electronic component 2 can also be set according to other specific situations, which is not limited here.
  • the second electronic component 2 and the substrate 11 form a stack in the first direction AB, and the first direction AB intersects the first surface 12 and the second surface 13 of the substrate 11.
  • the first direction AB is perpendicular to the first surface 12 and the second surface 13, of course, the first direction AB can also be set by intersecting the first surface 12 and the second surface 13 of the substrate 11, instead of It needs to intersect perpendicularly, which is not limited here.
  • the present application can provide an electronic assembly 100, in which the second electronic component 2 and the first electronic component 14 are stacked in the first direction AB, thereby reducing the distance between the first electronic component 14 and the second electronic component 2 and the first electronic component 2.
  • the area in the second direction intersecting the first direction AB further keeps the second electronic component 2 away from other circuit devices other than the electronic component 100 , so as to improve the heat dissipation efficiency of the second electronic component 2 .
  • FIG. 2 is a schematic structural view of the electronic assembly in FIG. 1; the first electronic component 14 of the electronic assembly 100 is a passive electronic component 141, and the second electronic component 2 includes active electronic components. Element 21.
  • the substrate 11 is a package with a thickness of 2-4 mm, such as 2 mm, 3 mm or 4 mm.
  • the substrate 11 is provided with a first surface 12 and a second surface 13 opposite to each other.
  • the passive electronic component 141 is embedded in the substrate 11 and has a first electrical connection terminal 151 connected to the first surface 12 of the substrate 11 and a second electrical connection terminal 152 connected to the second surface 13 .
  • the active electronic component 21 is disposed on the second surface 13 of the substrate 11 and is electrically connected to the second electrical connection terminal 152 .
  • the present application can provide an electronic component 100, in which the passive electronic component 141 is embedded in the substrate 11, and the passive electronic component 141 is electrically connected to the active electronic component 21 and connected to other electronic components 100 through the electrical connection terminal 15.
  • Other circuits are electrically connected, and make the active electronic components 21 and the substrate 11 form a stack in the first direction AB, thereby reducing the size of the substrate 11 and the active electronic components 21 in the second direction perpendicular to the first direction AB.
  • the area of the active electronic component 21 is further kept away from other circuit devices other than the electronic assembly 100, so that the heat dissipation efficiency of the active electronic component 21 is improved.
  • FIG. 3 is a schematic diagram of another specific structure of the electronic assembly in FIG. 1 ; .
  • the substrate 11 is a package, which is provided with a first surface 12 and a second surface 13 opposite to each other.
  • the inductance element 1411 is embedded in the substrate 11 and has a first electrical connection terminal 151 connected to the first surface 12 of the substrate 11 and a second electrical connection terminal 152 connected to the second surface 13 .
  • the switch element 211 is disposed on the second surface 13 of the substrate 11 and is electrically connected to the second electrical connection terminal 152 .
  • the present application can provide an electronic component 100, in which the inductance element 1411 is embedded in the substrate 11, and the inductance element 1411 is electrically connected to the switching element 211 and electrically connected to other circuits other than the electronic component 100 through the electrical connection terminal 15, And make the switching element 211 and the first electronic component 14 form a stack in the first direction AB, thereby reducing the area and body shape of the first electronic component 14 and the switching element 211 in the second direction perpendicular to the first direction AB , so that the switching element 211 is kept away from other circuit devices other than the electronic component 100 , so that the heat dissipation efficiency of the switching element 211 is improved.
  • the first electronic element embedded in the substrate 11 may be an inductance element 1411 , and may also be a capacitive element, a resistive element, or other elements, which are specifically selected according to needs and are not limited here. If the inductance element 1411 is selected, the electronic component can be used as a part of a voltage regulator, and can also be used as an energy storage element.
  • the selected inductance element may be a choke inductor on the one hand, or a chip inductor on the other hand, which is not limited here. The application of the inductor will be described in detail later when the electronic components form a voltage regulation module.
  • the first electronic component placed on the substrate 11 in the first direction AB may be a switching element 211, such as a triode, a MOS transistor, or other semiconductor component products, which are specifically selected according to needs, not Do limited.
  • FIG. 4 is a schematic diagram of another specific structure of the electronic assembly in FIG. 1 ; the substrate 11 of the electronic assembly 100 is provided with an accommodating groove 142 , and the first electronic component 14 is placed in the accommodating groove 142, and is electrically connected to the outside through the first electrical connection terminal 151.
  • the first electronic component 14 When the first electronic component 14 is placed in the accommodating groove 142 , the first electronic component 14 can be quickly embedded in the substrate 11 through the accommodating groove 142 and placed in the substrate 11 stably.
  • the first electrical connection terminal 151 of the first electronic component 14 is drawn out at one end of the accommodating groove 142 in the first direction AB, so that the first electrical connection terminal 151 is electrically connected to an external circuit;
  • the other end on the top leads out the second electrical connection terminal 152 of the first electronic component 14 , so that the second electrical connection terminal 152 is electrically connected with the second electronic component 2 .
  • the electrical connection terminal 15 can lead the electrical connection terminal 15 of the first electronic component 14 to or through the first surface 12 and the second surface 13 of the substrate 11 through the surface of the accommodating groove 142 , and can also pass through the surface of the accommodating groove 142 The interior penetrates to the surface of the accommodating groove 142 to lead the electrical connection terminal 15 of the first electronic component 14 to or expose the first surface 12 and the second surface 13 of the substrate 11. Therefore, there are multiple ways to lead the electrical connection terminal 15, so It can be selected as required, and is not specifically limited here.
  • FIG. 5 is a schematic structural view of the substrate in FIG. 1; the first surface 12 of the substrate 11 of the electronic component 100 is provided with a first conductive layer 161, and the first conductive layer 161 can be The entire metal layer, such as a copper layer, an aluminum layer, or a gold layer, may also be a metal layer with a conductive pattern.
  • the second surface 13 of the substrate is provided with a second conductive layer 162.
  • the second conductive layer 162 can be a whole piece of metal layer such as a copper layer, an aluminum layer or a gold layer, or a metal layer with a conductive pattern, specifically , such as when an active electronic component is placed on the second surface 13, the second conductive layer 162 can be a whole piece of metal layer; and when more than one active electronic component is placed on the second surface 13, the second conductive layer 162 Layer 162 may be a pattern layer.
  • the substrate 11 is also provided with a first conductive hole 171 connected to the first conductive layer 161, and a second conductive hole 172 connected to the second conductive layer 162, the first electrical connection terminal 151 is connected to the The first conductive layer 161 and the second electrical connection terminal 152 are connected to the second conductive layer 162 through the second conductive hole 172 .
  • FIG. 6 is a schematic diagram of a specific structure when a blind hole is provided inside the substrate in FIG. 5.
  • the specific embodiment of the second conductive hole is the first blind hole 1711 , that is, the substrate 11 is provided with the first blind hole 1711 connected to the first conductive layer 161 and the second blind hole 1721 connected to the second conductive layer 162 .
  • the first electrical connection terminal 151 is connected to the first conductive layer 161 through the first blind hole 1711
  • the second electrical connection terminal 152 is connected to the second conductive layer 162 through the second blind hole 1721 .
  • the cross-sections of the first blind hole 1711 and the second blind hole 1721 can be respectively arranged on the first surface and the second surface of the first electronic component 14 along the first direction AB, showing Trapezoidal shape, specifically, the first blind hole 1711 is a trapezoidal shape with a large upper bottom and a smaller lower bottom.
  • the first electrical connection terminal 151 is arranged to be electrically connected to the first electrical connection terminal 151;
  • the second blind hole 1721 is in the shape of a trapezoid with a large upper bottom and a smaller bottom, and is arranged on the second surface of the first electronic component 14, which can completely It is set facing the second electrical connection terminal 152 , and can also be partially set facing the second electrical connection terminal 152 so as to be electrically connected to the first electrical connection terminal 151 .
  • the cross-sectional shape of the first blind hole 1711 and the second blind hole 1721 can also be other shapes, for example, as shown in Figure 5, the cross-sectional shape of the first blind hole 1711 and the second blind hole 1721 can also be a rectangle shape or square shape, the size and shape of the first blind hole 1711 and the second blind hole 1721 may be the same or different, which are specifically selected according to needs and are not limited here.
  • the first electrical connection terminal 151 and the second electrical connection terminal 152 of the electronic component 100 can be arranged on the first surface and the second surface of the first electronic component 14 respectively, and the second electrical connection terminal 152 of the first electronic component 14 One side and the second side are two sides opposite to the first direction AB, that is, the first electrical connection terminal 151 of the electronic component 100 is arranged on the first side of the first electronic component 14 along the first side A of the first direction AB. , and the second electrical connection terminal 152 of the electronic component 100 is disposed on the second surface of the first electronic component 14 along the other end B along the first direction AB.
  • the first surface may be the first surface 12, or a surface intersecting with the first surface 12, and the second surface may be the second surface 13, or a surface intersecting with the second surface 13, specifically according to Need to choose, not limited.
  • the first electrical connection terminal 151 of the electronic component 100 can be arranged on the first surface of the first electronic component 14 along the longitudinal direction perpendicular to the first surface and in the substrate 11 , and the electronic component 100
  • the second electrical connection terminal 152 is disposed on the second surface of the first electronic component 14 along the longitudinal direction and perpendicular to the second surface and inside the substrate 11 .
  • the electrical connection terminal 15 is not necessarily perpendicular to the first surface and the second surface, and the first electrical connection terminal 151 may intersect the first surface, and the second electrical connection terminal 152 may intersect the second surface.
  • first conductive hole 171 and the second conductive hole 172 are opened along the first direction AB, and are electrically connected to the first electrical connection terminal 151 and the second electrical connection terminal 152 respectively. That is, the first conductive hole 171 is opened along one end A of the first direction AB, and is electrically connected to the first electrical connection terminal 151; the second conductive hole 172 is opened along the other end B of the first direction AB, and is electrically connected to the second Terminal 152 is electrically connected.
  • the first conductive hole 171 is opened along the interior of the substrate 11 at the bottom of the longitudinal direction, so that the first conductive hole 171 is connected to the first electrical connection at the lower end of the first electronic component 14 at the bottom of the vertical direction.
  • the terminal 151 is electrically connected;
  • the second conductive hole 172 is opened along the interior of the substrate 11 at the upper end of the longitudinal direction, and the second conductive hole 172 is electrically connected with the second electrical connection terminal 152 at the upper end of the first electronic component 14 at the upper end of the longitudinal direction.
  • Fig. 7 is another specific structural schematic diagram of the components inside the substrate, disclosing another structure and connection method of connecting the electrical connection terminal 15 to the conductive hole 17 ; Set in the second direction CD where the first direction AB intersects, as shown in FIG. 7 .
  • the first electrical connection terminal 151 and the second electrical connection terminal 152 of the electronic component 100 are respectively composed of the third surface and the fourth surface of the first electronic component, and the first surface and the second surface of the first electronic component 14 are the second surface.
  • the two sides opposite to the direction CD are drawn out. That is, the first electrical connection terminal 151 of the electronic component 100 is drawn out along the third surface at one end D of the second direction CD, and the second electrical connection terminal 152 of the electronic component 100 is drawn out along the fourth surface of the other end C of the second direction CD.
  • the third surface may be a surface perpendicular to the first surface 12, or a surface intersecting the first surface 12, or a surface perpendicular to the first surface, or a surface intersecting the first surface.
  • the fourth surface can be a surface perpendicular to the second surface 13, or a surface intersecting the second surface 13, or a surface perpendicular to the second surface, or a surface intersecting the second surface.
  • the first electrical connection terminal 151 of the electronic component 100 can be arranged on the third surface of the first electronic component 14 along the transverse direction and perpendicular to the third surface and in the substrate 11, and the electronic component 100
  • the second electrical connection terminal 152 is disposed on the second surface of the first electronic component 14 along the transverse direction and perpendicular to the second surface and within the substrate 11 .
  • the electrical connection terminals 15 do not have to be arranged vertically on the third surface and the fourth surface, and it is sufficient that the first electrical connection terminal 151 intersects the third surface and the second electrical connection terminal 152 intersects the fourth surface.
  • the second direction CD is perpendicular to the first direction AB, and the first conductive hole 171 and the second conductive hole 172 are opened along the first direction AB, and are respectively connected to the first electrical connection terminal 151 and the second electrical connection terminal. 152 electrical connections. That is, the first conductive hole 171 is opened along one end A of the first direction AB, and is electrically connected to the first electrical connection terminal 151; the second conductive hole 172 is opened along the other end B of the first direction AB, and is electrically connected to the second Terminal 152 is electrically connected.
  • the first conductive hole 171 is opened along the inside of the substrate 11 at the bottom of the longitudinal direction, so that the first conductive hole 171 is positioned at the first direction below the longitudinal direction.
  • the lower end of the electronic component 14 is electrically connected to the first electrical connection terminal 151;
  • the second conductive hole 172 is opened along the interior of the substrate 11 in the vertical direction, so that the second conductive hole 172 is connected to the upper end of the first electronic component 14 in the vertical direction.
  • the two electrical connection terminals 152 are electrically connected.
  • FIG. 8 is a specific structural diagram of through holes provided inside the substrate in FIG. Two through holes 182 are opened along the first direction AB, and the first electrical connection terminal 151 and the second electrical connection terminal 152 are respectively connected to the first electrical connection terminal 151 and the second electrical connection terminal 151 through the first through hole 181 and the second through hole 182. Terminal 152 is electrically connected.
  • the first through hole 181 can be opened along one end A close to the first direction AB, and the second through hole 182 can be opened along the other end B close to the first direction AB.
  • the hole 181 is connected to the first conductive hole 171
  • the second electrical connection terminal 152 is connected to the second conductive hole 172 through the second through hole 182 .
  • the conductive hole 17 is connected to the conductive metal layer or the conductive pattern layer on the substrate 11 .
  • the first through hole 181 can be electrically connected to the first surface 12 on the substrate 11 by connecting the first conductive hole 171, but the first through hole 181 does not penetrate the substrate 11, so that the first through hole 181 conducts the first surface 12; similarly, the second through hole 182 can be electrically connected to the second surface 13 on the substrate 11 by connecting the second conductive hole 172, but the second through hole 182 does not penetrate the substrate 11, so that the second through hole 182 is single
  • the second surface 13 is surface-conducted.
  • first through hole 181 and the second through hole 182 can also be arranged at one end D of the first electronic component 14 along the second direction CD and the other end C of the first electronic component 14 along the second direction CD,
  • the first electrical connection terminal 151 is connected to the first conductive hole 171 through the first through hole 181
  • the second electrical connection terminal 152 is connected to the second conductive hole 172 through the second through hole 182 .
  • the first electrical connection terminal 151 and the second electrical connection terminal 152 are exposed outside the first electronic component 14, at least higher than the surface of the first electronic component 14 At 100um, for example, 100um-120um higher than the surface of the first electronic component 14, the distance between the first through hole 181 and the second through hole 182 and the first electronic component 14 is greater than or equal to 200um.
  • the first electrical connection terminal 151 is electrically connected to the first through hole 181
  • the second electrical connection terminal 152 is electrically connected to the second through hole 182 in a connected manner.
  • FIG. 9 is a schematic structural diagram of a voltage regulation module in another embodiment of the present application; the The voltage regulation module 200 includes a circuit board 3 and the above-mentioned electronic assembly 100 , wherein the electronic assembly 100 is electrically connected to the circuit board 3 .
  • a conductive pattern layer 31 is provided on the surface of the circuit board 3 , and the conductive pattern layer 31 is electrically connected to the electronic component 100 through the electrical connection terminal 15 .
  • the electronic component 100 is disposed on the circuit board 3 and electrically connected to the conductive pattern layer 31 of the circuit board 3 , and the electronic component 100 may be the electronic component as described above.
  • the second electronic component 2 , the first electronic component 14 and the circuit board 3 are sequentially stacked in a first direction AB, and the first direction AB intersects both the first surface 12 and the second surface 13 of the substrate 11 .
  • the first direction AB may perpendicularly intersect both the first surface 12 and the second surface 13 of the substrate 11 .
  • the present application can provide a voltage regulation module 200, and the second electronic component 2, the first electronic component 14 and the circuit board 3 are sequentially stacked in the first direction AB, thereby reducing the size of the second electronic component 2, the first The area and shape of the electronic component 14 and the circuit board 3 in the second direction CD intersecting the first direction AB, so that the second electronic component 2 is far away from other circuit devices other than the electronic assembly 100, such as making the second electronic component 2 It is far away from the circuit board 3 so as to improve the heat dissipation efficiency of the second electronic component 2 .
  • FIG. 10 is a schematic structural diagram of the voltage regulation module in FIG. Substrate 11. Specifically, the bottom surface of the groove 32 is provided with a conductive pattern layer 31 , which can be used for electrical connection with the first electrical connection terminal 151 .
  • the multiple electronic components 100 can be arranged on the circuit board 3, and the groove 32 provided on the circuit board 3 can be used to partially accommodate the substrate 11 of one electronic component 100,
  • the substrates 11 of multiple electronic components 100 can also be accommodated in the circuit board 3, and the substrates 11 of all the electronic components 100 can also be accommodated in the circuit board 3. Specifically, it is selected according to the needs, and will not be described here. limited.
  • the first electronic component 14 of the electronic assembly 100 may be an inductance component
  • the second electronic component 2 includes a switch component.
  • the inductance element can be a part of the electronic component 100 used as the voltage regulation module 200, and can also be used as an energy storage component.
  • the inductance element selected for it may be a choke inductor on the one hand, or a chip inductor on the other hand.
  • the inductance element When the inductance element is a choke inductor, the inductance element is integrally formed and is a packaged shielded inductor.
  • the voltage regulation module 200 When the voltage regulation module 200 is electrically connected to the external power supply and the load, and the voltage at both ends of the load decreases, the external power supply charges the choke inductor through the switching element, so that the load reaches the required rated voltage.
  • the switching action of the switching element causes the external power supply to disconnect the choke inductor, so as to release energy and continue to supply power to the load.
  • the inductance element is a chip inductor
  • the voltage regulation module 200 when the voltage regulation module 200 is electrically connected to the external power supply and the load, and the voltage across the load decreases, the external power supply charges the chip inductor through the switching element, so that the load reaches the required rated voltage.
  • the switching action of the switching element causes the external power supply to disconnect the chip inductor, so as to release energy and continue to supply power to the load.
  • the present application embeds the inductance element 1411 in a printed circuit board (Printed Circuit Board, PCB). Designing and constructing, and disposing a heat sink or heat dissipating parts on the chip, so as to solve the heat dissipation effect of the voltage regulation module 200, although the thickness of the voltage regulation module 200 in the first direction AB is increased, but the thickness in the second direction AB is reduced.
  • the manufacturing area in the direction CD and considering that the thickness of the blind hole is limited, the increased thickness of the voltage regulation module 200 in the first direction AB is beneficial to better arrange the blind hole.
  • the first electronic component 14 placed on the substrate 11 can be an inductive component, and the switching component 211 can be arranged on the inductive component, such as a triode, a MOS tube, or other semiconductor component products , such as capacitors or PMICs, when the circuit board is a PCB motherboard, the first electronic component 14 is sunk onto the printed circuit board (Printed Circuit Board, PCB) motherboard, and the PMIC, resistors, and capacitors are attached to the inductance unit , and do heat dissipation on the outer surface of the PMIC, resistors, and capacitors. Wherein, if the PMIC is a plastic package, the PMIC does not need to be packaged twice.
  • PCB printed Circuit Board
  • the calculation power of the module 200 is increased, that is, the number of on-offs in the insulated gate bipolar transistor (Insulated Gate Bipolar Transistor, IGBT) in the second electronic component is increased, and the IGBT is a bipolar transistor (BJT) and an insulated gate transistor.
  • IGBT Insulated Gate Bipolar Transistor
  • the composite fully-controlled voltage-driven power semiconductor device composed of a type field effect transistor (MOS) has the advantages of both, which can greatly increase the power density of the voltage regulation module 200 and improve the working performance of the voltage regulation module 200, so that It has a wide range of applications in the CPU and GPU fields.
  • MOS type field effect transistor
  • Fig. 11 is a schematic structural diagram of a voltage stabilizing device in another embodiment of the present application; the voltage stabilizing The device 400 includes the electronic assembly 100 described above.

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Abstract

提供了一种电子组件（100）、电压调节模块（200）以及稳压器件（400），电子组件（100）包括基板（11），设置相背的第一表面（12）以及第二表面（13）；第一电子元件（14），埋设于基板（11）中，并设有连通至基板（11）第一表面（12）的第一电连接端子（151）及连通至第二表面（13）的第二电连接端子（152）；第二电子元件（2），设置在基板（11）的第二表面（13）上，并与第二电连接端子（152）电连接；其中，第二电子元件（2）与基板（11）在第一方向（AB）上形成堆叠，第一方向（AB）与基板（11）的第一表面（12）、第二表面（13）均相交。电子组件（100），将第二电子元件（2）与第一电子元件（14）在第一方向（AB）上形成堆叠，从而减小第一电子元件（14）以及第二电子元件（2）在与第一方向（AB）相交的第二方向（CD）上所占的面积。

Description

一种电子组件、电压调节模块以及稳压器件 技术领域
本申请涉及电子组件生产工艺技术领域，特别是涉及一种电子组件、电压调节模块以及稳压器件。
背景技术
随着电子组件的大量运用，人们对于较为轻薄的电子组件产品更为喜爱，因而电子组件的各部分组件的排布和规划也得到越来越的重视以及关注。
通常在多个电子元件同时存在的情况下，往往将多个电子元件平铺在同一层面上，并且将各电子元件之间间隔相应的距离，以使在各电子元件之间清晰地布局走线，能够使各电子元件之间相互配合进行工作。
因此，本申请发明人经过长期研究发现，上述在现有相关技术中，通常多个电子元件被平铺于同一层面上，往往使得同一层面的电子元件占用的面积较大，不利于各电子元件的规划和排布。
发明内容
本申请提供一种电子组件、电压调节模块以及稳压器件，以解决现有技术中电子组件存在的上述问题。
为解决上述技术问题，本申请采用的第一个技术方案提供一种电子组件，该电子组件包括：基板，设置相背的第一表面以及第二表面；第一电子元件，埋设于基板中，并设有连通至基板第一表面的第一电连接端子及连通至第二表面的第二电连接端子；第二电子元件，设置在基板的第二表面上，并与第二电连接端子电连接；其中，第二电子元件与第一电子元件在第一方向上形成堆叠，第一方向与基板的第一面、第二面均相交。
因此，本申请能够提供一种电子组件，将第二电子元件与第一电子元件在第一方向上形成堆叠，从而减小第一电子元件以及第二电子元件在与第一方向相交的第二方向上所占的面积。
其中，该电子组件的第一电子元件为无源电子元件，第二电子元件包括有源电子元件。
其中，该电子组件的第一电子元件为电感元件，第二电子元件包括开关元件。
其中，该电子组件的基板内设置有容置槽，第一电子元件置于容置槽内，并通过第一电连接端子与外部电连接。
其中，该电子组件的基板第一表面设有第一导电层，基板第二表面设有第二导电层，基板还设有连通至第一导电层的第一导电孔，及连通至第二导电层的第二导电孔，第一电连接端子通过第一导电孔连接至第一导电层，第二电连接端子通过第二导电孔连接至第二导电层。
其中一些实施方式中，该电子组件的第一电连接端子、第二电连接端子分别设置在第一电子元件的第一面和第二面上，所述第一电子元件的第一面和第二面为第一方向相背的两侧面上，第一导电孔沿第一方向的一端开设，并与第一电连接端子电连接；第二导电孔沿第一方向的另一端开设，并与第二电连接端子电连接。
其中另一些实施方式中，该电子组件的第一电连接端子、第二电连接端子分别由第一电子元件的第三面和第四面上，第一电子元件的第一面和第二面为第二方向相背的两侧面引出，第二方向与第一方向相交，第一导电孔沿第一方向的一端开设，并与第一电连接端子电连接；第二导电孔沿第一方向的另一端开设，并与第二电连接端子电连接。
其中，该电子组件的基板内设有第一通孔以及第二通孔，第一电连接端子通过第一通孔连接至第一导电孔，第二电连接端子通过第二通孔连接至第二导电孔。
其中，该电子组件的第一通孔、第二通孔设置在第一电子元件的沿第二方向的一端以及第一电子元件的沿第二方向的另一端，第一电连接端子通过第一通孔连接至第一导电孔，第二电连接端子通过第二通孔连 接至第二导电孔；其中，第一通孔以及第二通孔与第一电子组件的距离大于或等于200um。
为解决上述技术问题，本申请采用的另一个技术方案是提供一种电压调节模块，该电压调节模块包括：电路板，电路板表面设有导电图案层，以及设置于电路板上且与电路板的导电图案层电连接的电子组件，电子组件如第一个技术方案提供的电子组件；其中，第二电子元件、第一电子元件与电路板依次在第一方向上形成堆叠，所述第一方向与所述基板的第一表面、第二表面均相交。
其中，电压调节模块的电路板靠近第一表面的一侧设置凹槽，凹槽用于部分容置基板。
其中，电压调节模块的凹槽底部表面设置有导电图案层，用于与第一电连接端子进行电连接。
为解决上述技术问题，本申请采用的另一个技术方案是还提供一种稳压器件，该稳压器件包括上述的电子组件。
本申请的有益效果是：区别于现有技术，本申请能够提供一种电子组件，将第二电子元件与第一电子元件在第一方向上形成堆叠，从而减小第一电子元件以及第二电子元件在与第一方向相交的第二方向上的面积，进而提高第二电子元件的散热效率。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请一实施例中的电子组件的结构示意图；
图2是图1中的电子组件的一具体结构示意图；
图3是图1中的电子组件的另一具体结构示意图；
图4是本申请另一实施例中的电子组件的结构示意图；
图5是图1中的基板的一具体结构示意图；
图6是图5中基板内部设置盲孔时的一具体结构示意图；
图7是图5中基板内部各部件的另一具体结构示意图；
图8是图7中基板内部设置通孔的一具体结构示意图；
图9是本申请另一实施例中的电压调节模块的结构示意图；
图10是图9中的电压调节模块的一具体结构示意图；
图11是本申请再一实施例中的稳压器件的结构示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性的劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书及上述附图中的术语“第一”、“第二”、“第三”、“第四”等(如果存在)是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便这里描述的本申请的实施例，例如能够以除了在这里图示或描述的那些以外的顺序实施。此外，术语“包括”和“具有”以及他们的任何变形，意图在于覆盖不排他的包含，例如，包含了一系列步骤或单元的过程、方法、系统、产品或设备不必限于清楚地列出的那些步骤或单元，而是可包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其它步骤或单元。
请参阅图1，图1是本申请一实施例中的电子组件的结构示意图，本申请采用的第一个技术方案提供一种电子组件100，该电子组件100，包括：基板11、第一电子元件14以及第二电子元件2，其中第一电子元件14埋设于基板11中，第一电子元件14上设置有电连接端子15，基板11中的第一电子元件14通过电连接端子15与第二电子元件2实现电连接。
其中，基板11为一个封装体，设置有相背的第一表面12以及第二 表面13，根据相背的第一表面12以及第二表面13进一步设置第一方向AB，第一方向AB可以是本领域技术人员常见的纵向，也可以是根据需要进行具体设置的其他方向，其中A为第一方向AB的一端，B为第一方向AB的另一端，以此为确定电子组件100各部件的排布和规划提供方向划分基础。
第一电子元件14，埋设于基板11中，并设有连通至基板11第一表面12的第一电连接端子151及连通至第二表面13的第二电连接端子152。其中，一方面，对于第一电子元件14的埋设可以是习惯常见的埋入基板11中，然后通过填充介质，然后在露出电连接端子15以实现电连接第二电子元件2以及电子组件100以外的外部电路；另一方面，对于第一电子元件14的埋设可以是先在基板中填充一部分介质，然后通过电连接端子15将调整第一电子元件14在基板中的位置，使第一电子元件14能够平稳地埋入基板11中，再将第一电子元件14上填充介质，然后在露出电连接端子15以实现第二电子元件2以及电子组件100以外的外部电路的电连接，当然，本领域相关技术人员还可以采用本领习惯常见的埋设方式将第一电子元件14埋设于基板11中，此处不做限定。
该电子组件100的第二电子元件2，设置在基板11的第二表面13上，并与第二电连接端子152电连接；其中，第二电子元件2可以通过露出基板11第二表面13的第二电连接端子152实现与第一电子元件14的电连接，也可以在基板11上的第二表面13点接导电焊锡，通过导电焊锡将第一电子元件14的第二电连接端子152与第二电子元件2进行电连接，还可以根据其他具体情况进行设置，具体此处不做限定。
其中，第二电子元件2与基板11在第一方向AB上形成堆叠，第一方向AB与基板11的第一表面12、第二表面13均相交，为了更便易理解和画图，图中画出的第一方向AB与第一表面12以及第二表面13均垂直相交，当然，还可以通过与基板11的第一表面12、第二表面13均相交来设置第一方向AB，而并不需要垂直相交，具体此处不做限定。
因此，本申请能够提供一种电子组件100，将第二电子元件2与第一电子元件14在第一方向AB上形成堆叠，从而减小第一电子元件14 以及第二电子元件2在与第一方向AB相交的第二方向上的面积，进而使得第二电子元件2远离与电子组件100以外的其他电路器件，使得提高第二电子元件2的散热效率。
更进一步地，请参阅图2，图2是图1中的电子组件的一具体结构示意图；该电子组件100的第一电子元件14为无源电子元件141，第二电子元件2包括有源电子元件21。
具体地，基板11为一个封装体，厚度可以为2～4mm，比如2mm、3mm或4mm，基板11设置有相背的第一表面12以及第二表面13。无源电子元件141，埋设于基板11中，并设有连通至基板11第一表面12的第一电连接端子151及连通至第二表面13的第二电连接端子152。有源电子元件21，设置在基板11的第二表面13上，并与第二电连接端子152电连接。
因此，本申请能够提供一种电子组件100，将无源电子元件141埋设于基板11中，通过电连接端子15使得无源电子元件141与有源电子元件21电连接以及与电子组件100以外的其他电路进行电连接，并使得有源电子元件21与基板11在第一方向AB上形成堆叠，从而减小基板11以及有源电子元件21在与第一方向AB相互垂直相交的第二方向上的面积，进而使得有源电子元件21远离与电子组件100以外的其他电路器件，使得提高有源电子元件21的散热效率。
更进一步地，请参阅图3，图3是图1中的电子组件的另一具体结构示意图；该电子组件100的第一电子元件14可以为电感元件1411，第二电子元件2包括开关元件211。
具体地，基板11为一个封装体，设置有相背的第一表面12以及第二表面13。电感元件1411，埋设于基板11中，并设有连通至基板11第一表面12的第一电连接端子151及连通至第二表面13的第二电连接端子152。开关元件211，设置在基板11的第二表面13上，并与第二电连接端子152电连接。
因此，本申请能够提供一种电子组件100，将电感元件1411埋设于基板11中，通过电连接端子15使得电感元件1411与开关元件211电连 接以及与电子组件100以外的其他电路进行电连接，并使得开关元件211与第一电子元件14在第一方向AB上形成堆叠，从而减小第一电子元件14以及开关元件211在与第一方向AB相互垂直相交的第二方向上的面积以及体型，进而使得开关元件211远离与电子组件100以外的其他电路器件，使得提高开关元件211的散热效率。
其中，埋设于基板11中的第一电子元件可以是电感元件1411，还可以是电容元件、电阻元件以及其他元件，具体此处根据需要进行选择，不做限定。若选用电感元件1411，该电子组件则可以用作电压调节器的一部分，还可以作为储能元件来使用。其选用的电感元件一方面可以是扼流电感，另一方面还可以是贴片电感，具体此处不做限定。作为电感的应用，将在后文电子组件组成电压调节模块时进行详细描述。
此外，在第一方向AB上放置于基板11上的第一电子元件可以是开关元件211，比如三极管，还可以是MOS管，还可以是其他半导体元件产品，具体此处根据需要进行选择，不做限定。
更进一步地，请参阅图4，图4是图1中的电子组件的另一具体结构示意图；该电子组件100的基板11内设置有容置槽142，第一电子元件14置于容置槽142内，并通过第一电连接端子151与外部电连接。当第一电子元件14置于容置槽142内时，可以通过容置槽142快速地将第一电子元件14埋设在基板11内并平稳地安放在基板11内。
在容置槽142处于第一方向AB上的一端引出第一电子元件14的第一电连接端子151，以使第一电连接端子151电连接外部电路；在容置槽142处于第一方向AB上的另一端引出第一电子元件14的第二电连接端子152，以使第二电连接端子152与第二电子元件2进行电连接。
具体地，电连接端子15可以通过容置槽142的表面将第一电子元件14的电连接端子15引出至或贯穿基板11的第一表面12以及第二表面13，还可以通过从容置槽142内部贯穿到该容置槽142表面将第一电子元件14的电连接端子15引出至或外露基板11的第一表面12以及第二表面13，因此，电连接端子15有多种引出方法，因此可以根据需要进行选择，具体此处不做限定。
更进一步地，请参阅图5，图5是图1中的基板的一具体结构示意图；该电子组件100的基板11第一表面12设有第一导电层161，该第一导电层161可以是整片的金属层比如铜层、铝层或金层等，也可以是具有导电图形的金属层。基板第二表面13设有第二导电层162，同样该第二导电层162可以是整片的金属层比如铜层、铝层或金层等，也可以是具有导电图形的金属层，具体地，比如当在第二表面13上放置一个有源电子元件时，第二导电层162可以是整片的金属层；而当在第二表面13上放置不止一个有源电子元件时，第二导电层162可以是图案层。
此外，基板11还设有连通至第一导电层161的第一导电孔171，及连通至第二导电层162的第二导电孔172，第一电连接端子151通过第一导电孔171连接至第一导电层161，第二电连接端子152通过第二导电孔172连接至第二导电层162。
具体地，请参阅图6，图6是图5中基板内部设置盲孔时的一具体结构示意图，在图6实施例中，该第一导电孔具体实施方式为第一盲孔1711，以及第二导电孔具体实施方式为第一盲孔1711，也即基板11设有连通至第一导电层161的第一盲孔1711，及连通至第二导电层162的第二盲孔1721。第一电连接端子151通过第一盲孔1711连接至第一导电层161，第二电连接端子152通过第二盲孔1721连接至第二导电层162。
其中，如图6所示，第一盲孔1711以及第二盲孔1721的横截面可以为沿设在第一方向AB分别设置在第一电子元件14的第一面和第二面上，呈梯形状，具体地，第一盲孔1711呈上底大下底小的梯形状，设置在第一电子元件14的第一面，可以完全正对第一电连接端子151设置，还可以部分正对第一电连接端子151设置，以与第一电连接端子151电连接；第二盲孔1721呈上底大下底小的梯形状，设置在第一电子元件14的第二面，可以完全正对第二电连接端子152设置，还可以部分正对第二电连接端子152设置，以与第一电连接端子151电连接。当然，第一盲孔1711以及第二盲孔1721的横截面形状还可以是其他形状，比如，如图5所示，第一盲孔1711以及第二盲孔1721的横截面形状还可 以是长方形状或正方形状，第一盲孔1711以及第二盲孔1721的大小以及形状可以相同，也可以不同，具体此处根据需要进行选择，不做限定。
在一些实施方式中，该电子组件100的第一电连接端子151、第二电连接端子152可以分别设置在第一电子元件14的第一面和第二面上，第一电子元件14的第一面和第二面为第一方向AB相背的两侧面上，也即电子组件100的第一电连接端子151设置在第一电子元件14的沿第一方向AB一端A的第一面上，以及电子组件100的第二电连接端子152设置在第一电子元件14的沿第一方向AB另一端B的第二面上。
其中，第一面可以是第一表面12，也可以是与第一表面12相交的面，第二面可以是第二表面13，也可以是与第二表面13相交的面，具体此处根据需要进行选择，不做限定。
具体地，当第一方向AB为纵向时，电子组件100的第一电连接端子151可以设置在第一电子元件14沿纵向的垂直于第一面上且在基板11内，以及电子组件100的第二电连接端子152设置在第一电子元件14沿纵向的垂直于第二面上且在基板11内。
当然，电连接端子15未必一定垂直与第一面以及第二面上，还可以第一电连接端子151与第一面相交即可，第二电连接端子152与第二面相交即可。
其中，第一导电孔171、第二导电孔172沿第一方向AB开设，并分别与第一电连接端子151、第二电连接端子152电连接。也即第一导电孔171沿第一方向AB的一端A开设，并且与第一电连接端子151电连接；第二导电孔172沿第一方向AB的另一端B开设，并与第二电连接端子152电连接。
如此，在第一方向AB表现为纵向时，第一导电孔171沿基板11内部于纵向的下方进行开设，实现第一导电孔171于纵向下方在第一电子元件14的下端与第一电连接端子151电连接；第二导电孔172沿基板11内部于纵向的上方进行开设，实现第二导电孔172于纵向上方在第一电子元件14的上端与第二电连接端子152电连接。
除此图5以及图6这种结构示意图之外，请参阅图7，图7是基板 内部各部件的另一具体结构示意图，公开另一种电连接端子15连接导电孔17的结构以及连接方式；设置于第一方向AB相交的第二方向CD，如图7所示。该电子组件100的第一电连接端子151、第二电连接端子152分别由第一电子元件的第三面和第四面上，第一电子元件14的第一面和第二面为第二方向CD相背的两侧面引出。也即电子组件100的第一电连接端子151沿第二方向CD一端D的第三面引出，以及电子组件100的第二电连接端子152沿第二方向CD另一端C的第四面引出。
其中，第三面可以是与第一表面12垂直相交的面，也可以是与第一表面12相交的面，还可以是与第一面垂直相交的面，也还可以是与第一面相交的面，第四面可以是与第二表面13垂直相交的面，也可以是与第二表面13相交的面，还可以是与第二面垂直相交的面，也还可以是与第二面相交的面，具体此处根据需要进行选择，不做限定。
具体地，当第二方向CD表现为横向时，电子组件100的第一电连接端子151可以设置在第一电子元件14沿横向的垂直于第三面上且在基板11内，以及电子组件100的第二电连接端子152设置在第一电子元件14沿横向的垂直于第二面上且在基板11内。
当然，电连接端子15未必一定垂直设置在第三面以及第四面上，还可以第一电连接端子151与第三面相交即可，第二电连接端子152与第四面相交即可。
具体地，可是设置第二方向CD与第一方向AB垂直相交，第一导电孔171、第二导电孔172沿第一方向AB开设，并分别与第一电连接端子151、第二电连接端子152电连接。也即第一导电孔171沿第一方向AB的一端A开设，并与第一电连接端子151电连接；第二导电孔172沿第一方向AB的另一端B开设，并与第二电连接端子152电连接。
如此，在第一方向AB表现为纵向时，在第二方向CD表现为横向时，第一导电孔171沿基板11内部于纵向的下方进行开设，实现第一导电孔171于纵向下方在第一电子元件14的下端与第一电连接端子151电连接；第二导电孔172沿基板11内部于纵向的上方进行开设，实现第二导电孔172于纵向上方在第一电子元件14的上端与第二电连接端 子152电连接。
更进一步地，请参阅图8，图8是图7中基板内部设置通孔的一具体结构示意图，基板11内设有第一通孔181以及第二通孔182，第一通孔181、第二通孔182沿第一方向AB开设，并且第一电连接端子151、第二电连接端子152分别通过第一通孔181、第二通孔182与第一电连接端子151、第二电连接端子152电连接。
具体地，一方面第一通孔181可以沿靠近第一方向AB的一端A开设，第二通孔182可以沿靠近第一方向AB的另一端B开设，第一电连接端子151通过第一通孔181连接至第一导电孔171，第二电连接端子152通过第二通孔182连接至第二导电孔172。
其中，为了使得电连接端子15通过通孔18连接导电孔17连接至基板11上第一表面12或第二表面13，也即单面导通基板11上的导电金属层或导电图案层。第一通孔181可以通过连接第一导电孔171与基板11上的第一表面12电连接，但是第一通孔181并不贯通基板11，以实现第一通孔181单面导通第一表面12；同理第二通孔182可以通过连接第二导电孔172与基板11上的第二表面13电连接，但是第二通孔182并不贯通基板11，以实现第二通孔182单面导通第二表面13。
此外，另一方面，第一通孔181、第二通孔182还可以设置在第一电子元件14的沿第二方向CD一端D以及第一电子元件14的沿第二方向CD另一端C，第一电连接端子151通过第一通孔181连接至第一导电孔171，第二电连接端子152通过第二通孔182连接至第二导电孔172。
其中，为了更好地放置第一电子元件14的电连接端子15，第一电连接端子151以及第二电连接端子152外露于第一电子元件14外，至少高于第一电子元件14的表面100um处，比如处于高于第一电子元件14的表面100um～120um处，第一通孔181以及第二通孔182与第一电子元件14的距离大于或等于200um，如此，可以是通过焊锡点接的方式将第一电连接端子151与第一通孔181进行电连接、将第二电连接端子152与第二通孔182进行电连接。
更进一步地，为解决上述技术问题，本申请采用的另一个技术方案 是提供一种电压调节模块，请参阅图9，图9是本申请另一实施例中的电压调节模块的结构示意图；该电压调节模块200包括电路板3以及如上述的电子组件100，其中电子组件100电连接该电路板3。
具体地，电路板3表面设有导电图案层31，导电图案层31通过电连接端子15与电子组件100电连接。如此，电子组件100设置于电路板3上且与电路板3的导电图案层31电连接，电子组件100可以为如上述的电子组件。
其中，第二电子元件2、第一电子元件14与电路板3依次在第一方向AB上形成堆叠，第一方向AB与基板11的第一表面12、第二表面13均相交。具体地，如图8所示，第一方向AB可以与基板11的第一表面12、第二表面13均垂直相交。
因此，本申请能够提供一种电压调节模块200，将第二电子元件2、第一电子元件14与电路板3依次在第一方向AB上形成堆叠，从而减小第二电子元件2、第一电子元件14与电路板3在与第一方向AB相交的第二方向CD上的面积以及体型，进而使得第二电子元件2远离与电子组件100以外的其他电路器件，比如使得第二电子元件2远离电路板3，如此使得提高第二电子元件2的散热效率。
更进一步地，请参阅图10，图10是图9中的电压调节模块的一具体结构示意图；电路板3靠近第一表面12的一侧设置凹槽32，凹槽32可以用于部分容置基板11。具体地，凹槽32底部表面设置有导电图案层31，可以用于与第一电连接端子151进行电连接。
当有多个电子组件100时，可以将多个电子组件100均设置在电路板3上，还可以设置在电路板3上的凹槽32可以用于部分容置一个电子组件100的基板11，也可以将多个电子组件100的基板11部分容置于电路板3中，还可以将所有的电子组件100的基板11部分容置于电路板3中，具体根据需要进行选择，此处不做限定。
具体地，该电子组件100的第一电子元件14可以为电感元件，第二电子元件2包括开关元件。当作为电感的应用，电子组件100组成电压调节模块200时，电感元件可以是该电子组件100中用作电压调节模 块200的一部分，还可以作为储能元件来使用。当作为电压调节模块200时，其选用的电感元件一方面可以是扼流电感，另一方面还可以是贴片电感。
当电感元件为扼流电感时，电感元件一体成型，为封装式屏蔽电感。当电压调节模块200电连接外部电源以及负载，负载两端的电压降低时，外部电源通过开关元件对扼流电感进行充电，使得负载达到所需的额定电压。当电压调节模块200电连接的负载两端的电压升高时，通过开关元件的开关作用，使得外部电源供电断开扼流电感，以释放能量并继续对负载供电。
当电感元件为贴片电感时，当电压调节模块200电连接外部电源以及负载，负载两端的电压降低时，外部电源通过开关元件对贴片电感进行充电，使得负载达到所需的额定电压。当电压调节模块200电连接的负载两端的电压升高时，通过开关元件的开关作用，使得外部电源供电断开贴片电感，以释放能量并继续对负载供电。
基于上述相关技术方案，本申请在将电感元件1411埋入印刷电路板(Printed Circuit Board，PCB)中，当含有三极管的芯片外露于PCB外，设置于电感元件1411上方，采用纵向堆叠式对次进行设计和构造，并在芯片上设置散热器或者散热部件，以促使将解决电压调节模块200的散热效应，虽然增加了电压调节模块200在第一方向AB上的厚度，但是缩小了在第二方向CD上的制造面积，并且考虑到盲孔受限于介厚，电压调节模块200在第一方向AB上增加的厚度，反而有利于较好地设置盲孔。
在第一方向AB上，因为放置于基板11上的第一电子元件14可以是电感元件，而电感元件上可以设置开关元件211，比如三极管，还可以是MOS管，还可以是其他半导体元件产品，比如电容或PMIC，当电路板为PCB母板时，将第一电子元件14下沉至入印刷电路板(Printed Circuit Board，PCB)母板上，将PMIC、电阻、电容表贴于电感单元上，且在PMIC、电阻、电容的外表面做散热处理。其中，若PMIC为塑封件，因此PMIC不需要作二次塑封。
另外，针对功率密度U＝P/S，由于在第一方向AB上的面积S减小，若电压调节模块200的功率P未变，则第二电子元件2的散热性能提升，是因为电压调节模块200的计算力功率提升，也即第二电子元器件中的绝缘栅双极型晶体管(Insulated Gate Bipolar Transistor，IGBT)中的通断次数增加，IGBT是双极型三极管(BJT)和绝缘栅型场效应管(MOS)组成的复合全控型电压驱动式功率半导体器件，兼有两者的优点，可以使得电压调节模块200的功率密度大幅提升，提升电压调节模块200的工作性能，如此使之在CPU以及GPU领域具备有广泛的应用场合。
为解决上述技术问题，本申请采用的另一个技术方案是还提供一种稳压器件400，请参阅图11，图11是本申请再一实施例中的稳压器件的结构示意图；该稳压器件400包括上述的电子组件100。
以上仅为本申请的实施例，并非因此限制本申请的专利范围，凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (13)

  1. 一种电子组件，其特征在于，包括：
    基板，设置相背的第一表面以及第二表面；
    第一电子元件，埋设于所述基板中，并设有连通至所述基板第一表面的第一电连接端子及连通至第二表面的第二电连接端子；
    第二电子元件，设置在所述基板的第二表面上，并与第二电连接端子电连接；
    其中，所述第二电子元件与所述第一电子元件在第一方向上形成堆叠，所述第一方向与所述基板的第一面、第二面均相交。
  2. 根据权利要求1所述的电子组件，其特征在于，
    所述第一电子元件为无源电子元件，所述第二电子元件包括有源电子元件。
  3. 根据权利要求2所述的电子组件，其特征在于，
    所述第一电子元件为电感元件，所述第二电子元件包括开关元件。
  4. 根据权利要求1所述的电子组件，其特征在于，
    所述基板内设置有容置槽，所述第一电子元件置于所述容置槽内，并通过所述第一电连接端子与外部电连接。
  5. 根据权利要求1所述的电子组件，其特征在于，
    所述基板第一表面设有第一导电层，所述基板第二表面设有第二导电层，所述基板还设有连通至第一导电层的第一导电孔，及连通至第二导电层的第二导电孔，所述第一电连接端子通过所述第一导电孔连接至所述第一导电层，所述第二电连接端子通过所述第二导电孔连接至所述第二导电层。
  6. 根据权利要求5所述的电子组件，其特征在于，
    所述第一电连接端子、第二电连接端子分别设置在所述第一电子元件的第一面和第二面上，所述第一电子元件的所述第一面和所述第二面为第一方向相背的两侧面上，所述第一导电孔沿所述第一方向的一端开 设，并与所述第一电连接端子电连接；所述第二导电孔沿所述第一方向的另一端开设，并与所述第二电连接端子电连接。
  7. 根据权利要求5所述的电子组件，其特征在于，
    所述第一电连接端子、第二电连接端子分别由所述第一电子元件的第三面和第四面上，所述第一电子元件的第一面和第二面为第二方向相背的两侧面引出，所述第二方向与所述第一方向相交，第一导电孔沿第一方向的一端开设，并与第一电连接端子电连接；第二导电孔沿第一方向的另一端开设，并与第二电连接端子电连接。
  8. 根据权利要求7所述的电子组件，其特征在于，
    所述基板内设有第一通孔以及第二通孔，所述第一电连接端子通过所述第一通孔连接至所述第一导电孔，所述第二电连接端子通过所述第二通孔连接至所述第二导电孔。
  9. 根据权利要求8所述的电子组件，其特征在于，
    所述第一通孔、所述第二通孔设置在所述第一电子元件的沿所述第二方向一端以及所述第一电子元件的沿所述第二方向另一端，所述第一电连接端子通过所述第一通孔连接至所述第一导电孔，所述第二电连接端子通过所述第二通孔连接至所述第二导电孔；
    其中，所述第一通孔以及所述第二通孔与所述第一电子组件的距离大于或等于200um。
  10. 一种电压调节模块，其特征在于，包括：
    电路板，所述电路板表面设有导电图案层，
    以及设置于所述电路板上且与所述电路板的导电图案层电连接的电子组件，所述电子组件如权利要求1-9中任一项所述的电子组件；
    其中，所述第二电子元件、所述第一电子元件与所述电路板依次在第一方向上形成堆叠，所述第一方向与所述基板的第一表面、第二表面均相交。
  11. 根据权利要求10所述的电压调节模块，其特征在于，所述电路板靠近所述第一表面的一侧设置凹槽，所述凹槽用于部分容置所述基板。
  12. 根据权利要求11所述的电压调节模块，其特征在于，
    所述凹槽底部表面设置有所述导电图案层，用于与所述第一电连接端子进行电连接。
  13. 一种稳压器件，其特征在于，所述稳压器件包括权利要求1-9中任一项所述的电子组件。
PCT/CN2021/103812 2021-06-30 2021-06-30 一种电子组件、电压调节模块以及稳压器件 WO2023272644A1 (zh)

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US20020191366A1 (en) * 1999-12-27 2002-12-19 Murata Manufacturing Co. Ltd. Wiring connection structure of laminated capacitor and decoupling capacitor, and wiring board
CN1575108A (zh) * 2003-06-09 2005-02-02 松下电器产业株式会社 安装板的制造方法
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