BRPI0917289A8 - revestimento polimérico de halo-hidrocarboneto - Google Patents

revestimento polimérico de halo-hidrocarboneto Download PDF

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Publication number
BRPI0917289A8
BRPI0917289A8 BRPI0917289A BRPI0917289A BRPI0917289A8 BR PI0917289 A8 BRPI0917289 A8 BR PI0917289A8 BR PI0917289 A BRPI0917289 A BR PI0917289A BR PI0917289 A BRPI0917289 A BR PI0917289A BR PI0917289 A8 BRPI0917289 A8 BR PI0917289A8
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BR
Brazil
Prior art keywords
solder joint
multilayer coating
pcb
halo
polymeric coating
Prior art date
Application number
BRPI0917289A
Other languages
English (en)
Inventor
Ferdinandi Frank
Robson Humphries Mark
Edward Smith Rodney
Original Assignee
Semblant Global Ltd
Semblant Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB0815095A external-priority patent/GB2462823A/en
Priority claimed from GB0815094A external-priority patent/GB2462822B/en
Priority claimed from GB0815096A external-priority patent/GB2462824A/en
Application filed by Semblant Global Ltd, Semblant Ltd filed Critical Semblant Global Ltd
Publication of BRPI0917289A2 publication Critical patent/BRPI0917289A2/pt
Publication of BRPI0917289A8 publication Critical patent/BRPI0917289A8/pt

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
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    • H05K3/28—Applying non-metallic protective coatings
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    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L2924/14—Integrated circuits
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    • H01L2924/1904—Component type
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    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2924/20—Parameters
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    • H01L2924/2075—Diameter ranges larger or equal to 1 micron less than 10 microns
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0179—Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1322—Encapsulation comprising more than one layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

"placas de circuito impresso, métodos e aparelhos". em algumas modalidades, uma placa de circuito impresso (pcb) compreende um substrato que compreende um material de isolamento. a pcb, compreende adicionalmente uma pluralidade das trilhas condutoras ligadas a pelo menos uma superfície do substrato. a pcb, compreende adicionalmente um revestimento das múltiplas camadas depositado na pelo menos uma superfície do substrato. o revestimento das múltiplas camadas (i) reveste pelo menos uma porção da pluralidade das trilhas condutoras e (ii) que compreende pelo menos uma camada formada de um polímero de halo-hidrocarboneto. a pcb, compreende adicionalmente pelo menos um componente elétrico ligado por meio de uma junta de solda a pelo menos uma trilha condutora, em que a junta de solda é soldada através do revestimento das múltiplas camadas de modo que a junta de solda está em contato com o revestimento das múltiplas camadas.
BRPI0917289A 2008-08-18 2009-08-11 revestimento polimérico de halo-hidrocarboneto BRPI0917289A8 (pt)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
GB0815095A GB2462823A (en) 2008-08-18 2008-08-18 A switch
GB0815094A GB2462822B (en) 2008-08-18 2008-08-18 Wire bonding
GB0815096A GB2462824A (en) 2008-08-18 2008-08-18 Printed circuit board encapsulation
PCT/GB2009/001966 WO2010020753A2 (en) 2008-08-18 2009-08-11 Halo-hydrocarbon polymer coating

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BRPI0917289A2 BRPI0917289A2 (pt) 2015-11-10
BRPI0917289A8 true BRPI0917289A8 (pt) 2019-09-17

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EP (1) EP2327283A2 (pt)
JP (2) JP5645821B2 (pt)
KR (2) KR101591619B1 (pt)
CN (3) CN102150480A (pt)
AU (1) AU2009283992B2 (pt)
BR (1) BRPI0917289A8 (pt)
CA (2) CA2733765C (pt)
MX (1) MX2011001775A (pt)
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RU (2) RU2533162C2 (pt)
SG (2) SG10201701218UA (pt)
TW (1) TWI459878B (pt)
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