SG114532A1 - Low fabrication cost, fine pitch and high reliability solder bump - Google Patents

Low fabrication cost, fine pitch and high reliability solder bump

Info

Publication number
SG114532A1
SG114532A1 SG200201291A SG200201291A SG114532A1 SG 114532 A1 SG114532 A1 SG 114532A1 SG 200201291 A SG200201291 A SG 200201291A SG 200201291 A SG200201291 A SG 200201291A SG 114532 A1 SG114532 A1 SG 114532A1
Authority
SG
Singapore
Prior art keywords
layer
metal
solder bump
high reliability
fine pitch
Prior art date
Application number
SG200201291A
Other languages
English (en)
Inventor
Lee Jin-Yuan
Lin Mou-Shiung
Huang Ching-Cheng
Original Assignee
Megic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Megic Corp filed Critical Megic Corp
Publication of SG114532A1 publication Critical patent/SG114532A1/en

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SG200201291A 2001-03-05 2002-03-05 Low fabrication cost, fine pitch and high reliability solder bump SG114532A1 (en)

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US20020121692A1 (en) 2002-09-05
US6818545B2 (en) 2004-11-16
US7863739B2 (en) 2011-01-04
US20090261473A1 (en) 2009-10-22
US20080054459A1 (en) 2008-03-06
US8368213B2 (en) 2013-02-05
US8072070B2 (en) 2011-12-06
US7468316B2 (en) 2008-12-23
US20080258305A1 (en) 2008-10-23
US20080048320A1 (en) 2008-02-28
US20050032349A1 (en) 2005-02-10
EP1239514A3 (de) 2003-06-18
EP1239514A2 (de) 2002-09-11
US20080188071A1 (en) 2008-08-07
US20080083985A1 (en) 2008-04-10

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