SG141425A1 - Environmental system including vacuum scavange for an immersion lithography apparatus - Google Patents

Environmental system including vacuum scavange for an immersion lithography apparatus

Info

Publication number
SG141425A1
SG141425A1 SG200800250-3A SG2008002503A SG141425A1 SG 141425 A1 SG141425 A1 SG 141425A1 SG 2008002503 A SG2008002503 A SG 2008002503A SG 141425 A1 SG141425 A1 SG 141425A1
Authority
SG
Singapore
Prior art keywords
fluid
immersion
barrier
scavange
environmental system
Prior art date
Application number
SG200800250-3A
Other languages
English (en)
Inventor
Andrew J Hazelton
Michael Sogard
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of SG141425A1 publication Critical patent/SG141425A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70816—Bearings
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
SG200800250-3A 2003-04-10 2004-03-29 Environmental system including vacuum scavange for an immersion lithography apparatus SG141425A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US46211203P 2003-04-10 2003-04-10
US48447603P 2003-07-01 2003-07-01

Publications (1)

Publication Number Publication Date
SG141425A1 true SG141425A1 (en) 2008-04-28

Family

ID=33162259

Family Applications (6)

Application Number Title Priority Date Filing Date
SG2014015176A SG2014015176A (en) 2003-04-10 2004-03-29 Environmental system including vacuum scavange for an immersion lithography apparatus
SG2012050829A SG2012050829A (en) 2003-04-10 2004-03-29 Environmental system including vacuum scavange for an immersion lithography apparatus
SG10201604762UA SG10201604762UA (en) 2003-04-10 2004-03-29 Environmental system including vacuum scavange for an immersion lithography apparatus
SG2014015184A SG2014015184A (en) 2003-04-10 2004-03-29 Environmental system including vacuum scavange for an immersion lithography apparatus
SG200800250-3A SG141425A1 (en) 2003-04-10 2004-03-29 Environmental system including vacuum scavange for an immersion lithography apparatus
SG200800251-1A SG141426A1 (en) 2003-04-10 2004-03-29 Environmental system including vacuum scavange for an immersion lithography apparatus

Family Applications Before (4)

Application Number Title Priority Date Filing Date
SG2014015176A SG2014015176A (en) 2003-04-10 2004-03-29 Environmental system including vacuum scavange for an immersion lithography apparatus
SG2012050829A SG2012050829A (en) 2003-04-10 2004-03-29 Environmental system including vacuum scavange for an immersion lithography apparatus
SG10201604762UA SG10201604762UA (en) 2003-04-10 2004-03-29 Environmental system including vacuum scavange for an immersion lithography apparatus
SG2014015184A SG2014015184A (en) 2003-04-10 2004-03-29 Environmental system including vacuum scavange for an immersion lithography apparatus

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG200800251-1A SG141426A1 (en) 2003-04-10 2004-03-29 Environmental system including vacuum scavange for an immersion lithography apparatus

Country Status (8)

Country Link
US (13) US7321415B2 (es)
EP (7) EP2950148B1 (es)
JP (10) JP4775256B2 (es)
KR (13) KR101724117B1 (es)
CN (7) CN103439864B (es)
HK (8) HK1086637A1 (es)
SG (6) SG2014015176A (es)
WO (1) WO2004090634A2 (es)

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EP1611485B1 (en) 2015-06-03
US20160085159A1 (en) 2016-03-24
US9658537B2 (en) 2017-05-23
JP5949876B2 (ja) 2016-07-13
EP2667252B1 (en) 2015-05-20
US8456610B2 (en) 2013-06-04
US20120262684A1 (en) 2012-10-18
JP2018028705A (ja) 2018-02-22
KR20140054408A (ko) 2014-05-08
US7456930B2 (en) 2008-11-25
JP2010183085A (ja) 2010-08-19
KR20120061976A (ko) 2012-06-13
EP3232271A1 (en) 2017-10-18
SG141426A1 (en) 2008-04-28
KR101369016B1 (ko) 2014-02-28
CN103439864B (zh) 2016-05-11
CN105700301B (zh) 2018-05-25
KR101280628B1 (ko) 2013-07-01
CN103383527A (zh) 2013-11-06
EP2717098B1 (en) 2015-05-13
CN101061429A (zh) 2007-10-24
US20060028632A1 (en) 2006-02-09
CN103383528B (zh) 2016-05-04
US20090180096A1 (en) 2009-07-16
US20060114435A1 (en) 2006-06-01
US8836914B2 (en) 2014-09-16
KR20150092341A (ko) 2015-08-12

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