JP2013074178A - 部品内蔵配線基板の製造方法 - Google Patents
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- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
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- H05K1/0213—Electrical arrangements not otherwise provided for
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- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
- H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
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- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
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- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
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- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
- Y10T29/49135—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting and shaping, e.g., cutting or bending, etc.
Abstract
【解決手段】コア基板準備工程ではコア基板11を準備し、収容穴部形成工程では収容穴部90をコア基板11に形成し、貫通穴部形成工程では貫通穴部14を形成する。めっき層形成工程では、収容穴部90の内壁面91に対してめっき層92を形成するとともに、貫通穴部14の内壁面に対して、空洞部を有するスルーホール導体となるめっき層71を形成する。収容工程では、部品101を収容穴部90に収容する。樹脂埋め工程では、収容穴部90の内壁面91と部品側面106との隙間、及び、空洞部に対して、樹脂充填材93を充填して埋める。
【選択図】図8
Description
以下、本発明の部品内蔵配線基板を具体化した第1実施形態を図面に基づき詳細に説明する。
以下、本発明を具体化した第2実施形態を図面に基づき説明する。ここでは、第1実施形態と相違する部分を中心に説明する。
11…コア基板
12,312…コア主面
13…コア裏面
14,314…貫通穴部
15,315…空洞部
16,316…スルーホール導体
31…配線積層部としての主面側ビルドアップ層
33,35…樹脂層間絶縁層
41…導体層
71,72,73,92…めっき層
90,390,490…収容穴部
91…収容穴部の内壁面
93,393…樹脂充填材
94…樹脂充填材の表面
95,395…絶縁層
101,304…部品としてのセラミックコンデンサ
102,303…部品主面としてのコンデンサ主面
103…部品裏面としてのコンデンサ裏面
106…部品側面としてのコンデンサ側面
301…カバー部材
302…穴埋め材
401…部品としてのチップコンデンサ
S1…隙間
Claims (8)
- コア主面及びコア裏面を有するコア基板を準備するコア基板準備工程と、
少なくとも前記コア主面側にて開口する収容穴部を前記コア基板に形成する収容穴部形成工程と、
前記コア基板においてその厚さ方向に貫通する貫通穴部を形成する貫通穴部形成工程と、
前記収容穴部の内壁面に対してめっき層を形成するとともに、前記貫通穴部の内壁面に対して、空洞部を有するスルーホール導体となるめっき層を形成するめっき層形成工程と、
部品主面、部品裏面及び部品側面を有する部品を、前記コア主面と前記部品主面とを同じ側に向けた状態で前記収容穴部に収容する収容工程と、
前記収容穴部の内壁面と前記部品側面との隙間、及び、前記空洞部に対して、樹脂充填材を充填して埋める樹脂埋め工程と、
前記コア主面及び前記部品主面の上において、樹脂層間絶縁層及び導体層を交互に積層して配線積層部を形成する配線積層部形成工程と
を含むことを特徴とする部品内蔵配線基板の製造方法。 - 前記樹脂埋め工程は、
前記コア主面及び前記部品主面の上に前記樹脂充填材の形成材料であるシート状の絶縁層を貼付する絶縁層貼付工程と、
前記絶縁層貼付工程後、加熱加圧することにより、前記絶縁層の一部を前記収容穴部の内壁面と前記部品側面との隙間に落とし込んで前記部品を固定するとともに、前記絶縁層の一部を前記空洞部に落とし込んで埋める充填工程と
を含むことを特徴とする請求項1に記載の部品内蔵配線基板の製造方法。 - 前記樹脂埋め工程は、
前記収容穴部の前記コア主面側開口、または、前記貫通穴部の前記コア主面側開口をカバー部材で塞ぐ閉塞工程と、
前記収容穴部及び前記貫通穴部のうち前記コア主面側開口が前記カバー部材に塞がれていない側の穴部に、前記樹脂充填材の形成材料である穴埋め材を充填する第1充填工程と、
前記第1充填工程後、前記コア主面側から前記カバー部材を除去する除去工程と、
前記除去工程後、前記コア主面の上に前記樹脂充填材の形成材料であるシート状の絶縁層を貼付する絶縁層貼付工程と、
前記絶縁層貼付工程後、加熱加圧することにより、前記収容穴部及び前記貫通穴部のうち前記穴埋め材が充填されていない側の穴部に、前記絶縁層の一部を落とし込む第2充填工程と
を含むことを特徴とする請求項1に記載の部品内蔵配線基板の製造方法。 - 前記部品内蔵配線基板は、配線基板となるべき基板形成領域が平面方向に沿って複数配置された多数個取り用配線基板であり、
前記閉塞工程では、前記収容穴部の前記コア主面側開口をカバー部材で塞ぎ、
前記第1充填工程では、前記貫通穴部に前記穴埋め材を充填し、
前記第2充填工程では、前記収容穴部に前記絶縁層の一部を落とし込む
ことを特徴とする請求項3に記載の部品内蔵配線基板の製造方法。 - 前記めっき層形成工程後かつ前記樹脂埋め工程前に、前記収容穴部の内壁面に形成された前記めっき層の表面、及び、前記貫通穴部の内壁面に形成された前記めっき層の表面のうち、少なくとも前記収容穴部の内壁面に形成された前記めっき層の表面を粗化する表面粗化工程を行うことを特徴とする請求項1乃至4のいずれか1項に記載の部品内蔵配線基板の製造方法。
- 前記表面粗化工程は、前記めっき層形成工程後かつ前記収容工程前に実行されることを特徴とする請求項5に記載の部品内蔵配線基板の製造方法。
- 前記表面粗化工程は、前記収容工程後かつ前記樹脂埋め工程前に実行されることを特徴とする請求項5に記載の部品内蔵配線基板の製造方法。
- 前記めっき層は、前記収容穴部の内壁面、前記貫通穴部の内壁面、前記コア主面及び前記コア裏面を含む前記コア基板の表面全体に対してめっきを行うことにより形成された全面めっき層であり、
前記樹脂埋め工程後かつ前記配線積層部形成工程前に、前記樹脂充填材を薄くすることにより、前記樹脂充填材の表面を前記コア主面上に形成された前記めっき層の表面と同じ高さに合わせる高さ合わせ工程を行う
ことを特徴とする請求項1乃至7のいずれか1項に記載の部品内蔵配線基板の製造方法。
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JP2011212967A JP2013074178A (ja) | 2011-09-28 | 2011-09-28 | 部品内蔵配線基板の製造方法 |
US13/626,477 US9167702B2 (en) | 2011-09-28 | 2012-09-25 | Method of manufacturing wiring substrate having built-in component |
TW101135458A TWI522025B (zh) | 2011-09-28 | 2012-09-27 | 零件內建配線基板之製造方法 |
KR20120109107A KR101478876B1 (ko) | 2011-09-28 | 2012-09-28 | 부품 내장 배선기판의 제조방법 |
US14/637,655 US20150181722A1 (en) | 2011-09-28 | 2015-03-04 | Method of manufacturing wiring substrate having built-in component |
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JP2011212967A JP2013074178A (ja) | 2011-09-28 | 2011-09-28 | 部品内蔵配線基板の製造方法 |
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JP2020150096A (ja) * | 2019-03-13 | 2020-09-17 | イビデン株式会社 | プリント配線板の製造方法 |
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WO2017119248A1 (ja) * | 2016-01-07 | 2017-07-13 | 株式会社村田製作所 | 多層基板、電子機器及び多層基板の製造方法 |
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Also Published As
Publication number | Publication date |
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TW201322863A (zh) | 2013-06-01 |
KR101478876B1 (ko) | 2015-01-02 |
TWI522025B (zh) | 2016-02-11 |
US9167702B2 (en) | 2015-10-20 |
US20150181722A1 (en) | 2015-06-25 |
US20130074332A1 (en) | 2013-03-28 |
KR20130034637A (ko) | 2013-04-05 |
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