DE69839964D1 - Einseitige leiterplatte und verfahren zu deren herstellung - Google Patents
Einseitige leiterplatte und verfahren zu deren herstellungInfo
- Publication number
- DE69839964D1 DE69839964D1 DE69839964T DE69839964T DE69839964D1 DE 69839964 D1 DE69839964 D1 DE 69839964D1 DE 69839964 T DE69839964 T DE 69839964T DE 69839964 T DE69839964 T DE 69839964T DE 69839964 D1 DE69839964 D1 DE 69839964D1
- Authority
- DE
- Germany
- Prior art keywords
- production
- sided pcb
- pcb
- sided
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
- H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0733—Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16529197 | 1997-06-06 | ||
PCT/JP1998/002498 WO1998056220A1 (fr) | 1997-06-06 | 1998-06-05 | Plaquette de circuit simple face et procede de fabrication de ladite plaquette |
Publications (1)
Publication Number | Publication Date |
---|---|
DE69839964D1 true DE69839964D1 (de) | 2008-10-16 |
Family
ID=15809547
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69839964T Expired - Lifetime DE69839964D1 (de) | 1997-06-06 | 1998-06-05 | Einseitige leiterplatte und verfahren zu deren herstellung |
DE69839882T Expired - Lifetime DE69839882D1 (de) | 1997-06-06 | 1998-06-05 | Mehrschichtige gedruckte leiterplatte und verfahren zu deren herstellung |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69839882T Expired - Lifetime DE69839882D1 (de) | 1997-06-06 | 1998-06-05 | Mehrschichtige gedruckte leiterplatte und verfahren zu deren herstellung |
Country Status (4)
Country | Link |
---|---|
US (4) | US6586686B1 (de) |
EP (2) | EP1009205B1 (de) |
DE (2) | DE69839964D1 (de) |
WO (2) | WO1998056219A1 (de) |
Families Citing this family (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998056219A1 (fr) * | 1997-06-06 | 1998-12-10 | Ibiden Co., Ltd. | Tableau de connexions imprime a couches multiples et procede de fabrication dudit tableau |
JP3213292B2 (ja) * | 1999-07-12 | 2001-10-02 | ソニーケミカル株式会社 | 多層基板、及びモジュール |
US6583364B1 (en) * | 1999-08-26 | 2003-06-24 | Sony Chemicals Corp. | Ultrasonic manufacturing apparatuses, multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boards |
US7893435B2 (en) * | 2000-04-18 | 2011-02-22 | E Ink Corporation | Flexible electronic circuits and displays including a backplane comprising a patterned metal foil having a plurality of apertures extending therethrough |
WO2001080287A2 (en) * | 2000-04-18 | 2001-10-25 | E Ink Corporation | Process for fabricating thin film transistors |
JP2001320167A (ja) * | 2000-05-10 | 2001-11-16 | Ibiden Co Ltd | 多層回路基板の製造方法 |
JP3407737B2 (ja) * | 2000-12-14 | 2003-05-19 | 株式会社デンソー | 多層基板の製造方法およびその製造方法によって形成される多層基板 |
US6630743B2 (en) * | 2001-02-27 | 2003-10-07 | International Business Machines Corporation | Copper plated PTH barrels and methods for fabricating |
US7331502B2 (en) | 2001-03-19 | 2008-02-19 | Sumitomo Bakelite Company, Ltd. | Method of manufacturing electronic part and electronic part obtained by the method |
US6759600B2 (en) * | 2001-04-27 | 2004-07-06 | Shinko Electric Industries Co., Ltd. | Multilayer wiring board and method of fabrication thereof |
JP3729092B2 (ja) * | 2001-06-19 | 2005-12-21 | ソニー株式会社 | 導電性接合材、多層型プリント配線基板及び多層型プリント配線基板の製造方法 |
WO2003007370A1 (en) * | 2001-07-12 | 2003-01-23 | Hitachi, Ltd. | Wiring glass substrate and method of manufacturing the wiring glass substrate, conductive paste and semiconductor module used for wiring glass substrate, and method of forming wiring substrate and conductor |
MY140754A (en) * | 2001-12-25 | 2010-01-15 | Hitachi Chemical Co Ltd | Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof |
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US7260890B2 (en) | 2002-06-26 | 2007-08-28 | Georgia Tech Research Corporation | Methods for fabricating three-dimensional all organic interconnect structures |
US20040012097A1 (en) * | 2002-07-17 | 2004-01-22 | Chien-Wei Chang | Structure and method for fine pitch flip chip substrate |
KR101012239B1 (ko) * | 2002-11-27 | 2011-02-08 | 스미토모 베이클리트 컴퍼니 리미티드 | 회로 기판, 다층 배선판, 회로 기판의 제조 방법 및 다층배선판의 제조 방법 |
CN100469221C (zh) * | 2002-12-09 | 2009-03-11 | 野田士克林股份有限公司 | 印刷电路板的制造方法 |
JP2004282033A (ja) * | 2003-02-28 | 2004-10-07 | Ngk Spark Plug Co Ltd | 樹脂製配線基板 |
US6759318B1 (en) * | 2003-04-15 | 2004-07-06 | Kinsus Interconnect Technology Corp. | Translation pad flip chip (TPFC) method for improving micro bump pitch IC substrate structure and manufacturing process |
KR100567087B1 (ko) * | 2003-10-20 | 2006-03-31 | 삼성전기주식회사 | 층간 전기 접속이 향상된 병렬적 다층 인쇄회로기판 제조방법 |
US8345433B2 (en) * | 2004-07-08 | 2013-01-01 | Avx Corporation | Heterogeneous organic laminate stack ups for high frequency applications |
JP4287458B2 (ja) * | 2005-11-16 | 2009-07-01 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | ペーストバンプを用いた印刷回路基板およびその製造方法 |
TWI350793B (en) * | 2006-03-08 | 2011-10-21 | E Ink Corp | Methods for production of electro-optic displays |
US7439840B2 (en) | 2006-06-27 | 2008-10-21 | Jacket Micro Devices, Inc. | Methods and apparatuses for high-performing multi-layer inductors |
US7808434B2 (en) * | 2006-08-09 | 2010-10-05 | Avx Corporation | Systems and methods for integrated antennae structures in multilayer organic-based printed circuit devices |
US20080053688A1 (en) * | 2006-09-01 | 2008-03-06 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and method of manufacturing the same |
JP2008108791A (ja) * | 2006-10-23 | 2008-05-08 | Fujifilm Corp | 多層プリント配線基板及び多層プリント配線基板の作製方法 |
US7989895B2 (en) | 2006-11-15 | 2011-08-02 | Avx Corporation | Integration using package stacking with multi-layer organic substrates |
CN102405692A (zh) * | 2009-04-02 | 2012-04-04 | 松下电器产业株式会社 | 电路基板的控制方法及电路基板 |
JP5476906B2 (ja) * | 2009-10-05 | 2014-04-23 | 富士通株式会社 | 配線基板の製造方法及び配線基板の設計方法 |
JP5450885B2 (ja) * | 2010-04-02 | 2014-03-26 | インクテック カンパニー リミテッド | 両面プリント回路基板の製造方法 |
US8716867B2 (en) | 2010-05-12 | 2014-05-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Forming interconnect structures using pre-ink-printed sheets |
CN106455369A (zh) * | 2010-06-03 | 2017-02-22 | Ddi环球有限公司 | 利用盲过孔和内部微过孔以耦联子组件来制造印刷电路板的系统和方法 |
US9532465B2 (en) | 2012-03-28 | 2016-12-27 | Ttm Technologies, Inc. | Method of fabricating a printed circuit board interconnect assembly |
CN103517558B (zh) * | 2012-06-20 | 2017-03-22 | 碁鼎科技秦皇岛有限公司 | 封装基板制作方法 |
JP5400235B1 (ja) * | 2012-11-09 | 2014-01-29 | 太陽誘電株式会社 | 電子部品内蔵基板 |
US9288917B2 (en) * | 2013-11-07 | 2016-03-15 | Unimicron Technology Corp. | Manufacturing method for multi-layer circuit board |
US9818682B2 (en) * | 2014-12-03 | 2017-11-14 | International Business Machines Corporation | Laminate substrates having radial cut metallic planes |
WO2020045528A1 (ja) * | 2018-08-31 | 2020-03-05 | 株式会社村田製作所 | 配線基板およびモジュール |
CN114126225A (zh) * | 2020-08-31 | 2022-03-01 | 庆鼎精密电子(淮安)有限公司 | 电路基板的制造方法、电路板及其制造方法 |
DE102020133220B3 (de) | 2020-12-11 | 2022-02-17 | I.T.C.Intercircuit Electronic GmbH | Verfahren zum Füllen von mindestens einem in einer Leiterplatte ausgebildeten Loch, derart gefüllte Leiterplatte und Fahrzeug, welches eine solche Leiterplatte aufweist |
CN116504771B (zh) * | 2023-06-27 | 2023-12-08 | 长春希达电子技术有限公司 | 一种Micro-LED驱动面板及其制备方法 |
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JPS62244156A (ja) | 1986-04-16 | 1987-10-24 | Ibiden Co Ltd | 表面実装用パツケ−ジ |
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JPH077264A (ja) | 1993-06-15 | 1995-01-10 | Nec Toyama Ltd | 印刷配線板の製造方法 |
JPH0714942A (ja) | 1993-06-15 | 1995-01-17 | Shinko Electric Ind Co Ltd | 半導体装置 |
JP3474897B2 (ja) | 1993-10-08 | 2003-12-08 | 株式会社東芝 | 印刷配線板及びその製造方法 |
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JP3474910B2 (ja) | 1994-02-16 | 2003-12-08 | 株式会社東芝 | 印刷配線板の製造方法 |
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JP3207663B2 (ja) | 1994-03-22 | 2001-09-10 | 松下電器産業株式会社 | プリント配線基板及びその製造方法 |
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JPH08172270A (ja) | 1994-12-15 | 1996-07-02 | Toshiba Chem Corp | 印刷配線板の製造方法 |
JPH08213748A (ja) | 1995-01-31 | 1996-08-20 | Mitsui High Tec Inc | 基板およびその製造方法 |
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JPH10117067A (ja) * | 1996-10-11 | 1998-05-06 | Shinko Electric Ind Co Ltd | 多層配線基板及びその製造方法 |
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-
1998
- 1998-06-05 WO PCT/JP1998/002497 patent/WO1998056219A1/ja active IP Right Grant
- 1998-06-05 DE DE69839964T patent/DE69839964D1/de not_active Expired - Lifetime
- 1998-06-05 EP EP98923141A patent/EP1009205B1/de not_active Expired - Lifetime
- 1998-06-05 DE DE69839882T patent/DE69839882D1/de not_active Expired - Lifetime
- 1998-06-05 WO PCT/JP1998/002498 patent/WO1998056220A1/ja active IP Right Grant
- 1998-06-05 EP EP98923140A patent/EP1009204B1/de not_active Expired - Lifetime
-
1999
- 1999-12-02 US US09/454,905 patent/US6586686B1/en not_active Expired - Lifetime
- 1999-12-03 US US09/453,636 patent/US6518513B1/en not_active Expired - Lifetime
-
2003
- 2003-02-05 US US10/358,933 patent/US20030141108A1/en not_active Abandoned
-
2005
- 2005-10-06 US US11/244,728 patent/US7721427B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
WO1998056220A1 (fr) | 1998-12-10 |
EP1009205B1 (de) | 2008-09-03 |
US20060037193A1 (en) | 2006-02-23 |
US6518513B1 (en) | 2003-02-11 |
US20030141108A1 (en) | 2003-07-31 |
EP1009205A1 (de) | 2000-06-14 |
WO1998056219A1 (fr) | 1998-12-10 |
EP1009204A4 (de) | 2004-06-23 |
EP1009204A1 (de) | 2000-06-14 |
DE69839882D1 (de) | 2008-09-25 |
US6586686B1 (en) | 2003-07-01 |
US7721427B2 (en) | 2010-05-25 |
EP1009204B1 (de) | 2008-08-13 |
EP1009205A4 (de) | 2004-06-23 |
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