CN103906371A - 具有内埋元件的电路板及其制作方法 - Google Patents
具有内埋元件的电路板及其制作方法 Download PDFInfo
- Publication number
- CN103906371A CN103906371A CN201210577546.4A CN201210577546A CN103906371A CN 103906371 A CN103906371 A CN 103906371A CN 201210577546 A CN201210577546 A CN 201210577546A CN 103906371 A CN103906371 A CN 103906371A
- Authority
- CN
- China
- Prior art keywords
- conducting wire
- wire layer
- insulating barrier
- conductive
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 230000004888 barrier function Effects 0.000 claims description 92
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 47
- 239000011889 copper foil Substances 0.000 claims description 42
- 238000000034 method Methods 0.000 claims description 37
- 238000003825 pressing Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 description 15
- 230000015572 biosynthetic process Effects 0.000 description 13
- 239000000084 colloidal system Substances 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000009713 electroplating Methods 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
- H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
双面覆铜基板 | 10,10A |
第一导电孔 | 11,11A |
基底层 | 12,12A |
第一铜箔层 | 13,13A |
第二铜箔层 | 14,14A |
第一表面 | 121,121A |
第二表面 | 122,122A |
填充通孔 | 102,102A |
第一导电线路层 | 132,132A |
第二导电线路层 | 142,142A |
多层基板 | 20,20A |
电性连接垫 | 143,143A |
导电膏 | 15,15A |
电子元件 | 16,16A |
电极 | 162,162A |
双面线路板 | 17,17A |
第一绝缘层 | 21,21A |
第三导电线路层 | 22,22A |
第二绝缘层 | 23,23A |
第四导电线路层 | 24,24A |
具有内埋元件的电路板 | 100,100A |
第二导电孔 | 25,25A |
第三导电孔 | 26,26A |
开口 | 211A |
第三绝缘层 | 27A |
第五导电线路层 | 28A |
第四导电孔 | 29A |
Claims (9)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210577546.4A CN103906371B (zh) | 2012-12-27 | 2012-12-27 | 具有内埋元件的电路板及其制作方法 |
TW102101269A TWI466606B (zh) | 2012-12-27 | 2013-01-14 | 具有內埋元件的電路板及其製作方法 |
US14/138,126 US9730328B2 (en) | 2012-12-27 | 2013-12-23 | Printed circuit board with embedded component and method for manufacturing same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210577546.4A CN103906371B (zh) | 2012-12-27 | 2012-12-27 | 具有内埋元件的电路板及其制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103906371A true CN103906371A (zh) | 2014-07-02 |
CN103906371B CN103906371B (zh) | 2017-09-19 |
Family
ID=50997450
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210577546.4A Active CN103906371B (zh) | 2012-12-27 | 2012-12-27 | 具有内埋元件的电路板及其制作方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9730328B2 (zh) |
CN (1) | CN103906371B (zh) |
TW (1) | TWI466606B (zh) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105321888A (zh) * | 2014-08-04 | 2016-02-10 | 恒劲科技股份有限公司 | 封装结构及其制法 |
CN105789161A (zh) * | 2014-12-22 | 2016-07-20 | 恒劲科技股份有限公司 | 封装结构及其制法 |
CN106169445A (zh) * | 2015-05-22 | 2016-11-30 | 艾马克科技公司 | 用以制造具有多层模制导电基板和结构半导体封装的方法 |
CN107146781A (zh) * | 2017-05-27 | 2017-09-08 | 华进半导体封装先导技术研发中心有限公司 | 一种用于bot封装的双面有芯板结构及其制造方法 |
CN107949166A (zh) * | 2017-11-30 | 2018-04-20 | 广州兴森快捷电路科技有限公司 | 埋置元件电路板的制作方法及埋置元件电路板 |
CN111954384A (zh) * | 2019-05-17 | 2020-11-17 | 同泰电子科技股份有限公司 | 线路板结构及其制作方法、显示装置及其制作方法 |
CN112752429A (zh) * | 2019-10-31 | 2021-05-04 | 鹏鼎控股(深圳)股份有限公司 | 多层线路板及其制作方法 |
CN114258200A (zh) * | 2020-09-21 | 2022-03-29 | 庆鼎精密电子(淮安)有限公司 | 具有内埋元件的软硬结合线路板的制作方法 |
CN114501854A (zh) * | 2020-10-27 | 2022-05-13 | 鹏鼎控股(深圳)股份有限公司 | 内埋元件的电路板的制作方法及内埋元件的电路板 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10700011B2 (en) | 2016-12-07 | 2020-06-30 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of forming an integrated SIP module with embedded inductor or package |
WO2023272641A1 (zh) * | 2021-06-30 | 2023-01-05 | 深南电路股份有限公司 | 一种转接板及其制作方法、电路板组件 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2001332860A (ja) * | 2000-05-18 | 2001-11-30 | Hitachi Cable Ltd | 多層配線基板、半導体装置、電子装置及びそれらの製造方法 |
CN1551717A (zh) * | 2003-04-25 | 2004-12-01 | ���µ�����ҵ��ʽ���� | 多层印刷线路板和利用该多层印刷线路板的集成电路 |
CN1750736A (zh) * | 2004-09-15 | 2006-03-22 | 三星电机株式会社 | 包括嵌入式无源元件的印刷电路板及其制造方法 |
CN101754590A (zh) * | 2008-12-18 | 2010-06-23 | 华通电脑股份有限公司 | 内置被动元件的电路板制造方法 |
US20100301468A1 (en) * | 2009-05-27 | 2010-12-02 | Elpida Memory, Inc. | Semiconductor device and method of manufacturing the same |
Family Cites Families (7)
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CN100435605C (zh) * | 1996-12-19 | 2008-11-19 | 揖斐电株式会社 | 印刷布线板 |
CN100381026C (zh) * | 1999-09-02 | 2008-04-09 | 伊比登株式会社 | 印刷布线板及其制造方法 |
WO2004034759A1 (ja) * | 2002-10-08 | 2004-04-22 | Dai Nippon Printing Co., Ltd. | 部品内蔵配線板、部品内蔵配線板の製造方法 |
TWI324901B (en) * | 2007-01-08 | 2010-05-11 | Unimicron Technology Corp | Printed circuit board structure integrating electronic components |
US8039303B2 (en) * | 2008-06-11 | 2011-10-18 | Stats Chippac, Ltd. | Method of forming stress relief layer between die and interconnect structure |
TW201023708A (en) * | 2008-12-05 | 2010-06-16 | Compeq Mfg Co Ltd | Manufacturing method of circuit board having passive components set inside it |
US8093151B2 (en) * | 2009-03-13 | 2012-01-10 | Stats Chippac, Ltd. | Semiconductor die and method of forming noise absorbing regions between THVS in peripheral region of the die |
-
2012
- 2012-12-27 CN CN201210577546.4A patent/CN103906371B/zh active Active
-
2013
- 2013-01-14 TW TW102101269A patent/TWI466606B/zh active
- 2013-12-23 US US14/138,126 patent/US9730328B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001332860A (ja) * | 2000-05-18 | 2001-11-30 | Hitachi Cable Ltd | 多層配線基板、半導体装置、電子装置及びそれらの製造方法 |
CN1551717A (zh) * | 2003-04-25 | 2004-12-01 | ���µ�����ҵ��ʽ���� | 多层印刷线路板和利用该多层印刷线路板的集成电路 |
CN1750736A (zh) * | 2004-09-15 | 2006-03-22 | 三星电机株式会社 | 包括嵌入式无源元件的印刷电路板及其制造方法 |
CN101754590A (zh) * | 2008-12-18 | 2010-06-23 | 华通电脑股份有限公司 | 内置被动元件的电路板制造方法 |
US20100301468A1 (en) * | 2009-05-27 | 2010-12-02 | Elpida Memory, Inc. | Semiconductor device and method of manufacturing the same |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105321888A (zh) * | 2014-08-04 | 2016-02-10 | 恒劲科技股份有限公司 | 封装结构及其制法 |
CN105321888B (zh) * | 2014-08-04 | 2018-08-10 | 恒劲科技股份有限公司 | 封装结构及其制法 |
CN105789161A (zh) * | 2014-12-22 | 2016-07-20 | 恒劲科技股份有限公司 | 封装结构及其制法 |
CN105789161B (zh) * | 2014-12-22 | 2019-07-12 | 恒劲科技股份有限公司 | 封装结构及其制法 |
CN106169445A (zh) * | 2015-05-22 | 2016-11-30 | 艾马克科技公司 | 用以制造具有多层模制导电基板和结构半导体封装的方法 |
CN107146781B (zh) * | 2017-05-27 | 2019-08-30 | 华进半导体封装先导技术研发中心有限公司 | 一种用于bot封装的双面有芯板结构及其制造方法 |
CN107146781A (zh) * | 2017-05-27 | 2017-09-08 | 华进半导体封装先导技术研发中心有限公司 | 一种用于bot封装的双面有芯板结构及其制造方法 |
CN107949166B (zh) * | 2017-11-30 | 2020-04-14 | 广州兴森快捷电路科技有限公司 | 埋置元件电路板的制作方法及埋置元件电路板 |
CN107949166A (zh) * | 2017-11-30 | 2018-04-20 | 广州兴森快捷电路科技有限公司 | 埋置元件电路板的制作方法及埋置元件电路板 |
CN111954384A (zh) * | 2019-05-17 | 2020-11-17 | 同泰电子科技股份有限公司 | 线路板结构及其制作方法、显示装置及其制作方法 |
CN112752429A (zh) * | 2019-10-31 | 2021-05-04 | 鹏鼎控股(深圳)股份有限公司 | 多层线路板及其制作方法 |
US11297722B2 (en) | 2019-10-31 | 2022-04-05 | Avary Holding (Shenzhen) Co., Limited. | Multi-layered circuit board |
CN112752429B (zh) * | 2019-10-31 | 2022-08-16 | 鹏鼎控股(深圳)股份有限公司 | 多层线路板及其制作方法 |
CN114258200A (zh) * | 2020-09-21 | 2022-03-29 | 庆鼎精密电子(淮安)有限公司 | 具有内埋元件的软硬结合线路板的制作方法 |
CN114258200B (zh) * | 2020-09-21 | 2024-04-12 | 庆鼎精密电子(淮安)有限公司 | 具有内埋元件的软硬结合线路板的制作方法 |
CN114501854A (zh) * | 2020-10-27 | 2022-05-13 | 鹏鼎控股(深圳)股份有限公司 | 内埋元件的电路板的制作方法及内埋元件的电路板 |
CN114501854B (zh) * | 2020-10-27 | 2024-03-29 | 鹏鼎控股(深圳)股份有限公司 | 内埋元件的电路板的制作方法及内埋元件的电路板 |
Also Published As
Publication number | Publication date |
---|---|
US9730328B2 (en) | 2017-08-08 |
CN103906371B (zh) | 2017-09-19 |
US20140185257A1 (en) | 2014-07-03 |
TWI466606B (zh) | 2014-12-21 |
TW201427509A (zh) | 2014-07-01 |
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Effective date of registration: 20161201 Address after: No. 18, Tengfei Road, Qinhuangdao Economic & Technological Development Zone, Hebei, China Applicant after: Qi Ding Technology Qinhuangdao Co.,Ltd. Applicant after: Zhen Ding Technology Co.,Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant before: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. Applicant before: Zhen Ding Technology Co.,Ltd. |
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Effective date of registration: 20231012 Address after: No. 18-2, Tengfei Road, Qinhuangdao Economic and Technological Development Zone, Hebei Province Patentee after: Liding semiconductor technology Qinhuangdao Co.,Ltd. Patentee after: Zhen Ding Technology Co.,Ltd. Address before: No.18, Tengfei Road, Qinhuangdao Economic and Technological Development Zone, Hebei Province 066004 Patentee before: Qi Ding Technology Qinhuangdao Co.,Ltd. Patentee before: Zhen Ding Technology Co.,Ltd. |