RU2011110260A - Галогенуглеводородное полимерное покрытие - Google Patents
Галогенуглеводородное полимерное покрытие Download PDFInfo
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- RU2011110260A RU2011110260A RU2011110260/07A RU2011110260A RU2011110260A RU 2011110260 A RU2011110260 A RU 2011110260A RU 2011110260/07 A RU2011110260/07 A RU 2011110260/07A RU 2011110260 A RU2011110260 A RU 2011110260A RU 2011110260 A RU2011110260 A RU 2011110260A
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Abstract
1. Печатная плата, включающая: ! подложку, включающую изоляционный материал; ! множество электропроводных печатных дорожек, присоединенных по меньшей мере к одной поверхности подложки; ! многослойное покрытие, осажденное по меньшей мере на одной поверхности подложки, причем многослойное покрытие покрывает по меньшей мере часть множества электропроводных печатных дорожек, причем многослойное покрытие включает по меньшей мере один слой, сформированный из галогенуглеводородного полимера; и ! по меньшей мере один электрический компонент, присоединенный паяным соединением по меньшей мере к одной электропроводной печатной дорожке, причем паяное соединение припаяно через многослойное покрытие так, что паяное соединение примыкает к многослойному покрытию. ! 2. Печатная плата по п.1, в которой многослойное покрытие имеет толщину от 1 нм до 10 мкм. ! 3. Печатная плата по п.1, в которой многослойное покрытие включает первый слой и второй слой, которые отличаются друг от друга, причем первый слой и второй слой включают различные полимеры. ! 4. Печатная плата по п.1, в которой: ! многослойное покрытие включает первый слой, включающий полимер конкретного типа; ! многослойное покрытие включает второй слой, включающий полимер конкретного типа; ! полимер в первом слое отличается от полимера во втором слое в отношении по меньшей мере одного из следующих свойств: ! молекулярной массы; ! химического состава; ! структуры; ! геометрической формы; и ! пористости. ! 5. Печатная плата по п.1, в которой: ! многослойное покрытие включает отдельный слой первого полимера и другой слой второго полимера, причем слои примыкают друг к другу; и ! слои
Claims (71)
1. Печатная плата, включающая:
подложку, включающую изоляционный материал;
множество электропроводных печатных дорожек, присоединенных по меньшей мере к одной поверхности подложки;
многослойное покрытие, осажденное по меньшей мере на одной поверхности подложки, причем многослойное покрытие покрывает по меньшей мере часть множества электропроводных печатных дорожек, причем многослойное покрытие включает по меньшей мере один слой, сформированный из галогенуглеводородного полимера; и
по меньшей мере один электрический компонент, присоединенный паяным соединением по меньшей мере к одной электропроводной печатной дорожке, причем паяное соединение припаяно через многослойное покрытие так, что паяное соединение примыкает к многослойному покрытию.
2. Печатная плата по п.1, в которой многослойное покрытие имеет толщину от 1 нм до 10 мкм.
3. Печатная плата по п.1, в которой многослойное покрытие включает первый слой и второй слой, которые отличаются друг от друга, причем первый слой и второй слой включают различные полимеры.
4. Печатная плата по п.1, в которой:
многослойное покрытие включает первый слой, включающий полимер конкретного типа;
многослойное покрытие включает второй слой, включающий полимер конкретного типа;
полимер в первом слое отличается от полимера во втором слое в отношении по меньшей мере одного из следующих свойств:
молекулярной массы;
химического состава;
структуры;
геометрической формы; и
пористости.
5. Печатная плата по п.1, в которой:
многослойное покрытие включает отдельный слой первого полимера и другой слой второго полимера, причем слои примыкают друг к другу; и
слои имеют постепенно изменяющиеся свойства так, что многослойное покрытие переходит из первого полимера во второй полимер.
6. Печатная плата по п.1, в которой многослойное покрытие включает отдельный слой, сформированный из галогенуглеводородного полимера, и еще один слой, сформированный из полимера, не содержащего атомов галогенов.
7. Печатная плата по п.1, в которой многослойное покрытие осаждено так, что слой галогенида металла покрывает по меньшей мере часть множества электропроводных печатных дорожек.
8. Печатная плата по п.1, в которой многослойное покрытие осаждено так, что слой галогенида металла по существу отсутствует между множеством электропроводных печатных дорожек и многослойным покрытием.
9. Печатная плата по п.1, в которой галогенуглеводородный полимер включает один или более фторуглеводородов.
10. Печатная плата по п.1, в которой многослойное покрытие включает:
первый слой, включающий фторуглеводородный материал; и
второй слой, включающий хлорфторуглеводородный материал.
11. Печатная плата по п.10, в которой второй слой сформирован между первым слоем и множеством электропроводных печатных дорожек.
12. Печатная плата по п.10, в которой первый слой сформирован между вторым слоем и множеством электропроводных печатных дорожек.
13. Печатная плата по п.1, в которой:
паяное соединение сформировано в отдельной области подложки после того, как по существу непрерывный слой многослойного покрытия осажден на подложке; и
пайка изменяет многослойное покрытие в отдельной области подложки без изменения многослойного покрытия в других областях подложки.
14. Печатная плата по п.13, в которой пайка изменяет многослойное покрытие в отдельной области подложки удалением многослойного покрытия с отдельной области подложки без удаления многослойного покрытия с других областей подложки.
15. Печатная плата по п.1, в которой:
первая область подложки покрыта многослойным покрытием; и
вторая область подложки покрыта другим покрытием.
16. Печатная плата по п.1, дополнительно включающая по меньшей мере один провод, который соединен проводным соединением по меньшей мере с одной электропроводной печатной дорожкой, причем проводное соединение сформировано через многослойное покрытие так, что проводное соединение примыкает к многослойному покрытию.
17. Печатная плата по п.1, в которой нагревание флюса в отдельной области подложки изменяет многослойное покрытие в отдельной области подложки без изменения многослойного покрытия в других областях подложки.
18. Печатная плата по п.1, в которой подложка включает по меньшей мере одно из:
склеенной эпоксидной смолой стеклоткани;
склеенной синтетической смолой бумаги;
эпоксидной смолы;
хлопковой бумаги;
картона;
натурального материала на основе древесины; и
синтетического материала на основе древесины.
19. Печатная плата по п.1, в которой по меньшей мере один слой многослойного покрытия включает металлический материал.
20. Способ, включающий этапы, на которых:
присоединяют множество электропроводных печатных дорожек по меньшей мере к одной поверхности подложки, включающей изоляционный материал;
осаждают многослойное покрытие по меньшей мере на одну поверхность подложки, причем многослойное покрытие покрывает по меньшей мере часть многочисленных электропроводных печатных дорожек, причем по меньшей мере один слой многослойного покрытия включает по меньшей мере один галогенуглеводородный полимер; и
после осаждения многослойного покрытия проводят пайку через многослойное покрытие с образованием паяного соединения между электрическим компонентом и по меньшей мере одной электропроводной печатной дорожкой, присоединенной к подложке, причем паяное соединение примыкает к многослойному покрытию.
21. Способ по п.20, в котором многослойное покрытие имеет толщину от 1 нм до 10 мкм.
22. Способ по п.20, в котором многослойное покрытие включает первый слой и второй слой, которые отличаются друг от друга, причем первый слой и второй слой включают различные полимеры.
23. Способ по п.20, в котором:
многослойное покрытие включает первый слой, включающий полимер конкретного типа;
многослойное покрытие включает второй слой, включающий полимер конкретного типа;
полимер в первом слое отличается от полимера во втором слое в отношении по меньшей мере одного из следующих свойств:
молекулярной массы;
химического состава;
структуры;
геометрической формы; и
пористости.
24. Способ по п.20, в котором:
многослойное покрытие включает отдельный слой первого полимера и другой слой второго полимера, причем слои примыкают друг к другу; и
слои имеют постепенно изменяющиеся свойства так, что многослойное покрытие переходит из первого полимера во второй полимер.
25. Способ по п.20, в котором многослойное покрытие включает отдельный слой, сформированный из галогенуглеводородного полимера, и другой слой, сформированный из полимера, не содержащего атомов галогенов.
26. Способ по п.20, в котором многослойное покрытие осаждают так, что слой галогенида металла покрывает по меньшей мере часть множества электропроводных печатных дорожек.
27. Способ по п.20, в котором многослойное покрытие осаждают так, что слой галогенида металла по существу отсутствует между множеством электропроводных печатных дорожек и многослойным покрытием.
28. Способ по п.20, в котором галогенуглеводородный полимер включает один или более фторуглеводородов.
29. Способ по п.20, в котором многослойное покрытие включает:
первый слой, включающий фторуглеводородный материал; и
второй слой, включающий хлорфторуглеводородный материал.
30. Способ по п.29, в котором второй слой формируют между первым слоем и многочисленными электропроводными печатными дорожками.
31. Способ по п.29, в котором первый слой формируют между вторым слоем и многочисленными электропроводными печатными дорожками.
32. Способ по п.20, в котором:
паяное соединение формируют в отдельной области подложки после того, как по существу непрерывный слой многослойного покрытия осажден на подложке; и
пайка изменяет многослойное покрытие в отдельной области подложки без изменения многослойного покрытия в других областях подложки.
33. Способ по п.32, в котором пайка изменяет многослойное покрытие в отдельной области подложки удалением многослойного покрытия с отдельной области подложки без удаления многослойного покрытия с других областей подложки.
34. Способ по п.20, в котором:
первую область подложки покрывают многослойным покрытием; и
вторую область подложки покрывают другим покрытием.
35. Способ по п.20, дополнительно включающий этап, на котором:
формируют проводное соединение через многослойное покрытие, причем проводное соединение соединяет по меньшей мере один провод по меньшей мере с одной электропроводной печатной дорожкой, причем проводное соединение примыкает к многослойному покрытию.
36. Способ по п.20, дополнительно включающий этап, на котором:
модифицируют характеристики смачивания многослойного покрытия по меньшей мере одним путем из следующих:
плазменной очисткой;
плазменным травлением;
плазменной активацией;
плазменной полимеризацией и нанесением покрытия; и
жидкостным химическим травлением.
37. Способ по п.20, в котором многослойное покрытие осаждают по меньшей мере одним путем из следующих:
осаждения методом плазменного распыления;
химического осаждения из паровой фазы;
химического осаждения из паровой фазы методом разложения металлоорганических соединений;
способа молекулярно-пучковой эпитаксии;
нанесения покрытия набрызгиванием;
напыления; и
нанесения покрытия методом центрифугирования.
38. Способ по п.20, в котором:
подложка составляет часть печатной платы; и
покрытие делает печатную плату огнестойкой.
39. Способ по п.20, дополнительно включающий этап, на котором регулируют смачиваемость многослойного покрытия во время пайки.
40. Способ по п.20, дополнительно включающий этап, на котором согласуют пригодность к пайке и защитные свойства покрытия, причем согласования достигают, по меньшей мере отчасти, регулированием пористости и характеристик смачивания многослойного покрытия.
41. Способ по п.20, дополнительно включающий этап, на котором:
после формирования паяного соединения на печатную плату осаждают конформное покрытие, причем конформное покрытие включает по меньшей мере один галогенуглеводородный полимер, причем конформное покрытие имеет по меньшей мере одно из следующих свойств:
способность к пайке через покрытие;
способность обеспечивать проведение проводного монтажа через конформное покрытие; и
электрическую проводимость вдоль оси, перпендикулярной поверхности, покрытой конформным покрытием.
42. Способ по п.20, дополнительно включающий этап, на котором:
после формирования паяного соединения на печатную плату осаждают конформное покрытие, причем конформное покрытие включает по меньшей мере один галогенуглеводородный полимер, в котором:
конформное покрытие является изолирующим вдоль оси, перпендикулярной поверхности, покрытой конформным покрытием; и
конформное покрытие имеет по меньшей мере одно из следующих свойств:
способность к пайке через покрытие; и
способность обеспечивать проведение проводного монтажа через конформное покрытие.
43. Печатная плата, включающая:
подложку, включающую изоляционный материал;
множество электропроводных печатных дорожек, присоединенных по меньшей мере к одной поверхности подложки;
покрытие, осажденное по меньшей мере на одну поверхность подложки, причем:
покрытие покрывает по меньшей мере часть множества электропроводных печатных дорожек; и
включает по меньшей мере один галогенуглеводородный полимер;
и
по меньшей мере один электропроводный провод, который соединен проводным соединением по меньшей мере с одной электропроводной печатной дорожкой, причем проводное соединение формируют через покрытие без предварительного удаления покрытия так, что проводное соединение примыкает к покрытию.
44. Печатная плата по п.43, в которой проводное соединение примыкает к покрытию вдоль плоскости, параллельной по меньшей мере одной поверхности подложки.
45. Печатная плата по п.43, в которой проводное соединение представляет собой по меньшей мере одно из:
шарикового термокомпрессионного микросварного соединения; и
клинового термокомпрессионного микросварного соединения.
46. Печатная плата по п.43, в которой провод включает по меньшей мере одно из:
золота;
алюминия;
серебра;
меди;
никеля; и
железа.
47. Печатная плата по п.43, в которой по меньшей мере часть провода покрыта покрытием.
48. Печатная плата по п.43, в которой покрытие имеет толщину от 1 нм до 2 мкм.
49. Печатная плата по п.43, в которой покрытие имеет толщину от 10 нм до 100 нм.
50. Печатная плата по п.43, в которой по меньшей мере один галогенуглеводородный полимер представляет собой фторуглеводородный полимер.
51. Печатная плата по п.43, в которой проводное соединение сформировано в отдельной области подложки, причем формирование проводного соединения изменяет покрытие в отдельной области без изменения покрытия в других областях подложки.
52. Печатная плата по п.51, в которой:
покрытие не удалено с отдельной области подложки перед формированием проводного соединения; и
формирование проводного соединения изменяет покрытие в отдельной области подложки в результате избирательного удаления покрытия с отдельной области подложки.
53. Печатная плата по п.43, дополнительно включающая по меньшей мере один электрический компонент, соединенный паяным соединением по меньшей мере с одной электропроводной печатной дорожкой, причем паяное соединение припаяно через покрытие так, что паяное соединение примыкает к покрытию.
54. Печатная плата по п.43, в которой проводное соединение сформировано в первой области подложки, причем первая область покрыта покрытием, и дополнительно включает:
по меньшей мере один электрический компонент, соединенный паяным соединением по меньшей мере с одной электропроводной печатной дорожкой во второй области подложки, причем вторая область покрыта другим покрытием.
55. Печатная плата по п.43, в которой покрытие осаждают так, что слой галогенида металла покрывает по меньшей мере часть многочисленных электропроводных печатных дорожек.
56. Печатная плата по п.43, в которой покрытие осаждают так, что слой галогенида металла по существу отсутствует между многочисленными электропроводными печатными дорожками и покрытием.
57. Способ, включающий этапы, на которых:
присоединяют множество электропроводных печатных дорожек по меньшей мере к одной поверхности подложки, включающей изоляционный материал;
осаждают покрытие по меньшей мере на одну поверхность подложки, причем покрытие покрывает по меньшей мере часть множества электропроводных печатных дорожек, причем покрытие включает по меньшей мере один галогенуглеводородный полимер; и
формируют проводное соединение между по меньшей мере одним электропроводным проводом и по меньшей мере одной электропроводной печатной дорожкой, причем проводное соединение формируют через покрытие без предварительного удаления покрытия так, что проводное соединение примыкает к покрытию.
58. Способ по п.57, в котором проводное соединение примыкает к покрытию вдоль плоскости, параллельной по меньшей мере одной поверхности подложки.
59. Способ по п.57, в котором проводное соединение представляет собой по меньшей мере одно из:
шарикового термокомпрессионного микросварного соединения; и
клинового термокомпрессионного микросварного соединения.
60. Способ по п.57, в котором провод включает по меньшей мере одно из:
золота;
алюминия;
серебра;
меди;
никеля; и
железа.
61. Способ по п.57, в котором по меньшей мере часть провода покрывают покрытием перед формированием проводного соединения.
62. Способ по п.57, в котором покрытие имеет толщину от 1 нм до 2 мкм.
63. Способ по п.57, в котором покрытие имеет толщину от 10 нм до 100 нм.
64. Способ по п.57, в котором по меньшей мере один галогенуглеводородный полимер представляет собой фторуглеводородный полимер.
65. Способ по п.57, в котором проводное соединение формируют в отдельной области подложки, причем формирование проводного соединения изменяет покрытие в отдельной области без изменения покрытия в других областях подложки.
66. Способ по п.65, в котором:
покрытие не удаляют с отдельной области подложки перед формированием проводного соединения; и
формирование проводного соединения изменяет покрытие в отдельной области подложки избирательным удалением покрытия с отдельной области подложки.
67. Способ по п.57, дополнительно включающий этап, на котором:
после осаждения покрытия проводят пайку через покрытие с образованием паяного соединения между электрическим компонентом и по меньшей мере одной электропроводной печатной дорожкой, присоединенной к подложке, причем паяное соединение примыкает к покрытию.
68. Способ по п.57, в котором проводное соединение формируют по меньшей мере в первой области подложки, причем первую область покрывают покрытием, и дополнительной включающий этапы, на которых:
осаждают другое покрытие во второй области подложки; и
проводят пайку через другое покрытие во второй области подложки для формирования паяного соединения между электрическим компонентом и по меньшей мере одной электропроводной печатной дорожкой, присоединенной к подложке.
69. Способ по п.57, в котором осаждение покрытия включает осаждение первого слоя покрытия, и дополнительно включающий этап, на котором после формирования проводного соединения осаждают второй слой покрытия по меньшей мере на одну поверхность подложки, причем второй слой покрытия покрывает по меньшей мере часть проводного соединения.
70. Способ по п.57, в котором проводное соединение представляет собой проводное соединение бескорпусного кристалла.
71. Способ по п.57, в котором подложка включена в печатную плату, и дополнительно включающий этап, на котором:
после формирования проводного соединения на печатную плату осаждают конформное покрытие, причем конформное покрытие включает по меньшей мере один галогенуглеводородный полимер, причем конформное покрытие имеет по меньшей мере одно из следующих свойств:
способность к пайке через покрытие;
способность обеспечивать проведение проводного монтажа через конформное покрытие; и
электрическую проводимость вдоль оси, перпендикулярной поверхности, покрытой конформным покрытием.
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- 2009-08-11 MX MX2011001775A patent/MX2011001775A/es active IP Right Grant
- 2009-08-11 CN CN201610133298.2A patent/CN105744751B/zh not_active Expired - Fee Related
- 2009-08-11 SG SG10201701218UA patent/SG10201701218UA/en unknown
- 2009-08-11 SG SG2013062617A patent/SG193213A1/en unknown
- 2009-08-11 US US13/059,602 patent/US9055700B2/en active Active
- 2009-08-11 KR KR1020117006208A patent/KR101574374B1/ko active IP Right Grant
- 2009-08-11 CN CN2009801355060A patent/CN102150480A/zh active Pending
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- 2009-08-11 WO PCT/GB2009/001966 patent/WO2010020753A2/en active Application Filing
- 2009-08-11 KR KR1020147019126A patent/KR101591619B1/ko active IP Right Grant
- 2009-08-11 RU RU2011110260/07A patent/RU2533162C2/ru active
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- 2009-08-11 AU AU2009283992A patent/AU2009283992B2/en not_active Ceased
- 2009-08-11 EP EP09784909A patent/EP2327283A2/en not_active Withdrawn
- 2009-08-17 TW TW098127585A patent/TWI459878B/zh not_active IP Right Cessation
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2014
- 2014-05-28 RU RU2014121727A patent/RU2685692C2/ru not_active IP Right Cessation
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2015
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