BR9706961A - Montagem com camada múltipla de circuito impresso e método de fabricação para o mesmo - Google Patents

Montagem com camada múltipla de circuito impresso e método de fabricação para o mesmo

Info

Publication number
BR9706961A
BR9706961A BR9706961-2A BR9706961A BR9706961A BR 9706961 A BR9706961 A BR 9706961A BR 9706961 A BR9706961 A BR 9706961A BR 9706961 A BR9706961 A BR 9706961A
Authority
BR
Brazil
Prior art keywords
printed circuit
layers
conductive
layer
circuit boards
Prior art date
Application number
BR9706961-2A
Other languages
English (en)
Inventor
Richard J Pommer
Original Assignee
Allied Signal Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Allied Signal Inc filed Critical Allied Signal Inc
Publication of BR9706961A publication Critical patent/BR9706961A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8312—Aligning
    • H01L2224/83136—Aligning involving guiding structures, e.g. spacers or supporting members
    • H01L2224/83138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10666—Plated through-hole for surface mounting on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

Patente de Invenção:<B>"MONTAGEM COM CAMADA MúLTIPLA DE CIRCUITO IMPRESSO E MéTODO DE FABRICAçãO PARA O MESMO"<D>. Um conjunto de placa de circuito impresso e um método de confecção do mesmo utilizam em uma realização uma camada de adesivo que inclui uma pluralidade de "partículas de calibre" não-condutoras dispostas em um adesivo não-condutor. Quando a camada de adesivo é disposta entre camadas de circuito impresso opostas (sejam elas substratos de isolamento, camadas condutoras, ou outras camadas), as partículas de calibre individuais (44, 174) são interpostas ou intercaladas em vários pontos entre as camadas, de modo que os diâmetros das partículas controlem a separação de camada por todas as áreas sobrepostas das mesmas, desse modo permitindo um controle cuidadoso quanto a separação de camada. Um conjunto de circuito impresso e um método de confecção do mesmo utilizam, em uma outra realização, uma tecnologia de interconexões entre camadas que incorpora colunas condutoras que são depositadas em um de um par de calços de contato formados em placas de circuito impresso opostas e, após isso, unidas ao outro no par de calços de contato durante a laminação. O material fusível pode ser utilizado nas colunas condutoras (208, 209) para facilitar a ligação mecânica a um calço de contato, e as colunas se projetam através de uma camada dielétrica disposta entre as placas de circuito impresso, desse modo formando as conexões elétricas entre as placas em locais discretos.
BR9706961-2A 1996-01-05 1997-01-03 Montagem com camada múltipla de circuito impresso e método de fabricação para o mesmo BR9706961A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/583,645 US5839188A (en) 1996-01-05 1996-01-05 Method of manufacturing a printed circuit assembly
PCT/US1997/000175 WO1997025844A1 (en) 1996-01-05 1997-01-03 Printed circuit multilayer assembly and method of manufacture therefor

Publications (1)

Publication Number Publication Date
BR9706961A true BR9706961A (pt) 1999-12-28

Family

ID=24334001

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9706961-2A BR9706961A (pt) 1996-01-05 1997-01-03 Montagem com camada múltipla de circuito impresso e método de fabricação para o mesmo

Country Status (12)

Country Link
US (2) US5839188A (pt)
EP (1) EP0956748A1 (pt)
JP (1) JP2000515680A (pt)
KR (1) KR100442215B1 (pt)
CN (1) CN1096222C (pt)
AU (1) AU1527697A (pt)
BR (1) BR9706961A (pt)
CA (1) CA2241446A1 (pt)
IL (1) IL125101A (pt)
MY (1) MY113149A (pt)
TW (1) TW342580B (pt)
WO (1) WO1997025844A1 (pt)

Families Citing this family (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6147870A (en) * 1996-01-05 2000-11-14 Honeywell International Inc. Printed circuit assembly having locally enhanced wiring density
DE19701165C1 (de) * 1997-01-15 1998-04-09 Siemens Ag Chipkartenmodul
DE69839964D1 (de) * 1997-06-06 2008-10-16 Ibiden Co Ltd Einseitige leiterplatte und verfahren zu deren herstellung
US6315856B1 (en) * 1998-03-19 2001-11-13 Kabushiki Kaisha Toshiba Method of mounting electronic component
JP3535746B2 (ja) * 1998-08-20 2004-06-07 ソニーケミカル株式会社 フレキシブル基板製造方法
US6492738B2 (en) 1999-09-02 2002-12-10 Micron Technology, Inc. Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer
US6299749B1 (en) 1999-10-25 2001-10-09 Molex Incorporated Method of fabricating an electrical component
US6484045B1 (en) * 2000-02-10 2002-11-19 Medtronic Minimed, Inc. Analyte sensor and method of making the same
JP2001251061A (ja) * 2000-03-02 2001-09-14 Sony Corp 多層型プリント配線基板
US6477031B1 (en) * 2000-03-22 2002-11-05 Tdk Corporation Electronic component for high frequency signals and method for fabricating the same
US6461677B1 (en) 2000-04-18 2002-10-08 Molex Incorporated Method of fabricating an electrical component
US6484299B1 (en) 2000-07-07 2002-11-19 Micron Technology, Inc. Method and apparatus for PCB array with compensated signal propagation
SE518642C2 (sv) * 2000-07-11 2002-11-05 Mydata Automation Ab Förfarande, anordning för att förse ett substrat med visköst medium, anordning för korrigering av applikationsfel samt användningen av utskjutnings- organ för korrigering av appliceringsfel
SE518640C2 (sv) * 2000-07-11 2002-11-05 Mydata Automation Ab Förfarande, anordning för applicering av ett visköst medium på ett substrat, anordning för applicering av ytterligare visköst medium samt användningen av screentryckning
US6872586B2 (en) 2000-10-17 2005-03-29 Seiko Epson Corporation Method of manufacture of active matrix substrate and liquid crystal display device
SE0004125L (sv) * 2000-11-10 2002-05-11 Ericsson Telefon Ab L M Distanshållande dielektriskt skikt
US6800169B2 (en) * 2001-01-08 2004-10-05 Fujitsu Limited Method for joining conductive structures and an electrical conductive article
US6866741B2 (en) * 2001-01-08 2005-03-15 Fujitsu Limited Method for joining large substrates
US6884313B2 (en) * 2001-01-08 2005-04-26 Fujitsu Limited Method and system for joining and an ultra-high density interconnect
JP4344101B2 (ja) * 2001-02-14 2009-10-14 Ｏｋｉセミコンダクタ株式会社 配線構造部
US6490786B2 (en) * 2001-04-17 2002-12-10 Visteon Global Technologies, Inc. Circuit assembly and a method for making the same
TW540281B (en) * 2001-08-09 2003-07-01 Matsushita Electric Ind Co Ltd Manufacturing method of conductive paste material and manufacturing method of printing wiring base board
EP1296374B1 (en) * 2001-09-14 2012-09-05 STMicroelectronics Srl Process for bonding and electrically connecting microsystems integrated in several distinct substrates
US7754976B2 (en) * 2002-04-15 2010-07-13 Hamilton Sundstrand Corporation Compact circuit carrier package
JP3893100B2 (ja) * 2002-10-29 2007-03-14 新光電気工業株式会社 配線基板への電子部品搭載方法
KR100559937B1 (ko) * 2003-01-08 2006-03-13 엘에스전선 주식회사 미세회로의 접속방법 및 그에 의한 접속 구조체
US6982504B2 (en) * 2003-01-24 2006-01-03 Gsi Group Corporation Galvanometer motor with composite stator assembly
GB0302485D0 (en) 2003-02-04 2003-03-05 Plastic Logic Ltd Pixel capacitors
US20040241396A1 (en) * 2003-05-29 2004-12-02 3M Innovative Properties Company Method of modifying a surface of a substrate and articles therefrom
US20040241323A1 (en) * 2003-05-29 2004-12-02 3M Innovative Properties Company Method for applying adhesive to a substrate
GB0400982D0 (en) * 2004-01-16 2004-02-18 Fujifilm Electronic Imaging Method of forming a pattern on a substrate
US7378598B2 (en) * 2004-02-19 2008-05-27 Hewlett-Packard Development Company, L.P. Printed circuit board substrate and method for constructing same
US6989493B2 (en) * 2004-03-03 2006-01-24 Seagate Technology Llc Electrical feedthrough assembly for a sealed housing
JP2006019567A (ja) * 2004-07-02 2006-01-19 Seiko Epson Corp シールド線
US20060280912A1 (en) * 2005-06-13 2006-12-14 Rong-Chang Liang Non-random array anisotropic conductive film (ACF) and manufacturing processes
US8802214B2 (en) * 2005-06-13 2014-08-12 Trillion Science, Inc. Non-random array anisotropic conductive film (ACF) and manufacturing processes
US7444253B2 (en) * 2006-05-09 2008-10-28 Formfactor, Inc. Air bridge structures and methods of making and using air bridge structures
KR100752665B1 (ko) * 2006-06-23 2007-08-29 삼성전자주식회사 도전성 접착층을 이용한 반도체 소자 및 그 제조 방법
US7923488B2 (en) * 2006-10-16 2011-04-12 Trillion Science, Inc. Epoxy compositions
WO2008059695A1 (fr) * 2006-11-13 2008-05-22 Konica Minolta Opto, Inc. Unité de lentille, procédé de fabrication d'unité de lentille, cône de vision de lentille, procédé de fabrication de cône de vision de lentille et dispositif de prise de vues
US20080171450A1 (en) * 2007-01-12 2008-07-17 Nokia Corporation Wafer Bump Manufacturing Using Conductive Ink
JP2009135388A (ja) * 2007-10-30 2009-06-18 Hitachi Chem Co Ltd 回路接続方法
TW200941659A (en) * 2008-03-25 2009-10-01 Bridge Semiconductor Corp Thermally enhanced package with embedded metal slug and patterned circuitry
JP5217659B2 (ja) * 2008-06-10 2013-06-19 株式会社村田製作所 セラミック電子部品、およびセラミック電子部品の製造方法
JP4825286B2 (ja) * 2009-08-07 2011-11-30 ナミックス株式会社 多層配線板の製造方法
JP2011049367A (ja) * 2009-08-27 2011-03-10 Panasonic Corp 基板接続構造および電子機器
DE102011075009B4 (de) * 2011-04-29 2019-11-14 Continental Automotive Gmbh Auf einem Träger angeordnete Kontaktfläche zur Verbindung mit einer auf einem weiteren Träger angeordneten Gegenkontaktfläche
US20130000968A1 (en) * 2011-06-30 2013-01-03 Broadcom Corporation 1-Layer Interposer Substrate With Through-Substrate Posts
EP2544514B1 (de) * 2011-07-05 2019-03-06 Pierburg Pump Technology GmbH Verfahren zur Überprüfung einer korrekten Klebung eines Substrates auf einem elektrisch und thermisch leitfähigen Körper
US9475963B2 (en) 2011-09-15 2016-10-25 Trillion Science, Inc. Fixed array ACFs with multi-tier partially embedded particle morphology and their manufacturing processes
US9102851B2 (en) 2011-09-15 2015-08-11 Trillion Science, Inc. Microcavity carrier belt and method of manufacture
US9040837B2 (en) * 2011-12-14 2015-05-26 Ibiden Co., Ltd. Wiring board and method for manufacturing the same
US9179547B2 (en) * 2013-03-30 2015-11-03 Shenzhen O-Film Tech Co., Ltd. Gold finger and touch screen
KR101513642B1 (ko) * 2013-08-21 2015-04-20 엘지전자 주식회사 반도체 디바이스
JP2015156309A (ja) * 2014-02-20 2015-08-27 矢崎総業株式会社 ヒューズ
JP5974147B1 (ja) 2015-07-31 2016-08-23 株式会社フジクラ 配線体アセンブリ、導体層付き構造体、及びタッチセンサ
TWI566646B (zh) * 2015-10-06 2017-01-11 挺暉工業股份有限公司 柔性印刷電路板、連接器組件及電子裝置
CN109246925B (zh) * 2018-08-28 2020-03-31 庆鼎精密电子（淮安）有限公司 软硬板的制作方法
JP7125547B2 (ja) 2018-12-29 2022-08-24 深南電路股▲ふん▼有限公司 多様に組み立て可能なプリント基板及びその製造方法

Family Cites Families (75)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2721822A (en) 1953-07-22 1955-10-25 Pritikin Nathan Method for producing printed circuit
NL190034A (pt) 1953-08-17
US3181986A (en) 1961-03-31 1965-05-04 Intellux Inc Method of making inlaid circuits
US3350498A (en) 1965-01-04 1967-10-31 Intellux Inc Multilayer circuit and method of making the same
US3475213A (en) 1965-09-13 1969-10-28 Minnesota Mining & Mfg Electrically conductive adhesive tape
US3680037A (en) 1970-11-05 1972-07-25 Tech Wire Prod Inc Electrical interconnector
GB1353671A (en) * 1971-06-10 1974-05-22 Int Computers Ltd Methods of forming circuit interconnections
US4174331A (en) 1972-06-23 1979-11-13 The Carborundum Company Refractory moldable composition containing ceramic fiber and colloidal silica
US3823252A (en) 1972-10-26 1974-07-09 Owens Illinois Inc Conducting element having bundled substantially parallel crystalline conductors and process for manufacture
AT332926B (de) * 1973-02-21 1976-10-25 Electrovac Anordnung zur verbindung von einander gegenuberliegenden elektrischen leitern und verfahren zu deren herstellung
US3986255A (en) 1974-11-29 1976-10-19 Itek Corporation Process for electrically interconnecting chips with substrates employing gold alloy bumps and magnetic materials therein
US3982320A (en) 1975-02-05 1976-09-28 Technical Wire Products, Inc. Method of making electrically conductive connector
US4050756A (en) 1975-12-22 1977-09-27 International Telephone And Telegraph Corporation Conductive elastomer connector and method of making same
JPS5357481A (en) * 1976-11-04 1978-05-24 Canon Inc Connecting process
US4159222A (en) 1977-01-11 1979-06-26 Pactel Corporation Method of manufacturing high density fine line printed circuitry
US4268849A (en) * 1978-11-03 1981-05-19 National Semiconductor Corporation Raised bonding pad
JPS5668579A (en) 1979-11-09 1981-06-09 Hitachi Ltd Connecting method by melting solder
US4545840A (en) * 1983-03-08 1985-10-08 Monolithic Memories, Inc. Process for controlling thickness of die attach adhesive
US4667220A (en) * 1984-04-27 1987-05-19 Trilogy Computer Development Partners, Ltd. Semiconductor chip module interconnection system
US4604644A (en) 1985-01-28 1986-08-05 International Business Machines Corporation Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making
JPS6433808A (en) 1986-10-18 1989-02-03 Japan Synthetic Rubber Co Ltd Conductive particle and conductive adhesive including it
JPH07112041B2 (ja) * 1986-12-03 1995-11-29 シャープ株式会社 半導体装置の製造方法
JPS63249393A (ja) * 1987-04-03 1988-10-17 シャープ株式会社 電子部品の接続方法
KR910004797B1 (ko) 1987-04-08 1991-07-13 가시오 게이상기 가부시기가이샤 소형 전자기기 및 그 제조방법
US4771159A (en) 1987-05-27 1988-09-13 Gte Government Systems Corporation Method of soldering leadless component carriers or the like
US4778635A (en) 1987-09-18 1988-10-18 American Telephone And Telegraph Company Method and apparatus for fabricating anisotropically conductive material
JPH01206575A (ja) 1988-02-15 1989-08-18 Shin Etsu Polymer Co Ltd 接着性熱融着形コネクタ
AU612771B2 (en) * 1988-02-26 1991-07-18 Minnesota Mining And Manufacturing Company Electrically conductive pressure-sensitive adhesive tape
US5502889A (en) * 1988-06-10 1996-04-02 Sheldahl, Inc. Method for electrically and mechanically connecting at least two conductive layers
US4908258A (en) 1988-08-01 1990-03-13 Rogers Corporation High dielectric constant flexible sheet material
USRE35064E (en) 1988-08-01 1995-10-17 Circuit Components, Incorporated Multilayer printed wiring board
US5031308A (en) * 1988-12-29 1991-07-16 Japan Radio Co., Ltd. Method of manufacturing multilayered printed-wiring-board
JPH0291360U (pt) 1988-12-29 1990-07-19
US5235741A (en) 1989-08-18 1993-08-17 Semiconductor Energy Laboratory Co., Ltd. Electrical connection and method for making the same
US4991285A (en) * 1989-11-17 1991-02-12 Rockwell International Corporation Method of fabricating multi-layer board
JPH03196650A (ja) 1989-12-26 1991-08-28 Sharp Corp フリップチップボンディング方法
JPH03209734A (ja) 1990-01-11 1991-09-12 Japan Radio Co Ltd 半導体接続方法
JPH03218030A (ja) 1990-01-23 1991-09-25 Hitachi Ltd 半導体集積回路装置およびそれに用いられるプリフォーム接合材
JP2590450B2 (ja) 1990-02-05 1997-03-12 株式会社村田製作所 バンプ電極の形成方法
JP2740357B2 (ja) 1990-02-06 1998-04-15 松下電工株式会社 プリント回路用基板
JPH03231216A (ja) 1990-02-06 1991-10-15 Nec Corp 光シャッタ
US5376403A (en) 1990-02-09 1994-12-27 Capote; Miguel A. Electrically conductive compositions and methods for the preparation and use thereof
US5538789A (en) 1990-02-09 1996-07-23 Toranaga Technologies, Inc. Composite substrates for preparation of printed circuits
US5046238A (en) * 1990-03-15 1991-09-10 Rogers Corporation Method of manufacturing a multilayer circuit board
US5112464A (en) 1990-06-15 1992-05-12 The Dow Chemical Company Apparatus to control reverse current flow in membrane electrolytic cells
US5060844A (en) 1990-07-18 1991-10-29 International Business Machines Corporation Interconnection structure and test method
US5147084A (en) 1990-07-18 1992-09-15 International Business Machines Corporation Interconnection structure and test method
US5112462A (en) 1990-09-13 1992-05-12 Sheldahl Inc. Method of making metal-film laminate resistant to delamination
US5137791A (en) 1990-09-13 1992-08-11 Sheldahl Inc. Metal-film laminate resistant to delamination
JP2906282B2 (ja) 1990-09-20 1999-06-14 富士通株式会社 ガラスセラミック・グリーンシートと多層基板、及び、その製造方法
US5154341A (en) 1990-12-06 1992-10-13 Motorola Inc. Noncollapsing multisolder interconnection
JPH04317663A (ja) 1991-04-16 1992-11-09 Photonics:Kk つぼの刺激装置
US5225966A (en) 1991-07-24 1993-07-06 At&T Bell Laboratories Conductive adhesive film techniques
US5203075A (en) 1991-08-12 1993-04-20 Inernational Business Machines Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders
US5261155A (en) 1991-08-12 1993-11-16 International Business Machines Corporation Method for bonding flexible circuit to circuitized substrate to provide electrical connection therebetween using different solders
JPH0548230A (ja) * 1991-08-17 1993-02-26 Fuji Xerox Co Ltd 薄膜配線基板
US5318651A (en) * 1991-11-27 1994-06-07 Nec Corporation Method of bonding circuit boards
US5261593A (en) 1992-08-19 1993-11-16 Sheldahl, Inc. Direct application of unpackaged integrated circuit to flexible printed circuit
US5329695A (en) * 1992-09-01 1994-07-19 Rogers Corporation Method of manufacturing a multilayer circuit board
JP3113749B2 (ja) * 1992-11-27 2000-12-04 株式会社リコー 配線構造及び導電部材の製造方法
CA2109687A1 (en) * 1993-01-26 1995-05-23 Walter Schmidt Method for the through plating of conductor foils
US5450290A (en) 1993-02-01 1995-09-12 International Business Machines Corporation Printed circuit board with aligned connections and method of making same
US5346775A (en) 1993-02-22 1994-09-13 At&T Laboratories Article comprising solder with improved mechanical properties
US5324569A (en) 1993-02-26 1994-06-28 Hewlett-Packard Company Composite transversely plastic interconnect for microchip carrier
US5445308A (en) 1993-03-29 1995-08-29 Nelson; Richard D. Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metal
US5600103A (en) * 1993-04-16 1997-02-04 Kabushiki Kaisha Toshiba Circuit devices and fabrication method of the same
US5401913A (en) * 1993-06-08 1995-03-28 Minnesota Mining And Manufacturing Company Electrical interconnections between adjacent circuit board layers of a multi-layer circuit board
US5439162A (en) 1993-06-28 1995-08-08 Motorola, Inc. Direct chip attachment structure and method
DE69419219T2 (de) * 1993-09-03 2000-01-05 Toshiba Kawasaki Kk Leiterplatte und Verfahren zur Herstellung solcher Leiterplatten
US5346118A (en) 1993-09-28 1994-09-13 At&T Bell Laboratories Surface mount solder assembly of leadless integrated circuit packages to substrates
US5431571A (en) * 1993-11-22 1995-07-11 W. L. Gore & Associates, Inc. Electrical conductive polymer matrix
US5492266A (en) 1994-08-31 1996-02-20 International Business Machines Corporation Fine pitch solder deposits on printed circuit board process and product
US5497938A (en) 1994-09-01 1996-03-12 Intel Corporation Tape with solder forms and methods for transferring solder to chip assemblies
US5468655A (en) 1994-10-31 1995-11-21 Motorola, Inc. Method for forming a temporary attachment between a semiconductor die and a substrate using a metal paste comprising spherical modules
US5429293A (en) 1994-12-19 1995-07-04 Motorola, Inc. Soldering process

Also Published As

Publication number Publication date
KR19990077005A (ko) 1999-10-25
EP0956748A1 (en) 1999-11-17
KR100442215B1 (ko) 2004-11-09
US5839188A (en) 1998-11-24
WO1997025844A1 (en) 1997-07-17
IL125101A0 (en) 1999-01-26
MY113149A (en) 2001-11-30
CN1212115A (zh) 1999-03-24
IL125101A (en) 2003-06-24
AU1527697A (en) 1997-08-01
CN1096222C (zh) 2002-12-11
JP2000515680A (ja) 2000-11-21
US6246014B1 (en) 2001-06-12
CA2241446A1 (en) 1997-07-17
TW342580B (en) 1998-10-11

Similar Documents

Publication Publication Date Title
BR9706961A (pt) Montagem com camada múltipla de circuito impresso e método de fabricação para o mesmo
ES2094003T3 (es) Resistencia electrica bajo forma de placa de circuito impreso de montaje en superficie y su procedimiento de fabricacion.
KR860002890A (ko) 가요성 테이프 및 그 제조방법
ES289337U (es) Unos medios adhesivos de interconexion electrica
KR950015856A (ko) 이방성 도전막, 그 제조방법 및 그것을 사용하는 컨넥터
DE69505553D1 (de) MONOLITHISCHE MIKROELEKTRONISCHE SCHALTUNGSMODULE AUS FLüSSIGKRISTALLPOLYMER
KR970061017A (ko) 도체층부착이방성도전시트 및 이를 사용한 배선기판
RU2000128714A (ru) Композитное схемное защитное устройство и способ его получения
KR890013673A (ko) 전기 전도의 압감성 접착 테이프
KR960019374A (ko) 전류 보호기
KR870008424A (ko) 박층 프린트 코일 구조
EP1005086A3 (en) Metal foil having bumps, circuit substrate having the metal foil, and semiconductor device having the circuit substrate
BR8406131A (pt) Processo para preparar um trajeto eletricamente condutor em uma camada dieletrica imprensada entre duas camadas condutivas e atraves de uma camada dieletrica imprensada entre duas camadas de cobre,e artigo
JPS6433808A (en) Conductive particle and conductive adhesive including it
SE9802157L (sv) Elektrisk komponent
TW344938B (en) Multilayer printed-circuit board and method of fabricating the multilayer printed-circuit board
US3765076A (en) Printed circuit board and a method of repairing contacts on a printed circuit board
JPS6422097A (en) Manufacture of metal base printed circuit board having through hole on both sides
KR850004371A (ko) 연결 시트
EP1018761A4 (en) SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
JP2003208931A (ja) 接続部材
JPS5998597A (ja) 多層プリント配線板
BR9306894A (pt) Processo para a manufatura de uma placa de circuito impresso em multicamadas
KR830004645A (ko) 전기전도성 적층판(積層板)
JP2763799B2 (ja) 多層プリント配線板

Legal Events

Date Code Title Description
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B09B Patent application refused [chapter 9.2 patent gazette]

Free format text: INDEFERIDO COM BASE NO ART. 8O COMBINADO COM O ART. 13 DA LPI.