CN103889165B - 具有内埋元件的电路板及其制作方法 - Google Patents
具有内埋元件的电路板及其制作方法 Download PDFInfo
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- CN103889165B CN103889165B CN201210561907.6A CN201210561907A CN103889165B CN 103889165 B CN103889165 B CN 103889165B CN 201210561907 A CN201210561907 A CN 201210561907A CN 103889165 B CN103889165 B CN 103889165B
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- electric connection
- conductive circuit
- circuit layer
- layer
- connection pad
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- 238000002360 preparation method Methods 0.000 title abstract description 6
- 239000000853 adhesive Substances 0.000 claims abstract description 32
- 230000001070 adhesive effect Effects 0.000 claims abstract description 30
- 230000004888 barrier function Effects 0.000 claims abstract description 18
- 238000003466 welding Methods 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000006071 cream Substances 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- IXSZQYVWNJNRAL-UHFFFAOYSA-N etoxazole Chemical compound CCOC1=CC(C(C)(C)C)=CC=C1C1N=C(C=2C(=CC=CC=2F)F)OC1 IXSZQYVWNJNRAL-UHFFFAOYSA-N 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
第一线路板 | 10 |
第一基底层 | 11 |
第一导电线路层 | 12 |
第二导电线路层 | 13 |
第一绝缘层 | 14 |
第一电性连接垫 | 122 |
第一导电孔 | 132 |
第一防焊层 | 15 |
第二电性连接垫 | 152 |
第一收容槽 | 16 |
第三电性连接垫 | 17 |
第一电子元件 | 18 |
第一电极 | 182 |
第二线路板 | 30 |
第二基底层 | 31 |
第三导电线路层 | 32 |
第四导电线路层 | 33 |
第二绝缘层 | 34 |
第四电性连接垫 | 322 |
第二导电孔 | 332 |
第二防焊层 | 35 |
第五电性连接垫 | 352 |
第二收容槽 | 36 |
第六电性连接垫 | 37 |
第二电子元件 | 38 |
第二多层基板 | 40 |
第二电极 | 382 |
胶片 | 50 |
开孔 | 51 |
导电粘接块 | 52 |
具有内埋元件的电路板 | 60 |
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210561907.6A CN103889165B (zh) | 2012-12-22 | 2012-12-22 | 具有内埋元件的电路板及其制作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210561907.6A CN103889165B (zh) | 2012-12-22 | 2012-12-22 | 具有内埋元件的电路板及其制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103889165A CN103889165A (zh) | 2014-06-25 |
CN103889165B true CN103889165B (zh) | 2017-05-31 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201210561907.6A Active CN103889165B (zh) | 2012-12-22 | 2012-12-22 | 具有内埋元件的电路板及其制作方法 |
Country Status (1)
Country | Link |
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CN (1) | CN103889165B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105789161B (zh) * | 2014-12-22 | 2019-07-12 | 恒劲科技股份有限公司 | 封装结构及其制法 |
TWI599283B (zh) * | 2015-12-07 | 2017-09-11 | 南亞電路板股份有限公司 | 印刷電路板及其製作方法 |
CN108966568B (zh) * | 2018-07-26 | 2020-11-13 | 维沃移动通信有限公司 | 一种电子设备 |
CN112153801B (zh) * | 2019-06-28 | 2022-03-08 | 庆鼎精密电子(淮安)有限公司 | 电路板及其制作方法 |
CN113973433B (zh) * | 2020-07-24 | 2023-08-18 | 宏启胜精密电子(秦皇岛)有限公司 | 内埋式线路板及其制作方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1697162A (zh) * | 2004-05-14 | 2005-11-16 | 相互股份有限公司 | 芯片埋入式半导体元件构装结构 |
TW201143005A (en) * | 2010-05-17 | 2011-12-01 | Advanced Semiconductor Eng | Embedded component substrate, semiconductor package structure using the same and fabrication methods thereof |
-
2012
- 2012-12-22 CN CN201210561907.6A patent/CN103889165B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1697162A (zh) * | 2004-05-14 | 2005-11-16 | 相互股份有限公司 | 芯片埋入式半导体元件构装结构 |
TW201143005A (en) * | 2010-05-17 | 2011-12-01 | Advanced Semiconductor Eng | Embedded component substrate, semiconductor package structure using the same and fabrication methods thereof |
Also Published As
Publication number | Publication date |
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CN103889165A (zh) | 2014-06-25 |
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Effective date of registration: 20161202 Address after: Taoyuan County, Taiwan, China Grand Garden Township three stone village three and 6 Lane 28 Lane Applicant after: Zhen Ding Technology Co.,Ltd. Applicant after: Qi Ding Technology Qinhuangdao Co.,Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant before: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. Applicant before: Zhen Ding Technology Co.,Ltd. |
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Effective date of registration: 20231023 Address after: No. 18-2, Tengfei Road, Qinhuangdao Economic and Technological Development Zone, Hebei Province Patentee after: Liding semiconductor technology Qinhuangdao Co.,Ltd. Patentee after: Zhen Ding Technology Co.,Ltd. Address before: No.18, Tengfei Road, Qinhuangdao Economic and Technological Development Zone, Hebei Province 066004 Patentee before: Qi Ding Technology Qinhuangdao Co.,Ltd. Patentee before: Zhen Ding Technology Co.,Ltd. |