JP6573957B2 - 抵抗器の製造方法 - Google Patents
抵抗器の製造方法 Download PDFInfo
- Publication number
- JP6573957B2 JP6573957B2 JP2017237821A JP2017237821A JP6573957B2 JP 6573957 B2 JP6573957 B2 JP 6573957B2 JP 2017237821 A JP2017237821 A JP 2017237821A JP 2017237821 A JP2017237821 A JP 2017237821A JP 6573957 B2 JP6573957 B2 JP 6573957B2
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- Prior art keywords
- resistor
- heat conductive
- conductive layer
- electrode plate
- curing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 title claims description 33
- 229920005989 resin Polymers 0.000 claims description 29
- 239000011347 resin Substances 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 12
- 238000003825 pressing Methods 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 91
- 239000000463 material Substances 0.000 description 13
- 239000011241 protective layer Substances 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 11
- 239000000945 filler Substances 0.000 description 9
- 230000017525 heat dissipation Effects 0.000 description 7
- 238000007747 plating Methods 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000001938 differential scanning calorimetry curve Methods 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000001382 dynamic differential scanning calorimetry Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000002076 thermal analysis method Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
- H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/148—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
- H01C1/028—Housing; Enclosing; Embedding; Filling the housing or enclosure the resistive element being embedded in insulation with outer enclosing sheath
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C13/00—Resistors not provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/07—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by resistor foil bonding, e.g. cladding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/003—Thick film resistors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Details Of Resistors (AREA)
Description
本実施形態の抵抗器の製造方法に関し、図面を用いながら以下、製造工程順に説明する。
以上の製造工程を経て製造された抵抗器11は、図7Bや図7Cに示すように、抵抗体2と、抵抗体2の両側に配置され、抵抗体2の下面側に折り曲げられた電極板3と、抵抗体2と電極板3との間に介在する、硬化された熱伝導層4と、を有することを特徴とする。
ポリイミド・エポキシ樹脂
[示差走査型熱量計]
株式会社リガク製のDSC8231
2 :抵抗体
3 :電極板
4 :熱伝導層
5 :第2熱伝導層
6 :切欠き
7 :保護層
7a :表面保護層
7b :底面保護層
8 :メッキ層
10 :抵抗器中間体
11 :抵抗器
Claims (2)
- 抵抗体の表面に、未硬化で固化した状態の熱伝導層である熱伝導性樹脂フィルムを貼り合わせる工程、
前記熱伝導性樹脂フィルムを半硬化する工程、
前記抵抗体の両側に配置された電極板を折り曲げて、前記熱伝導性樹脂フィルムに接触させた状態で、前記熱伝導性樹脂フィルムを更に硬化させ、前記抵抗体と電極板の間を、前記熱伝導性樹脂フィルムにより接着する工程、
を有することを特徴とする抵抗器の製造方法。 - 折り曲げた前記電極板に圧力を加えながら前記熱伝導層を硬化させることを特徴とする請求項1に記載の抵抗器の製造方法。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017237821A JP6573957B2 (ja) | 2017-12-12 | 2017-12-12 | 抵抗器の製造方法 |
EP18888116.3A EP3726542A4 (en) | 2017-12-12 | 2018-12-11 | RESISTANCE MANUFACTURING PROCESS |
US16/771,334 US10892074B2 (en) | 2017-12-12 | 2018-12-11 | Method for manufacturing resistor |
KR1020207018162A KR102296639B1 (ko) | 2017-12-12 | 2018-12-11 | 저항기의 제조 방법 |
CN201880079884.0A CN111465999B (zh) | 2017-12-12 | 2018-12-11 | 电阻器的制造方法 |
PCT/JP2018/045457 WO2019117128A1 (ja) | 2017-12-12 | 2018-12-11 | 抵抗器の製造方法 |
US16/903,674 US11011290B2 (en) | 2017-12-12 | 2020-06-17 | Method for manufacturing resistor, and resistor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017237821A JP6573957B2 (ja) | 2017-12-12 | 2017-12-12 | 抵抗器の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019106449A JP2019106449A (ja) | 2019-06-27 |
JP6573957B2 true JP6573957B2 (ja) | 2019-09-11 |
Family
ID=66819626
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017237821A Active JP6573957B2 (ja) | 2017-12-12 | 2017-12-12 | 抵抗器の製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10892074B2 (ja) |
EP (1) | EP3726542A4 (ja) |
JP (1) | JP6573957B2 (ja) |
KR (1) | KR102296639B1 (ja) |
CN (1) | CN111465999B (ja) |
WO (1) | WO2019117128A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11011290B2 (en) * | 2017-12-12 | 2021-05-18 | Koa Corporation | Method for manufacturing resistor, and resistor |
DE102022113553A1 (de) * | 2022-05-30 | 2023-11-30 | Isabellenhütte Heusler Gmbh & Co. Kg | Herstellungsverfahren für einen elektrischen Widerstand |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2745931A (en) * | 1953-03-25 | 1956-05-15 | Erie Resistor Corp | Resistors and method of making the same |
JPS6015319Y2 (ja) * | 1976-07-19 | 1985-05-14 | 北陸電気工業株式会社 | リ−ドフレ−ム |
DE3027122A1 (de) * | 1980-07-17 | 1982-02-11 | Siemens AG, 1000 Berlin und 8000 München | Chip-widerstand |
JPS59177929U (ja) * | 1983-05-13 | 1984-11-28 | 日本電気株式会社 | 樹脂外装形電子部品 |
JPS62290581A (ja) | 1986-06-09 | 1987-12-17 | Mitsubishi Paper Mills Ltd | 熱転写記録材料 |
DE4143217A1 (de) * | 1991-01-18 | 1992-07-23 | Tech Wissenschaftliche Ges Thi | Chipwiderstand und chip-leiterbahnbruecke in duennschichttechnik und verfahren zu deren herstellung |
US5179366A (en) * | 1991-06-24 | 1993-01-12 | Motorola, Inc. | End terminated high power chip resistor assembly |
DE4202824C2 (de) * | 1992-01-31 | 1995-01-05 | Fraunhofer Ges Forschung | Chip-Bauelement und Verfahren zu dessen Herstellung |
DE4339551C1 (de) * | 1993-11-19 | 1994-10-13 | Heusler Isabellenhuette | Widerstand in SMD-Bauweise und Verfahren zu seiner Herstellung sowie Leiterplatte mit solchem Widerstand |
JPH09181448A (ja) * | 1995-12-25 | 1997-07-11 | Matsushita Electric Works Ltd | 多層配線板の製造方法 |
US5739743A (en) * | 1996-02-05 | 1998-04-14 | Emc Technology, Inc. | Asymmetric resistor terminal |
JP3846986B2 (ja) * | 1997-11-21 | 2006-11-15 | 北陸電気工業株式会社 | チップ抵抗器の製造方法 |
TW404969B (en) | 1998-02-23 | 2000-09-11 | Asahi Chemical Ind | Curable polyphenylene ether resin composition and the uses thereof |
JP2003272453A (ja) * | 2002-03-13 | 2003-09-26 | Kanegafuchi Chem Ind Co Ltd | 半導電性無機フィラー及びその製造方法ならびに半導電性樹脂組成物 |
JP4012029B2 (ja) * | 2002-09-30 | 2007-11-21 | コーア株式会社 | 金属板抵抗器およびその製造方法 |
US20040156177A1 (en) | 2003-02-12 | 2004-08-12 | Matsushita Electric Industrial Co., Ltd. | Package of electronic components and method for producing the same |
JP4128106B2 (ja) * | 2003-05-21 | 2008-07-30 | 北陸電気工業株式会社 | シャント抵抗器及びその製造方法 |
US7190252B2 (en) | 2005-02-25 | 2007-03-13 | Vishay Dale Electronics, Inc. | Surface mount electrical resistor with thermally conductive, electrically insulative filler and method for using same |
JPWO2007043360A1 (ja) * | 2005-10-11 | 2009-04-16 | 株式会社村田製作所 | 正特性サーミスタ装置 |
US8164415B2 (en) | 2005-11-07 | 2012-04-24 | Tyco Electronics Japan G.K. | PTC device |
EP2215639A1 (en) * | 2007-09-27 | 2010-08-11 | Vishay Dale Electronics, Inc. | Power resistor |
US8325007B2 (en) * | 2009-12-28 | 2012-12-04 | Vishay Dale Electronics, Inc. | Surface mount resistor with terminals for high-power dissipation and method for making same |
US8872358B2 (en) * | 2012-02-07 | 2014-10-28 | Shin-Etsu Chemical Co., Ltd. | Sealant laminated composite, sealed semiconductor devices mounting substrate, sealed semiconductor devices forming wafer, semiconductor apparatus, and method for manufacturing semiconductor apparatus |
US8823483B2 (en) * | 2012-12-21 | 2014-09-02 | Vishay Dale Electronics, Inc. | Power resistor with integrated heat spreader |
EP3035397B1 (en) * | 2013-09-25 | 2018-04-11 | Lintec Corporation | Heat-conductive adhesive sheet, manufacturing method for same, and electronic device using same |
US20150194553A1 (en) * | 2014-01-08 | 2015-07-09 | Taiflex Scientific Co., Ltd. | Thermally conductive encapsulate and solar cell module comprising the same |
US11438973B2 (en) * | 2014-04-10 | 2022-09-06 | Metis Design Corporation | Multifunctional assemblies |
TWI600354B (zh) * | 2014-09-03 | 2017-09-21 | 光頡科技股份有限公司 | 具高彎折力之微電阻結構及其製造方法 |
KR101853170B1 (ko) * | 2015-12-22 | 2018-04-27 | 삼성전기주식회사 | 칩 저항기 및 그 제조 방법 |
US10438729B2 (en) * | 2017-11-10 | 2019-10-08 | Vishay Dale Electronics, Llc | Resistor with upper surface heat dissipation |
-
2017
- 2017-12-12 JP JP2017237821A patent/JP6573957B2/ja active Active
-
2018
- 2018-12-11 EP EP18888116.3A patent/EP3726542A4/en active Pending
- 2018-12-11 CN CN201880079884.0A patent/CN111465999B/zh active Active
- 2018-12-11 US US16/771,334 patent/US10892074B2/en active Active
- 2018-12-11 KR KR1020207018162A patent/KR102296639B1/ko active IP Right Grant
- 2018-12-11 WO PCT/JP2018/045457 patent/WO2019117128A1/ja unknown
Also Published As
Publication number | Publication date |
---|---|
US10892074B2 (en) | 2021-01-12 |
US20200343028A1 (en) | 2020-10-29 |
KR20200090867A (ko) | 2020-07-29 |
CN111465999A (zh) | 2020-07-28 |
CN111465999B (zh) | 2022-04-15 |
KR102296639B1 (ko) | 2021-09-02 |
JP2019106449A (ja) | 2019-06-27 |
EP3726542A1 (en) | 2020-10-21 |
EP3726542A4 (en) | 2021-09-01 |
WO2019117128A1 (ja) | 2019-06-20 |
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