CN112203413A - 埋入式电路板及其制作方法 - Google Patents

埋入式电路板及其制作方法 Download PDF

Info

Publication number
CN112203413A
CN112203413A CN202010645383.3A CN202010645383A CN112203413A CN 112203413 A CN112203413 A CN 112203413A CN 202010645383 A CN202010645383 A CN 202010645383A CN 112203413 A CN112203413 A CN 112203413A
Authority
CN
China
Prior art keywords
layer
sub
daughter
circuit layer
inductance element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010645383.3A
Other languages
English (en)
Inventor
黄立湘
王泽东
缪桦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shennan Circuit Co Ltd
Original Assignee
Shennan Circuit Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shennan Circuit Co Ltd filed Critical Shennan Circuit Co Ltd
Priority to PCT/CN2020/127015 priority Critical patent/WO2022007272A1/zh
Priority to EP20827982.8A priority patent/EP4156873A4/en
Priority to US17/134,220 priority patent/US11452211B2/en
Publication of CN112203413A publication Critical patent/CN112203413A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/182Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/188Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/143Masks therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/06Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/24Magnetic cores
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/32Insulating of coils, windings, or parts thereof
    • H01F27/324Insulation between coil and core, between different winding sections, around the coil; Other insulation structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/12Insulating of windings
    • H01F41/127Encapsulating or impregnating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/12Mountings, e.g. non-detachable insulating substrates
    • H01L23/14Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142Metallic substrates having insulating layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0271Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0296Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298Multilayer circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/111Pads for surface mounting, e.g. lay-out
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/115Via connections; Lands around holes or via connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/182Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183Components mounted in and supported by recessed areas of the printed circuit board
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/182Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061Etching masks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/146By vapour deposition
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/16Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation by cathodic sputtering
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038Through-connections; Vertical interconnect access [VIA] connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/06Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
    • H01F2027/065Mounting on printed circuit boards
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822Multilayer substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0183Dielectric layers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0183Dielectric layers
    • H05K2201/0195Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0302Properties and characteristics in general
    • H05K2201/0317Thin film conductor layer; Thin film passive component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0338Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08Magnetic details
    • H05K2201/083Magnetic materials
    • H05K2201/086Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09063Holes or slots in insulating substrate not used for electrical connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09072Hole or recess under component or special relationship between hole and component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703Plating
    • H05K2203/0723Electroplating, e.g. finish plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4602Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated

Abstract

本申请涉及埋入电感技术领域,具体公开了一种埋入式电路板,该埋入式电路板包括:至少一层子体,其中,所述子体的预设位置上开设有贯通的槽体;电感元件,嵌设在所述槽体内,且所述电感元件与所述槽体的侧壁间隔设置。通过上述方式,能够使得本申请的埋入式电路板结构紧凑,集成度高,使用范围广,安全可靠。

Description

埋入式电路板及其制作方法
技术领域
本申请涉及电感埋入技术领域,特别是涉及一种埋入式电路板及其制作方法。
背景技术
当今电子产品向短小轻薄的方向发展,电路板的密度要求也越来越高,但在电路板的设计中,电感被大量应用,电源类型电路板的电感元件占用电源板40%以上表面积。
发明内容
本申请提供一种埋入式电路板及其制作方法,其结构紧凑且集成度高。
一方面,本申请提供了一种埋入式电路板,电路板包括:至少两层子体,其中,两层相邻的所述子体在对应位置分别开设有相通的槽体;电感元件,嵌设在所述槽体内,且所述电感元件与所述槽体的侧壁间隔设置。
另一方面,本申请提供了一种埋入式电路板的制作方法,包括:提供电感元件和至少两层带相同位置槽体的子体;将所述电感元件置入至少两层所述子体的槽体内;压合各层所述子体以固定所述子体和所述电感元件;其中,所述电感元件与所述槽体的侧壁间隔设置。
本申请的有益效果是:区别于现有技术的情况,本申请通过在相邻子体的对应位置分别开设相通的槽体,将电感元件嵌设在槽体内,且使电感元件与槽体的侧壁间隔设置,通过压合工艺压合,可以使得电路板结构紧凑,集成度高,且安全可靠。
附图说明
为了更清楚地说明本申请实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本申请的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。其中:
图1是本申请埋入式电路板一实施例的结构示意图;
图2是本申请埋入式电路板另一实施例的结构示意图;
图3是本申请埋入式电路板又一实施例的结构示意图;
图4是本申请埋入式电路板再一实施例的结构示意图;
图5是本申请埋入式电路板的制作方法一实施例的流程示意图;
图6是本申请埋入式电路板的制作方法又一实施例的流程示意图。
具体实施方式
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部实施例。基于本申请中的实施例,本领域普通技术人员在没有做出创造性的劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。
参阅图1,埋入式电路板100包括:至少一层子体10,电感元件20。
子体10的预设位置上开设有贯通的槽体101,电感元件20嵌设在槽体101内,且电感元件20与槽体101的侧壁1011间隔设置。
区别于现有技术的情况,本申请实施例通过在子体10的预设位置上开设贯通的槽体101,将电感元件20嵌设在槽体101内,且使电感元件20与槽体101的侧壁间隔设置,通过压合工艺压合,可以使得电路板结构紧凑,集成度高,且安全可靠。
进一步地,当子体的数量大于等于2时,至少两层相邻的子体10在对应位置分别开设有相通的槽体101。
具体地,子体10A、10B、10C上均开设有贯通槽101,10A上的贯通槽101与相邻子体10B上的贯通槽101相通。10C上的贯通槽101与相邻10B的贯通槽101相通。电路板100可以有多层子体,不限于本实施例中的情况。
通过在子体10的预设位置开设贯通的槽体101,再将子体10B、10C通过相通的槽体101套在电感元件20上,最后再通过压合工艺固定各层子体10A、10B、10C和电感元件20,可以使得电路板结构紧凑,集成度高,且安全可靠。
可选地,子体10A与10B、10B与10C之间设有可熔融介质层50,子体10在利用槽体101套设在电感元件20后,通过可熔融介质层50层叠压合而成,至少部分可熔融介质层50流入电感元件20与槽体101的侧壁之间并接触电感元件20。可选的,可熔融介质层50填满电感元件20与槽体101的侧壁之间的空间,可熔融介质层50再次凝固后将各层子体10A、10B、10C相对粘连并固定,同时包围电感元件20,将电感元件20固定到各层子体10A、10B、10C上,形成强度高且紧凑的产品结构。
本实施例中,可熔融介质层50的厚度为40-300um,例如可以是240um。子体10可以是无铜芯板层,无铜芯板层的厚度为200-500um,例如可以是400um。子体10选无铜芯板层的目的是将电路板100厚度加厚,以足够厚度埋入电感元件20。当然,子体10也可选有铜芯板层,其上可以设置线路以进行电路连接。
在一实施例中,埋入式电路板100还包括:第一线路层30、第二线路层40。第一线路层30、第二线路层40分别覆盖槽体101的相对两端,使得电感元件20位于第一线路层30和第二线路层40之间。
电感元件20的连接端子201可以设置在电感元件20靠近第一线路层30的一端,第一线路层30上设有激光通孔(图未示),激光通孔中设有导电柱301,电感元件20的连接端子201通过导电柱301连接第一线路层30。
可选地,电感元件20的连接端子201设置在电感元件20靠近第二线路层40的一端,第二线路层上设有激光通孔,激光通孔中设有导电柱(图未示),电感元件20的连接端子201通过导电柱连接第二线路层40。
参阅图2,还可以在电感元件20靠近第一线路层30的一端和靠近第二线路层40的一端均设置连接端子201,在第一线路层30和第二线路层40的对应位置处均设置激光通孔,并在激光通孔中设置导电柱301,电感元件20的连接端子201可以通过导电柱301连接第一线路层30和第二线路层40。
本实施例中,子体10及可熔融介质层50的对应位置均开设有用于层间连接的导电孔200,第一线路层30和第二线路层40与导电孔200的对应位置上设有导电盲孔,其中,电感元件20的连接端子201依序通过第一线路层30的导电盲孔和导电孔200与第二线路层40的导电盲孔电连接。
具体地,可以对子体10和可熔融介质层50进行图形化处理,以在子体10和可熔融介质层50形成贯穿孔,对贯穿孔进行沉铜电镀,以在贯穿孔的内壁上形成导电层,得到导电孔200。在第一线路层30和第二线路层40与导电孔200对应的位置上设置导电盲孔,可以实现电感元件20的连接端子201依序通过第一线路层30的导电盲孔和导电孔200与第二线路层40的导电盲孔电连接。
可选地,设置一个或一个以上元器件(图未示)在第一线路层30远离槽体的一侧上或第二线路层40远离槽体的一侧上,还可以有多个元器件分别设置在第一线路层30远离槽体的一侧上、第二线路层40远离槽体的一侧上,元器件通过第一线路层30或第二线路层40实现与电感元件20电连接,其中,元器件可以是芯片、电容元件、电阻元件、电源器件中的一种或几种。
在一实施例中,两层子体10之间填有第一介质层50,电感元件20与槽体的侧壁1011之间填有第二介质层60,第一介质层50和第二介质层60经一次压合熔接。
在进行高温压合时,第一介质层50融化,将相邻的子体10粘合在一起,部分第一介质层50流入电感元件20与槽体的侧壁1011之间,并接触电感元件20,第二介质层60也融化,第一介质层50与第二介质层60粘合在一起,冷却固化后,第一介质层50与第二介质层60成为一体结构。其中,第一介质层50与第二介质层60可以是相同材料,也可以是不同材料。
可选地,第一介质层50与第二介质层60为树脂、molding硅树脂胶中的一种绝缘材料或任意组合,其中,molding硅树脂胶,其是一种无色透明液体,固化时具有一定的透气性及弹性,其主要具有耐温特性、耐候性、电气绝缘性、生理惰性、低表面张力和低表面能。树脂是指受热后有软化或熔融范围,软化时在外力作用下有流动倾向,常温下是固态、半固态,有时也可以是液态的有机聚合物。
可选地,可以在每层子体10的对应位置设置至少两个标识图形,由标识图形为基准设置定位孔,定位孔可以用于将各层子体10进行对准、准确地通过各自槽体101套在电感元件20,再将所有子体压合。通过设置定位孔,在将子体10套设于电感元件20时,可以使各层子体10整齐排列,且子体10的槽体101能够精准套入电感元件20而不损伤元件,提高准确度和成品率。
在其他的实施例中,可以在子体10上设置标识图形,以标识图形为基准设置各层子体10的槽体101,且各层子体10的槽体101形状与尺寸相同,槽体用于将各层子体10进行对准、准确地通过各自槽体101套设在电感元件20,再将所有子体10压合。
标识图形还用于定位电感元件20的连接端子201,具体地,可在第一层子体10A上对应电感元件20的连接端子201的位置设置标识图形,根据标识图形对第一层子体10A、邻近第一层子体10A的第一介质层50进行激光打孔,对第一线路层30或第二线路层40也进行激光打孔,以使第一层子体10A、邻近第一层子体的第一介质层50上形成激光通孔,第一线路层30或第二线路层40上也形成激光通孔。
可选地,子体10是覆铜板,采用化学蚀刻工艺对子体10上的铜箔层进行蚀刻,以形成标识图形,其中,化学蚀刻工艺是指采用蚀刻液蚀刻去除材料的方法。标识图形的材料为可透X光材料,在X光线照射下,可以确定标识图形的位置。
参阅图3-4,电感元件20的外部围设有电感框架70,电感框架70用于在子体10利用槽体101套设在电感元件20的过程中辅助电感元件20保持竖立的状态,以使电感元件20始终与槽体的侧壁1011保持预设距离。
其中,电感框架70与槽体的侧壁101之间的距离为80-120um。
电感框架70为导电材料,电感元件20通过电感框架70和与电感框架70连接的导电柱301连接第一线路层30。或者,可以在第二线路层40上设置激光孔,在激光孔中设置导电柱,电感元件20通过电感框架70靠近第二线路层40的一端连接导电柱,实现与第二线路层40的电连接。
还可以在第一线路层30和第二线路层40对应电感框架70的位置处均设置激光通孔,并在激光通孔中设置导电柱,电感元件20通过电感框架70与导电柱连接,从而实现电感元件20与第一线路层30和第二线路层40的电连接。
参阅图5,该埋入式电路板的制作方法包括以下步骤:
S11:提供电感元件和至少两层带相同位置槽体的子体。
提供电感元件,以及至少两层子体,且至少两层子体在相同的位置开设有贯通的槽体,子体可以是无铜芯板或其他可用于制造电路板的材料。
S12:将电感元件置入至少两层子体的槽体内,其中,电感元件与槽体的侧壁间隔设置。步骤如下:
(1)将电感元件置入第一层子体的槽体中。
可选地,将电感元件嵌设到电感框架上,组成电感组件,电感框架用于在子体利用槽体套设在电感元件的过程中辅助电感元件保持竖立的状态,以使电感元件始终与槽体的侧壁保持预设距离。
将电感组件置入第一层子体的槽体中,并将电感组件与第一层子体粘合。将电感组件与第一层子体粘合的目的是防止电感组件偏倒,使电感组件保持竖立状态。
在一实施例中,可以使用胶带粘合电感组件和第一层子体,若此步骤使用胶带粘合电感组件和第一层子体,留出不粘合部分,电感元件不易偏倒或不偏倒后,通过不粘合部分去掉胶带,可以理解的是,胶带需在压合之前去电。在其它实施例中,可以采用热熔胶或胶水粘合电感组件和第一层子体。
(2)将剩余子体依次套设在电感元件上。
在一实施例中,可以按照以下步骤实施:
将若干层第一可熔融介质层以及剩余子体依次交替层叠套设在电感元件上,将第一线路层盖设在最外侧的第一可熔融介质层上,将第二可熔融介质层、第二线路层依次盖设在第一层子体远离第一线路层的一侧。
在其它实施例中,可以按照以下步骤实施:
依次放置第二线路层、第二可熔融介质层以及第一层子体,将电感元件容置于第一层子体的槽体,将剩余若干层第一可熔融介质层以及剩余子体依次交替层叠套设在电感元件上,将第一线路层盖设在最外侧的第一可熔融介质层上
可选地,可以在第一可熔融介质层和子体上的对应位置设置标识图形,根据标识图形设置定位孔,定位孔用以将各层子体和第一可熔融介质对准,从而在将第一可熔融介质层以及剩余子体依次交替层叠套设在电感元件上时,电感元件可精准落入子体上的槽体,以免造成元件损伤,从而提高成品率。
进一步地,可以对子体和第一可熔融介质层、第二可熔融介质层进行图形化处理,形成标识图案,通过标识图案在子体和第一可熔融介质层、第二可熔融介质层形成贯穿孔,对贯穿孔进行沉铜电镀,以在贯穿孔的内壁上形成导电层,得到导电孔,在第一线路层和第二线路层与导电孔对应的位置上设置导电盲孔,可以实现电感元件的连接端子依序通过第一线路层的导电盲孔和导电孔与第二线路层的导电盲孔电连接。
可选地,根据子体层上的标识图形对第一层子体、第一线路层和/或第二线路层进行激光打孔,以在第一层子体、第一线路层和/或第二线路层形成激光通孔,其中,子体层上的标识图形与电感元件的连接端子对应设置,在激光通孔中设置导电柱,以使电感元件的连接端子通过导电柱连接第一线路层和/或第二线路层。
其中,子体可以选用覆铜板,采用化学蚀刻工艺对覆铜板上的铜箔层进行蚀刻,以形成标识图形,其中,化学蚀刻工艺是指采用蚀刻液蚀刻去除材料的方法。标识图形的材料为可透X光材料,在X光线作用下,可以确定标识图形的位置,便于设置定位孔。
可以在电感元件与槽体的侧壁之间填入第二介质层,以使电感元件更加稳固地与槽体侧壁粘合。
其中,第二介质层、第二可熔融介质层和第一可熔融介质层可以是树脂、molding硅树脂胶中的一种或任意组合。molding硅树脂胶,其是一种无色透明液体,固化时具有一定的透气性及弹性,其主要具有耐温特性、耐候性、电气绝缘性、生理惰性、低表面张力和低表面能。树脂是指受热后有软化或熔融范围,软化时在外力作用下有流动倾向,常温下是固态、半固态,有时也可以是液态的有机聚合物。
S13:压合各层子体以固定子体和电感元件。
具体地,对第二线路层、第二可熔融介质层、各层子体层、若干层第一可熔融介质层以及第一线路层进行压合,以固定第二线路层、子体层、电感元件以及第一线路层。
在进行高温压合时,第一可熔融介质层会融化,进而将各子体层、第一线路层粘合在一起,第二可熔融介质层也会融化,将第二线路层与邻近的子体层粘合在一起。具有一定流动性的第一可熔融介质层部分进入槽体,与融化的第二介质层结合,固化后形成一体结构。
参阅图6,步骤如下:
S21:提供电感元件和至少两层带相同位置槽体的子体。
与前一实施例相同,此处不再赘述。
S22:将电感元件置入第一层子体的槽体中。
与前一实施例相同,此处不再赘述。
S23:将若干层第一可熔融介质层以及剩余子体依次交替层叠套设在电感元件上,第一线路层盖设在最外侧的第一可熔融介质层上。
在盖设最外层第一可熔融介质层前,可在电感元件与槽体的侧壁之间加入第二介质层,以使电感元件更加稳固地与槽体侧壁粘合。
S24:对第一线路层、若干层第一可熔融介质层以及各层子体层进行第一次压合。
第一线路层、各第一可熔融介质层、子体层以及盖设完成后,进行第一次压合,高温压合过程中,第一可熔融介质层受热融化,将各相邻子体层以及第一线路层粘合在一起,第二介质层也受热融化,将电感元件与槽体侧壁粘合在一起,且部分第一可熔融介质层进入槽体与第二介质层粘合,冷却后,各第一可熔融介质层与第二介质层形成一体结构。第一线路层、子体以及电感元件被固定。
S25:将第二可熔融介质层、第二线路层依次盖设在第一层子体远离第一线路层的一侧。
将第二可熔融介质层盖设在第一层子体远离第一线路层的一侧,第二线路层盖设在第二可熔融介质层远离第一层子体的一侧。
S26:对第二线路层、第二可熔融介质层、各层子体层、若干层第一可熔融介质层以及第一线路层进行第二次压合。
完成第二可熔融介质层和第二线路层盖设,进行第二次压合,第二次高温压合过程中,各第一可熔融介质层与第二介质层再次融化,可以进一步将各子体层压合得更加紧凑,降低电路板的厚度,第二可熔融介质层融化,将第二线路层与第一层子体粘合起来。以固定第二线路层、子体层、电感元件以及第一线路层。
本申请的有益效果是:区别于现有技术的情况,本申请通过在相邻子体的对应位置分别开设相通的槽体,将电感元件嵌设在槽体内,且使电感元件与槽体的侧壁间隔设置,通过压合工艺压合,工艺步骤简洁方便,可以使得电路板结构紧凑,集成度高,且安全可靠。
以上仅为本申请的实施方式,并非因此限制本申请的专利范围,凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换,或直接或间接运用在其他相关的技术领域,均同理包括在本申请的专利保护范围内。

Claims (20)

1.一种埋入式电路板,其特征在于,所述埋入式电路板包括:
至少一层子体,其中,所述子体的预设位置上开设有贯通的槽体;
电感元件,嵌设在所述槽体内,且所述电感元件与所述槽体的侧壁间隔设置。
2.根据权利要求1所述的埋入式电路板,其特征在于,
所述子体的数量大于等于2;
相邻两层所述子体之间设有可熔融介质层,至少两层所述子体在利用所述槽体套设在所述电感元件后,通过所述可熔融介质层层叠压合而成,至少部分所述可熔融介质层流入所述电感元件与所述槽体的侧壁之间并接触所述电感元件。
3.根据权利要求2所述的埋入式电路板,其特征在于,
所述可熔融介质层的厚度为40-300um;
所述子体是无铜芯板层,所述无铜芯板层的厚度为200-500um。
4.根据权利要求2所述的埋入式电路板,其特征在于,所述埋入式电路板还包括:
第一线路层和第二线路层,且所述第一线路层、所述第二线路层分别覆盖所述槽体的相对两侧,使得所述电感元件位于所述第一线路层和所述第二线路层之间;
所述电感元件具有连接端子,所述电感元件的连接端子与所述第一线路层和/或所述第二线路层电连接。
5.根据权利要求4所述的埋入式电路板,其特征在于,所述第一线路层和/或所述第二线路层上设有激光通孔,所述激光通孔中设有导电柱;
所述电感元件的连接端子通过所述导电柱连接第一线路层和/或所述第二线路层。
6.根据权利要求4所述的埋入式电路板,其特征在于,
所述子体及所述可熔融介质层的对应位置均开设有用于层间连接的导电孔;
所述第一线路层和所述第二线路层与所述导电孔的对应位置上设有导电盲孔;
其中,所述电感元件的连接端子依序通过所述第一线路层的导电盲孔和所述导电孔与所述第二线路层的导电盲孔电连接。
7.根据权利要求4所述的埋入式电路板,其特征在于,所述埋入式电路板还包括:
至少一个元器件,设置在所述第一线路层和/或第二线路层远离所述槽体的一侧上,通过所述第一线路层和/或所述第二线路层与所述电感元件电连接;
其中,所述元器件为芯片、电容元件、电阻元件、电源器件中的至少一种。
8.根据权利要求1所述的埋入式电路板,其特征在于,
所述子体的数量大于等于2;
相邻两层所述子体之间填有第一介质层;
所述电感元件与所述槽体的侧壁之间填有第二介质层;
所述第一介质层和所述第二介质层经一次压合熔接。
9.根据权利要求8所述的埋入式电路板,其特征在于,
所述第一介质层与所述第二介质层为树脂、molding硅树脂胶中的一种绝缘材料或任意组合,且所述第一介质层与所述第二介质层为一体结构,所述第一介质层与所述第二介质层材料相同或不同。
10.根据权利要求2至9任一项所述的埋入式电路板,其特征在于,
至少两层所述子体上设有标识图形以及定位孔,所述定位孔是由所述标识图形为基准而设置,所述定位孔用于将各层所述子体进行对准、准确地用通过各自所述槽体套在所述电感元件,再将所有所述子体压合;
或者,至少两层所述子体上设有标识图形,各层所述子体的槽体是由所述标识图形为基准而设置,且各层所述子体的槽体形状与尺寸相同,所述槽体用于将各层所述子体进行对准、准确地通过各自所述槽体套在所述电感元件,再将所有所述子体压合。
11.根据权利要求10所述的埋入式电路板,其特征在于,
所述标识图形还用于定位所述电感元件的连接端子,可根据所述标识图形对第一层所述子体、邻近所述第一层所述子体的第一介质层进行激光打孔,并对所述第一线路层和/或第二线路层进行激光打孔,以使所述第一层所述子体、邻近所述第一层所述子体的第一介质层上形成激光通孔,所述第一线路层和/或所述第二线路层上也形成激光通孔。
12.根据权利要求10所述的埋入式电路板,其特征在于,
所述标识图形的材料为可透X光材料。
13.根据权利要求1所述的埋入式电路板,其特征在于,
所述电感元件的外部围设有电感框架,所述电感框架用于在所述子体利用所述槽体套设在所述电感元件的过程中辅助所述电感元件保持竖立的状态,以使所述电感元件始终与所述槽体的侧壁保持预设距离;
其中,所述电感框架与所述槽体的侧壁之间的距离为80-120um。
14.一种埋入式电路板的制作方法,其特征在于,包括:
提供电感元件和至少两层子体,其中两层相邻的所述子体在对应位置分别开设有相通的槽体;
将所述电感元件置入至少两层所述子体的槽体内,其中,所述电感元件与所述槽体的侧壁间隔设置;
压合各层所述子体以固定所述子体和所述电感元件。
15.根据权利要求14所述的方法,其特征在于,所述将所述电感元件置入至少两层所述子体的槽体内的步骤包括:
将所述电感元件置入第一层所述子体的槽体中;
将剩余所述子体依次套设在所述电感元件上。
16.根据权利要求15所述的方法,其特征在于,所述将所述电感元件置入第一层所述子体的槽体中步骤包括:
将所述电感元件嵌设到电感框架上,以组成电感组件,其中,所述电感框架用于在所述子体利用所述槽体套设在所述电感元件的过程中辅助所述电感元件保持竖立的状态,以使所述电感元件始终与所述槽体的侧壁保持预设距离;
将所述电感组件置入第一层所述子体的槽体中,并将所述电感组件与所述第一层所述子体粘合。
17.根据权利要求16所述的方法,其特征在于,所述将所述电感组件与所述第一层所述子体粘合的步骤包括:
使用胶带粘合所述第一层所述子体底面以封堵所述第一层所述子体的槽体下端,将所述电感组件自所述第一层的顶端置入所述第一层的槽体并接触所述胶带;或者,
使用热熔胶或胶水粘合所述电感组件与所述第一层所述子体。
18.根据权利要求15所述的方法,其特征在于,所述将剩余所述子体依次套设在所述电感元件上的步骤包括:
将若干层第一可熔融介质层以及剩余所述子体依次交替层叠套设在所述电感元件上,第一线路层盖设在最外侧的所述第一可熔融介质层上;
所述压合各层所述子体以固定所述子体和所述电感元件的步骤包括:
对所述第一线路层、若干层所述第一可熔融介质层以及各层子体进行第一次压合,以固定所述第一线路层、所述子体以及所述电感元件;
所述将剩余所述子体依次套设在所述电感元件上的步骤还包括:
将第二可熔融介质层、第二线路层依次盖设在第一层所述子体远离所述第一线路层的一侧;
所述压合各层所述子体以固定所述子体和所述电感元件的步骤还包括:
对所述第二线路层、所述第二可熔融介质层、各层所述子体、若干层所述第一可熔融介质层以及所述第一线路层进行第二次压合,以固定所述第二线路层、所述子体、所述电感元件以及所述第一线路层。
19.根据权利要求15所述的方法,其特征在于,所述将剩余所述子体依次套设在所述电感元件上的步骤包括:
将若干层第一可熔融介质层以及剩余所述子体依次交替层叠套设在所述电感元件上;
将第一线路层盖设在最外侧的所述第一可熔融介质层上;
将第二可熔融介质层、第二线路层依次盖设在第一层所述子体远离所述第一线路层的一侧;
所述压合各层所述子体以固定所述子体和所述电感元件的步骤包括:
对所述第二线路层、所述第二可熔融介质层、各层所述子体、若干层所述第一可熔融介质层以及所述第一线路层进行压合,以固定所述第二线路层、所述子体、所述电感元件以及所述第一线路层。
20.根据权利要求17或18所述的方法,其特征在于,所述方法还包括:
根据所述子体上的标识图形对所述第一线路层和/或所述第二线路层进行激光打孔,以在所述第一线路层和/或所述第二线路层形成激光通孔,其中,所述子体上的标识图形与所述电感元件的连接端子对应设置;
在所述激光通孔中设置导电柱,以使所述电感元件的连接端子通过所述导电柱连接第一线路层和/或所述第二线路层。
CN202010645383.3A 2019-07-07 2020-07-07 埋入式电路板及其制作方法 Pending CN112203413A (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
PCT/CN2020/127015 WO2022007272A1 (zh) 2019-07-07 2020-11-06 埋入式电路板及其制作方法
EP20827982.8A EP4156873A4 (en) 2020-07-07 2020-11-06 INTEGRATED PRINTED CIRCUIT BOARD AND RELATED MANUFACTURING METHOD
US17/134,220 US11452211B2 (en) 2020-07-07 2020-12-25 Embedded circuit board and method of manufacturing same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2019106073456 2019-07-07
CN201910607345 2019-07-07

Publications (1)

Publication Number Publication Date
CN112203413A true CN112203413A (zh) 2021-01-08

Family

ID=71534852

Family Applications (24)

Application Number Title Priority Date Filing Date
CN201911055986.1A Pending CN112201652A (zh) 2019-07-07 2019-10-31 线路板及其制作方法
CN201921880312.0U Active CN211045436U (zh) 2019-07-07 2019-10-31 线路板
CN201911158137.9A Pending CN112203409A (zh) 2019-07-07 2019-11-22 线路板及其制作方法
CN201922061876.8U Active CN211580313U (zh) 2019-07-07 2019-11-22 线路板
CN202010645377.8A Pending CN112203410A (zh) 2019-07-07 2020-07-07 埋入式电路板及其制备方法
CN202010645958.1A Pending CN112201456A (zh) 2019-07-07 2020-07-07 电感组件及其制作方法
CN202021322905.8U Active CN213280225U (zh) 2019-07-07 2020-07-07 埋入式电路板、设备或传感组件
CN202010645383.3A Pending CN112203413A (zh) 2019-07-07 2020-07-07 埋入式电路板及其制作方法
CN202021323023.3U Active CN213277740U (zh) 2019-07-07 2020-07-07 电感组件
CN202010645388.6A Pending CN112203414A (zh) 2019-07-07 2020-07-07 埋入式电路板以及埋入式电路板的制作方法
CN202021323024.8U Active CN213213963U (zh) 2019-07-07 2020-07-07 埋入式电路板、电子装置
CN202010645387.1A Pending CN112203394A (zh) 2019-07-07 2020-07-07 线路板及其制作方法
CN202010645381.4A Pending CN112203412A (zh) 2019-07-07 2020-07-07 埋入式电路板、电子装置
CN202010645981.0A Pending CN112203417A (zh) 2019-07-07 2020-07-07 一种电路板及其制作方法
CN202010645946.9A Pending CN112203433A (zh) 2019-07-07 2020-07-07 埋入式电路板的制造方法、埋入式电路板以及应用
CN202021318375.XU Active CN213403656U (zh) 2019-07-07 2020-07-07 线路板
CN202021329677.7U Active CN213280231U (zh) 2019-07-07 2020-07-07 埋入式电路板、移动设备以及传感组件
CN202010645380.XA Pending CN112203411A (zh) 2019-07-07 2020-07-07 一种电路板及其制作方法
CN202021329565.1U Active CN213586434U (zh) 2019-07-07 2020-07-07 一种埋入式电路板
CN202021323245.5U Active CN213342791U (zh) 2019-07-07 2020-07-07 线路板
CN202010645947.3A Pending CN112203416A (zh) 2019-07-07 2020-07-07 线路板及其制作方法
CN202021319007.7U Active CN213403657U (zh) 2019-07-07 2020-07-07 一种电路板
CN202010645933.1A Active CN112203415B (zh) 2019-07-07 2020-07-07 埋入式电路板及其制备方法
CN202021323130.6U Active CN213547921U (zh) 2019-07-07 2020-07-07 一种电路板

Family Applications Before (7)

Application Number Title Priority Date Filing Date
CN201911055986.1A Pending CN112201652A (zh) 2019-07-07 2019-10-31 线路板及其制作方法
CN201921880312.0U Active CN211045436U (zh) 2019-07-07 2019-10-31 线路板
CN201911158137.9A Pending CN112203409A (zh) 2019-07-07 2019-11-22 线路板及其制作方法
CN201922061876.8U Active CN211580313U (zh) 2019-07-07 2019-11-22 线路板
CN202010645377.8A Pending CN112203410A (zh) 2019-07-07 2020-07-07 埋入式电路板及其制备方法
CN202010645958.1A Pending CN112201456A (zh) 2019-07-07 2020-07-07 电感组件及其制作方法
CN202021322905.8U Active CN213280225U (zh) 2019-07-07 2020-07-07 埋入式电路板、设备或传感组件

Family Applications After (16)

Application Number Title Priority Date Filing Date
CN202021323023.3U Active CN213277740U (zh) 2019-07-07 2020-07-07 电感组件
CN202010645388.6A Pending CN112203414A (zh) 2019-07-07 2020-07-07 埋入式电路板以及埋入式电路板的制作方法
CN202021323024.8U Active CN213213963U (zh) 2019-07-07 2020-07-07 埋入式电路板、电子装置
CN202010645387.1A Pending CN112203394A (zh) 2019-07-07 2020-07-07 线路板及其制作方法
CN202010645381.4A Pending CN112203412A (zh) 2019-07-07 2020-07-07 埋入式电路板、电子装置
CN202010645981.0A Pending CN112203417A (zh) 2019-07-07 2020-07-07 一种电路板及其制作方法
CN202010645946.9A Pending CN112203433A (zh) 2019-07-07 2020-07-07 埋入式电路板的制造方法、埋入式电路板以及应用
CN202021318375.XU Active CN213403656U (zh) 2019-07-07 2020-07-07 线路板
CN202021329677.7U Active CN213280231U (zh) 2019-07-07 2020-07-07 埋入式电路板、移动设备以及传感组件
CN202010645380.XA Pending CN112203411A (zh) 2019-07-07 2020-07-07 一种电路板及其制作方法
CN202021329565.1U Active CN213586434U (zh) 2019-07-07 2020-07-07 一种埋入式电路板
CN202021323245.5U Active CN213342791U (zh) 2019-07-07 2020-07-07 线路板
CN202010645947.3A Pending CN112203416A (zh) 2019-07-07 2020-07-07 线路板及其制作方法
CN202021319007.7U Active CN213403657U (zh) 2019-07-07 2020-07-07 一种电路板
CN202010645933.1A Active CN112203415B (zh) 2019-07-07 2020-07-07 埋入式电路板及其制备方法
CN202021323130.6U Active CN213547921U (zh) 2019-07-07 2020-07-07 一种电路板

Country Status (4)

Country Link
US (3) US11632861B2 (zh)
EP (2) EP4181159A4 (zh)
CN (24) CN112201652A (zh)
WO (14) WO2021004459A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023272644A1 (zh) * 2021-06-30 2023-01-05 深南电路股份有限公司 一种电子组件、电压调节模块以及稳压器件
WO2023272642A1 (zh) * 2021-06-30 2023-01-05 深南电路股份有限公司 电子元件封装体、电子组件、电压调节模块以及稳压器件

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112201652A (zh) * 2019-07-07 2021-01-08 深南电路股份有限公司 线路板及其制作方法
CN115732943A (zh) * 2021-09-01 2023-03-03 深南电路股份有限公司 用于相控阵天线收发组件的印制线路板、收发组件及雷达
CN115206190B (zh) * 2022-07-11 2023-11-28 武汉华星光电半导体显示技术有限公司 显示装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1823555A (zh) * 2003-07-24 2006-08-23 摩托罗拉公司 具有嵌入式元件的电路板及制造方法
TW200707524A (en) * 2005-08-08 2007-02-16 Advanced Semiconductor Eng Substrate process and structure for embedded component
US20080116562A1 (en) * 2006-11-17 2008-05-22 Phoenix Precision Technology Corporation Carrier structure for semiconductor chip and method for manufacturing the same
JP2009054930A (ja) * 2007-08-29 2009-03-12 Cmk Corp 部品内蔵型多層プリント配線板及びその製造方法
US20150043183A1 (en) * 2013-08-09 2015-02-12 Ibiden Co., Ltd. Wiring board with built-in electronic component

Family Cites Families (98)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3462282B2 (ja) * 1994-11-29 2003-11-05 株式会社東芝 樹脂封止型半導体装置、電子回路装置およびこの製造方法
JP2001102749A (ja) * 1999-09-17 2001-04-13 Internatl Business Mach Corp <Ibm> 回路基板
KR100488412B1 (ko) * 2001-06-13 2005-05-11 가부시키가이샤 덴소 내장된 전기소자를 갖는 인쇄 배선 기판 및 그 제조 방법
JP2004235266A (ja) * 2003-01-28 2004-08-19 Kyocera Corp 電子素子内蔵多層配線基板
US7148577B2 (en) * 2003-12-31 2006-12-12 Intel Corporation Materials for electronic devices
TWI301739B (en) * 2004-12-03 2008-10-01 Via Tech Inc Structure and method for embedded passive component assembly
EP1861857A4 (en) * 2004-12-07 2009-09-02 Multi Fineline Electronix Inc MINIATURE CIRCUITS AND INDUCTIVE COMPONENTS AND MANUFACTURING METHOD THEREFOR
JP4682606B2 (ja) * 2004-12-07 2011-05-11 ソニー株式会社 インダクタンス素子及びその製造方法、並びに配線基板
US7687724B2 (en) * 2005-01-10 2010-03-30 Endicott Interconnect Technologies, Inc. Circuitized substrate with internal resistor, method of making said circuitized substrate, and electrical assembly utilizing said circuitized substrate
US20060286696A1 (en) * 2005-06-21 2006-12-21 Peiffer Joel S Passive electrical article
KR100704936B1 (ko) * 2005-06-22 2007-04-09 삼성전기주식회사 전자부품 내장 인쇄회로기판 및 그 제작방법
KR100700922B1 (ko) * 2005-10-17 2007-03-28 삼성전기주식회사 수동 소자를 내장한 기판 및 그 제조 방법
TWI260075B (en) * 2005-10-24 2006-08-11 Via Tech Inc Embedded inductor element and chip package applying the same
DE102005054233A1 (de) * 2005-11-14 2007-05-16 Grieshaber Vega Kg Hohlleiterübergang
WO2007054355A1 (de) * 2005-11-14 2007-05-18 Vega Grieshaber Kg Hohlleiterübergang
KR100736635B1 (ko) * 2006-02-09 2007-07-06 삼성전기주식회사 베어칩 내장형 인쇄회로기판 및 그 제조 방법
CN100542379C (zh) * 2006-03-15 2009-09-16 日月光半导体制造股份有限公司 具有嵌入式元件的基板及其制造方法
KR100796523B1 (ko) * 2006-08-17 2008-01-21 삼성전기주식회사 전자부품 내장형 다층 인쇄배선기판 및 그 제조방법
EP2095379A4 (en) * 2006-11-14 2012-12-19 Pulse Eng Inc WIRELESS INDUCTIVE DEVICE AND METHOD
KR100788213B1 (ko) * 2006-11-21 2007-12-26 삼성전기주식회사 전자소자 내장형 인쇄회로기판의 제조방법
KR20080076241A (ko) * 2007-02-15 2008-08-20 삼성전기주식회사 전자소자 내장 인쇄회로기판 및 그 제조방법
TWI315658B (en) * 2007-03-02 2009-10-01 Phoenix Prec Technology Corp Warp-proof circuit board structure
TWI341577B (en) * 2007-03-27 2011-05-01 Unimicron Technology Corp Semiconductor chip embedding structure
CN101364581A (zh) * 2007-08-10 2009-02-11 全懋精密科技股份有限公司 嵌埋有芯片的承载板结构及其制作方法
JP5125567B2 (ja) * 2008-02-07 2013-01-23 株式会社デンソー 多層回路基板
JP5284155B2 (ja) * 2008-03-24 2013-09-11 日本特殊陶業株式会社 部品内蔵配線基板
CN101616541A (zh) * 2008-06-24 2009-12-30 华为技术有限公司 印制电路板及其制造方法、相关设备
TWI363411B (en) * 2008-07-22 2012-05-01 Advanced Semiconductor Eng Embedded chip substrate and fabrication method thereof
JP2010114434A (ja) * 2008-10-08 2010-05-20 Ngk Spark Plug Co Ltd 部品内蔵配線基板及びその製造方法
CN201345363Y (zh) * 2008-10-30 2009-11-11 欣兴电子股份有限公司 埋入式电路板结构
CN101511148B (zh) * 2009-03-13 2011-03-09 深圳市深南电路有限公司 一种集成于pcb上的谐振腔制备方法
US8120158B2 (en) * 2009-11-10 2012-02-21 Infineon Technologies Ag Laminate electronic device
CN101795539B (zh) * 2010-01-13 2011-11-09 深南电路有限公司 埋电感电路板的加工方法
CN102254885B (zh) * 2010-05-20 2014-01-15 深南电路有限公司 无源器件、无源器件埋入式电路板及其制造方法
CN201797029U (zh) * 2010-06-11 2011-04-13 深南电路有限公司 一种具有谐振腔的高频滤波器
KR101289140B1 (ko) * 2010-09-28 2013-07-23 삼성전기주식회사 임베디드 인쇄회로기판 및 그 제조방법
US8879276B2 (en) * 2011-06-15 2014-11-04 Power Gold LLC Flexible circuit assembly and method thereof
CN103703874A (zh) * 2011-07-13 2014-04-02 揖斐电株式会社 电子部件内置电路板及其制造方法
KR20130014122A (ko) * 2011-07-29 2013-02-07 삼성전기주식회사 전자 소자 내장 인쇄회로기판 및 그 제조방법
CN102300406B (zh) * 2011-08-19 2013-06-26 深南电路有限公司 埋入式电路板及其制作方法
CN103188882B (zh) * 2011-12-31 2015-12-16 深南电路有限公司 一种电路板及其制作方法
JP2013211426A (ja) * 2012-03-30 2013-10-10 Dainippon Printing Co Ltd 部品内蔵配線板、及びその製造方法
KR101472628B1 (ko) * 2012-07-02 2014-12-15 삼성전기주식회사 커패시터 내장형 기판
CN102933040A (zh) * 2012-10-23 2013-02-13 东莞生益电子有限公司 具有埋入电感器件的pcb板的制作方法
CN103840238A (zh) * 2012-11-20 2014-06-04 深圳光启创新技术有限公司 一种谐振腔、滤波器件及电磁波设备
KR101987285B1 (ko) * 2012-11-30 2019-06-10 삼성전기주식회사 인쇄회로기판용 수지 조성물, 절연필름, 프리프레그 및 인쇄회로기판
CN103906372B (zh) * 2012-12-27 2017-03-01 碁鼎科技秦皇岛有限公司 具有内埋元件的电路板及其制作方法
KR101472640B1 (ko) * 2012-12-31 2014-12-15 삼성전기주식회사 회로 기판 및 회로 기판 제조방법
JP6113510B2 (ja) * 2013-01-16 2017-04-12 アルプス電気株式会社 磁気素子
US20140210111A1 (en) * 2013-01-25 2014-07-31 Apple Inc. Embedded package on package systems
CN104051405A (zh) * 2013-03-11 2014-09-17 欣兴电子股份有限公司 嵌埋有电子组件的线路板结构及其制法
US9142501B2 (en) * 2013-03-14 2015-09-22 International Business Machines Corporation Under ball metallurgy (UBM) for improved electromigration
CN203150678U (zh) * 2013-04-02 2013-08-21 武汉凡谷电子技术股份有限公司 介质谐振腔耦合连接结构
JP5639242B2 (ja) * 2013-04-12 2014-12-10 太陽誘電株式会社 電子部品内蔵基板
CN103327750B (zh) * 2013-06-03 2015-12-02 东莞生益电子有限公司 埋电感式印制电路板的制作方法以及该方法制得的电路板
US9082626B2 (en) * 2013-07-26 2015-07-14 Infineon Technologies Ag Conductive pads and methods of formation thereof
KR102192356B1 (ko) * 2013-07-29 2020-12-18 삼성전자주식회사 반도체 패키지
CN103489841B (zh) * 2013-08-08 2016-08-24 华进半导体封装先导技术研发中心有限公司 同时埋入电容、电感、电阻的pcb板及其制备方法
KR20150046615A (ko) * 2013-10-22 2015-04-30 삼성전기주식회사 다층 인쇄회로기판
CN104853522B (zh) * 2014-02-13 2018-02-23 深南电路有限公司 电路板制作方法和嵌入有金属基的电路板
AT515447B1 (de) * 2014-02-27 2019-10-15 At & S Austria Tech & Systemtechnik Ag Verfahren zum Kontaktieren eines in eine Leiterplatte eingebetteten Bauelements sowie Leiterplatte
JP6334962B2 (ja) * 2014-03-05 2018-05-30 新光電気工業株式会社 配線基板、及び、配線基板の製造方法
JP6373605B2 (ja) * 2014-03-05 2018-08-15 新光電気工業株式会社 配線基板、及び、配線基板の製造方法
CN203840635U (zh) * 2014-04-04 2014-09-17 史利利 印制线路板
CN105322909A (zh) * 2014-06-06 2016-02-10 精工爱普生株式会社 电子器件封装用基板、电子器件封装、电子器件及制造方法
TWI513379B (zh) * 2014-07-02 2015-12-11 Nan Ya Printed Circuit Board 內埋元件的基板結構與其製造方法
JP2016076658A (ja) * 2014-10-08 2016-05-12 イビデン株式会社 電子部品内蔵配線板及びその製造方法
JP2016076656A (ja) * 2014-10-08 2016-05-12 イビデン株式会社 電子部品内蔵配線板及びその製造方法
JP2016096297A (ja) * 2014-11-17 2016-05-26 イビデン株式会社 金属塊内蔵配線板及びその製造方法
KR102281452B1 (ko) * 2014-11-20 2021-07-27 삼성전기주식회사 전자부품 내장 인쇄회로기판 및 그 제조방법
KR102333084B1 (ko) * 2014-12-10 2021-12-01 삼성전기주식회사 임베디드 인쇄회로기판 및 그 제조 방법
DE102014118462A1 (de) * 2014-12-11 2016-06-16 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Semiflexible Leiterplatte mit eingebetteter Komponente
KR102139755B1 (ko) * 2015-01-22 2020-07-31 삼성전기주식회사 인쇄회로기판 및 그 제조방법
CN106163128A (zh) * 2015-04-07 2016-11-23 深南电路股份有限公司 一种扁平化集成电路结构及其加工方法
EP3091821A1 (en) * 2015-05-08 2016-11-09 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Printed circuit board
JP2016219478A (ja) * 2015-05-15 2016-12-22 イビデン株式会社 配線基板及びその製造方法
CN105047630B (zh) * 2015-07-08 2018-05-22 华进半导体封装先导技术研发中心有限公司 芯片后组装有源埋入封装结构及其生产工艺
CN106470526A (zh) * 2015-08-18 2017-03-01 宏启胜精密电子(秦皇岛)有限公司 电感结构、柔性电路板及其制作方法
WO2017119249A1 (ja) * 2016-01-07 2017-07-13 株式会社村田製作所 多層基板及び多層基板の製造方法
JP2017123459A (ja) * 2016-01-08 2017-07-13 サムソン エレクトロ−メカニックス カンパニーリミテッド. プリント回路基板
KR102493463B1 (ko) * 2016-01-18 2023-01-30 삼성전자 주식회사 인쇄회로기판, 이를 가지는 반도체 패키지, 및 인쇄회로기판의 제조 방법
CN107295747B (zh) * 2016-03-31 2021-03-12 奥特斯(中国)有限公司 器件载体及制造器件载体的方法
JP2017195261A (ja) * 2016-04-20 2017-10-26 イビデン株式会社 インターポーザ及びインターポーザの製造方法
CN106332447B (zh) * 2016-08-31 2018-09-21 电子科技大学 一种用于印制电路板埋嵌技术的电感结构及其制作方法
CN106848519B (zh) * 2017-01-17 2020-11-17 电子科技大学 一种人工复合介质填充的介质集成悬置线
CN108347820B (zh) * 2017-01-25 2020-09-15 奥特斯(中国)有限公司 容纳部件的基底结构上的高导热涂层
EP3478033A1 (en) * 2017-10-25 2019-05-01 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Embedding component with pre-connected pillar in component carrier
KR101963293B1 (ko) * 2017-11-01 2019-03-28 삼성전기주식회사 팬-아웃 반도체 패키지
EP3483929B1 (en) * 2017-11-08 2022-04-20 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with electrically conductive and insulating layers and a component embedded therein and manufacturing method thereof
CN207491318U (zh) * 2017-12-08 2018-06-12 中国电子科技集团公司第三十研究所 一种基于埋容材料的板级电源分配网络
JP2019117910A (ja) * 2017-12-27 2019-07-18 イビデン株式会社 プリント配線板
CN207783281U (zh) * 2018-02-27 2018-08-28 浙江万正电子科技有限公司 埋平面电阻聚酰亚胺多层线路板
CN109195327A (zh) * 2018-08-20 2019-01-11 深圳崇达多层线路板有限公司 一种解决埋磁位表面凹坑及分层爆板的方法
EP3633721A1 (en) * 2018-10-04 2020-04-08 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with face-up and face-down embedded components
US10879575B2 (en) * 2018-10-04 2020-12-29 International Business Machines Corporation Embedded filtering in PCB integrated ultra high speed dielectric waveguides using photonic band gap structures
CN109257874A (zh) * 2018-11-16 2019-01-22 深圳市和美精艺科技有限公司 一种在pcb板制作过程中芯片埋入的方法及其结构
CN112201652A (zh) * 2019-07-07 2021-01-08 深南电路股份有限公司 线路板及其制作方法
CN111564414B (zh) * 2019-12-12 2021-09-24 奥特斯(中国)有限公司 部件承载件及制造部件承载件的方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1823555A (zh) * 2003-07-24 2006-08-23 摩托罗拉公司 具有嵌入式元件的电路板及制造方法
TW200707524A (en) * 2005-08-08 2007-02-16 Advanced Semiconductor Eng Substrate process and structure for embedded component
US20080116562A1 (en) * 2006-11-17 2008-05-22 Phoenix Precision Technology Corporation Carrier structure for semiconductor chip and method for manufacturing the same
JP2009054930A (ja) * 2007-08-29 2009-03-12 Cmk Corp 部品内蔵型多層プリント配線板及びその製造方法
US20150043183A1 (en) * 2013-08-09 2015-02-12 Ibiden Co., Ltd. Wiring board with built-in electronic component

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
程婕 主编: "《电子产品制造工程实践技术》", 西北工业大学出版社, pages: 160 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023272644A1 (zh) * 2021-06-30 2023-01-05 深南电路股份有限公司 一种电子组件、电压调节模块以及稳压器件
WO2023272642A1 (zh) * 2021-06-30 2023-01-05 深南电路股份有限公司 电子元件封装体、电子组件、电压调节模块以及稳压器件
US11711893B2 (en) 2021-06-30 2023-07-25 Shennan Circuits Co., Ltd. Electronic component, voltage regulation module and voltage stabilizer
US11737212B2 (en) 2021-06-30 2023-08-22 Shennan Circuits Co., Ltd. Electronic component package, electronic assembly, voltage regulation module, and voltage regulator member

Also Published As

Publication number Publication date
CN213213963U (zh) 2021-05-14
CN213280231U (zh) 2021-05-25
WO2021004459A1 (zh) 2021-01-14
CN213403657U (zh) 2021-06-08
WO2022007268A1 (zh) 2022-01-13
US11632861B2 (en) 2023-04-18
WO2021098531A1 (zh) 2021-05-27
CN112203410A (zh) 2021-01-08
WO2022007272A1 (zh) 2022-01-13
CN213280225U (zh) 2021-05-25
CN211580313U (zh) 2020-09-25
CN213547921U (zh) 2021-06-25
EP3958656A4 (en) 2022-05-11
US20230154665A1 (en) 2023-05-18
US20220279648A1 (en) 2022-09-01
CN112203412A (zh) 2021-01-08
WO2021083367A1 (zh) 2021-05-06
CN112201456A (zh) 2021-01-08
CN112203417A (zh) 2021-01-08
CN112203416A (zh) 2021-01-08
CN213342791U (zh) 2021-06-01
WO2022007277A1 (zh) 2022-01-13
US20220015243A1 (en) 2022-01-13
CN112203411A (zh) 2021-01-08
CN211045436U (zh) 2020-07-17
WO2022007271A1 (zh) 2022-01-13
WO2022007276A1 (zh) 2022-01-13
CN112203415A (zh) 2021-01-08
CN112203433A (zh) 2021-01-08
CN112203409A (zh) 2021-01-08
WO2022007275A1 (zh) 2022-01-13
CN112203394A (zh) 2021-01-08
WO2022007270A1 (zh) 2022-01-13
EP4181159A1 (en) 2023-05-17
CN112201652A (zh) 2021-01-08
WO2022007278A1 (zh) 2022-01-13
CN112203415B (zh) 2022-06-28
CN112203414A (zh) 2021-01-08
CN213277740U (zh) 2021-05-25
CN213586434U (zh) 2021-06-29
EP4181159A4 (en) 2023-12-27
WO2022007269A1 (zh) 2022-01-13
EP3958656A1 (en) 2022-02-23
CN213403656U (zh) 2021-06-08
WO2022007273A1 (zh) 2022-01-13
WO2022007274A1 (zh) 2022-01-13

Similar Documents

Publication Publication Date Title
CN213586434U (zh) 一种埋入式电路板
CN102612252B (zh) 印刷线路板
US9961780B2 (en) Method for manufacturing resin multilayer board
US10765005B2 (en) Embedding component with pre-connected pillar in component carrier
CN105027691B (zh) 印刷电路板及其制造方法
US8544756B2 (en) Method of receiving a module in a smart card body
CN103378014A (zh) 封装载板及其制作方法
KR101125995B1 (ko) 프린트 배선판의 제조방법 및 프린트 기판 유닛의 제조방법
JP2006108211A (ja) 配線板と、その配線板を用いた多層配線基板と、その多層配線基板の製造方法
JP6139653B2 (ja) 部品内蔵樹脂多層基板
CN103906371A (zh) 具有内埋元件的电路板及其制作方法
CN107770947A (zh) 印刷布线板和印刷布线板的制造方法
CN108235562A (zh) 用于将部件嵌入部件承载件中的透气性临时载带
WO2014112108A1 (ja) 部品内蔵基板及びその製造方法
CN104299919B (zh) 无芯层封装结构及其制造方法
CN103635028A (zh) 埋入式元件电路板与其制作方法
CN103889165B (zh) 具有内埋元件的电路板及其制作方法
CN102047403A (zh) 电子器件及电子器件的制造方法
JP4285339B2 (ja) 回路モジュールおよび回路モジュールの製造方法
CN107770946A (zh) 印刷布线板及其制造方法
JP4635331B2 (ja) プリント配線板
TW200840450A (en) Multilayer wiring board and method of manufacturing the same
EP4156873A1 (en) Embedded circuit board and manufacturing method therefor
JP2006093439A (ja) 多層基板及びその製造方法
US7958626B1 (en) Embedded passive component network substrate fabrication method

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination