WO2023272641A1 - 一种转接板及其制作方法、电路板组件 - Google Patents

一种转接板及其制作方法、电路板组件 Download PDF

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Publication number
WO2023272641A1
WO2023272641A1 PCT/CN2021/103808 CN2021103808W WO2023272641A1 WO 2023272641 A1 WO2023272641 A1 WO 2023272641A1 CN 2021103808 W CN2021103808 W CN 2021103808W WO 2023272641 A1 WO2023272641 A1 WO 2023272641A1
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WO
WIPO (PCT)
Prior art keywords
board
sub
adapter
component
blind hole
Prior art date
Application number
PCT/CN2021/103808
Other languages
English (en)
French (fr)
Inventor
黄立湘
缪桦
Original Assignee
深南电路股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深南电路股份有限公司 filed Critical 深南电路股份有限公司
Priority to PCT/CN2021/103808 priority Critical patent/WO2023272641A1/zh
Priority to US17/463,575 priority patent/US11856702B2/en
Publication of WO2023272641A1 publication Critical patent/WO2023272641A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09481—Via in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10022—Non-printed resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1003—Non-printed inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers

Definitions

  • the invention relates to the technical field of circuit boards, in particular to an adapter board, a manufacturing method thereof, and a circuit board assembly.
  • the adapter board is used to electrically connect the upper and lower circuit boards, or to connect the circuit board and electronic components.
  • the present application proposes an adapter board, a manufacturing method thereof, and a circuit board assembly, which can effectively improve the surface utilization rate of the adapter board.
  • an adapter board including: a board body; a first component embedded in the board body; a first connecting part and a second connecting part respectively arranged on opposite sides of the board body , and are respectively used to connect the circuit board and the second component; the first conducting body and the second conducting body extend in the board body in the thickness direction of the board body, one end of the first conducting body is connected to the first component, and the other end connected to the first connection part, one end of the second conducting body is connected to the first element, and the other end is connected to the second connection part.
  • an accommodating groove is provided inside the adapter board, and the first component is placed in the accommodating groove; the first conducting body and the second conducting body are laminated blind holes.
  • the quantity of the first element is at least one.
  • the adapter board includes at least two stacked sub-boards, at least part of the accommodating groove and the blind hole is located on one of the sub-boards, and at least part of the blind hole is set corresponding to the first component area and exposed on one side of one of the sub-boards , where one side of the sub-board is provided with a fan-out pad, at least part of the blind hole is respectively connected to the fan-out pad and the first component, and the fan-out pad is used to connect with the remaining part of the blind hole located on the other sub-board, or Connect to the first pad of the second component/second pad on one side of the circuit board in turn.
  • the first component includes a passive component
  • the second component includes a ball grid array package board
  • the circuit board includes a PCB mother board.
  • the adapter board also includes: a third connection part and a fourth connection part, which are respectively arranged on opposite sides of the board body, and are respectively used to connect the circuit board and the third element; the third conducting body, the third conducting The body passes through the adapter plate, one end is connected to the third connection part, and the other end is connected to the fourth connection part.
  • the present application also provides a circuit board assembly, which includes: a sequentially stacked circuit board, an interposer board and a second component; the interposer board is an interposer board according to any of the above-mentioned embodiments.
  • the present application also provides a method for making an adapter board, including: providing a board body; embedding the first component in the board body; The second connecting part, the first connecting part and the second connecting part are used to connect the circuit board and the second element; the first conducting body and the second conducting body are extended in the board body in the thickness direction of the board body, so that the first connecting body One end of a conducting body is connected to the first element, and the other end is connected to the first connecting portion; one end of the second conducting body is connected to the first element, and the other end is connected to the second connecting portion.
  • the step of embedding the first component in the board body includes: opening a receiving groove on the board body, placing the first component in the receiving groove; laminating a dielectric layer on the opening side of the receiving groove of the board body ;
  • Arranging the first through body and the second through body in the board body in the thickness extension direction of the board body includes: forming the first stacked conductive blind holes and the second stacked conductive blind holes on the opposite sides of the adapter plate corresponding to the first element positions; Layer conductive blind holes to obtain the first through body and the second through body respectively.
  • the step of embedding the first element in the board body includes: opening an accommodating groove on the main body, placing the first element in the accommodating groove; covering at least one layer of sub-boards on opposite sides of the board body ;
  • Arranging the first through body and the second through body in the board body in the thickness extension direction of the board body includes: forming the first stacked conductive blind holes and the second stacked conductive blind holes on the opposite sides of the adapter plate corresponding to the first element positions; Layer conductive blind holes; Fan-out pads are provided on the other side of the daughter board, so that the respective ends of the first stacked conductive blind holes and the second stacked conductive blind holes are respectively connected to the fan-out pads and the first component, Furthermore, the first through body and the second through body can be obtained respectively; wherein, the fan-out pad is used to connect with another sub-board of the interposer board, or with the side of the second component other than the interposer board The first pad, or be connected to the second pad on one side of the circuit board.
  • the beneficial effects of the present application are: the first component is buried in the adapter plate, and the first component is connected to the first connecting part through the first conducting body, and connected to the second connecting part through the second conducting body, thereby Realize the conduction between the first connection part and the second connection part on the adapter board, which not only saves the surface mounting area of the adapter board, but also makes the extra mounting area available for mounting more and larger BGAs Integrated chips; and the integration of consumable components inside the adapter board improves reliability and reduces component failures caused by secondary welding of the original structure.
  • the double-sided interconnection of the adapter board is realized by laser drilling blind holes, which reduces the DC resistance of the conductive network compared with the connection method of integrating components on the surface of the adapter board through soldering.
  • Fig. 1 is a structural schematic diagram of an embodiment of the adapter board of the present application
  • FIG. 2 is a schematic structural view of an embodiment of a laminated blind via in FIG. 1;
  • Fig. 3 is a schematic structural view of an embodiment of the conducting body in Fig. 1;
  • FIG. 4 is a schematic structural view of an embodiment of the circuit board assembly of the present application.
  • FIG. 5 is a schematic flow chart of an embodiment of a method for manufacturing an adapter plate of the present application.
  • the directional indication is only used to explain the position in a certain posture (as shown in the accompanying drawing). If the specific posture changes, the directional indication will also change accordingly.
  • FIG. 1 is a schematic structural diagram of an embodiment of the adapter board of the present application.
  • the adapter board includes: a board body 11; a first element 12, which is embedded in the board body 11; a first connecting portion 131 and a second connecting portion 132, the first connecting portion 131
  • the first connecting portion 131 and the second connecting portion 132 are respectively arranged on opposite sides of the board body 11, and the first connecting portion 131 and the second connecting portion 132 are used to connect the circuit board and the second component; the first conducting body 141 and the second conducting body body 142, wherein both the first conducting body 141 and the second conducting body 142 extend in the board body 11 in the thickness direction of the board body 11, one end of the first conducting body 141 is connected to the first element 12, and the other end is connected to the first One end of the second conducting body 142 is connected to the first element 12 , and the other end is connected to the second connecting portion 132 .
  • the step of embedding the first component 12 in the plate body 11 includes: opening a receiving groove in the adapter plate, placing the first component 12 in the receiving groove, and A first via 141 and a second via 142 are provided.
  • first through body 141 and the second through body 142 are both single-layer or stacked conductive blind holes, which are formed by stacking single-layer or multi-layer conductive blind holes.
  • the adapter board includes at least two stacked sub-boards, such as a first sub-board 21 and a second sub-board 22 , please refer to FIG. 2 for details.
  • FIG. 2 shows the structure of an embodiment of the stacked blind hole in FIG. 1 Schematically, as shown in FIG. 2 , at least part of the accommodating groove 211 and the blind hole 23 are located on one of the sub-boards. In this embodiment, a part of the accommodating groove 211 and the blind hole 23 is located on the first sub-board 21 . The part of the blind hole 23 is disposed corresponding to the area of the accommodating groove 211 and is exposed on one side of the first sub-board 21 .
  • the side of the first sub-board 21 is provided with a fan-out pad, and this part of the blind hole 23 is respectively connected to the first component 12 and the fan-out pad of the first sub-board.
  • the side of the second sub-board 22 away from the first sub-board 21 is also provided with a fan-out pad, and the remaining part of the blind hole 23 is located in the second sub-board 22, and is respectively connected to the fan-out pad of the second sub-board 22 and The fan-out pad of the first sub-board 21 .
  • the number 24 in the figure refers to the fan-out pad.
  • the fan-out pads of the second sub-board 22 are connected to the fan-out pads of other sub-boards, or connected to the first pads on the side of the second component or the second pads on the side of the circuit board.
  • the fan-out pad of the second sub-board 22 may be the first connecting portion 131 or the second connecting portion 132, or the outer surface of the fan-out pad may be processed to form the first connecting portion 131 and/or The second connection part 132 .
  • the riser board includes three sequentially stacked sub-boards, namely the first sub-board 111 , the second sub-board 112 and the third sub-board 113 .
  • FIG. 3 is a schematic structural diagram of an embodiment of the conducting body in FIG. 1.
  • the hole 1121 , the second blind hole 1122 and the third blind hole 1123 are respectively located in the first sub-board 111 , the second sub-board 112 and the third sub-board 113 .
  • At least part of the first blind hole 1121 is set corresponding to the first component 12 and exposed on the side of the first sub-board 111.
  • the first fan-out pad 1221 is provided on the side of the first sub-board 111.
  • the first blind holes 1121 are respectively connected to The first fan-out pad 1221 and the first component 12; the first fan-out pad 1221 is used to connect with the second blind hole 1122 located on the second sub-board 112, at least part of the second blind hole 1122 corresponds to the first fan-out
  • the welding pad 1221 is set and exposed on the side of the second sub-board 112 facing the third sub-board 113, and the second sub-board 112 is provided with a second fan-out pad 1222 on the side opposite to the first sub-board 111.
  • Two blind holes 1122 are respectively connected to the second fan-out pad 1222 and the first fan-out pad 1221, the second fan-out pad 1222 is used to connect with the third blind hole 1123 located on the third sub-board 113, the third blind hole At least part of 1123 is set corresponding to the second fan-out pad 1222, and is exposed on the side of the third sub-board 113 facing away from the second sub-board 112, and the third sub-board 113 is provided with a second There are three fan-out pads 1223 , and the third blind hole 1123 is respectively connected to the second fan-out pad 1222 and the third fan-out pad 1223 .
  • the third fan-out pad 1223 is used to connect with the first pad on the side of the second component/the second pad on the side of the circuit board.
  • a fourth sub-board, fourth blind holes, and fourth fan-out pads may also be sequentially disposed on the surface of the third sub-board 113 , and the number of layers of the sub-board is not limited here. It should be noted that, in the above embodiment, when the fan-out pad is only provided on the side of the fourth sub-board 114 opposite to the third sub-board 113, at least part of the second blind hole 1122 is connected to the first blind hole 1121.
  • the third blind hole 1123 is at least partially connected to the first blind hole 1122, and a fan-out pad can also be provided on one side of each sub-board, then at least part of the second blind hole 1122 is connected to the first fan-out pad 1221 , at least part of the third blind hole 1123 is connected to the second fan-out pad 1222 , which is not limited herein.
  • Fan-out pads can be used to convert a signal into multiple signal outputs or to route one signal to another.
  • the fan-out pad of the third sub-board 113 can be the first connection part 131 or the second connection part 132, or the outer surface of the fan-out pad of the third sub-board 113 can be processed into a first The connection part 131 and/or the second connection part 132 .
  • the first blind hole 1121, the second blind hole 1122, and the third blind hole 1123 form the first through body 141 or the second through body 142, and the first blind hole 1121, the second blind hole 1122,
  • the third blind hole 1123 includes a trapezoid or a rectangle, which is not limited here.
  • blind holes are drilled through the entire board to connect the opposite sides of the board, while blind holes are drilled on the multilayer board of the board to connect with the board.
  • the first sub-board 111, the second sub-board 112 and the third sub-board 113 are connected to each other by lamination, wherein the first sub-board 111, the second sub-board 112, the second sub-board A first fan-out pad 1221 and a second fan-out pad 1222 are included between the board 112 and the third sub-board 113 .
  • a PP board is further included between the first sub-board 111 and the second sub-board 112, and between the second sub-board 112 and the third sub-board 113, and the first sub-board 111 and the second sub-board are connected by laminating the PP board.
  • the second sub-board 112 is connected to the second sub-board 112 and the third sub-board 113 .
  • the conduction body is formed by stacking multiple layers of blind holes to realize the conduction between the first connecting portion 131 /the second connecting portion 132 and the first element 12 . Specifically including: connecting and conducting the fan-out pads between the sub-boards through a laser drilling blind hole process.
  • the third fan-out pad 1223 includes the first connection portion 131 and the second connection portion 132 .
  • the first element 12 also includes a first pin and a second pin, the first pin is connected to the first connection part 131 through the first conducting body 141, and the second pin is connected to the first connecting part 131 through the second conducting body 141.
  • the body 142 is connected to the second connection part 132 .
  • the number of the first element 12 is at least one.
  • a plurality of first components 12 may be embedded in the board body 11 of the adapter board, which is not limited here.
  • the first component 12 may be a passive component such as a capacitive component, an inductive component or a resistive component
  • the second component may be a BGA board
  • the circuit board may be a PCB motherboard.
  • the adapter board further includes a third connection part and a fourth connection part, the third connection part and the fourth connection part are respectively arranged on opposite sides of the board body, and are respectively used for connecting the circuit board and the third connection part.
  • the third component may be a BGA board or other active or passive components, which is not limited here.
  • the adapter board further includes a third conducting body, the third conducting body passes through the adapter board, one end of the third conducting body is connected to the third connection part, and the other end is connected to the fourth connection part.
  • the third connecting portion and the fourth connecting portion may be the same as or different from the first connecting portion 131 and the second connecting portion 132 , which are not limited herein.
  • the first connection part 131 , the second connection part 132 , the third connection part and the fourth connection part can all be connection pads.
  • the beneficial effect of this embodiment is: the first element is connected to the first connection part through the first conducting body, and the second connecting part is connected through the second conducting body, so as to realize the connection between the first element and the transition in the board.
  • the first connection part and the second connection part on opposite sides of the board are connected separately, so as to realize the conduction of the adapter board, and install the first component in the board body of the adapter board, saving the surface mounting area of the adapter board , so that the extra mounting area can be used to mount more and larger BGA integrated chips, and integrate the consumable components inside the adapter board, which improves the reliability and reduces the components caused by the secondary welding of the original structure invalidated.
  • the double-sided interconnection of the adapter board is realized by laser drilling blind holes, which reduces the DC resistance of the conductive network compared with the connection method of integrating components on the surface of the adapter board through soldering.
  • FIG. 4 is a schematic structural diagram of an embodiment of the circuit board assembly of the present application. As shown in FIG. The adapter plate 42 and the second element 43, wherein the adapter plate 42 includes the adapter plate in any of the above-mentioned embodiments.
  • the adapter board 42 includes a board body 421, a first element 422, the first element 422 is embedded in the board body 421, a first connecting portion 4231 and a second connecting portion 4232, and the first connecting portion 4231 and the second connecting portion 4232 are respectively arranged on opposite sides of the board body, and are respectively connected to the circuit board 41 and the second element 43, the first conducting body 4241 and the second conducting body 4242, and the first conducting body 4241 and the second conducting body 4242 All extend in the plate body 421 in the thickness direction of the plate body 421, one end of the first conducting body 4241 is connected to the first element 422, the other end is connected to the first connecting part 4231, one end of the second conducting body 4242 is connected to the first element 422, and the other end is connected to the first element 422. One end is connected to the second connecting portion 4232 .
  • the plate body 421 of the adapter plate 42 is provided with a receiving groove, and the first element 422 is placed in the receiving groove.
  • the first through body 4241 and the second through body 4242 are single-layer or stacked conductive blind holes, which are formed by stacking single-layer or multi-layer conductive blind holes.
  • the adapter board 42 includes at least two stacked sub-boards, and a part of the accommodating groove and the blind hole is located on one of the sub-boards, wherein the part of the blind hole is located in the area corresponding to the first element 422, and One side of the sub-board is exposed, and at the same time, one side of the sub-board is provided with a fan-out pad, and this part of the blind hole is respectively connected to the fan-out pad and the first component 422, and the other sub-board is far away from the first sub-board There is also a fan-out pad on one side of the blind hole, and the remaining part of the blind hole is located in the other sub-board, and is respectively connected to the fan-out pad of the other sub-board and the fan-out pad of one of the sub-boards.
  • the fan-out pad of another sub-board is connected to the fan-out pad of other sub-boards, or connected to the first pad 431 of the second component 43/the second pad 411 on one side of the circuit board 41 .
  • the outer fan-out pad includes a first connection portion 4231 and a second connection portion 4232 .
  • the first through body 4241 and the second through body 4242 are formed by stacking multiple layers of conductive blind holes.
  • the first sub-board, the second sub-board and the third sub-board, the first through body 4241 and the second through body 4242 include blind holes drilled by laser in the first sub-board, the second sub-board and the third sub-board hole. At least part of the accommodating groove and the blind hole are located in the first sub-board, and at least part of the blind hole is respectively located in the first sub-board, the second sub-board and the third sub-board. At least part of the blind hole is set corresponding to the first component 422 and is exposed on the side of the first sub-board.
  • the first fan-out pad is provided on the side of the first sub-board.
  • the blind hole connects the first fan-out pad and the first component.
  • the first fan-out pad is used to connect with a part of the blind hole located on the second sub-board, at least part of the blind hole is set corresponding to the first fan-out pad, and is exposed on the second sub-board toward the third sub-board
  • the second sub-board is provided with a second fan-out pad on the side opposite to the first sub-board, and the blind holes are respectively connected to the second fan-out pad and the first fan-out pad
  • the second fan-out pad is used for
  • a third fan-out pad is provided on one side of the second sub-board, and the blind holes are respectively connected to the second fan-out pad and the third fan-out pad.
  • the third fan-out pad is also used to connect with the first pad on the side of the second component/the second pad on the side of the circuit board.
  • a fourth sub-board, a fourth blind hole, and a fourth fan-out pad can also be successively arranged on the surface of the third sub-board, and the number of layers of the sub-board is not limited here.
  • Fan-out pads can be used to convert a signal into multiple signal outputs or to route one signal to another.
  • the outermost fan-out pad of the adapter board 42 can be the first connection part 131 or the second connection part 132, or the outer surface of the outermost fan-out pad can be processed to form the first connection part 131 and/or the second connecting part 132.
  • the blind hole includes a trapezoid or a rectangle, which is not limited here.
  • the first through body 4241 and the second through body 4242 are formed by stacking blind holes.
  • the second component 43 includes a plurality of BGA boards and/or passive components that are adjacently connected or arranged at intervals, which is not limited herein.
  • the first element 422 is a passive element, including an inductance element, a capacitance element, and a resistance element, etc.
  • the circuit board 41 includes a PCB motherboard.
  • the first pad 431 and the second pad 411 include a plurality of pads respectively disposed on the second component 43 and the circuit board 41 , and the plurality of pads are spaced apart from each other.
  • the first component 422 includes a first pin and a second pin, which are respectively connected to the first through body 4241 and the second through body 4242 .
  • the adapter board also includes a third connecting portion 4251 and a fourth connecting portion 4252, the third connecting portion 4251 and the fourth connecting portion 4252 are respectively arranged on opposite sides of the board body 11, and are used to connect the circuit board 41 and the third connecting portion respectively.
  • Components 44 wherein the third component 44 includes a BGA board or a passive component or the like.
  • the adapter plate 42 includes a third conducting body 426 , the third conducting body 426 runs through the adapter plate 42 , one end is connected to the third connecting portion 4251 , and the other end is connected to the fourth connecting portion 4252 .
  • the third connecting portion 4251 and the fourth connecting portion 4252 may be the same as or different from the first connecting portion 4231 and the second connecting portion 4232 , which are not limited herein.
  • the first connection part 4231 , the second connection part 4232 , the third connection part 4251 and the fourth connection part 4252 can all be connection pads.
  • the beneficial effect of this embodiment is: by embedding the first element in the board body of the adapter plate, and setting the first conducting body and the second conducting body on both sides of the first element, the first connecting part of the adapter plate and the second connecting portion can be conducted through the conducting body.
  • the first pad of the second component is connected to the first connection part on the transfer board, and the second pad on one side of the circuit board is connected to the transfer board.
  • the second connection part on one side is connected, so as to realize the circuit conduction between the circuit board and the second element through the adapter board.
  • the surface mounting area of the adapter board is saved, so that the extra mounting area can be used to mount more and larger BGA integrated chips, and the Consumable components are integrated inside the adapter board, which improves reliability and reduces component failure caused by secondary welding of the original structure.
  • the double-sided interconnection of the adapter board is realized by laser drilling blind holes, which reduces the DC resistance of the conductive network compared with the connection method of integrating components on the surface of the adapter board through soldering.
  • FIG. 5 is a schematic flowchart of an embodiment of the method for manufacturing an adapter board of the present application. As shown in Figure 5, including:
  • Step S51 providing a plate body.
  • the board body includes a single-layer or multi-layer core board.
  • Step S52 Embedding the first component in the board.
  • the first element includes a passive element, such as a capacitive element, an inductive element, a resistive element, and the like. It specifically includes: setting up two opening accommodation grooves in the board body, placing the first element in the accommodation grooves, laminating a dielectric layer on each side of the two openings of the accommodation grooves, so as to embed the first element in the board body .
  • a passive element such as a capacitive element, an inductive element, a resistive element, and the like. It specifically includes: setting up two opening accommodation grooves in the board body, placing the first element in the accommodation grooves, laminating a dielectric layer on each side of the two openings of the accommodation grooves, so as to embed the first element in the board body .
  • the method includes: opening an accommodating groove in the board body, placing the first component in the accommodating groove, and covering at least one layer of sub-boards on opposite sides of the accommodating groove respectively.
  • the sub-board and the dielectric layer may be the same or different, which is not limited here, and the number of layers of the sub-board is also not limited.
  • Step S53 arranging a first through body and a second through body in the board body in the thickness extending direction of the board body, so that one end of the first through body and the second through body are respectively connected to the first element.
  • the first stacked conductive blind holes and the second stacked conductive blind holes are formed on the opposite sides of the adapter board body corresponding to the first component positions; fan-out pads are provided on the side opposite to the first component of each sub-board, The two ends of the first stacked conductive blind hole and the second stacked conductive blind hole are respectively connected to the fan-out pad and the first element, so as to obtain the first through body and the second through body respectively; wherein, The fan-out pad is used to connect to another sub-board of the interposer board, or to connect to the first pad on the side of the second component outside the interposer board, or to connect to the second pad on the side of the circuit board.
  • the first through body and the second through body are formed by stacking multiple layers of conductive blind holes, wherein the manufacturing method of the first through body and the second through body includes: The upper and lower surfaces are respectively covered with a first sub-board, and a first blind hole is drilled on the first sub-board. The bottom of the first blind hole is connected to the pin of the first component. Plating copper on one side of the board to form the first fan-out pad, so that the first fan-out pad is connected to the pin of the first component through the first blind hole; A second blind hole is drilled on the second sub-board, and the bottom of the second blind hole is connected to the surface of the first blind hole or to the first fan-out pad on the surface of the first blind hole.
  • the second fan-out pad is formed by electroplating on one side of the sub-board, so that the second fan-out pad is connected to the first blind hole or the first fan-out pad on the surface of the first blind hole and conducts on the second sub-board.
  • the third sub-board is covered, and a third blind hole is drilled on the third sub-board. The bottom of the third blind hole is connected to the second blind hole or the second fan-out pad on the surface of the second blind hole.
  • the hole is electroplated on the side opposite to the second sub-board to form a third fan-out pad, so that the third fan-out pad is connected and conducted with the second blind hole or the second fan-out pad on the surface of the second blind hole,
  • a multi-layer sub-board may be provided on the third sub-board, drilled, and copper-plated to form a conducting body, which is not limited here.
  • the board body 11 of the adapter board is formed by laminating multiple layers of sub-boards, wherein a PP layer is further included between the sub-boards, which is not limited here.
  • the first sub-board, the second sub-board and the third sub-board may be PCB boards, which are not limited here.
  • blind holes and through holes are different. Through holes are drilled through the entire board to conduct the opposite sides of the board, while blind holes are drilled on the multi-layer sub-board of the board. The hole is used to conduct the two-layer board connected with the blind hole.
  • the first blind hole, the second blind hole and the third blind hole are made by laser drilling blind holes.
  • the first layer board, the second layer board and the third layer board include a circuit pattern board, and the signal between the circuit board and the second component can pass through the first layer board and the second layer board in the adapter board.
  • the circuit pattern of the board and the third layer board transmits the signal to different circuit layers.
  • the signal between the circuit board and the second component can be shunted or converted to different circuit layers for transmission through the first component, wherein the first component includes a capacitive component, an inductive component, and a resistive component, etc. .
  • Step S54 setting a first connecting portion and a second connecting portion on opposite sides of the board, the first connecting portion is connected to the first conducting body, and the second connecting portion is connected to the second conducting body.
  • first connecting part and the second connecting part are also used for connecting the circuit board and the second component.
  • the method includes: setting a fan-out pad on the other side of the sub-board facing away from the board body, so as to obtain the first connection part and the second connection part. In another embodiment, it includes: setting a fan-out pad on the other side of the sub-board facing away from the board body, and setting a first connection part and a second connection part on the side of the fan-out pad facing away from the sub-board.
  • first connecting portion connects at least part of the blind hole
  • second connecting portion connects at least part of the blind hole in another sub-board.
  • the circuit board includes a PCB mother board, and the second component includes a BGA board.
  • the first connection part and the second connection part include connection pads.
  • the first element further includes a first pin and a second pin, wherein the first pin is used to communicate with the first conducting body, and the second pin is used to communicate with the second conducting body connected.
  • the beneficial effect of this embodiment is: the first element is buried in the adapter plate, and the first element is connected to the first connecting part through the first conducting body, and connected to the second connecting part through the second conducting body, In this way, the conduction between the first connection part and the second connection part on the adapter board is realized, which not only saves the surface mounting area of the adapter board, but also enables the extra mounting area to be used for mounting more and larger BGA integrated chip; and the easy-to-wear components are integrated inside the adapter board, which improves reliability and reduces component failure caused by secondary welding of the original structure.
  • the double-sided interconnection of the adapter board is realized by laser drilling blind holes, which reduces the DC resistance of the conductive network compared with the connection method of integrating components on the surface of the adapter board through soldering.

Abstract

本申请提供一种转接板及其制作方法、电路板组件，转接板包括：板体；第一元件，埋设与所述板体中；第一连接部和第二连接部，分别设置与板体相背两侧，以及分别用于连接诶电路板和第二元件；第一导通体和第二导通体，均在板体中以板体厚度方向延伸，第一导通体一端连接诶第一元件，另一端连接第一连接诶部，第二导通体一端连接第一元件，另一端连接第二连接部。通过上述方式，能够有效提高转接板的表面利用率。

Description

一种转接板及其制作方法、电路板组件 【技术领域】
本发明涉及电路板技术领域，特别是涉及一种转接板及其制作方法、电路板组件。
【背景技术】
转接板是用于电性连接上下两层电路板，或是连接电路板与电子元件。随着技术的发展，电子器件变得微型化并且越来越轻以满足用户的需求。
现有技术中，为了实现转接板的多功能性，会将多个元件通过锡膏焊接的方式安装在转接板表面，再在转接板表面使用BGA(球栅阵列封装)技术对转接板进行封装。但是这种通过锡膏将元件安装在转接板表面的方式，不仅占用转接板表面的贴装面积，而且还增加了转接板的厚度。
【发明内容】
本申请提出一种转接板及其制作方法、电路板组件，能够有效提高转接板的表面利用率。
为解决上述技术问题，本申请提供了一种转接板，包括：板体；第一元件，埋设于板体中；第一连接部和第二连接部，分别设置于板体相背两侧，以及分别用于连接电路板和第二元件；第一导通体和第二导通体，均在板体中以板体厚度方向延伸，第一导通体一端连接第一元件，另一端连接第一连接部，第二导通体一端连接第一元件，另一端连接第二连接部。
其中，转接板内部开设有容置槽，第一元件置于容置槽内；第一导通体和第二导通体为叠层盲孔。
其中，第一元件的数量至少为一。
其中，转接板包括至少两个层叠的子板，容置槽和盲孔的至少部分位于其中一个子板，盲孔的至少部分对应第一元件区域设置，且暴露在其中一个子板一侧，其中一个子板一侧设有扇出焊盘，盲孔的至少部分分别连接扇出焊盘和第一元件，扇出焊盘用于与位于另一子板的盲孔剩余部分连接，或与第二元件依次的第一焊盘/电路板一侧的第二焊盘连接。
其中，第一元件包括被动元件，第二元件包括球栅阵列封装板，电路板包括PCB母板。
其中，转接板还包括：第三连接部和第四连接部，分别设置于板体相背两 侧，以及分别用于连接电路板和第三元件；第三导通体，第三导通体贯穿转接板，一端连接第三连接部，另一端连接第四连接部。
为了解决上述技术问题，本申请还提供一种电路板组件，电路板组件包括：顺序层叠的电路板、转接板和第二元件；转接板是如上述任一实施方式的转接板。
为了解决上述技术问题，本申请还提供一种转接板的制作方法，包括：提供一种板体；将第一元件埋设于板体中；在板体相背两侧设置第一连接部和第二连接部，第一连接部和第二连接部用于连接电路板和第二元件；在板体中以板体厚度方向延伸设置第一导通体和第二导通体，以使第一导通体一端连接第一元件，另一端连接第一连接部，第二导通体一端连接第一元件，另一端连接第二连接部。
其中，将第一元件埋设于板体中的步骤包括：在板体上开设容置槽，将第一元件置于容置槽内；在板体的容置槽开口一侧层压一介质层；在板体中以板体厚度延伸方向设置第一导通体和第二导通体包括：在转接板相背两侧对应第一元件位置形成第一叠层导电盲孔和第二叠层导电盲孔，以分别得到第一导通体和第二导通体。
其中，将第一元件埋设与板体中的步骤包括：在本体上开设容置槽，将第一元件置于容置槽内；在板体的相背两侧分别盖设至少一层子板；在板体中以板体厚度延伸方向设置第一导通体和第二导通体包括：在转接板相背两侧对应第一元件位置形成第一叠层导电盲孔和第二叠层导电盲孔；在子板的另一侧设置扇出焊盘，以使第一叠层导电盲孔、第二叠层导电盲孔的各自两端分别连接扇出焊盘和第一元件，进而以分别得到第一导通体和第二导通体；其中，扇出焊盘用于与转接板的另一层子板连接，或与转接板之外的第二元件一侧的第一焊盘，或与电路板一侧的第二焊盘连接。
本申请的有益效果是：将第一元件埋设与转接板中，并使第一元件通过第一导通体与第一连接部连接，通过第二导通体与第二连接部连接，从而实现转接板上的第一连接部和第二连接部的导通，不仅节约了转接板的表面贴装面积，使多出来的贴装面积可以用于贴装更多、更大的BGA集成芯片；而且将易损耗元件集成在转接板内部，提高了可靠性，减少了原有结构二次焊接导致的元件失效。
此外，通过激光钻盲孔实现转接板的双面互连，相比于通过焊锡将元件集成在转接板表面的连接方式，降低了导电网络的直流电阻。
【附图说明】
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请转接板一实施方式的结构示意图；
图2为图1中叠层盲孔一实施方式的结构示意图；
图3为图1中导通体一实施方式的结构示意图；
图4为本申请电路板组件一实施方式的结构示意图；
图5为本申请转接板制作方法一实施方式的流程示意图。
【具体实施方式】
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性的劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
需要说明，若本发明实施例中有涉及方向性指示(诸如上、下、左、右、前、后……)，则该方向性指示仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
在本文中提及“实施例”意味着，结合实施例描述的特定特征、结构或特性可以包含在本申请的至少一个实施例中。在说明书中的每一个位置出现该短语并不一定均是指相同的实施例，也不是与其它实施例互斥的独立的或备选的实施例。本领域技术人员显式地和隐式地理解的是，本文所描述的实施例可以与其它实施例相结合。
本申请提供一种转接板，请参阅图1，图1为本申请转接板一实施方式的结构示意图。
如图1所示，转接板包括：板体11；第一元件12，该第一元件12埋设于板体11中；第一连接部131和第二连接部132，该第一连接部131和第二连接部132分别设置于板体11相背两侧，该第一连接部131和第二连接部132用于连接电路板和第二元件；第一导通体141和第二导通体142，其中，第一导通体141和第二导通体142均在板体11中以板体11厚度方向延伸，第一导通体141一端连接第一元件12，另一端连接第一连接部131，第二导通体142一端连接 第一元件12，另一端连接第二连接部132。
具体地，将第一元件12埋设于板体11中的步骤包括：在转接板内开设有容置槽，将第一元件12置于容置槽内，在容置槽的相背两侧设置第一导通体141和第二导通体142。
其中，第一导通体141和第二导通体142均为单层或叠层导电盲孔，由单层或多层导电盲孔堆叠而成。
具体地，转接板包括至少两个层叠的子板，比如包括第一子板21和第二子板22，具体请参阅图2，图2为图1中叠层盲孔一实施方式的结构示意图，如图2所示，容置槽211和盲孔23的至少部分位于其中一个子板，在本实施例中，容置槽211和盲孔23的一部分位于第一子板21。盲孔23的该一部分对应容置槽211区域设置，且暴露在第一子板21一侧。同时，第一子板21的该侧设有扇出焊盘，盲孔23的该一部分分别连接第一元件12和第一子板的扇出焊盘。第二子板22远离第一子板21的一侧也设有扇出焊盘，盲孔23的剩余部分位于第二子板22中，且分别连接第二子板22的扇出焊盘和第一子板21的扇出焊盘。其中，图中标号24是指扇出焊盘。
第二子板22的扇出焊盘与其他子板的扇出焊盘连接，或与第二元件一侧的第一焊盘或所述电路板一侧的第二焊盘连接。在本实施例中，第二子板22的扇出焊盘可以是第一连接部131或第二连接部132，也可以在扇出焊盘外表面加工制成第一连接部131和/或第二连接部132。
在另一实施方式中，转接板包括三个顺序层叠的子板，分别为第一子板111、第二子板112以及第三子板113。请进一步参阅图3，图3为图1中导通体一实施方式的结构示意图，如图3所示，容置槽和盲孔的至少部分位于第一子板111，盲孔包括第一盲孔1121、第二盲孔1122、第三盲孔1123，分别位于第一子板111、第二子板112以及第三子板113中。第一盲孔1121的至少部分对应第一元件12设置，且暴露在第一子板111一侧，第一子板111一侧设有第一扇出焊盘1221，第一盲孔1121分别连接第一扇出焊盘1221和第一元件12；第一扇出焊盘1221用于与位于第二子板112的第二盲孔1122连接，第二盲孔1122的至少部分对应第一扇出焊盘1221设置，且暴露在第二子板112朝向所述第三子板113一侧，第二子板112相背于第一子板111一侧设有第二扇出焊盘1222，第二盲孔1122分别连接第二扇出焊盘1222和第一扇出焊盘1221，第二扇出焊盘1222用于与位于第三子板113的第三盲孔1123连接，第三盲孔1123的至少部分对应第二扇出焊盘1222设置，且暴露在第三子板113背向第二子板112一侧，第三子板113相背于第二子板112一侧设有第三扇出焊盘1223，第三盲孔1123分别连接第二 扇出焊盘1222和第三扇出焊盘1223。第三扇出焊盘1223用于与第二元件一侧的第一焊盘/电路板一侧的第二焊盘连接。在其他实施例中，还可以依次在第三子板113表面依次设置第四子板以及第四盲孔以及第四扇出焊盘，在此不作对子板层数进行限定。需要说明的是，上述实施例中，当只在第四子板114相背于第三子板113的一侧设置扇出焊盘，则第二盲孔1122的至少部分与第一盲孔1121连接，第三盲孔1123至少部分与第一盲孔1122连接，也可在每一子板一侧设置扇出焊盘，则第二盲孔1122的至少部分与第一扇出焊盘1221连接，第三盲孔1123的至少部分与第二扇出焊盘1222连接，在此不作限定。扇出焊盘可用于将信号转换成多路信号流出或将一路信号传输至另一路流出。在本实施例中，第三子板113的扇出焊盘可以是第一连接部131或第二连接部132，也可以在第三子板113的扇出焊盘外表面加工制成第一连接部131和/或第二连接部132。在本实施例中，第一盲孔1121、第二盲孔1122、第三盲孔1123组成第一导通体141或第二导通体142，第一盲孔1121、第二盲孔1122、第三盲孔1123包括梯形或矩形，在此不作限定。
由于盲孔和通孔的制作工艺不同，通孔是对整块板体钻通孔以导通板体相背两侧面，而盲孔是对板体的多层板进行钻孔以导通与盲孔相连的两层板面。上述实施例中，第一子板111、第二子板112以及第三子板113通过层压方式以使彼此之间相连，其中，第一子板111和第二子板112、第二子板112和第三子板113之间包括第一扇出焊盘1221和第二扇出焊盘1222。在另一实施方式中，第一子板111和第二子板112、第二子板112和第三子板113之间还包括PP板，通过层压PP板连接第一子板111和第二子板112以及连接第二子板112和第三子板113。
在上述实施例中是通过多层盲孔堆叠形成导通体以实现第一连接部131/第二连接部132与第一元件12的导通。具体包括：通过激光钻盲孔工艺使子板之间的扇出焊盘连接并导通。
上述实施例中，第三扇出焊盘1223包括第一连接部131和第二连接部132。
在本实施例中，第一元件12还包括第一引脚和第二引脚，第一引脚通过第一导通体141与第一连接部131连接，第二引脚通过第二导通体142与第二连接部132连接。
其中，第一元件12的数量至少为一。在一优先实施方式中，可以将多个第一元件12埋入转接板的板体11中，在此不作限定。
可选的，第一元件12可以是电容元件、电感元件或电阻元件等被动元件，第二元件可以是BGA板，电路板为PCB母板。
在本实施例中，转接板还包括第三连接部和第四连接部，第三连接部和第四连接部分别设置于板体相背两侧，以及分别用于连接电路板和第三元件；其中，第三元件可以是BGA板或其他主动、被动元件，在此不作限定。转接板还包括第三导通体，第三导通体贯穿转接板，一端连接第三连接部，另一端连接第四连接部。其中，第三连接部和第四连接部可与第一连接部131和第二连接部132相同，也可以不同，在此不作限定。第一连接部131、第二连接部132、第三连接部以及第四连接部均可为连接焊盘。
本实施例的有益效果是：将第一元件通过第一导通体与第一连接部连接，通过第二导通体与第二连接部连接，以实现在板体内的第一元件与转接板相背两侧的第一连接部和第二连接部分别连接，从而实现转接板的导通，且将第一元件安装在转接板板体内，节约了转接板的表面贴装面积，使多出来的贴装面积可以用于贴装更多、更大的BGA集成芯片，将易损耗元件集成在转接板内部，提高了可靠性，减少了原有结构二次焊接导致的元件失效。此外，通过激光钻盲孔实现转接板的双面互连，相比于通过焊锡将元件集成在转接板表面的连接方式，降低了导电网络的直流电阻。
本申请还提供一种电路板组件，具体请参阅图4，图4为本申请电路板组件一实施方式的结构示意图，如图4所示，电路板组件包括：顺序层叠的电路板41、转接板42和第二元件43，其中，转接板42包括上述任一实施例中的转接板。具体地，转接板42包括板体421，第一元件422，第一元件422埋设于板体421中，第一连接部4231和第二连接部4232，第一连接部4231和第二连接部4232分别设置于板体相背两侧，以及分别连接电路板41和第二元件43，第一导通体4241和第二导通体4242，第一导通体4241和第二导通体4242均在板体421中以板体421厚度方向延伸，第一导通体4241一端连接第一元件422，另一端连接第一连接部4231，第二导通体4242一端连接第一元件422，另一端连接第二连接部4232。
其中，转接板42的板体421上开设有容置槽，第一元件422置于容置槽内。第一导通体4241和第二导通体4242为单层或叠层导电盲孔，由单层或多层导电盲孔堆叠而成。在一具体实施方式中，转接板42包括至少两个层叠的子板，容置槽和盲孔的一部分位于其中一个子板，其中，盲孔的该一部分对应第一元件422区域设置，且暴露在其中一个子板一侧，同时，其中一个子板一侧设有扇出焊盘，盲孔的该一部分分别连接扇出焊盘和第一元件422，另一子板远离第一子板的一侧也设有扇出焊盘，盲孔的剩余部分位于另一子板中，且分别连接另一子板的扇出焊盘和其中一个子板的扇出焊盘。另一子板的扇出焊盘与其他 子板的扇出焊盘连接，或与第二元件43的第一焊盘431/电路板41一侧的第二焊盘411连接。外层扇出焊盘包括第一连接部4231和第二连接部4232。
在一实施方式中，在一实施方式中，第一导通体4241和第二导通体4242包括多层导电盲孔堆叠而成，比如转接板42包括三个顺序层叠的子板，分别为第一子板、第二子板以及第三子板，第一导通体4241和第二导通体4242包括第一子板、第二子板以及第三子板中激光钻通的盲孔。容置槽和盲孔的至少部分位于第一子板，盲孔的至少部分分别位于第一子板、第二子板以及第三子板中。盲孔的至少部分对应第一元件422设置，且暴露在第一子板一侧，第一子板一侧设有第一扇出焊盘，盲孔连接第一扇出焊盘和第一元件422；第一扇出焊盘用于与位于第二子板的部分盲孔连接，盲孔的至少部分对应第一扇出焊盘设置，且暴露在第二子板朝向所述第三子板一侧，第二子板相背于第一子板一侧设有第二扇出焊盘，盲孔分别连接第二扇出焊盘和第一扇出焊盘，第二扇出焊盘用于与位于第三子板的剩余部分盲孔连接，盲孔的至少部分对应第二扇出焊盘设置，且暴露在第三子板背向第二子板一侧，第三子板相背于第二子板一侧设有第三扇出焊盘，盲孔分别连接第二扇出焊盘和第三扇出焊盘。第三扇出焊盘还用于与第二元件一侧的第一焊盘/电路板一侧的第二焊盘连接。在其他实施例中，还可以依次在第三子板表面依次设置第四子板以及第四盲孔以及第四扇出焊盘，在此不作对子板层数进行限定。扇出焊盘可用于将信号转换成多路信号流出或将一路信号传输至另一路流出。在本实施例中，转接板42最外层的扇出焊盘可以是第一连接部131或第二连接部132，也可以在最外层扇出焊盘外表面加工制成第一连接部131和/或第二连接部132。在本实施例中，盲孔包括梯形或矩形，在此不作限定。第一导通体4241和第二导通体4242由盲孔堆叠而成。
可选的，第二元件43包括相邻连接或间隔设置的多个BGA板和/或被动元件等，在此不作限定。第一元件422是被动元件，包括电感元件、电容元件以及电阻元件等，电路板41包括PCB母板。
其中，第一焊盘431和第二焊盘411包括分别设置于第二元件43和电路板41上的多个焊盘，且多个焊盘彼此之间间隔设置。
在一实施方式中，第一元件422包括第一引脚和第二引脚，分别与第一导通体4241和第二导通体4242连接。
转接板还包括第三连接部4251和第四连接部4252，第三连接部4251和第四连接部4252分别设置于板体11相背两侧，以及分别用于连接电路板41和第三元件44，其中第三元件44包括BGA板或被动元件等。转接板42包括第三导 通体426，第三导通体426贯穿转接板42，一端连接第三连接部4251，另一端连接第四连接部4252。其中，第三连接部4251和第四连接部4252可与第一连接部4231和第二连接部4232相同，也可以不同，在此不作限定。第一连接部4231、第二连接部4232、第三连接部4251以及第四连接部4252均可为连接焊盘。
本实施例的有益效果是：通过将第一元件埋设于转接板板体内，并在第一元件两面设置第一导通体和第二导通体，以使转接板的第一连接部和第二连接部能通过导通体导通。同时，通过顺序层叠电路板、转接板和第二元件，使第二元件的第一焊盘与转接板上的第一连接部相连，电路板一侧的第二焊盘与转接板一侧的第二连接部相连，从而实现了电路板通过转接板与第二元件之间的电路导通。另一方面，通过将第一元件安装在转接板内，节约了转接板的表面贴装面积，使多出来的贴装面积可以用于贴装更多、更大的BGA集成芯片，将易损耗元件集成在转接板内部，提高了可靠性，减少了原有结构二次焊接导致的元件失效。此外，通过激光钻盲孔实现转接板的双面互连，相比于通过焊锡将元件集成在转接板表面的连接方式，降低了导电网络的直流电阻。
本申请还提供一种转接板的制作方法，请参阅图5，图5为本申请转接板制作方法一实施方式的流程示意图。如图5所示，包括：
步骤S51：提供一种板体。
具体地，该板体包括单层或多层芯板。
步骤S52：将第一元件埋设于板体中。
其中，第一元件包括被动元件，如电容元件、电感元件、电阻元件等。具体包括：在板体中开设两开口容置槽，将第一元件置于容置槽内，在容置槽两开口一侧各层压一介质层，以将第一元件埋设于板体中。
在另一实施方式中，包括：在板体中开设容置槽，将第一元件置于容置槽内，在容置槽相背两侧分别盖设至少一层子板。其中，子板与介质层可以相同也可以不同，在此不作限定，子板的层数同样不作限定。
步骤S53：在板体中向板体厚度延伸方向设置第一导通体和第二导通体，以使第一导通体和第二导通体一端分别连接第一元件。
具体包括：在容置槽的相背两侧分别盖设至少一层子板；在各子板内形成盲孔的至少部分；其中，盲孔对应第一元件设置。
在转接板板体相背两侧对应第一元件位置形成第一叠层导电盲孔和第二叠层导电盲孔；在各子板与第一元件相背一侧设置扇出焊盘，以使第一叠层导电盲孔、第二叠层导电盲孔的各自两端分别连接扇出焊盘和第一元件，进而以分 别得到第一导通体和第二导通体；其中，扇出焊盘用于与转接板的另一层子板连接，或与转接板之外的第二元件一侧的第一焊盘，或与电路板一侧的第二焊盘连接。
在一实施方式中，第一导通体和第二导通体包括多层导电盲孔堆叠而成，其中，第一导通体和第二导通体的制作方法包括：在容置槽的上下表面分别盖设第一子板,在第一子板上钻设第一盲孔，该第一盲孔的底部与第一元件的引脚相连，在该第一盲孔背于第一子板一侧镀铜，形成第一扇出焊盘，使第一扇出焊盘通过第一盲孔与第一元件的引脚连接；在第一子板上盖设第二子板，在第二子板上钻设第二盲孔，该第二盲孔的底部与第一盲孔的表面或与第一盲孔表面的第一扇出焊盘相连，在第二盲孔相背于第一子板一侧电镀形成第二扇出焊盘，使第二扇出焊盘与第一盲孔或第一盲孔表面的第一扇出焊盘相连并导通，在第二子板上盖设第三子板，在第三子板上钻设第三盲孔，第三盲孔的底部与第二盲孔或第二盲孔表面的第二扇出焊盘相连，在第三盲孔相背于第二子板一侧电镀形成第三扇出焊盘，以使第三扇出焊盘与第二盲孔或第二盲孔表面的第二扇出焊盘相连并导通，以此类推，可在第三子板上曾设多层子板并钻孔、镀铜处理，以形成导通体，在此不作限制。在本实施例中，转接板的板体11包括多层子板压合而成，其中，子板与子板之间还包括PP层，在此不作限定。第一子板、第二子板以及第三子板可为PCB板，在此不作限定。需要说明的是，盲孔和通孔的制作工艺不同，通孔是对整块板体钻通孔以导通板体相背两侧面，而盲孔是对板体的多层子板进行钻孔以导通与盲孔相连的两层板面。本实施例中，第一盲孔、第二盲孔以及第三盲孔是由激光钻盲孔制成。
在一实施例方式中，第一层板、第二层板以及第三层板包括线路图形板，电路板与第二元件之间的信号可通过转接板中第一层板、第二层板以及第三层板的线路图形将信号传输至不同线路层。在另一实施方式中，电路板与第二元件之间的信号可通过第一元件将信号分流或转换至不同的线路层进行传输，其中，第一元件包括电容元件、电感元件以及电阻元件等。
步骤S54：在板体相背两侧设置第一连接部和第二连接部，第一连接部连接第一导通体，第二连接部连接第二导通体。
其中，第一连接部、第二连接部还用于连接电路板和第二元件。
在一实施方式中，包括：在子板的背对板体的另一侧设置扇出焊盘，以得到第一连接部、第二连接部。在另一实施方式中，包括：在子板的背对板体的另一侧设置扇出焊盘，在扇出焊盘背于子板的一侧设置第一连接部、第二连接部。
其中，第一连接部连接盲孔的至少部分，第二连接部连接另一子板内盲孔的至少部分。
其中，电路板包括PCB母板，第二元件包括BGA板。第一连接部和第二连接部包括连接焊盘。
在一实施方式中，第一元件还包括第一引脚和第二引脚，其中，第一引脚用于与第一导通体相连通，第二引脚用于与第二导通体相连通。
本实施例的有益效果是：将第一元件埋设与转接板中，并使第一元件通过第一导通体与第一连接部连接，通过第二导通体与第二连接部连接，从而实现转接板上的第一连接部和第二连接部的导通，不仅节约了转接板的表面贴装面积，使多出来的贴装面积可以用于贴装更多、更大的BGA集成芯片；而且将易损耗元件集成在转接板内部，提高了可靠性，减少了原有结构二次焊接导致的元件失效。另一方面，通过激光钻盲孔实现转接板的双面互连，相比于通过焊锡将元件集成在转接板表面的连接方式，降低了导电网络的直流电阻。
以上所述仅为本申请的实施方式，并非因此限制本申请的专利保护范围，凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (10)

  1. 一种转接板，其特征在于，所述转接板包括：
    板体；
    第一元件，埋设于所述板体中；
    第一连接部和第二连接部，分别设置于所述板体相背两侧，以及分别用于连接电路板和第二元件；
    第一导通体和第二导通体，均在所述板体中以所述板体厚度方向延伸，所述第一导通体一端连接所述第一元件，另一端连接所述第一连接部，所述第二导通体一端连接所述第一元件，另一端连接所述第二连接部。
  2. 根据权利要求1所述的转接板，其特征在于，
    所述板体上开设有容置槽，所述第一元件置于所述容置槽内；
    所述第一导通体和第二导通体为叠层导电盲孔。
  3. 根据权利要求2所述的转接板，其特征在于，
    所述第一元件的数量至少为一。
  4. 根据权利要求2所述的转接板，其特征在于，
    所述转接板包括至少两个层叠的子板，所述容置槽和所述盲孔的至少部分位于其中一个所述子板，所述盲孔的至少部分对应所述第一元件区域设置，且暴露在所述其中一个所述子板一侧，所述其中一个所述子板一侧设有扇出焊盘，所述盲孔的至少部分分别连接所述扇出焊盘和所述第一元件，所述扇出焊盘用于与位于另一所述子板的所述盲孔剩余部分连接，或与所述第二元件依次的第一焊盘/所述电路板一侧的第二焊盘连接。
  5. 根据权利要求1所述的转接板，其特征在于，所述第一元件包括被动元件，所述第二元件包括球栅阵列封装板，所述电路板包括PCB母板。
  6. 根据权利要求1所述的转接板，其特征在于，所述转接板还包括：
    第三连接部和第四连接部，分别设置于所述板体相背两侧，以及分别用于连接所述电路板和第三元件；
    第三导通体，所述第三导通体贯穿所述转接板，一端连接所述第三连接部，另一端连接所述第四连接部。
  7. 一种电路板组件，其特征在于，所述电路板组件包括：
    顺序层叠的电路板、转接板和第二元件；
    所述转接板是如权利要求1-5任一项所述的转接板。
  8. 一种转接板的制作方法，其特征在于，所述制作方法包括：
    提供一种板体；
    将第一元件埋设于所述板体中；
    在所述板体中以所述板体厚度延伸方向设置第一导通体和第二导通体，以使所述第一导通体一端和所述第二导通体的一端分别连接所述第一元件的两端；
    在所述板体相背两侧设置第一连接部和第二连接部，所述第一连接部的一端连接所述第一导通体，所述第二连接部的一端连接所述第二导通体；其中，所述第一连接部和所述第二连接部的另一端分别用于连接电路板和第二元件。
  9. 根据权利要求8所述的转接板的制作方法，其特征在于，所述将第一元件埋设于所述板体中的步骤包括：
    在所述板体上开设容置槽，将所述第一元件置于所述容置槽内；
    所述将第一元件埋设与所述板体中后包括：
    在所述板体的所述容置槽两开口一侧各层压一介质层；
    所述在所述板体中以所述板体厚度延伸方向设置第一导通体和第二导通体包括：
    在两所述介质层对应所述第一元件位置形成第一叠层导电盲孔和第二叠层导电盲孔，以分别得到所述第一导通体和所述第二导通体。
  10. 根据权利要求8所述的转接板的制作方法，其特征在于，所述将第一元件埋设于所述板体中的步骤包括：
    在所述板体上开设容置槽，将所述第一元件置于所述容置槽内；
    在所述板体的相背两侧分别盖设至少一层子板；
    所述在所述板体中以所述板体厚度延伸方向设置第一导通体和第二导通体包括：
    在所述转接板相背两侧对应所述第一元件位置形成第一叠层导电盲孔和第二叠层导电盲孔；
    在所述子板的另一侧设置扇出焊盘，以使所述第一叠层导电盲孔、所述第二叠层导电盲孔的各自两端分别连接所述扇出焊盘和所述第一元件，进而以分别得到所述第一导通体和所述第二导通体；
    其中，所述扇出焊盘用于与所述转接板的另一层子板连接，或与所述转接板之外的第二元件一侧的第一焊盘，或与所述电路板一侧的第二焊盘连接。
PCT/CN2021/103808 2021-06-30 2021-06-30 一种转接板及其制作方法、电路板组件 WO2023272641A1 (zh)

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