HUE047861T2 - Berendezések, rendszerek és eljárások védõbevonatoknak elektronikus eszközök részegységeire történõ felviteléhez - Google Patents
Berendezések, rendszerek és eljárások védõbevonatoknak elektronikus eszközök részegységeire történõ felviteléhezInfo
- Publication number
- HUE047861T2 HUE047861T2 HUE13763739A HUE13763739A HUE047861T2 HU E047861 T2 HUE047861 T2 HU E047861T2 HU E13763739 A HUE13763739 A HU E13763739A HU E13763739 A HUE13763739 A HU E13763739A HU E047861 T2 HUE047861 T2 HU E047861T2
- Authority
- HU
- Hungary
- Prior art keywords
- apparatuses
- systems
- methods
- electronic device
- protective coatings
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/60—Deposition of organic layers from vapour phase
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261615172P | 2012-03-23 | 2012-03-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
HUE047861T2 true HUE047861T2 (hu) | 2020-05-28 |
Family
ID=49212062
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HUE13763739A HUE047861T2 (hu) | 2012-03-23 | 2013-03-25 | Berendezések, rendszerek és eljárások védõbevonatoknak elektronikus eszközök részegységeire történõ felviteléhez |
Country Status (5)
Country | Link |
---|---|
US (1) | US11060183B2 (hu) |
EP (1) | EP2828004B1 (hu) |
CN (1) | CN104334287A (hu) |
HU (1) | HUE047861T2 (hu) |
WO (1) | WO2013142858A1 (hu) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9333675B2 (en) | 2012-01-10 | 2016-05-10 | Hzo, Inc. | Profiles for precursors to polymeric materials |
EP2803083A4 (en) | 2012-01-10 | 2014-12-31 | Hzo Inc | MASKS FOR APPLYING PROTECTIVE COATINGS TO ELECTRONIC ASSEMBLIES, MASKED ELECTRONIC ASSEMBLIES, AND ASSOCIATED METHODS |
JP2014522543A (ja) | 2012-06-18 | 2014-09-04 | エイチズィーオー・インコーポレーテッド | 完全に組み立てられている電子デバイスの内部表面へ保護被覆を塗工するためのシステム及び方法 |
US8847412B2 (en) * | 2012-11-09 | 2014-09-30 | Invensas Corporation | Microelectronic assembly with thermally and electrically conductive underfill |
US9894776B2 (en) | 2013-01-08 | 2018-02-13 | Hzo, Inc. | System for refurbishing or remanufacturing an electronic device |
US10449568B2 (en) | 2013-01-08 | 2019-10-22 | Hzo, Inc. | Masking substrates for application of protective coatings |
JP6034884B2 (ja) | 2013-01-08 | 2016-11-30 | エイチズィーオー・インコーポレーテッド | 基板からの保護被覆選択部分の除去 |
WO2015192146A1 (en) * | 2014-06-13 | 2015-12-17 | Hzo, Inc. | Impermeable protective coatings through which electrical connections may be established and electronic devices including the impermeable protective coatings |
WO2021086354A1 (en) * | 2019-10-30 | 2021-05-06 | Hzo, Inc. | Combination parylene system for pre-treatment, deposition, post-treatment and cleaning |
KR20220129599A (ko) | 2020-01-22 | 2022-09-23 | 어플라이드 머티어리얼스, 인코포레이티드 | Oled 층 두께 및 도펀트 농도의 인-라인 모니터링 |
KR20220129598A (ko) * | 2020-01-22 | 2022-09-23 | 어플라이드 머티어리얼스, 인코포레이티드 | Oled 층 두께 및 도펀트 농도의 인-라인 모니터링 |
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-
2013
- 2013-03-25 US US13/849,790 patent/US11060183B2/en active Active
- 2013-03-25 CN CN201380026777.9A patent/CN104334287A/zh active Pending
- 2013-03-25 EP EP13763739.3A patent/EP2828004B1/en active Active
- 2013-03-25 WO PCT/US2013/033698 patent/WO2013142858A1/en active Application Filing
- 2013-03-25 HU HUE13763739A patent/HUE047861T2/hu unknown
Also Published As
Publication number | Publication date |
---|---|
WO2013142858A1 (en) | 2013-09-26 |
US20130251889A1 (en) | 2013-09-26 |
EP2828004A1 (en) | 2015-01-28 |
EP2828004B1 (en) | 2019-11-20 |
EP2828004A4 (en) | 2015-07-15 |
CN104334287A (zh) | 2015-02-04 |
US11060183B2 (en) | 2021-07-13 |
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