CN103489841B - 同时埋入电容、电感、电阻的pcb板及其制备方法 - Google Patents
同时埋入电容、电感、电阻的pcb板及其制备方法 Download PDFInfo
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- CN103489841B CN103489841B CN201310343921.3A CN201310343921A CN103489841B CN 103489841 B CN103489841 B CN 103489841B CN 201310343921 A CN201310343921 A CN 201310343921A CN 103489841 B CN103489841 B CN 103489841B
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- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 87
- 239000011162 core material Substances 0.000 claims abstract description 42
- 238000005530 etching Methods 0.000 claims description 18
- 230000015572 biosynthetic process Effects 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 abstract description 227
- 239000011229 interlayer Substances 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000004308 accommodation Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 8
- 238000003825 pressing Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
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CN201310343921.3A CN103489841B (zh) | 2013-08-08 | 2013-08-08 | 同时埋入电容、电感、电阻的pcb板及其制备方法 |
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CN201310343921.3A CN103489841B (zh) | 2013-08-08 | 2013-08-08 | 同时埋入电容、电感、电阻的pcb板及其制备方法 |
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CN103489841A CN103489841A (zh) | 2014-01-01 |
CN103489841B true CN103489841B (zh) | 2016-08-24 |
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CN201310343921.3A Active CN103489841B (zh) | 2013-08-08 | 2013-08-08 | 同时埋入电容、电感、电阻的pcb板及其制备方法 |
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Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
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CN106571355B (zh) * | 2015-10-12 | 2019-03-19 | 碁鼎科技秦皇岛有限公司 | 芯片封装基板的制作方法及芯片封装基板 |
CN106658964A (zh) * | 2015-10-28 | 2017-05-10 | 碁鼎科技秦皇岛有限公司 | 电路板及其制作方法 |
CN106658965A (zh) * | 2015-10-30 | 2017-05-10 | 碁鼎科技秦皇岛有限公司 | 载板及其制作方法 |
CN107567185B (zh) * | 2017-08-25 | 2020-11-24 | 奇酷互联网络科技(深圳)有限公司 | 电路板结构及其制备方法和电子设备 |
CN112201652A (zh) * | 2019-07-07 | 2021-01-08 | 深南电路股份有限公司 | 线路板及其制作方法 |
CN113035864B (zh) * | 2021-03-05 | 2023-01-24 | 泉芯集成电路制造(济南)有限公司 | 电源配置结构、集成电路器件和电子设备 |
CN113079621B (zh) * | 2021-03-29 | 2022-06-14 | 生益电子股份有限公司 | Pcb制作方法、pcb及导电介质的漏放检测方法 |
CN115831936B (zh) * | 2021-09-16 | 2023-09-05 | 安徽奥飞声学科技有限公司 | 一种具有埋容的基板及其埋容测试方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1303229A (zh) * | 1999-09-23 | 2001-07-11 | 莫顿国际公司 | 薄型集成电阻和电容和电感组件及其制作方法 |
CN1968576A (zh) * | 2005-11-17 | 2007-05-23 | 三星电机株式会社 | 具有埋入部件的印刷电路板的制造方法 |
CN101409981A (zh) * | 2007-10-09 | 2009-04-15 | 欣兴电子股份有限公司 | 具有内埋式电容及电阻结构的电路板 |
CN102933040A (zh) * | 2012-10-23 | 2013-02-13 | 东莞生益电子有限公司 | 具有埋入电感器件的pcb板的制作方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
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TW200926919A (en) * | 2007-12-03 | 2009-06-16 | Subtron Technology Co Ltd | Fabricating process of circuit board with embedded passive component |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1303229A (zh) * | 1999-09-23 | 2001-07-11 | 莫顿国际公司 | 薄型集成电阻和电容和电感组件及其制作方法 |
CN1968576A (zh) * | 2005-11-17 | 2007-05-23 | 三星电机株式会社 | 具有埋入部件的印刷电路板的制造方法 |
CN101409981A (zh) * | 2007-10-09 | 2009-04-15 | 欣兴电子股份有限公司 | 具有内埋式电容及电阻结构的电路板 |
CN102933040A (zh) * | 2012-10-23 | 2013-02-13 | 东莞生益电子有限公司 | 具有埋入电感器件的pcb板的制作方法 |
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Effective date of registration: 20191202 Address after: Room A107, research building a, high tech think tank center, Nanhai software technology park, Shishan town, Nanhai District, Foshan City, Guangdong Province Patentee after: Guangdong fozhixin microelectronics technology research Co.,Ltd. Address before: 214000 Jiangsu New District of Wuxi, Taihu international science and Technology Parks Linghu Road No. 200 Chinese Sensor Network International Innovation Park building D1 Patentee before: National Center for Advanced Packaging Co.,Ltd. |
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Denomination of invention: PCB board embedded with capacitor, inductor and resistor and its preparation method Effective date of registration: 20201224 Granted publication date: 20160824 Pledgee: Guangdong Nanhai Rural Commercial Bank branch branch of Limited by Share Ltd. Pledgor: Guangdong fozhixin microelectronics technology research Co.,Ltd. Registration number: Y2020980009995 |
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Granted publication date: 20160824 Pledgee: Guangdong Nanhai Rural Commercial Bank branch branch of Limited by Share Ltd. Pledgor: Guangdong Xinhua Microelectronics Technology Co.,Ltd.|Guangdong fozhixin microelectronics technology research Co.,Ltd. Registration number: Y2020980009995 |