WO2021083159A1 - 电池保护板及其制作方法、移动终端 - Google Patents

电池保护板及其制作方法、移动终端 Download PDF

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Publication number
WO2021083159A1
WO2021083159A1 PCT/CN2020/124127 CN2020124127W WO2021083159A1 WO 2021083159 A1 WO2021083159 A1 WO 2021083159A1 CN 2020124127 W CN2020124127 W CN 2020124127W WO 2021083159 A1 WO2021083159 A1 WO 2021083159A1
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WO
WIPO (PCT)
Prior art keywords
board
hard
soft
battery protection
electronic components
Prior art date
Application number
PCT/CN2020/124127
Other languages
English (en)
French (fr)
Inventor
张伟杰
张强波
骆延昕
张胜林
Original Assignee
天芯互联科技有限公司
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Application filed by 天芯互联科技有限公司 filed Critical 天芯互联科技有限公司
Publication of WO2021083159A1 publication Critical patent/WO2021083159A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/0029—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with safety or protection devices or circuits
    • H02J7/00302—Overcharge protection
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/0029—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with safety or protection devices or circuits
    • H02J7/00304—Overcurrent protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Definitions

  • This application relates to the field of battery technology, in particular to a battery protection board, a manufacturing method thereof, and a mobile terminal.
  • the battery protection board As a necessary component in contemporary mobile phones, the battery protection board is mainly used for overcharging and overload current protection.
  • the battery protection board structure currently on the market is mainly to mount the components on the surface of the hard board first, and then weld the structure of the soft board.
  • the main problems of the mounting of components on the surface of the hard board and the re-welding of the soft board structure are the poor reliability of the solder joints and the increase in temperature, and because the existing battery protection board components are exposed, it will cause poor water resistance and heat dissipation.
  • this application proposes a new type of battery protection board.
  • This application mainly provides a battery protection board, a manufacturing method thereof, and a mobile terminal to solve the problem of poor water resistance and heat dissipation of the existing battery protection board.
  • a technical solution adopted in this application is to provide a battery protection board, including: a hard board and a soft board, wherein the soft board and the hard board are connected; a surface of the hard board The electronic components are attached; the packaging layer covers the side surface of the hard board on which the electronic components are loaded, and cooperates with the hard board to package the electronic components.
  • the hard board and the soft board form a rigid-flex board, and the soft board is partially embedded in the hard board.
  • the electronic components include one or any combination of resistors, capacitors, inductors, integrated chips, and MOS tubes.
  • the surface of the hard board away from the electronic components has a first electrode area and a second electrode area, which are used to connect the positive electrode and the negative electrode of the battery.
  • the end of the soft board away from the hard board is provided with a connector for connecting the equipment to be powered.
  • the material of the hard board is a hard material
  • the material of the soft board is a soft material
  • both the hard board and the soft board have a circuit layer.
  • a technical solution adopted in this application is to provide a method for manufacturing a battery protection board, including: making a rigid board and a flexible board that are connected to each other; mounting electronic components on a surface of the rigid board ; On the side of the hard board loaded with the electronic components is provided with an encapsulation layer covering the hard board and the soft board; removing the encapsulation layer at the position of the soft board to expose the soft board .
  • the step of making a rigid board and a flexible board that are connected to each other includes: the rigid board and the flexible board form a rigid-flex board; two surfaces of the flexible board are arranged flush with the surface of the rigid board.
  • a cover plate to protect the soft board; the step of removing the encapsulation layer at the position of the soft board to expose the soft board further includes: removing the cover plates on both surfaces of the soft board to Expose the soft board.
  • the step of fabricating a rigid board and a flexible board that are connected to each other further includes: arranging a first electrode area and a second electrode area on a surface of the hard board away from the surface where the electronic components are loaded; and removing the The cover plates on both surfaces of the soft board to expose the soft board further include: arranging a connector on the end of the soft board away from the hard board to connect the battery protection board with the equipment to be powered .
  • another technical solution adopted in this application is to provide a mobile terminal, the mobile terminal including the battery protection board described in any one of the above.
  • the present application provides a battery protection board, including: a flexible board and a hard board connected to each other, and electronic components are mounted on one surface of the hard board, and the hard board is loaded There is an encapsulation layer on one side surface of the electronic component, and the encapsulation layer cooperates with a hard board to encapsulate the electronic component, so that the encapsulation layer improves the heat dissipation effect and the waterproofness.
  • FIG. 1 is a schematic diagram of the structure of a battery protection board in the prior art
  • FIG. 2 is a schematic structural diagram of an embodiment of a battery protection board according to the present application.
  • FIG. 3 is a schematic flowchart of the first embodiment of the manufacturing method of the battery protection board of the present application
  • 4a-4c are schematic diagrams of the process flow of the manufacturing method of the battery protection board of this application.
  • Figure 5 is a schematic diagram of the structure of the mobile terminal of the present application.
  • the structure of the battery protection board currently on the market is shown in Figure 1.
  • the hard board is first made, the components are mounted on the surface of the hard board, and then the soft board structure is welded.
  • the battery protection board in the prior art has problems and needs to be improved.
  • the present application provides a new type of battery protection board structure, which can solve the problems of poor reliability of solder joints, temperature rise, poor water resistance, and poor heat dissipation of the structure shown in FIG. 1.
  • the battery protection board of the present application includes a rigid-flex board, that is, a rigid board and a flexible board that are connected to each other, wherein the hard board is mounted with electronic components, and the side of the hard board with the electronic components is provided with a package Layer to encapsulate the electronic components, so as to improve the heat dissipation effect and water resistance of the battery protection board.
  • the soft board and the hard board form a rigid-flex board, which can avoid the use of tin solder for welding, improve the reliability of the battery protection board, and improve the performance of the battery protection board.
  • FIG. 2 is a schematic structural diagram of an embodiment of a battery protection board of the present application. It includes a hard board 11 and a soft board 12, wherein the hard board 11 and the soft board 12 are connected to each other.
  • the hard board 11 is a hard material, specifically made of a core board copper clad laminate
  • the core board is made of paper substrate, glass fiber cloth substrate, synthetic fiber cloth substrate, non-woven substrate, composite substrate and other materials impregnated with resin
  • the bonding sheet is formed by combining multiple bonding sheets, and copper foil is covered on one or both sides of the prepared substrate board, and then hot-press curing is performed to form the core board copper clad laminate.
  • the manufactured core copper clad laminate is pressed through the prepreg sheet to form a stack structure of the multilayer core copper clad laminate.
  • the prepreg is the interlayer bonding layer during lamination. Specifically, the prepreg is mainly composed of resin and reinforcing material.
  • glass fiber cloth is usually used as the reinforcing material and impregnated with resin.
  • the glue solution is heat-treated and pre-baked into a thin sheet, which will soften under heating and pressure, and will solidify after cooling, and is viscous. It can bond adjacent two layers in the process of high-temperature pressing.
  • the flexible board 12 is a flexible material, which is made of a polyimide copper clad laminate material.
  • printed circuit boards made of flexible insulating substrates mainly polyimide or polyester film
  • FPC flexible circuit boards
  • the rigid board 11 and the flexible board 12 form a rigid-flex board. Specifically, at the connection position of the hard board 11 and the soft board 12, the soft board 12 is partially embedded in the hard board 11. In this way, the soft board 12 and the hard board 11 are prevented from being connected by welding, and the reliability is improved.
  • an electronic component 13 is mounted on a surface of the hard board 11.
  • the electronic component 13 specifically includes one or any combination of resistors, capacitors, inductors, integrated chips, and MOS transistors.
  • the integrated chip is used to receive signals, and feed the signals back to electronic components 13 such as MOS tubes, so that they can react accordingly, thereby protecting the battery.
  • the integrated chip detects a voltage overshoot, it will reflect to other electronic components 13 that the MOS transistor is turned off to stop power supply and thereby protect the battery.
  • an encapsulation layer 14 is further provided on the side surface of the hard board 11 where the electronic components 13 are loaded, and the encapsulation layer 14 cooperates with the hard board 11 to encapsulate the electronic components 13. In this way, when the electronic component 13 is working, the generated heat can be dissipated through the encapsulation layer 14. Compared with air, the encapsulation layer 14 has a better heat dissipation effect. In addition, the encapsulation layer 14 also has a good waterproof effect, which can further protect the battery. Specifically, the encapsulation layer 14 can be made of a plastic encapsulation material, such as epoxy resin and the like.
  • first electrode area 15 and a second electrode area 16 are further provided on the surface of the hard board 11 away from the electronic component 13.
  • the first electrode region 15 is a positive electrode
  • the second electrode region 16 is a negative electrode, which is used to connect the positive and negative electrodes of the battery.
  • the first electrode area 15 and the second electrode area 16 are flush with the surface of the hard board 11 away from the electronic component 13.
  • the end of the soft board 12 far away from the hard board 11 is also provided with a connector 17 for connecting the device to be powered, such as a mobile phone, a tablet computer, etc., so as to load the battery in the device to be powered for the device to be powered powered by.
  • the device to be powered such as a mobile phone, a tablet computer, etc.
  • the hard board 11 and the soft board 12 are integrally formed, which avoids welding the hard board 11 and the soft board 12, thereby improving the reliability of the battery protection board.
  • the battery protection board of this embodiment is provided with an encapsulation layer 14 on the side surface of the hard board 11 where the electronic components 13 are mounted.
  • the encapsulation layer 14 can improve the heat dissipation capacity and accelerate the dissipation of heat generated by the electronic components 13.
  • it can play a role in waterproofing and protect the battery.
  • FIG. 3 is a schematic structural diagram of the first embodiment of the manufacturing method of the battery protection plate of this application. include:
  • Step S41 Fabricate the hard board and the soft board that are connected to each other.
  • the soft board 52 and the hard board 51 are integrally formed.
  • the thickness of the hard board 51 is greater than the thickness of the soft board 52.
  • a cover board 53 is provided on both sides of the soft board 52 and is flush with the two surfaces of the hard board 51 to protect the soft board 52.
  • the hard board 51 is a hard material, specifically made of a core board copper clad laminate.
  • the core board is made of paper substrate, glass fiber cloth substrate, synthetic fiber cloth substrate, non-woven substrate, composite substrate and other materials impregnated with resin to make adhesive
  • the sheeting is made by combining multiple bonding sheets, covered with copper foil on one or both sides of the prepared substrate board, and then subjected to heat and pressure curing to make a core board copper clad laminate.
  • the manufactured core copper clad laminate is pressed through the prepreg sheet to form a stack structure of the multilayer core copper clad laminate.
  • the prepreg is the interlayer bonding layer during lamination.
  • the prepreg is mainly composed of resin and reinforcing material.
  • glass fiber cloth is usually used as the reinforcing material and impregnated with resin.
  • the glue solution is heat-treated and pre-baked into a thin sheet, which will soften under heating and pressure, and will solidify after cooling, and is viscous. It can bond adjacent two layers in the process of high-temperature pressing.
  • the flexible board 52 is a flexible material, which is made of a polyimide copper clad laminate material.
  • printed circuit boards made of flexible insulating substrates mainly polyimide or polyester film
  • FPC flexible circuit boards
  • this step when making the hard board 51, it is also necessary to make the first electrode area 54 and the second electrode area 55 on one surface of the hard board 51, wherein the first electrode area 54 and the second electrode area 55 It is flush with one surface of the hard board 51.
  • the rigid board 51 and the soft board 52 are integrally formed to improve the reliability of the battery protection board.
  • Step S42 mounting electronic components on a surface of the hard board.
  • the electronic components 56 are mounted on a surface of the hard board 51 away from the first electrode area 54 and the second electrode area 55.
  • the electronic components 56 include resistors, capacitors, inductors, integrated chips, and MOS tubes. One or any combination.
  • Step S43 an encapsulation layer covering the hard board and the soft board is provided on the side where the electronic components are mounted on the hard board.
  • an encapsulation layer 57 covering the hard board 51, the soft board 52 and the electronic components 56 is provided on the side where the electronic components 56 are loaded.
  • the encapsulation layer 57 is a plastic encapsulation material, such as epoxy resin.
  • Step S44 Remove the encapsulation layer at the position of the soft board to expose the soft board.
  • the soft board 52 is uncovered, and the encapsulation layer 57 at the corresponding position of the soft board 52 is removed.
  • the cover opening process removes the cover plates 53 on both surfaces of the soft board 52.
  • a connector 58 is provided at the end of the soft board 52 away from the hard board 51.
  • the connector 58 is used to connect the device to be powered.
  • the mobile terminal 61 includes a battery protection board 62, wherein the battery board protection board 62 includes the battery board protection board 62 shown in FIG. 2.
  • the mobile terminal 61 refers to a computer device that can be used on the move, and in a broad sense includes a mobile phone, a notebook, a tablet computer, a POS machine, and even a vehicle-mounted computer.
  • the battery protection board and the manufacturing method thereof provided in the present application by forming a rigid-flex board with a hard board and a soft board, avoid welding the hard board and the soft board, thereby improving the reliability of the battery protection board.
  • the electronic components are mounted on a surface of the hard board, and the electronic components are packaged with an encapsulation layer.
  • the encapsulation layer can improve the heat dissipation capacity of the battery protection board, and then produce the electronic components. The heat is quickly dissipated.
  • the encapsulation layer is made of plastic encapsulation material, such as epoxy resin, which can play a waterproof role and further protect the battery from damage.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Battery Mounting, Suspending (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

一种电池保护板（62）及其制作方法，所述电池保护板（62）包括：硬板（11）及软板（12），其中，软板（12）及硬板（11）互相连接，硬板（11）的一表面贴装有电子元器件（13）。封装层（14），覆盖于硬板（11）装载有电子元器件（13）的一侧表面，并配合硬板（11）将电子元器件（13）封装。其中，封装层（14）封装电子元器件（13），提高了电池保护板（62）的散热能力防水能力。

Description

电池保护板及其制作方法、移动终端 【技术领域】
本申请涉及电池技术领域，特别是涉及一种电池保护板及其制作方法、移动终端。
【背景技术】
电池保护板作为当代移动手机中必备的一个部件，主要用于过度充电和过载电流保护。当前市场上推出的电池保护板结构主要是先做硬板表面元器件贴装，再焊接软板结构。但是硬板表面元器件贴装，再焊接软板结构主要问题是锡焊点可靠性差、温升高，且由于现有的电池保护板元器件裸露，其会造成防水性及散热性差。
为解决上述问题，本申请提出一种新型的电池保护板。
【发明内容】
本申请主要提供一种电池保护板及其制作方法、移动终端，以解决现有的电池保护板防水性及散热性差的问题。
为解决上述技术问题，本申请采用的一个技术方案是：提供一种电池保护板，包括：硬板及软板，其中，所述软板及所述硬板连接；所述硬板的一表面贴装有电子元器件；封装层，覆盖于所述硬板装载有所述电子元器件的一侧表面，并配合所述硬板将所述电子元器件封装。
其中，所述硬板及所述软板组成刚挠结合板，且所述软板部分嵌入在所述硬板中。
其中，所述电子元器件包括：电阻、电容、电感、集成芯片、MOS管中一种或任意组合。
其中，所述硬板远离所述电子元器件的表面具有第一电极区域及第二电极区域，用于连接电池的正极和负极。
其中，所述软板远离所述硬板的一端设有连接器，用于连接待供 电设备。
其中，所述硬板的材料为硬性材料，所述软板的材料为软性材料，所述硬板及所述软板上均具有线路层。
为解决上述技术问题，本申请采用的一个技术方案是：提供一种电池保护板的制作方法，包括：制作互相连接的硬板及软板；在所述硬板的一表面贴装电子元器件；在所述硬板装载有所述电子元器件的一侧设置覆盖所述硬板及所述软板的封装层；去除所述软板位置处的封装层，以将所述软板暴露出来。
其中，所述制作互相连接的硬板及软板的步骤包括：所述硬板与所述软板组成刚挠结合板；在所述软板的两表面设置与所述硬板表面平齐的盖板，以保护所述软板；所述去除所述软板位置处的封装层，以将所述软板暴露出来的步骤还包括：去除所述软板两表面的所述盖板，以将所述软板裸露出来。
其中，所述制作互相连接的硬板及软板的步骤进一步包括：在所述硬板远离装载有所述电子元器件的一表面设置第一电极区域及第二电极区域；所述去除所述软板两表面的所述盖板，以将所述软板裸露出来之后还包括：在所述软板远离所述硬板的一端设置连接器，以将所述电池保护板与待供电设备连接。
为解决上述技术问题，本申请采用的另一个技术方案为：提供一种移动终端，所述移动终端包括上述任一项所述的电池保护板。
本申请的有益效果是：区别于现有技术的情况，本申请提供一种电池保护板，包括：相互连接的软板与硬板，且硬板一表面贴装有电子元器件，硬板装载有所述电子元器件的一侧表面具有封装层，封装层配合硬板将电子元器件封装，以此通过封装层提高散热效果、提高防水性。
【附图说明】
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出 创造性劳动的前提下，还可以根据这些附图获得其他的附图。其中：
图1为现有技术中的电池保护板的结构示意图；
图2为本申请电池保护板的一实施例的结构示意图；
图3是本申请电池保护板的制作方法的第一实施例的流程示意图；
图4a-图4c为本申请电池保护板的制作方法的工艺流程示意图；
图5是本申请移动终端的结构示意图。
【具体实施方式】
当前市场上推出的电池保护板结构是如图1所示的，先做硬板，在硬板的表面贴装元器件，再焊接软板结构。
图1所示的电池保护板结构，硬板11制作好后，在硬板一表面贴装电子元器件，之后在硬板11的一端焊接软板12。在焊接时一般使用锡焊料进行焊接，但是锡焊点可靠性差，温升高。且现有的电池板护板电子元器件裸露，其会造成防水性及散热性差的问题。
因此现有技术中的电池保护板存在问题，有待提高。基于上述问题，本申请提供一种新型的电池保护板结构，其能够解决图1所示的结构的锡焊点可靠性差，温升高及防水性、散热性差的问题的问题。
具体地，本申请的电池保护板包括刚挠结合板，即相互连接的硬板及软板，其中，硬板上贴装有电子元器件，硬板装载有电子元器件的一侧设置有封装层，以将电子元器件进行封装，以此提高电池保护板的散热效果及防水性。其中软板与硬板组成刚挠结合板，以此能够避免使用锡焊料进行焊接，提高电池保护板的可靠性，进行提高电池保护板的性能。
下面将结合本申请实施方式中的附图，对本申请实施方式中的技术方案进行清楚、完整地描述，显然，所描述的实施方式仅仅是本申请一部分实施方式，而不是全部的实施方式。基于本申请中的实施方式，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施方式，均属于本申请保护的范围。
下面结合附图对本申请的具体实施例进行解释和说明。
请参见图2，图2为本申请电池保护板的一实施例的结构示意图。包括硬板11、软板12，其中，硬板11和软板12互相连接。
其中，硬板11为硬性材料，具体由芯板覆铜板制成，所述芯板由纸基板、玻纤布基板、合成纤维布基板、无纺布基板、复合基板等材料浸以树脂，制成粘结片，由多张粘结片组合制成，在制作好的基材板单面或双面覆以铜箔，再进行热压固化以制成芯板覆铜板。制作好的芯板覆铜板经过半固化片进行压合以形成多层芯板覆铜板的堆叠结构。其中，半固化片为层压时的层间粘结层，具体地，所述半固化片主要由树脂和增强材料组成，在制作多层线路板时，通常采用玻纤布做增强材料，将其浸渍上树脂胶液，再经热处理预烘制成薄片，其加热加压下会软化，冷却后会固化，且具有黏性，在高温压合过程中能将相邻的两层黏合。
其中，软板12为软性材料，其由聚酰亚胺覆铜板材料制成。具体地，用柔性的绝缘基材(主要是聚酰亚胺或聚酯薄膜)制成的印刷电路板，具有许多硬性印刷电路板不具备的优点。例如它可以自由弯曲、卷绕、折叠。利用柔性线路板(FPC)即软板可大大缩小电子产品的体积，适用电子产品向高密度、小型化、高可靠方向发展的需要。
在本实施例中，硬板11及软板12组成刚挠结合板。具体地，在硬板11及软板12连接位置处，软板12部分嵌入硬板11中。以此防止将软板12及硬板11通过焊接的方式连接在一起，提高可靠性等。
具体地，硬板11的一表面贴装有电子元器件13，电子元器件13具体包括：电阻、电容、电感、集成芯片、MOS管中一种或任意组合。集成芯片用于接收信号，并将信号反馈给MOS管等电子元器件13，以使其作出相应反应，进而保护电池。具体地，若集成芯片检测到电压过冲时，会向其他电子元器件13反映，MOS管关闭，以此停止供电，进而保护电池。
其中，在硬板11装载有电子元器件13的一侧表面还设置有封装层14，封装层14配合硬板11将电子元器件13封装。以此在电子元器件13工作时，可将产生的热量通过封装层14散发，相较于空气，封装层14的散热效果更佳。另外，封装层14还具有良好的防水效果，其能够 进一步保护电池。具体地，封装层14可采用塑封材料，如环氧树脂等。
进一步地，硬板11远离电子元器件13的一侧表面还设置有第一电极区域15及第二电极区域16。在一具体实施例中，第一电极区域15为正电极，第二电极区域16为负电极，其用于与电池的正负极连接。
第一电极区域15及第二电极区域16与硬板11远离电子元器件13的一侧表面平齐。
其中，软板12远离硬板11的一端还设有连接器17，连接器17用于连接待供电设备，如手机，平板电脑等，以此将电池装载在待供电设备中，以为待供电设备供电。
在本实施例提供的电池保护板中，硬板11及软板12一体成型，其避免将硬板11及软板12焊接，进而提高电池保护板的可靠性。另外，本实施例的电池保护板在硬板11贴装电子元器件13的一侧表面设置有封装层14，封装层14一方面能够提散热能力，加快电子元器件13产生的热量的散发，另一方面能够起到防水的作用，进而保护电池。
请参见图3，为本申请电池保护板的制作方法的第一实施例的结构示意图。包括：
步骤S41：制作互相连接的硬板及软板。
具体请参见图4a，在本实施例中。软板52及硬板51一体成型，在具体实施例中，硬板51的厚度大于软板52的厚度。在制作硬板51及软板52时，在软板52的两侧设置盖板53，并与硬板51的两表面平齐，进而保护软板52。
硬板51为硬性材料，具体由芯板覆铜板制成，所述芯板由纸基板、玻纤布基板、合成纤维布基板、无纺布基板、复合基板等材料浸以树脂，制成粘结片，由多张粘结片组合制成，在制作好的基材板单面或双面覆以铜箔，再进行热压固化以制成芯板覆铜板。制作好的芯板覆铜板经过半固化片进行压合以形成多层芯板覆铜板的堆叠结构。其中，半固化片为层压时的层间粘结层，具体地，所述半固化片主要由树脂和增强材料组成，在制作多层线路板时，通常采用玻纤布做增强材料，将其浸渍上树脂胶液，再经热处理预烘制成薄片，其加热加压下会软化，冷却后会 固化，且具有黏性，在高温压合过程中能将相邻的两层黏合。
其中，软板52为软性材料，其由聚酰亚胺覆铜板材料制成。具体地，用柔性的绝缘基材(主要是聚酰亚胺或聚酯薄膜)制成的印刷电路板，具有许多硬性印刷电路板不具备的优点。例如它可以自由弯曲、卷绕、折叠。利用柔性线路板(FPC)即软板可大大缩小电子产品的体积，适用电子产品向高密度、小型化、高可靠方向发展的需要。
具体地，在此步骤中，在制作硬板51时，还需要在硬板51的一表面制作第一电极区域54及第二电极区域55，其中，第一电极区域54及第二电极区域55与硬板51的一表面平齐。
硬板51及软板52一体成型设计，可提高电池保护板的可靠性。
步骤S42：在硬板的一表面贴装电子元器件。
具体请参照图4b，在硬板51的远离第一电极区域54及第二电极区域55的一表面贴装电子元器件56，电子元器件56包括电阻、电容、电感、集成芯片、MOS管中一种或任意组合。
步骤S43：在硬板装载有电子元器件的一侧设置覆盖硬板及软板的封装层。
请继续参照图4b，在装载有电子元器件56的一侧设置覆盖硬板51、软板52及电子元器件56的封装层57。封装层57为塑封材料，如环氧树脂等。
步骤S44：去除软板位置处的封装层，以将软板暴露出来。
请参见图4c，对软板52进行开盖处理，将软板52对应位置处的封装层57去除，在此步骤中，要使软板52裸露出来，还需要对软板52的两表面进行开盖处理，去除软板52两表面的盖板53。
在一实施例中，在去除盖板53将软板52裸露出来后，在软板52远离硬板51的一端设置连接器58。连接器58用于连接待供电设备。
请参见图5，为本申请移动终端的结构示意图。移动终端61包括电池保护板62，其中，电池板护板62包括图2所示的电池板护板62。
其中，移动终端61是指可以在移动中使用的计算机设备，广义的讲包括手机、笔记本、平板电脑、POS机甚至包括车载电脑。
本申请提供的电池保护板及其制作方法，通过将硬板及软板组成刚挠结合板，避免将硬板及软板进行焊接，进而提高电池保护板的可靠性。另外，在硬板的一表面贴装电子元器件，并使用封装层将电子元器件进行封装，以此相对于空气而言，封装层能够提高电池保护板的散热能力，进而将电子元器件产生的热量快速的散发出去，进一步地，封装层为塑封材料，如环氧树脂，其可起到防水作用，进一步保护电池不受损坏。
以上所述仅为本申请的实施方式，并非因此限制本申请的专利范围，凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (15)

  1. 一种电池保护板，其中，包括：
    硬板及软板，其中，所述软板及所述硬板连接；
    所述硬板的一表面贴装有电子元器件；
    封装层，覆盖于所述硬板装载有所述电子元器件的一侧表面，并配合所述硬板将所述电子元器件封装。
  2. 根据权利要求1所述的电池保护板，其中，所述硬板及所述软板组成刚挠结合板，且所述软板部分嵌入在所述硬板中。
  3. 根据权利要求1所述的电池保护板，其中，所述电子元器件包括：电阻、电容、电感、集成芯片、MOS管中一种或任意组合。
  4. 根据权利要求1所述的电池保护板，其中，所述硬板远离所述电子元器件的表面具有第一电极区域及第二电极区域，用于连接电池的正极和负极。
  5. 根据权利要求1所述的电池保护板，其中，所述软板远离所述硬板的一端设有连接器，用于连接待供电设备。
  6. 根据权利要求1所述的电池保护板，其中，所述硬板的材料为硬性材料，所述软板的材料为软性材料，所述硬板及所述软板上均具有线路层。
  7. 一种电池保护板的制作方法，其中，包括：
    制作互相连接的硬板及软板；
    在所述硬板的一表面贴装电子元器件；
    在所述硬板装载有所述电子元器件的一侧设置覆盖所述硬板及所述软板的封装层；
    去除所述软板位置处的封装层，以将所述软板暴露出来。
  8. 根据权利要求7所述的电池保护板的制作方法，其中，
    所述制作互相连接的硬板及软板的步骤包括：
    所述硬板与所述软板组成刚挠结合板；
    在所述软板的两表面设置与所述硬板表面平齐的盖板，以保护所述软板；
    所述去除所述软板位置处的封装层，以将所述软板暴露出来的步骤还 包括：
    去除所述软板两表面的所述盖板，以将所述软板裸露出来。
  9. 根据权利要求8所述的电池保护板的制作方法，其中，
    所述制作互相连接的硬板及软板的步骤进一步包括：
    在所述硬板远离装载有所述电子元器件的一表面设置第一电极区域及第二电极区域；
    所述去除所述软板两表面的所述盖板，以将所述软板裸露出来之后还包括：
    在所述软板远离所述硬板的一端设置连接器，以将所述电池保护板与待供电设备连接。
  10. 一种移动终端，其中，包括电池保护板，所述电池保护板包括：
    硬板及软板，其中，所述软板及所述硬板连接；
    所述硬板的一表面贴装有电子元器件；
    封装层，覆盖于所述硬板装载有所述电子元器件的一侧表面，并配合所述硬板将所述电子元器件封装。
  11. 根据权利要求10所述的电池保护板，其中，所述硬板及所述软板组成刚挠结合板，且所述软板部分嵌入在所述硬板中。
  12. 根据权利要求10所述的电池保护板，其中，所述电子元器件包括：电阻、电容、电感、集成芯片、MOS管中一种或任意组合。
  13. 根据权利要求10所述的电池保护板，其中，所述硬板远离所述电子元器件的表面具有第一电极区域及第二电极区域，用于连接电池的正极和负极。
  14. 根据权利要求10所述的电池保护板，其中，所述软板远离所述硬板的一端设有连接器，用于连接待供电设备。
  15. 根据权利要求10所述的电池保护板，其中，所述硬板的材料为硬性材料，所述软板的材料为软性材料，所述硬板及所述软板上均具有线路层。
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