ES2094003T3 - Resistencia electrica bajo forma de placa de circuito impreso de montaje en superficie y su procedimiento de fabricacion. - Google Patents
Resistencia electrica bajo forma de placa de circuito impreso de montaje en superficie y su procedimiento de fabricacion.Info
- Publication number
- ES2094003T3 ES2094003T3 ES94105581T ES94105581T ES2094003T3 ES 2094003 T3 ES2094003 T3 ES 2094003T3 ES 94105581 T ES94105581 T ES 94105581T ES 94105581 T ES94105581 T ES 94105581T ES 2094003 T3 ES2094003 T3 ES 2094003T3
- Authority
- ES
- Spain
- Prior art keywords
- circuit board
- printed circuit
- resistive
- surface mounted
- electrical resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/08—Cooling, heating or ventilating arrangements
- H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C13/00—Resistors not provided for elsewhere
- H01C13/02—Structural combinations of resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09281—Layout details of a single conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09772—Conductors directly under a component but not electrically connected to the component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10022—Non-printed resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49099—Coating resistive material on a base
Abstract
UNA RESISTENCIA EN FORMA DE CONSTRUCCION SMD CONTIENE COMO PISTA (5) DE RESISTENCIA UNA LAMINA A BASE DE UNA ALEACION DE RESISTENCIA COMPUESTA DE DOS ELEMENTOS (10A,10B) DE PLACA SOPORTE SEPARADOS ELECTRICAMENTE A BASE DE COBRE, QUE ESTAN CONFIGURADOS SOBRE EL CONDUCTOR DE CONEXION DE UN ELEMENTO DE CONTACTO SOLDABLE EN LA PLACA DE CIRCUITO IMPRESO Y CON ELLO SIRVEN PARA UNA DERIVACION DE CALOR ADECUADA EN LA PLACA DE CIRCUITO IMPRESO. PARA LA ELABORACION DE UNA RESISTENCIA DE ESTE TIPO SE PEGA UNA LAMINA DE RESISTENCIA COMPENSADA PARA UNA MULTIPLICIDAD DE RESISTENCIAS INDIVIDUALES SOBRE UNA CHAPA DE COBRE GRANDE CORRESPONDIENTE. EL LAMINADO CONFIGURADO CON ELLO SE DIVIDE DESPUES DE LA GENERACION DE LAS PISTAS DE RESISTENCIA INDIVIDUALES Y DE LAS UNIONES ELECTRICAS CON LA CHAPA DE COBRE DESPUES DE LA GENERACION DE LOS ESPACIOS (11) ENTRE LOS ELEMENTOS (10A,10B) DE LA PLACA EN LAS RESISTENCIAS INDIVIDUALES.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4339551A DE4339551C1 (de) | 1993-11-19 | 1993-11-19 | Widerstand in SMD-Bauweise und Verfahren zu seiner Herstellung sowie Leiterplatte mit solchem Widerstand |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2094003T3 true ES2094003T3 (es) | 1997-01-01 |
Family
ID=6503005
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES94105581T Expired - Lifetime ES2094003T3 (es) | 1993-11-19 | 1994-04-11 | Resistencia electrica bajo forma de placa de circuito impreso de montaje en superficie y su procedimiento de fabricacion. |
Country Status (6)
Country | Link |
---|---|
US (2) | US5563572A (es) |
EP (1) | EP0654799B1 (es) |
JP (1) | JP2649491B2 (es) |
AT (1) | ATE143170T1 (es) |
DE (2) | DE4339551C1 (es) |
ES (1) | ES2094003T3 (es) |
Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2316541B (en) * | 1994-06-09 | 1998-11-18 | Chipscale Inc | Resistor fabrication |
KR100358446B1 (ko) * | 1994-06-09 | 2003-01-29 | 칩스케일 인코포레이티드 | 저항기제조방법 |
DE19534056A1 (de) * | 1995-09-14 | 1997-03-20 | Braun Ag | Schaltungsanordnung zur Erkennung einer Übertemperatur aufgrund eines fließenden Stromes |
TW335595B (en) * | 1996-09-09 | 1998-07-01 | Philips Electronics Nv | Electric component which can be mounted on the surface of a printed circuit board as well as a method of manufacturiing such components |
DE19646441A1 (de) * | 1996-11-11 | 1998-05-14 | Heusler Isabellenhuette | Elektrischer Widerstand und Verfahren zu seiner Herstellung |
US5904496A (en) | 1997-01-24 | 1999-05-18 | Chipscale, Inc. | Wafer fabrication of inside-wrapped contacts for electronic devices |
IT1291779B1 (it) | 1997-02-17 | 1999-01-21 | Magnetek Spa | Procedimento per la realizzazione di circuiti stampati e circuiti stampati cosi'ottenuti |
US6159817A (en) * | 1998-05-07 | 2000-12-12 | Electro-Films Incorporated | Multi-tap thin film inductor |
JP3803025B2 (ja) | 2000-12-05 | 2006-08-02 | 富士電機ホールディングス株式会社 | 抵抗器 |
DE10122468C1 (de) * | 2001-05-09 | 2003-03-20 | Heusler Isabellenhuette | Elektrischer Widerstand und Verfahren zu seiner Herstellung |
EP1258891A2 (en) * | 2001-05-17 | 2002-11-20 | Shipley Co. L.L.C. | Resistors |
DE10158416C1 (de) * | 2001-11-29 | 2003-07-17 | Karlsruhe Forschzent | Multi-Kugelschalter-Anordnung in Schicht-/Plattenbauweise |
DE10203813A1 (de) * | 2002-01-31 | 2003-08-21 | Diehl Ako Stiftung Gmbh & Co | Schaltungsanordnung zur Messung und Begrenzung von Strömen |
US20040201447A1 (en) * | 2003-04-14 | 2004-10-14 | Wong Marvin Glenn | Thin-film resistor device |
DE10328870A1 (de) * | 2003-06-26 | 2005-01-20 | Isabellenhütte Heusler GmbH KG | Widerstandsanordnung, Herstellungsverfahren und Messschaltung |
US7052925B2 (en) * | 2004-04-08 | 2006-05-30 | International Business Machines Corporation | Method for manufacturing self-compensating resistors within an integrated circuit |
US20060034029A1 (en) * | 2004-08-13 | 2006-02-16 | Cyntec Company | Current detector with improved resistance adjustable range and heat dissipation |
US7190252B2 (en) * | 2005-02-25 | 2007-03-13 | Vishay Dale Electronics, Inc. | Surface mount electrical resistor with thermally conductive, electrically insulative filler and method for using same |
DE202006020215U1 (de) * | 2006-12-20 | 2008-02-21 | Isabellenhütte Heusler Gmbh & Co. Kg | Widerstand, insbesondere SMD-Widerstand |
JP2008275418A (ja) * | 2007-04-27 | 2008-11-13 | Omron Corp | 配線基板、電流検出装置 |
US8112884B2 (en) | 2007-10-08 | 2012-02-14 | Honeywell International Inc. | Method for providing an efficient thermal transfer through a printed circuit board |
JP5464829B2 (ja) * | 2008-04-28 | 2014-04-09 | ローム株式会社 | チップ抵抗器およびその製造方法 |
JP2014060463A (ja) * | 2008-05-14 | 2014-04-03 | Rohm Co Ltd | チップ抵抗器およびその製造方法 |
JP2009302494A (ja) * | 2008-05-14 | 2009-12-24 | Rohm Co Ltd | チップ抵抗器およびその製造方法 |
US8325007B2 (en) * | 2009-12-28 | 2012-12-04 | Vishay Dale Electronics, Inc. | Surface mount resistor with terminals for high-power dissipation and method for making same |
DE102011120276B4 (de) * | 2011-12-05 | 2015-05-07 | Isabellenhütte Heusler Gmbh & Co. Kg | Strommesswiderstand |
US8687369B2 (en) | 2012-02-20 | 2014-04-01 | Apple Inc. | Apparatus for creating resistive pathways |
US8823483B2 (en) | 2012-12-21 | 2014-09-02 | Vishay Dale Electronics, Inc. | Power resistor with integrated heat spreader |
JP2014165194A (ja) * | 2013-02-21 | 2014-09-08 | Rohm Co Ltd | チップ抵抗器、およびチップ抵抗器の製造方法 |
JP6120629B2 (ja) * | 2013-03-22 | 2017-04-26 | ローム株式会社 | チップ抵抗器、およびチップ抵抗器の製造方法 |
JP6295410B2 (ja) * | 2013-12-05 | 2018-03-20 | パナソニックIpマネジメント株式会社 | チップ抵抗器の抵抗値測定方法およびチップ抵抗器の実装方法 |
JP6398749B2 (ja) * | 2015-01-28 | 2018-10-03 | 三菱マテリアル株式会社 | 抵抗器及び抵抗器の製造方法 |
US10083781B2 (en) * | 2015-10-30 | 2018-09-25 | Vishay Dale Electronics, Llc | Surface mount resistors and methods of manufacturing same |
US10141088B2 (en) * | 2015-12-22 | 2018-11-27 | Panasonic Intellectual Property Management Co., Ltd. | Resistor |
JP2017163165A (ja) * | 2017-06-21 | 2017-09-14 | ローム株式会社 | チップ抵抗器、およびチップ抵抗器の製造方法 |
CN107359035A (zh) * | 2017-07-13 | 2017-11-17 | 中国振华集团云科电子有限公司 | 片式固定电阻器的制造方法与片式固定电阻器 |
US10438729B2 (en) | 2017-11-10 | 2019-10-08 | Vishay Dale Electronics, Llc | Resistor with upper surface heat dissipation |
JP6573957B2 (ja) * | 2017-12-12 | 2019-09-11 | Koa株式会社 | 抵抗器の製造方法 |
JP6573956B2 (ja) * | 2017-12-12 | 2019-09-11 | Koa株式会社 | 抵抗器の製造方法 |
DE102018121902A1 (de) * | 2018-09-07 | 2020-03-12 | Isabellenhütte Heusler Gmbh & Co. Kg | Herstellungsverfahren für ein elektrisches Widerstandselement und entsprechendes Widerstandselement |
JP6732996B2 (ja) * | 2019-04-15 | 2020-07-29 | ローム株式会社 | チップ抵抗器 |
KR102300015B1 (ko) * | 2019-12-12 | 2021-09-09 | 삼성전기주식회사 | 저항 부품 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2101441A (en) * | 1934-01-12 | 1937-12-07 | Int Resistance Co | Rheostat or potentiometer |
US2291246A (en) * | 1937-01-07 | 1942-07-28 | Int Resistance Co | Volume control |
US3775725A (en) * | 1970-04-30 | 1973-11-27 | Hokuriku Elect Ind | Printed resistor |
US3761860A (en) * | 1970-05-20 | 1973-09-25 | Alps Electric Co Ltd | Printed circuit resistor |
DE2834906C2 (de) * | 1978-08-09 | 1983-01-05 | Siemens AG, 1000 Berlin und 8000 München | Elektrische Hochfrequenz-Folienschaltung und Verfahren zu ihrer Herstellung |
US4301439A (en) * | 1978-12-26 | 1981-11-17 | Electro Materials Corp. Of America | Film type resistor and method of producing same |
DE3035717C2 (de) * | 1980-09-22 | 1983-08-25 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur serienmäßigen Herstellung von Folienwiderständen oder Netzwerken von Folienwiderständen |
JPS60145594U (ja) * | 1984-03-02 | 1985-09-27 | 東京コスモス電機株式会社 | 面状発熱体用抵抗体 |
US4628167A (en) * | 1985-06-27 | 1986-12-09 | Tocco, Inc. | Apparatus for inductively hardneing the interior surface of objects |
US4792781A (en) * | 1986-02-21 | 1988-12-20 | Tdk Corporation | Chip-type resistor |
US4716396A (en) * | 1986-07-10 | 1987-12-29 | Dale Electronics, Inc. | High power density, low corona resistor |
JPS646006U (es) * | 1987-06-30 | 1989-01-13 | ||
FR2653588B1 (fr) * | 1989-10-20 | 1992-02-07 | Electro Resistance | Resistance electrique sous forme de puce a montage de surface et son procede de fabrication. |
US5216404A (en) * | 1990-07-25 | 1993-06-01 | Matsushita Electric Industrial Co., Ltd. | Sic thin-film thermistor |
DE9015206U1 (es) * | 1990-11-05 | 1991-01-17 | Isabellenhuette Heusler Gmbh Kg, 6340 Dillenburg, De | |
US5181313A (en) * | 1990-12-19 | 1993-01-26 | United Technologies Automotive | Method of making a variable power resistor |
DE4143217A1 (de) * | 1991-01-18 | 1992-07-23 | Tech Wissenschaftliche Ges Thi | Chipwiderstand und chip-leiterbahnbruecke in duennschichttechnik und verfahren zu deren herstellung |
DE69213296T2 (de) * | 1991-04-16 | 1997-03-20 | Philips Electronics Nv | SMD-Widerstand |
US5179366A (en) * | 1991-06-24 | 1993-01-12 | Motorola, Inc. | End terminated high power chip resistor assembly |
JP3294331B2 (ja) * | 1992-08-28 | 2002-06-24 | ローム株式会社 | チップ抵抗器及びその製造方法 |
US5379017A (en) * | 1993-10-25 | 1995-01-03 | Rohm Co., Ltd. | Square chip resistor |
US5540055A (en) * | 1995-01-24 | 1996-07-30 | Kee; Kum | Suction and exhaust connection device |
-
1993
- 1993-11-19 DE DE4339551A patent/DE4339551C1/de not_active Expired - Fee Related
-
1994
- 1994-04-11 ES ES94105581T patent/ES2094003T3/es not_active Expired - Lifetime
- 1994-04-11 EP EP94105581A patent/EP0654799B1/de not_active Expired - Lifetime
- 1994-04-11 DE DE59400691T patent/DE59400691D1/de not_active Expired - Lifetime
- 1994-04-11 AT AT94105581T patent/ATE143170T1/de not_active IP Right Cessation
- 1994-05-16 JP JP6126824A patent/JP2649491B2/ja not_active Expired - Lifetime
- 1994-05-23 US US08/247,596 patent/US5563572A/en not_active Expired - Fee Related
-
1996
- 1996-05-14 US US08/649,133 patent/US5683566A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE59400691D1 (de) | 1996-10-24 |
JPH07192902A (ja) | 1995-07-28 |
EP0654799B1 (de) | 1996-09-18 |
ATE143170T1 (de) | 1996-10-15 |
US5683566A (en) | 1997-11-04 |
JP2649491B2 (ja) | 1997-09-03 |
DE4339551C1 (de) | 1994-10-13 |
EP0654799A1 (de) | 1995-05-24 |
US5563572A (en) | 1996-10-08 |
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FG2A | Definitive protection |
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