FR2924302B1 - Procede de fabrication de plots de connexion electrique d'une plaque - Google Patents

Procede de fabrication de plots de connexion electrique d'une plaque

Info

Publication number
FR2924302B1
FR2924302B1 FR0759273A FR0759273A FR2924302B1 FR 2924302 B1 FR2924302 B1 FR 2924302B1 FR 0759273 A FR0759273 A FR 0759273A FR 0759273 A FR0759273 A FR 0759273A FR 2924302 B1 FR2924302 B1 FR 2924302B1
Authority
FR
France
Prior art keywords
plate
electrical connection
manufacturing plates
plates
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0759273A
Other languages
English (en)
Other versions
FR2924302A1 (fr
Inventor
Romain Coffy
Jacky Seiller
Gil Provent
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics Grenoble 2 SAS
Original Assignee
STMicroelectronics Grenoble 2 SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics Grenoble 2 SAS filed Critical STMicroelectronics Grenoble 2 SAS
Priority to FR0759273A priority Critical patent/FR2924302B1/fr
Priority to US12/262,982 priority patent/US8227332B2/en
Publication of FR2924302A1 publication Critical patent/FR2924302A1/fr
Application granted granted Critical
Publication of FR2924302B1 publication Critical patent/FR2924302B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01076—Osmium [Os]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
FR0759273A 2007-11-23 2007-11-23 Procede de fabrication de plots de connexion electrique d'une plaque Expired - Fee Related FR2924302B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR0759273A FR2924302B1 (fr) 2007-11-23 2007-11-23 Procede de fabrication de plots de connexion electrique d'une plaque
US12/262,982 US8227332B2 (en) 2007-11-23 2008-10-31 Method for fabricating electrical bonding pads on a wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0759273A FR2924302B1 (fr) 2007-11-23 2007-11-23 Procede de fabrication de plots de connexion electrique d'une plaque

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FR2924302A1 FR2924302A1 (fr) 2009-05-29
FR2924302B1 true FR2924302B1 (fr) 2010-10-22

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KR101185859B1 (ko) * 2010-10-19 2012-09-25 에스케이하이닉스 주식회사 반도체 패키지용 범프, 상기 범프를 갖는 반도체 패키지 및 적층 반도체 패키지
US10833033B2 (en) 2011-07-27 2020-11-10 Taiwan Semiconductor Manufacturing Co., Ltd. Bump structure having a side recess and semiconductor structure including the same
US9105533B2 (en) 2011-07-27 2015-08-11 Taiwan Semiconductor Manufacturing Company, Ltd. Bump structure having a single side recess
US9935038B2 (en) * 2012-04-11 2018-04-03 Taiwan Semiconductor Manufacturing Company Semiconductor device packages and methods
FR2994304A1 (fr) * 2012-08-02 2014-02-07 St Microelectronics Tours Sas Puce a montage en surface

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US3661730A (en) * 1969-09-22 1972-05-09 Kazuo Nishihara Process for the formation of a super-bright solder coating
DE2044494B2 (de) * 1970-09-08 1972-01-13 Siemens AG, 1000 Berlin u 8000 München Anschlussflaechen zum anloeten von halbleiterbausteinen in flip chip technik
GB1536772A (en) * 1977-04-06 1978-12-20 Nevin Electric Ltd Selectively solder-plated printed circuit boards
AU5316996A (en) * 1995-04-05 1996-10-23 Mcnc A solder bump structure for a microelectronic substrate
US6042953A (en) 1996-03-21 2000-03-28 Matsushita Electric Industrial Co., Ltd. Substrate on which bumps are formed and method of forming the same
EP0899787A3 (fr) * 1997-07-25 2001-05-16 Mcnc Réservoirs de soudure formés-contrôlés pour augmenter le volume de bosses de soudure et dtructures ainsi formées
US6372622B1 (en) * 1999-10-26 2002-04-16 Motorola, Inc. Fine pitch bumping with improved device standoff and bump volume
TW459362B (en) * 2000-08-01 2001-10-11 Siliconware Precision Industries Co Ltd Bump structure to improve the smoothness
US6818545B2 (en) 2001-03-05 2004-11-16 Megic Corporation Low fabrication cost, fine pitch and high reliability solder bump
TW483136B (en) 2001-03-22 2002-04-11 Apack Technologies Inc Bump process
US6555296B2 (en) 2001-04-04 2003-04-29 Siliconware Precision Industries Co., Ltd. Fine pitch wafer bumping process
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DE10132158A1 (de) * 2001-07-03 2003-01-23 Infineon Technologies Ag Verfahren zum galvanischen Erzeugen einer lateral strukturierten Metallisierung
TW536767B (en) 2002-03-01 2003-06-11 Advanced Semiconductor Eng Solder ball attaching process
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US20090134514A1 (en) 2009-05-28
FR2924302A1 (fr) 2009-05-29
US8227332B2 (en) 2012-07-24

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