WO2021083367A1 - 线路板及其制作方法 - Google Patents

线路板及其制作方法 Download PDF

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Publication number
WO2021083367A1
WO2021083367A1 PCT/CN2020/125498 CN2020125498W WO2021083367A1 WO 2021083367 A1 WO2021083367 A1 WO 2021083367A1 CN 2020125498 W CN2020125498 W CN 2020125498W WO 2021083367 A1 WO2021083367 A1 WO 2021083367A1
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Prior art keywords
layer
chip
core board
circuit
metal layer
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PCT/CN2020/125498
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English (en)
French (fr)
Inventor
黄立湘
王泽东
缪桦
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深南电路股份有限公司
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Publication of WO2021083367A1 publication Critical patent/WO2021083367A1/zh

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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated

Abstract

一种线路板及其制作方法，线路板包括：芯板(11)，芯板(11)上开设有槽体(12)，至少一个芯片(13)，设置在槽体(12)中。其中，槽体(12)的侧壁上设置有第一金属层(18)，用于将所述芯片(13)产生的热量导出，进而实现更好的散热效果。

Description

线路板及其制作方法 【技术领域】
本申请涉及芯片埋入技术领域，特别是涉及一种线路板及其制作方法。
【背景技术】
今日的电子封装不但要提供芯片的保护，同时还要在一定的成本下满足不断增加的性能、可靠性、散热、功率分配等要求，功能芯片速度及处理能力的增加需要更多的引脚数，更快的时钟频率和更好的电源分配。同时由于用户对超薄，微缩，多功能，高性能且低耗电的智能移动电子产品的需求越来越大，直接促成移动终端芯片计算和通信功能的融合，出现集成度，复杂度越来越高，功耗和成本越来越低的趋势。
【发明内容】
本申请主要提供一种线路板及其制作方法，用于将芯片产生的热量导出。
为解决上述技术问题，本申请提供的第一个技术方案是：提供一种线路板，包括：芯板，开设有槽体；至少一个芯片，设置在所述槽体中；其中，所述槽体的侧壁上设置有第一金属层，用于将所述芯片产生的热量导出。
其中，所述芯片与所述槽体的侧壁之间设置有介质层；其中，所述介质层为具备热固性及填充性能的材料，如树脂、塑封料、molding硅胶中的一种或任意组合。
其中，所述芯板为覆铜板，所述覆铜板的两表面上均设置有第二金属层，所述第一金属层与所述第二金属层连接。
其中，所述线路板还进一步包括绝缘层和线路层，其中，所述绝缘层和所述线路层依次分别设置在所述芯板的表面上；所述绝缘层对应所述芯片的位置处具有第一导电通孔，以将所述芯片与所述线路层电连 接；或所述线路板包括贯穿所述芯板、所述绝缘层及所述线路层的第二导电通孔，用于将所述芯板与所述线路层电连接。
其中，所述线路层包括接地线。
其中，所述绝缘层还进一步包括贯穿所述绝缘层的第二导电通孔，用于以将所述芯板与所述线路层电连接。
为解决上述技术问题，本申请提供的第一个技术方案是：提供一种线路板的制作方法，包括：提供芯板；在所述芯板的指定位置处开设槽体；在所述槽体的侧壁设置第一金属层；在所述槽体中设置芯片。
其中，所述在所述槽体的侧壁设置第一金属层具体包括：采用包括但不限于化学沉铜、溅射、电镀等方法在所述槽体的侧壁沉积第一金属层；其中，所述第一金属层为铜层。
其中，所述芯板为覆铜板，所述覆铜板的两表面均设置有第二金属层，所述第一金属层与所述第二金属层连接。
其中，所述在所述槽体中设置芯片之后还包括：在所述槽体的侧壁与所述芯片之间设置介质层，以将所述芯片与所述芯板粘合；在所述芯板的外侧设置绝缘层，并在所述绝缘层对应所述芯片的位置处设置第一导电通孔，在所述绝缘层对应所述芯板的位置处设置第二导电通孔；在所述绝缘层远离所述芯板的一侧设置线路层，其中，所述线路层上包括接地线。
区别于现有技术，本申请通过在芯板上开设槽体，并在槽体的侧壁设置第一金属层，将芯片设置在芯板的槽体中，以此通过槽体侧壁的第一金属层将芯片产生的热量导出，进而实现更好的散热效果。
【附图说明】
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。其中：
图1是本申请线路板的第一实施例的结构示意图；
图2是本申请线路板的第二实施例的结构示意图；
图3是本申请线路板的制作方法的一实施例的流程示意图。
【具体实施方式】
下面将结合本申请实施方式中的附图，对本申请实施方式中的技术方案进行清楚、完整地描述，显然，所描述的实施方式仅仅是本申请一部分实施方式，而不是全部实施方式。基于本申请中的实施方式，本领域普通技术人员在没有做出创造性的劳动前提下所获得的所有其他实施方式，都属于本申请保护的范围。
请参见图1，为本申请线路板的一实施例的结构示意图。包括：芯板11、芯片13。其中，芯板11上开设有槽体12，芯片13设置在槽体12中。在一实施例中，芯片13可包括用于拍摄的摄像芯片、用于光感指纹识别的指纹芯片、扬声器芯片等等，在此不做限定。
其中，芯板11为覆铜板，即为制作线路板的基础材料，包括基材板及覆盖在所述基材板上的铜箔，所述基材板由纸基板、玻纤布基板、合成纤维布基板、无纺布基板、复合基板等材料浸以树脂，制成粘结片，由多张粘结片组合制成，在制作好的基材板单面或双面覆以铜箔，再进行热压固化以制成覆铜板。在本实施例中，芯板11的两表面的铜箔为第二金属层17，在本实施例中，用于放置芯片13的槽体12的侧壁具有第一金属层18，在一实施例中，第一金属层18与第二金属层17连接。具体地，在芯片13产生热量时，第一金属层18会将产生的热量传输至第二金属层17，热量在芯板11的第二金属层17的表面传递，进而将热量散出。
在一实施例中，线路板进一步包括绝缘层15、线路层16，如图1所示，绝缘层15位于芯板11的外侧，线路层16位于绝缘层15的外侧。进一步地，绝缘层15位于线路层16与芯板11之间，用于将线路层16与芯板11粘合。在一实施例中，绝缘层15为半固化片，其作为层压时的层间粘结层，具体地，所述半固化片主要由树脂和增强材料组成，在制作多层线路板时，通常采用玻纤布做增强材料，将其浸渍上树脂胶液， 再经热处理预烘制成薄片，其加热加压下会软化，冷却后会固化，且具有黏性，在高温压合过程中能将相邻的两层黏合。即绝缘层15在高温压合时会融化，进而将线路层16与芯板11粘合在一起。
在一实施例中，绝缘层15对应芯片13所在的区域具有第一导电通孔14，以将芯片13与线路层16电连接。具体地，第一导电通孔14为贯穿绝缘层15的通孔，通孔的侧壁具有导电金属层，具体地，导电金属层为铜层。在一实施例中，若芯片13自身具有连接端子时，则绝缘层15对应芯片13的连接端子的位置处可以直接具有通孔，通孔侧壁没有金属层或不设置金属层，连接端子穿过通孔与线路层16电连接。
在一实施例中，绝缘层15对应芯板11所在的区域具有第二导电通孔19，以将芯板11上的第一金属层18及第二金属层17与线路层16电连接，具体地，第二导电通孔19的目的是为了将芯板11上的第一金属层18及第二金属层17与线路层16电连接，进而将芯片13产生的热量传输到外层的线路层16上，以实现散热。
具体地，第二导电通孔19可以为图1所示的盲孔，其贯穿绝缘层15.在另一实施例中，第二导电通孔19还可以为图2所示的通孔，其贯穿芯板11、绝缘层15及线路层16，只要能够实现芯板11与线路层16的电连接即可。
在一实施例中，线路层16上包括接地线，第二导电通孔19将第一金属层18及第二金属层17与线路层16上的接地线电连接。这样在第二金属层17上若是安装有其他元器件时，第二金属层17可作为元器件的接地端，且通过与接线的连接，可屏蔽安装的元器件的信号。
进一步地，将第一金属层18及第二金属层17连接到接地线上，更加有利于散热，且由于此连接方式减少了线路层16与第一金属层18及第二金属层17之间的接地回路，有利于减少次生电感和寄生电容的产生，进而有利于减少次生电感和寄生电容对传输信号的影响，进而有利于提高高频信号或其它信号的传输性能，且有利于提升电路板的小型化集成化水平。
在一实施例中，在将芯片13放置到槽体12中时，为了将芯片13 与芯板11粘合，要在槽体12的侧壁设置介质层。具体地，介质层为树脂、molding硅胶中的一种或任意组合。其中，molding硅胶，其是一种无色透明液体，能够在150℃以上高温下进行硫化，固化时具有一定的透气性及弹性。其主要具有耐温特性、耐候性、电气绝缘性、生理惰性、低表面张力和低表面能。树脂是指受热后有软化或熔融范围，软化时在外力作用下有流动倾向，常温下是固态、半固态，有时也可以是液态的有机聚合物。
请参见图2，为本申请线路板的制作方法的一实施例的结构示意图。包括：
步骤S21：提供芯板。
在本实施例中，芯板为覆铜板，即为制作线路板的基础材料，包括基材板及覆盖在所述基材板上的铜箔，所述基材板由纸基板、玻纤布基板、合成纤维布基板、无纺布基板、复合基板等材料浸以树脂，制成粘结片，由多张粘结片组合制成，在制作好的基材板单面或双面覆以铜箔，再进行热压固化以制成覆铜板。覆铜板两表面的铜层为第二金属层。
步骤S22：在芯板的指定位置处开设槽体。
在芯板的指定位置设置槽体，槽体是用于放置芯片的，因此在一实施例中，槽体需要比芯片大，或者在另一实施例中，槽体还可以与芯板等大，只要能够容置芯片即可。
步骤S23：在槽体的侧壁设置第一金属层。
具体地，第一金属层为铜层，使用包括但不限于化学沉铜、溅射、电镀等方式在槽体的侧壁设置第一金属层，并使第一金属层与芯板表面的第二金属层连接，共同作为用于散热的金属层，进而将芯片产生的热量导出。
步骤S24：在槽体中设置芯片。
将芯片设置到槽体中，在一实施例中，将芯片设置到槽体中后需要将芯片与芯板粘合，即需要在槽体中填充介质层，通过介质层将芯片与芯板进行粘合。
步骤S25：在槽体的侧壁与芯片之间设置介质层，以将芯片与芯板 粘合。
具体地，在一实施例中，介质层为具备热固性及填充性能的材料，如树脂、塑封料、molding硅胶中的一种或任意组合。其中，molding硅胶，其是一种无色透明液体，能够在150℃以上高温下进行硫化，固化时具有一定的透气性及弹性。其主要具有耐温特性、耐候性、电气绝缘性、生理惰性、低表面张力和低表面能。树脂是指受热后有软化或熔融范围，软化时在外力作用下有流动倾向，常温下是固态、半固态，有时也可以是液态的有机聚合物。
步骤S26：在芯板的外侧设置绝缘层，并在绝缘层对应芯片的位置处设置第一导电通孔，在所述绝缘层对应所述芯板的位置处设置第二导电通孔。
在芯板的外侧设置绝缘层。在一实施例中，绝缘层为半固化片，其作为层压时的层间粘结层，具体地，所述半固化片主要由树脂和增强材料组成，在制作多层线路板时，通常采用玻纤布做增强材料，将其浸渍上树脂胶液，再经热处理预烘制成薄片，其加热加压下会软化，冷却后会固化，且具有黏性，在高温压合过程中能将相邻的两层黏合。即绝缘层在高温压合时会融化，进而将线路层与芯板粘合在一起。
在设置绝缘层时，需要在绝缘层对应芯片的的位置处设置第一导电通孔，以将芯片与线路层电连接，在一实施例中，若芯片具有连接端子，第一导电通孔可直接设置为通孔，连接端子穿过通孔与线路层连接。另外，再设置绝缘层时，还需要在绝缘层对应芯板的位置处设置第二导电通孔，以将芯板表面的第二金属层及槽体侧壁的第一金属层与线路层电连接。
步骤S27：在绝缘层远离芯板的一侧设置线路层，其中，线路层上包括接地线。
在绝缘层远离芯板的一侧设置线路层，具体地，绝缘层设置在芯板与线路层之间。在一实施例中，线路层上设置有线路图形层。其中线路图形层中包含有接地线，第二导电通孔将芯板表面的第二金属层及槽体侧壁的第一金属层与线路层的接地线连接，进而将热量导出，同时还可 以起到屏蔽信号的作用。
本申请提供的线路板及其制作方法，通过在芯板上设置槽体，在槽体的侧壁设置第一金属层，且由于芯板的表面包括第二金属层，第一金属层与第二金属层连接，可以将芯片产生的热量导出。另外芯板的外侧依次设置有绝缘层及线路层，绝缘层对应芯板的位置处设有导电通孔，以将第一金属层及第二金属层与线路层电连接，进而将相片产生的热量进行释放，实现有效的散热效果。
以上仅为本申请的实施方式，并非因此限制本申请的专利范围，凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (10)

  1. 一种线路板，其中，包括：
    芯板，开设有槽体；
    至少一个芯片，设置在所述槽体中；
    其中，所述槽体的侧壁上设置有第一金属层，用于将所述芯片产生的热量导出。
  2. 根据权利要求1所述的线路板，其中，所述芯片与所述槽体的侧壁之间设置有介质层；
    其中，所述介质层为具备热固性及填充性能的材料，如树脂、塑封料、molding硅胶中的一种或任意组合。
  3. 根据权利要求1所述的线路板，其中，所述芯板为覆铜板，所述覆铜板的两表面上均设置有第二金属层，所述第一金属层与所述第二金属层连接。
  4. 根据权利要求3所述的线路板，其中，还进一步包括绝缘层和线路层，其中，所述绝缘层和所述线路层依次分别设置在所述芯板的表面上；
    所述绝缘层对应所述芯片的位置处具有第一导电通孔，以将所述芯片与所述线路层电连接。
  5. 根据权利要求4所述的线路板，其中，所述线路层包括接地线。
  6. 根据权利要求5所述的线路板，其中，所述绝缘层还进一步包括贯穿所述绝缘层的第二导电通孔，用于将所述芯板与所述线路层电连接；或
    所述线路板包括贯穿所述芯板、所述绝缘层及所述线路层的第二导电通孔，用于将所述芯板与所述线路层电连接。
  7. 一种线路板的制作方法，其中，包括：
    提供芯板；
    在所述芯板的指定位置处开设槽体；
    在所述槽体的侧壁设置第一金属层；
    在所述槽体中设置芯片。
  8. 根据权利要求7所述的方法，其中，所述在所述槽体的侧壁设置第一金属层具体包括：
    采用包括但不限于化学沉铜、溅射、电镀等方法在所述槽体的侧壁沉积第一金属层；
    其中，所述第一金属层为铜层。
  9. 根据权利要求8所述的方法，其中，所述芯板为覆铜板，所述覆铜板的两表面均设置有第二金属层，所述第一金属层与所述第二金属层连接。
  10. 根据权利要求9所述的方法，其中，所述在所述槽体中设置芯片之后还包括：
    在所述槽体的侧壁与所述芯片之间设置介质层，以将所述芯片与所述芯板粘合；
    在所述芯板的外侧设置绝缘层，并在所述绝缘层对应所述芯片的位置处设置第一导电通孔，在所述绝缘层对应所述芯板的位置处设置第二导电通孔；
    在所述绝缘层远离所述芯板的一侧设置线路层，其中，所述线路层上包括接地线。
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