TWI459878B - 包含鹵-烴類聚合物塗層之電路板裝置及其製備方法 - Google Patents

包含鹵-烴類聚合物塗層之電路板裝置及其製備方法 Download PDF

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Publication number
TWI459878B
TWI459878B TW098127585A TW98127585A TWI459878B TW I459878 B TWI459878 B TW I459878B TW 098127585 A TW098127585 A TW 098127585A TW 98127585 A TW98127585 A TW 98127585A TW I459878 B TWI459878 B TW I459878B
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Taiwan
Prior art keywords
coating
layer
substrate
wire
circuit board
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TW098127585A
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English (en)
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TW201014483A (en
Inventor
Frank Ferdinandi
Rodney Edward Smith
Mark Robson Humphries
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Semblant Ltd
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Priority claimed from GB0815096A external-priority patent/GB2462824A/en
Priority claimed from GB0815095A external-priority patent/GB2462823A/en
Priority claimed from GB0815094A external-priority patent/GB2462822B/en
Application filed by Semblant Ltd filed Critical Semblant Ltd
Publication of TW201014483A publication Critical patent/TW201014483A/zh
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Publication of TWI459878B publication Critical patent/TWI459878B/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
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    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K1/00—Printed circuits
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Description

包含鹵-烴類聚合物塗層之電路板裝置及其製備方法 技術領域
本揭露一般係有關於聚合物塗層，且更特別地，係一種用於電裝置之鹵-烴類聚合物塗層。
 背景
許多電裝置包含與印刷電路板(PCB)焊接之電組件。電組件及PCB上之金屬表面通常與焊接在一起前氧化或腐蝕。金屬表面之氧化及腐蝕會阻礙強烈焊料接頭被形成或會降低此等點之壽命。因此，此等電裝置可能有缺失或可能無法依所欲作用。
 概要
於某些實施例，一印刷電路板(PCB)包含一基材，其包含一絕緣材料。PCB進一步包含多數個附接至此基材之至少一表面之導電軌。PCB進一步包含一沈積於此基材之此至少一表面上之塗層。此塗層可覆蓋此多數個導電軌之至少一部份，且可包含至少一鹵-烴類聚合物。PCB可進一步包含至少一導線，其係藉由一線結合(wire bond)與至少一導電軌連接，其中，此線結合係於無事先移除此塗層而經由此塗層形成，如此，此線結合鄰接此塗層。
於其它實施例，一PCB包含一基材，其包含一絕緣材料。此PCB進一步包含多數個與此基材之至少一表面附接之導電軌。此PCB進一步包含一沈積於此基材之此至少一表面上之多層塗層。此多層塗層(i)覆蓋此多數個導電軌之至少一部份，及(ii)包含至少一由一鹵-烴類聚合物形成之層。此PCB進一步包含至少一電組件，其係藉由一焊料接頭與至少一導電軌連接，其中，此焊料接頭係經由此多層塗層焊接，如此，此焊料接頭鄰接此多層塗層。
於其它實施例，一種裝置包含一基材，其包含一絕緣材料。此裝置進一步包含一與此基材之至少一表面附接之第一接頭。此裝置進一步包含一沈積於此第一接頭之至少一表面上之塗層。此塗層可包含至少一鹵-烴類聚合物，如此，此第一接頭可操作而於未移除此塗層下經由此塗層使一電信號傳導至一第二接頭。
一或多個實施例可包含一欲進行焊料連接之印刷電路板。該印刷電路板之表面可具有一多層塗層，其包含一或多種聚合物。此等聚合物可選自鹵-烴類聚合物及非鹵-烴類聚合物。此多層塗層之厚度可為1nm至10μm。
一或多個實施例可包含一欲進行焊料連接之印刷電路板。該印刷電路板之表面可具有一多層塗層，其包含一或多種聚合物。依據某些實施例，於該印刷電路板之該塗層與導電軌間可無焊接，或基本上無焊接。
一或多個實施例可包含一欲進行焊料連接之印刷電路板。該印刷電路板之表面可具有一多層塗層，其包含一或多種聚合物。此多層塗層可包含一或多數層之個別聚合物。
一或多個實施例可包含一欲進行焊料連接之印刷電路板。該印刷電路板之表面可具有一多層塗層，其包含一或多種聚合物。此多層塗層可包含不同聚合物之漸變層。
一或多個實施例可包含一欲進行焊料連接之印刷電路板。該印刷電路板之表面可具有一多層塗層，其包含一或多種聚合物。此多層塗層可包含二或更多層。
一或多個實施例可包含一欲進行焊料連接之印刷電路板。該印刷電路板之表面可具有一多層塗層，其包含一或多種聚合物。可與印刷電路板之表面接觸之第一層可包含一非鹵-烴類聚合物。
一或多個實施例可包含一欲進行焊料連接之印刷電路板。該印刷電路板之表面可具有一多層塗層，其包含一或多種聚合物。於某些實施例，於印刷電路板之表面上可無，或基本上無，金屬鹵化物層。
於某些實施例，一種與一具有一多層塗層之印刷電路板連接之方法，包含於一溫度塗敷焊料，及選擇性之助熔劑，至此印刷電路板且持續一段時間，以使此焊料與金屬結合，且組成物係局部地分散及/或吸收及/或蒸發。依據某些實施例，一或多個因素被選擇以便(a)具有良好之焊料流，(b)焊料覆蓋印刷電路板上之基材(典型上係一導電軌或墊)，及(c)產生一強的焊料接頭。此一或多個因素可包含(a)此基材之特徵，(b)此塗層之特徵，(c)此焊料/助熔劑之特徵，(d)焊接輪廓(包含時間及溫度)，(d)分散此塗層之方法，及(e)控制接點周圍之焊料流之方法。
一或多個實施例可包含一種藉由電漿蝕刻、電漿活化、電漿聚合化反應及塗覆，及/或以液體為主之化學蝕刻改良於一印刷電路板上之一包含一或多種鹵-烴類聚合物之塗層之濕潤特徵之方法。
一或多個實施例可包含一種藉由電漿蝕刻、電漿活化、電漿聚合化反應及塗覆，及/或以液體為主之化學蝕刻改良一多層塗層之濕潤特徵之方法。
於某些實施例，一印刷電路板包含一基材及導電軌。該印刷電路板之表面可以(a)一包含一或多種鹵-烴類聚合物之組成物之塗層，或(b)一包含一或多種之選自鹵-烴類聚合物及非鹵-烴類聚合物之聚合物之多層塗層以1nm至10μm之厚度完全或實質上封裝。依據某些實施例，基材包含一吸收水或以溶劑為主之化學品之材料。於某些實施例，此基材包含與環氧樹脂結合之玻璃織物、與合成樹脂結合之紙、酚醛棉紙、棉紙、環氧化物、紙、紙板、織物，或天然或合成之以木材為主之材料。
於某些實施例，一種製備一印刷電路板之方法，包含：(a)提供一具有一曝置於環境之表面之印刷電路板，(b)於一電漿腔室內使用諸如氫、氬或氮之氣體清理此表面，及(c)藉由電漿沈積對此表面塗敷1nm至10μm厚度之一包含鹵-烴類聚合物之組成物，該塗層選擇性地依循印刷電路板之3D形狀。
於某些實施例，一種製備一印刷電路板之方法，包含：(a)提供一具有一曝置於環境之表面之印刷電路板，(b)於一電漿腔室內使用諸如氫、氬或氮之氣體清理此表面，(c)藉由電漿沈積對此表面塗敷1nm至10μm厚度之一包含一或多種聚合物之多層塗層，該塗層選擇性地依循印刷電路板之3D形狀。此聚合物可選自鹵-烴類聚合物及非鹵-烴類聚合物。此多層塗層可選擇性依循印刷電路板之3D形狀。
一或多個實施例可包含使用一包含鹵-烴類聚合物之組成物作為一用於印刷電路板之阻燃性塗層。
於某些實施例，一種使一線材及一基材間連接之方法可使用線結合技術。此線材及/或基材可以一包含一或多種鹵-烴類聚合物之組成物以1nm至2μm之厚度塗覆。於某些實施例，線結合技術係球形/楔形結合。於其它實施例，線結合技術係楔形/楔形結合。依據某些實施例，線材包含金、鋁、銀、鎳，或鐵。於某些實施例，基材包含銅、金、銀、錫、導性聚合物，或導性墨水。
於某些實施例，一種使一線材與一基材間連接之方法可使用線結合技術。於某些實施例，僅此線材以一包含一或多種鹵-烴類聚合物之組成物以1nm至2μm之厚度塗覆。於其它實施例，僅此基材以一包含一或多種鹵-烴類聚合物之組成物以1nm至2μm之厚度塗覆。
於某些實施例，一種使一線材及一基材間連接之方法可使用線結合技術。此線材及/或此基材可以一包含一或多種鹵-烴類聚合物之組成物以10nm至100nm之厚度塗覆。
於某些實施例，一種使一線材與一基材間連接之方法可使用線結合技術。此線材及/或此基材可以一包含一或多種鹵-烴類聚合物之組成物塗覆。於某些實施例，此鹵-烴類聚合物係氟-烴類。
於某些實施例，一種使一線材及一基材間連接之方法可使用線結合技術。此線材及/或此基材可以一包含一或多種鹵-烴類聚合物之組成物塗覆。於某些實施例，鹵-烴類聚合物塗層於線結合後除其間形成連接之區域外係維持完整。依據某些實施例，鹵-烴類聚合物塗層係藉由線結合方法之作用移除及/或分散，而未使此塗層於一個別之預處理步驟移除。於某些實施例，一包含一或多種鹵-烴類聚合物之另外塗層係於形成連接後塗敷。
於某些實施例，鹵-烴類聚合物可用以避免於藉由線結合技術使此線材及此基材間之結合形成前此線材及/或基材氧化及/或腐蝕。依據某些實施例，鹵-烴類聚合物可用以於非惰性氛圍下使用線結合技術形成一線材及一基材間之連接。
於某些實施例，一裝置包含一或多個接頭。該等接頭之至少一者可以一包含一或多種鹵-烴類聚合物之組成物以1nm至2μm之厚度塗覆。
於某些實施例，一裝置包含一上接頭及一下接頭。此裝置可被建構以使此上接頭及下接頭能彼此呈電接觸。此上及/或下接頭可以一包含一或多種鹵-烴類聚合物之組成物以1nm至2μm之厚度塗覆。於某些實施例，此上及下接頭包含不銹鋼、銀、碳、鎳、金、錫，或其等之合金。於某些實施例，此裝置係一鍵盤。
於某些實施例，一感應器裝置包含一或多個感應器元件，且每一感應器元件包含一接頭。此等接頭可以一包含一或多種鹵-烴類聚合物之組成物以1nm至2μm之厚度塗覆。於某些實施例，此一或多個感應器元件係電極。於某些實施例，此等接頭包含碳、導性墨水，及/或以銀裝填之環氧化物。
於某些實施例，一裝置包含一或多個接頭。該等接頭之至少一者可以一包含一或多種鹵-烴類聚合物之組成物以10nm至100nm之厚度塗覆。
於某些實施例，一裝置包含一或多個接頭。該等接頭之至少一者可以一包含一或多種鹵-烴類聚合物之組成物塗覆。於某些實施例，此塗層於z-軸之導電性係高於x-軸及y-軸之導電性。於某些實施例，鹵-烴類聚合物塗層提供環境保護。於某些實施例，此塗層之電阻對於不同應用可被最佳化。
於某些實施例，一裝置包含一或多個接頭。該等接頭之至少一者可以一包含一或多種鹵-烴類聚合物之組成物塗覆。一種用以製備此裝置之方法可包含藉由電漿沈積沈積此鹵-烴類聚合物塗層。於某些實施例，此鹵-烴類聚合物係氟-烴類。
於某些實施例，一感應器元件包含一接頭。此接頭可以一包含一或多種鹵-烴類聚合物之組成物以1nm至2μm之厚度塗覆。
一或多個實施例可包含一種保護一裝置內之一或多個上及下接頭之方法。此裝置可被建構以使該上接頭及下接頭能彼此呈電接觸。此方法可包含以一包含一或多種鹵-烴類聚合物之組成物以1nm至2μm之厚度塗覆此等接頭。於某些實施例，此塗層於製造此裝置前被塗敷。
一或多個實施例可包含一種保護一感應器裝置內之一或多個接頭之方法。此方法可包含以一包含一或多種鹵-烴類聚合物之組成物以1nm至2μm之厚度塗覆此等接觸墊。於某些實施例，此塗層係於製造此裝置前塗敷。於某些實施例，沈積技術係電漿沈積。
於某些實施例，鹵-烴類聚合物可用以塗覆一包含一上接頭及一下接頭之裝置之接頭之一表面或多個表面。此裝置可被建構以使上接頭及下接頭能彼此呈電接觸。於某些實施例，鹵-烴類聚合物可用以塗覆一包含一或多個感應器元件之感應器裝置之一接頭之一表面或多個表面。
使此塗層塗敷至PCB或其它裝置可提供數個優點。各種實施例可具有此等優點之無一者、一些，或全部。一優點係此塗層可避免PCB上之導電軌氧化。PCB通常於電組件焊接至此PCB前貯存一段時間。若PCB未經塗覆，PCB上之導電軌會於貯存期間氧化。一導電軌上之一氧化層可妨礙或阻礙電組件與導電軌之焊接。於貯存前藉由使此塗層塗敷至PCB，製造業者可避免PCB上之導電軌氧化。藉由避免氧化，此塗層可容許於PCB上形成強的焊料接頭。
另一優點係此塗層能使一電組件經由此塗層焊接，而無需事先移除此塗層。此塗層可包含一或多種鹵-烴類聚合物。於某些實施例，焊接處理期間施加之熱、焊料，及/或助熔劑可選擇性改變其間焊料接頭欲被形成之PCB之特定區域上之塗層。於某些實施例，焊接處理可僅移除焊料接頭之區域內之塗層。因此，一旦焊料接頭形成，此塗層可擴展至(例如，鄰接)焊料接頭。因此，製造業者可能無需於焊接處理前蝕刻或以其它方式移除此塗層。藉由去除一個別蝕刻或移除步驟之必要性，此塗層可使PCB組合方法更簡單，較不昂貴，及/或較不費時。
另一優點係此塗層可避免PCB腐蝕。此塗層可於PCB及腐蝕性氣體及/或液體間提供一障壁。於某些實施例，此塗層可阻礙液體及/或水份到達PCB之基材及/或導電軌。此塗層可避免會促成接頭間之短路及/或漏電之樹突物形成。
另一優點係此塗層可沿一指向一經塗覆表面之平面之軸(“z-軸”)展現導性，同時沿與此經塗覆之表面平行之軸作為絕緣體。因此，此塗層可被塗敷至一導性接頭而不會阻礙此接頭將一電信號傳送至一相配合之接頭之能力。因此，於某些實施例，此塗層可避免接頭氧化及/或腐蝕，且不會且礙此等接頭之導性。
其它優點對熟習此項技藝者自說明內容及所附之申請專利範圍可輕易顯知。
圖式簡單說明
為更完全瞭解本發明及進一步之特徵及優點，現考參下列說明，並且結合附圖，其中：第1A-C圖例示依據某些實施例之一印刷電路板(PCB)；第2圖例示依據某些實施例使一塗層沈積於一PCB上；第3A-B圖例示依據某些實施例使一電組件焊接至PCB之導電軌；第4圖例示依據某些實施例之一包含一多層塗層之PCB；第5圖例示依據某些實施例之一包含選擇性塗敷至PCB之特定區域之多層塗層之PCB；第6A-B圖例示依據某些實施例之一包含以一塗層塗覆之接頭之鍵盤；第7圖係一例示依據某些實施例之具有各種厚度之例示塗層之z-軸導性之圖；第8圖例示依據某些實施例之一包含一具有經塗覆之接頭之感應器之測量裝置；第9圖係依據某些實施例之一經由一塗層形成之線結合；第10A圖例示依據某些實施例之於未經塗覆之線材及一經塗覆之接觸表面間形成之球型結合之顯微影像；第10B圖例示依據某些實施例之於一未經塗覆之線材及一經塗覆之接觸表面間之一球型結合之截面圖之顯微影像；第11A圖例示依據某些實施例之未經塗覆線材與一經塗覆之接觸表面間之楔型結合之顯微影像；第11B圖例示一經塗覆之線材與一經塗覆之接觸表面間之一楔型結合之截面圖之顯微影像；且第12圖例示依據某些實施例之一具有一球型結合及一楔型結合之PCB。
 圖式詳細說明
第1A圖例示依據某些實施例之一印刷電路板(PCB)10。PCB 10可機械式支撐及/或電連接與一電路結合之一或多個電組件12。PCB 10可包含一基材14，一或多個導電軌16，一塗層18，及一或多個電組件12。
PCB 10內之基材14可包含一或多個板材，其係機械式支撐一電路之元件。例如，導電軌16及/或電組件12可固定於基材14之至少一表面。基材14可包含避免基材14使PCB 10之電路短路之任何適合絕緣材料。於某些實施例，PCB 10之基材14包含一環氧層合材料、一經合成樹脂結合之紙、一經環氧樹脂結合之玻璃織物(ERBGH)、一複合環氧材料(CEM)、一酚醛棉紙，及/或任何其它適合型式及/或組合之絕緣材料。依據某些實施例，基材14包含紙、紙板、天然及/或合成之以木材為主之材料，及/或其它適合織物。於某些實施例，基材14包含一阻燃性材料，諸如，阻燃物2(Flame Retardant 2)(FR-2)及/或阻燃物4(FR-4)。PCB 10之基材14可包含單一層之絕緣材料或於任何層上具有或不具有導電軌16之多層之相同或相異之絕緣材料。
一或多個導電軌16可固定於基材14之至少一表面。導電軌16一般可操作而於PCB 10之電路之二或更多組件間傳導電信號。因此，導電軌16可作為用以傳導信號之一信號軌跡及/或線材。於某些實施例，導電軌16包含稱為接觸墊之區域。導電軌16之一接觸墊被建構以支撐及/或連接電組件12。導電軌16可包含任何適合之導性材料，諸如，金、鎢、銅、銀、鋁，及/或錫。於某些實施例，導電軌16可包含一或多種導性聚合物及/或導性墨水。
導電軌16可使用任何適合技術於PCB 10之基材14上形成。於某些實施例，導電軌16可使用”消去”技術於基材14上形成。例如，一金屬層(例如，銅箔、鋁箔等)可與基材14之一表面結合，然後，金屬層之不要部份可被移除，留下所欲之導電軌16。金屬層之不要部份可藉由化學蝕刻、光蝕刻、研磨，及/或任何適合技術自基材14移除。於其它實施例，導電軌16可使用”加成”技術(諸如，電鍍、使用一逆遮罩之沈積，及/或任何幾何控制沈積方法)於基材14上形成。
於某些實施例，塗層18可沈積於PCB 10之基材14上之一或多個導電軌16上。塗層18保護導電軌16免於氧化、腐蝕，及/或其它環境危險(例如，液體及/或水份造成之膨脹)。於某些實施例，塗層18係於使電組件12焊接至PCB 10之導電軌16前沈積於基材14之導電軌16上。因此，於塗層18與PCB 10之導電軌16間之一界面20可不具有焊料，或基本上無焊料。塗層18可使電組件12經由塗層18選擇性地焊接至導電軌16，而無需事先移除塗層18。此外，或另外，塗層18可使線材經由塗層18線結合至導電軌16，而無需事先移除塗層18。此外，或另外，塗層18可沿著z-軸22(即，指向固定導電軌16之PCB 10之表面之軸)展現低電阻及/或阻抗，如此，電信號及/或電流可於PCB 10之導電軌16及電組件12間經由塗層18傳導。於此內容，“電流”一辭可指電荷流動，且“信號”一辭可為一隨時間改變及/或隨空間改變之電量(例如，調變代表編碼資訊之電壓、電流，或場強度)。信號可為任何適合型式之信號，諸如，場誘發之信號或電流誘發之信號。
塗層18可包含保護導電軌16免於氧化及/或腐蝕之任何適合材料。於某些實施例，塗層18包含一或多種鹵-烴類聚合物材料。“聚合物”一辭可指於原位自單一及/或多種單體形成之聚合物，線性、分支、接枝，及/或交聯之共聚物，寡聚物，多聚合物，多單體聚合物，聚合物混合物，聚合物之摻合物及/或混合物，接枝之共聚物，及/或互穿式聚合物網絡(IPN)。
“鹵-烴類聚合物”一辭可指具有一直或分支之鏈或環狀之碳結構且具有0、1、2，或3個與此結構內之每一碳原子結合之聚合物。鹵-烴類聚合物內之鹵素原子可為氟、氯、溴，及/或碘。較佳地，鹵-烴類聚合物係氟-烴類聚合物、氯-烴類聚合物，或氟-氯-烴類聚合物，其中，0、1、2，或3個氟或氯原子與此鏈內之每一碳原子結合。於某些實施例，此鏈可經共軛或高度共軛或具有延長共軛之鏈、環，及/或分支。
塗層18內之鹵-烴類聚合物內之鹵素原子可為相同鹵素原子(例如，氟)或鹵素原子(例如，氟及氯)之混合物。於此使用之“鹵-烴類聚合物”一辭可包含含有一或多個不飽和基團(諸如，碳-碳雙及/或三鍵)之聚合物，及/或含有一或多個雜原子(非碳、氫，或鹵素之原子，例如，氮、硫，及/或氧)之聚合物。較佳地，塗層18內之鹵-烴類聚合物包含以聚合物內之總原子數之比例係少於5%之雜原子。鹵-烴類聚合物可具有任何適合之分子量。鹵-烴類聚合物之分子量可依據塗層18之所欲功能而選擇。於一較佳實施例，塗層18內之鹵-烴類聚合物之分子量係大於500amu。塗層18內之鹵-烴類聚合物鏈可為直或分支。於某些實施例，於塗層18內之聚合物鏈間具交聯。
較佳鹵-烴類聚合物之例子包含：
■聚四氟乙烯(PTFE)、PTFE型材料、氟化烴類、氯化氟化烴類、鹵化烴類，及鹵-烴類與共聚物、寡聚物、多聚合物、多單體聚合物、聚合物混合物、互穿式聚合物網絡(IPN)、摻合物、混合物、分支鏈聚合物、接枝共聚物，及此等材料之交聯變化物。於一較佳實施例，塗層18內之鹵-烴類聚合物係聚四氟乙烯(PTFE)型材料，且特別係經改質或未經改質之聚四氟乙烯(PTFE)。
■聚氯三氟乙烯(PCTFE)及共聚物、寡聚物、多聚合物、多單體聚合物、聚合物混合物、互穿式聚合物網絡(IPN)、摻合物、混合物、分支鏈聚合物、接枝共聚物，及此等材料之交聯變化物。
■聚氯三氟乙烯之乙烯共聚物(EPCTFE)及共聚物、寡聚物、多聚合物、多單體聚合物、聚合物混合物、互穿式聚合物網絡(IPN)、摻合物、混合物、分支鏈聚合物、接枝共聚物，及此等材料之交聯變化物。
■乙烯及四氟乙烯之共聚物(ETFE)；四氟乙烯及六氟丙烯之共聚物(FEP)；四氟乙烯及全氟乙烯基醚之共聚物(PFA)；偏氟乙烯之聚合物(PVDF)；四氟乙烯、六氟丙烯，及偏氯乙烯之共聚物(THV)；偏氟乙烯及六氟丙烯之共聚物(PVDFHFP)；四氟乙烯及全氟甲基乙烯基醚之共聚物(MFA)；乙烯、四氟乙烯及六氟丙烯(EFEP)之共聚物；六氟丙烯、四氟乙烯，及乙烯之共聚物(HTE)；偏氟乙烯及氯三氟乙烯之共聚物；及/或其它氟塑料，包含共聚物、寡聚物、多聚合物、多單體聚合物、聚合物混合物、互穿式聚合物網絡(IPN)、摻合物、混合物、分支鏈聚合物、接枝共聚物，及此等材料之交聯變化物。
PCB 10上之塗層18可包含單一層或多層之鹵-烴類聚合物。於一些實施例，塗層18包含於一導性表面上之至少一層鹵-烴類聚合物及至少一層金屬鹵化物(例如，金屬氟化物)。塗層18可具有任何適合厚度24。於某些實施例，塗層18之厚度24可為從1奈米(nm)至10微米(μm)。於其它實施例，塗層18之厚度24可為從1nm至2μm。於其它實施例，塗層18之厚度24可為從1nm至500nm。於其它實施例，塗層18之厚度24可為從3nm至500nm。於其它實施例，塗層18之厚度24可為從10nm至500nm。於其它實施例，塗層18之厚度24可為從10nm至250nm。於其它實施例，塗層18之厚度24可為從10nm至30nm。於其它實施例，塗層18係單層之鹵-烴類聚合物(具有數埃()之厚度24)。於一較佳實施例，塗層18之厚度24係10nm至100nm，呈各種梯度，且100nm係一較佳之厚度24。於某些實施例，塗層18可沈積於基材14及導電軌16上，以使塗層18之一曝露表面係實質上平坦(如第1A圖所例示)。於其它實施例，塗層18可沈積於基材14及導電軌16上，以使塗層18之一曝露表面不平坦，替代地係順從基材14及導電軌16之三維表面(如第1B圖所例示)。
於某些實施例，塗層18可以一連續膜沈積於導電軌16及/或基材14上。依據某些實施例，此連續膜可實質上無孔隙，例如，空隙、裂痕、孔洞，及/或瑕疵。於一些實施例，塗層18之多孔性被建構以提供塗層18所欲滲透性。例如，改變塗層18之多孔性可增加或減少塗層18對液體、化學品、氣體，及/或焊料之滲透性。塗層18之多孔性之改變可為對塗層18內之聚合物之物理性、化學性，及/或結構性之改變。於某些實施例，改變塗層18之表面能量可改變塗層18對液體、化學品、氣體，及/或焊料之滲透性。藉由控制塗層18對穿透液體及/或氣體之表面能量之相對表面能量，可增加或減少塗層18之滲透性。控制塗層18對水及/或其它溶劑之滲透性對於遭受液體環境(例如，水性環境)及/或溶劑(例如，於製造PCB 10時之清理處理期間)之PCB 10係特別期望。於某些實施例，塗層18之多孔性可被建構以使塗層18係選擇性地對特別之材料係可滲透，但對其它材料則否。例如，塗層18可為對水係實質上不可滲透，但對其它液體係可滲透。
於某些實施例，塗層18可包含多數層，且一薄的曝露層(例如，上層)係實質上無孔洞。因此，塗層18之此曝露層可為對氣體、水份，及/或液體係實質上不可滲透。於某些實施例，塗層18之隱蔽層(例如，塗層18之導電軌16及曝露層間之層)可包含使隱蔽層能傳導電流及/或信號之孔洞。
依據某些實施例，塗層18可展現自行復原之性質。於某些實施例，此自行復原之性質可為一使塗層18移動及/或壓縮以回應物理力量，然後，一旦此力量消退，回到其原始結構及/或形狀之機械性質。於其它實施例，此自行復原之性質可使塗層18電自行復原。當一物理力量及/或電力施加至一經塗覆之基材14之一特別區域時，於基材14之此特別區域上之塗層18可被壓縮及/或以其它方式變化。當此物理力量及/或電力消退，此特別區域上之塗層18可“復原”及/或以其它方式重組以覆蓋基材14之此特別區域。
塗層18可展現相對較低之氣體滲透性，因此，提供對氣體滲透之顯著障壁且避免經由塗層18至導電軌16之氣體腐蝕及/或氧化。於某些實施例，電組件12可經由塗層18選擇性地焊接，且無需事先移除塗層18。和與其它現今可利用之表面處理物結合之焊料接頭26相比，藉由經由塗層18焊接而達成之焊料接頭26可為較強。於某些實施例，塗層18可被建構以耐多個加熱週期。塗層18可展現對腐蝕性之氣體、液體，及/或鹽溶液(諸如，環境污染物)之耐化學性。於某些實施例，塗層18可展現低的表面能量及/或“濕潤性”。塗層18內之材料及沈積塗層18之方法可被建構以控制塗層18之相對濕潤性。塗層18於正常裝置溫度(例如，於其間PCB 10可被使用之溫度範圍)可為一穩定惰性材料。塗層18可展現良好之機械性質，諸如，耐磨耗性及/或與PCB材料之黏著性。於某些實施例，塗層18可展現改良之靜電保護。塗層18可具有相對較低之液體及鹽溶液滲透性，因此，避免經由塗層18之液體腐蝕。依據某些實施例，相較於現存之表面處理物，塗層18一般可為環境上有利。
PCB 10上之塗層18於PCB 10之一或多個表面上可為連續、實質上連續，或非連續。於某些實施例，塗層18於欲被焊接之表面及於其間或與其相鄰之非焊接表面上係連續或實質上連續。依據某些實施例，塗層18於PCB 10之實質上所有之曝露及/或脆弱之表面上係連續或實質上連續。雖然一實質上連續之塗層18對於保護PCB 10免於有害環境可能係較佳，但一非連續之塗層18對於其它目的可能較佳。
於某些實施例，PCB 10包含一或多個電組件12，其係經由塗層18固定於基材14上之導電軌16。電組件12可於PCB 10之任何適合之電元件。例如，電組件12可為電阻、電晶體、二極體、放大器、振盪器，及/或任何適合元件。於某些實施例，電組件12包含一或多個導線，其被建構而固定於PCB 10之基材14上之導電軌16之一部份。任何適合數量及/或組合之電組件12可被固定於PCB 10。
電組件12可使用任何適合技術固定於基材14上之導電軌16。於某些實施例，電組件12可藉由焊接、以雷射促進之焊接、超主波焊接，及/或使用導性黏著劑而與導電軌16連接。依據某些實施例，電組件12可經由塗層18焊接至基材14上之導電軌16，而無需事先移除塗層18。電組件12與導電軌16間之焊料連接可稱為焊料接頭26。於形成焊料接頭26前，塗層18可保護導電軌16免於氧化及/或腐蝕。於某些實施例，因為焊料接頭26可經由塗層18形成而無需移除塗層18，塗層18可鄰接焊料接頭26。藉由鄰接焊料接頭26，塗層18可保護導電軌16免於氧化及/或腐蝕，即使於電組件12焊接至PCB 10後。
電組件12與導電軌16間之焊料接頭26可使用含鉛焊料或無鉛焊料形成。於某些實施例，經由塗層18之焊接不會如預期般降低焊料接頭26之強度。事實上，於某些實施例，藉由經塗層18之焊接形成之焊料接頭26可能比於另外表面處理物上之焊料接頭更強。焊料接頭26可依據任何適合技術形成。於某些實施例，助熔劑(未被例示)可用以形成焊料接頭26。於其它實施例，單獨使用熱之焊接方法(例如，雷射焊接)可用以選擇性形成焊料接頭26。於其它實施例，焊料接頭26可藉由波焊形成，其可伴隨選擇性之助熔。
如上所示，焊料接頭26可於經由電組件12與導電軌16間之塗層18形成。於此內容，“經...形成”一辭可指焊料接頭26之形成係無需使塗層18事先自導電軌16移除。因此，導電軌16可以塗層18塗覆，然後，無需先使塗層18自導電軌16移除，一或多個電組件12可焊接至導電軌16。焊接方法可選擇性改變塗層18，且可於電組件12與導電軌16間形成焊料接頭26。因此，“經...形成”一辭可指焊料接頭26之形成係無需使塗層18事先自導電軌16移除。
如上所示，因為焊料接頭26可經由塗層18形成，而無需事先移除塗層18，焊料接頭26可鄰接塗層18。於此內容，“鄰接”一辭可指焊料接頭26之一或多個端緣直接接觸，實質上接觸，及/或實質上鄰近塗層18之一或多個端緣。因此，焊料接頭26可鄰接塗層18之未藉由焊接方法選擇性改變(例如，移除)之部份。於某些實施例，焊料接頭26可以單一方向或多個方向鄰接塗層18。例如，如第1A圖所例示，焊料接頭26可以x-軸及/或y-軸方笳，但非以z-軸方向，鄰接塗層。
包含塗層18之PCB 10可提供優於未經塗覆之PCB 10之優點。塗層18可提供下列優點之無一者、一些，或全部。一優點係，於某些實施例，塗層18可保護於貯存時之PCB 10免於氧化及/或腐蝕。一旦導電軌16於基材14上形成，於附接電組件12前，製造業者會貯存PCB 10一段可變化之時間，可能最高達數個月或數年。若未經塗覆，導電軌16內之材料(例如，銅)會於空氣中氧化，造成一氧化物層及/或污點於導電軌16上形成。因為傳統PCB 10缺乏塗層18，於傳統PCB 10上之導電軌16於貯存期間會氧化及/或腐蝕。未經塗覆之PCB 10貯存愈久，更多氧化會發生。未經塗覆之導電軌16上之氧化物或腐蝕層會阻礙強的焊料接頭26形成。特別地，導電軌16上之氧化物或腐蝕層之存在會造成(i)具低機械力量之弱結合，(ii)“乾結合”，其具有於操作此裝置期間失效之趨勢，(iii)無法使電接觸在一起之結合，及/或(iv)PCB 10失效(例如，導電軌16間之失效或劣化)。相反地，若塗層18被塗敷至PCB 10，塗層18可避免PCB 10上之導電軌16於長期貯存期間(例如，數月或數年)氧化及/或腐蝕，因此，使強的焊料接頭26於貯存後於導電軌16上形成。於其中塗層18被塗敷至以金屬及/或聚合物為主之電子產品之實施例，包含鹵-烴類聚合物之塗層18可避免導體及/或裝置膨脹。
另一優點係於某些實施例，包含鹵-烴類聚合物之塗層18可能不會如傳統表面處理物般昂貴及/或環境上有害。製造業者使金屬表面處理物(例如，錫、銀、鎳，及/或金)塗敷至其間焊接可能需要之區域。塗敷此等表面處理物之方法係耗時，需使用另外之金屬，且產生環境問題。此等表面處理物及方法可能昂貴及/或產生健康危險。於某些情況，製造業者使用包含有機化物(諸如，苯并咪唑)之表面處理物，及焊料可濕潤之金屬或焊料之顆粒。但是，此等有機表面處理物通常不能經歷多個加熱週期，且展現相對較短之於加工處理前之貯存壽命。因此，製造業者使用之傳統表面處理物一般係昂貴、耗時，及/或於製造方法需額外步驟。傳統之表面處理物亦會耗盡不能更新之來源，諸如，貴金屬。與傳統表面處理物相反，包含鹵-烴類聚合物之塗層18可呈現一種較不昂貴及/或更高性能之塗層18，其避免導電軌16於藉由焊接附接電組件12前氧化。
另一優點係，於某些實施例，包含鹵-烴類聚合物之塗層18可避免於焊料接頭26間形成樹突物。金屬化合物之樹突物已被觀察係於未經塗覆之PCB 10上之焊料接頭26間之間隙形成。樹突物會造成連接器間之短路及漏電，造成PCB 10失效。特別地，樹突物會於水份達未經塗覆之基材14及/或導電軌16時形成，且產生金屬離子，其於電磁場存在中藉由電遷移重新分佈。樹突物會呈現金屬生長，其係藉由電遷移造成且沿表面形成蕨類植物狀之圖案。於其中塗層18係於焊料接頭26形成前塗敷之實施例，塗層可能無法避免液體達焊料接頭26。但是，於此等實施例，塗層18可避免水份達PCB之基材14及/或導電軌16(其間係樹突物可能易藉由離子性溶解形成)。因此，塗層18可藉由(i)避免水份達基材14及/或導電軌16，及/或(ii)藉由於PCB 10之導體間提供障壁而保護PCB 10抵抗樹突物之形成。此外，或另外，因為樹突物之材料可與塗層18具低黏著性，塗層18可降低PCB 10上之導電軌16及/或電組件12間之樹突物形成。此外，或另外，塗層18可避免由於離子性物種及/或金屬存在而造成之導電軌16間短路。
另一優點係於某些實施例，塗層18可保護環境免於PCB 10內之毒性材料。為符合防火安全標準，PCB 10可包含自阻燃性化合物(例如，以溴為主之化合物，諸如，四溴雙酚A(TBBPA))製成之元件。但是，此等化合物可能係有毒，可能難以安全地棄置，及/或可能對環境產生危險。塗敷塗層18至PCB 10可保護環境免於此等有毒材料。塗敷塗層18可除去或大量降低基本PCB層合物中對於阻燃性化合物之需求。
第1A圖例示包含單一塗層之PCB10。於其它實施例，PCB10可包含多個塗層。雖然第1A圖例示焊接至PCB10之導電軌16之二電組件12，但需瞭解PCB10可包含任何適當數量及/或組合之電組件12。雖然第1A圖例示塗敷至基材14之一外表面之塗層18，但需瞭解塗層18可塗敷PCB 10之基材14及/或其它組件之一或多個內表面。需進一步瞭解塗層18可於使電組件12焊接至導電軌16之前及/或之後塗敷至PCB 10。
雖然第1A圖例示焊接至導電軌16之電組件12，但需瞭解一或多個電組件12可藉由另外之結合方法(諸如，線結合)固定於導電軌16。需進一步瞭解第1-12圖例示之裝置及組件係無需依比例繪製。
第1B圖例示一以塗層18塗覆之雙側PCB 10。此雙側PCB 10可包含一或多層之基材14。導電軌16可固定於基材14之相反側。於某些實施例，於基材14之相反側上之導電軌16可藉由一或多個孔27連通式偶合。孔27可包含一經電鍍之孔洞，其提供固定於PCB 10之不同表面及/或層之導電軌16間之電連接。孔27可為一穿孔式之孔(例如，延伸通過PCB之孔)、盲孔(例如，僅於PCB之一側上曝露出之導孔)、埋孔(例如，連接PCB之內層且未於任一表面上曝露之孔)，及/或任何適合型式之孔。於某些實施例，塗層18可沈積於孔27之外及/或內表面上。例如，塗層18可塗襯經PCB之至少一部份延伸之孔27之側壁。因此，塗層18可保護孔27及PCB 10之內層免於腐蝕及/或氧化。
第1C圖例示依據某些實施例藉由波焊方法固定於PCB 10之電組件12。如上所闡釋，PCB 10可包含一或多個穿過基材14之孔27。於使電組件12焊接至PCB 10前，塗層18可塗敷至基材14，以使一或多個塗層塗覆27之側壁。於塗層18沈積於基材14上之後，電組件12可置放於PCB 10之第一側上，以使電組件12之導線29延伸通過孔27。因此，導線29之一端可經由PCB 10之第二側(例如，相反側)上之孔27之開口伸出。於某些實施例，焊料及/或助熔劑其後可塗敷電組件12之導線29周圍以形成焊料接頭26。依據某些實施例，焊料及/或助熔劑係塗敷於PCB 10之第二側上(例如，經由PCB 10之第二側伸出之導線29之端部周圍)。然後，焊料及/或助熔劑可流經孔27於導線29與孔27之側壁及/或PCB 10之表面上之導電軌16間形成焊料接頭26。因此，焊料接頭26可完全或部份通過孔27而延伸。焊接方法可改變沿孔27之側壁之塗層18。例如，與形成焊料接頭26結合，焊接方法可自孔27之側壁移除塗層18。雖然第1C圖例示PCB之一個孔27，需瞭解PCB可包含任何適合數量之孔27。
第2圖例示依據某些實施例使塗層18沈積於PCB10上。塗層18可沈積於PCB 10上以保護導電軌16免於氧化及/或腐蝕。於某些實施例，一旦導電軌16於基材14之曝露於環境之表面上形成，塗層18被沈積於基材14上之導電軌。因此，塗層18可於使任何電組件12焊接至導電軌16前沈積於導電軌16上。因此，塗層18可與導電軌16直接接觸，而於塗層18與導電軌16間無任何焊料，或基本上無任何焊料。塗層18可依任何適合技術沈積於導電軌16上。例如，塗層18可使用電漿沈積、化學蒸氣沈積(CVD)、分子束磊晶(MBE)、電漿促進之化學蒸氣沈積(PE-CVD)、高壓/大氣電漿沈積、金屬-有機-化學蒸氣沈積(MO-CVD)，及/或雷射促進之化學蒸氣沈積(LE-CVD)沈積。於某些實施例，塗層18可藉由一於低溫發生之電漿沈積方法沈積。此一低溫電漿方法可使塗層18用於許多不同型式之基材14上。於某些實施例，塗層18可藉由產生互穿式聚合物網絡(IPN)及/或聚合物或單體之單層表面吸收(SAM)沈積於導電軌16上，而於原位形成聚合物及/或聚合物混合物。於其它實施例，塗層18可使用一液體塗覆技術(諸如，液體浸漬、噴灑塗覆、旋轉塗覆、噴濺，及/或溶膠-凝膠方法)沈積。
如第2圖所例示，塗層18可藉由電漿沈積沈積於導電軌16上。可用於廣泛產業應用範圍之電漿沈積一般係用於沈積薄膜塗層18之一有效技術。電漿沈積可於一產生包含離子化氣體離子、電子、原子，及/或中性物種之氣體電漿之反應器28內發生。反應器28可包含一腔室30、一真空系統32，及一或多個能量源34。反應器28可為被建構以產生氣體電漿之任何適合型式之反應器28。能量源34可為被建構以使一或多種氣體轉化成氣體電漿之任何適合之裝置。例如，能量源34可包含一加熱器、無線頻率(RF)產生器，及/或微波產生器。
於某些實施例，一旦導電軌16於基材14上形成，基材14可置於反應器28內之腔室30內。真空系統32可使腔室30泵取至10-3 至10毫巴範圍之壓力。然後，反應器28可使一或多種氣體引入腔室30內，且能量源34可產生及/或導引電磁輻射至腔室30內產生穩定之氣體電漿。然後，反應器28可使一或多種先質化合物36(以氣體及/或液體)引入腔室30內之氣體電漿內。當引至氣體電漿內時，先質化合物36可被離子化及/或分解而於電漿內產生一範圍之活性物種，其於PCB 10之表面反應(例如，藉由聚合化方法)產生一薄塗層18。
先質化合物36可被選擇以提供所欲之塗層性質。於某些實施例，先質化合物36係包含鹵素原子之烴類材料。例如，為形成包含鹵-烴類聚合物之塗層18，先質化合物36可為全氟烷、全氟烯、全氟炔、氟烷、氟烯、氟炔、氟氯烷、氟氯烯、氟氯炔，及/或任何適合之氟化及/或氯化之有機材料(例如，氟烴類、氟碳化物、氟氯烴類，及/或氯氟碳化物)。
於其中塗層18藉由電漿沈積沈積於PCB10上之實施例，塗層18之性質及組成可依一或多種條件而定，諸如，(i)選擇之電漿氣體；(ii)使用之特定先質化合物36；(iii)先質化合物36之量(其可藉由結合先質化合物36之壓力及流速而決定)；(iv)先質化合物36之比例；(v)先質化合物36之順序；(vi)電漿壓力；(vii)電漿趨動頻率；(viii)脈寬調速；(ix)塗覆時間；(x)電漿功率(包含峰值及/或平均電漿功率)；(xi)腔室電極配置；(xii)進料PCB 10之製備；及/或(xiii)腔室30之尺寸及幾何形狀。電漿沈積可用以沈積從單層(通常係數埃())至10微米(較佳係5微米)之薄膜，其係依如上之設定及條件而定。前述因素可於沈積方法期間改變以建立單一層、多層、均質，及/或非均質之塗層18。於某些實施例，電漿沈積方法可僅衝擊PCB 10之曝露表面(例如，固定導電軌16之表面)。因此，電漿沈積技術可與PCB 10之製造完全相容，對PCB 10造成極小或無損害或其它不要之作用。於某些實施例，電漿沈積技術不會使PCB 10曝露於與另外之表面處理方法有關之相對較高之溫度。
於某些實施例，電漿沈積之一優點可為塗層18被沈積以使其接近PCB 10之所有表面。因此，PCB 10之垂直表面(例如，僅可經由PCB 10之孔洞接近之表面)及/或PCB 10上之突出結構可以塗層18塗覆。因此，塗層18可保護PCB 10免於沿其間導電軌16接觸PCB 10之基材14之任何側邊、端緣、點及/或區域氧化及/或腐蝕。於某些實施例，電漿沈積方法不受限制用於其它表面處理方法之濕潤化學之表面張力限制所限制。因此，較小之孔及/或其它孔洞可被塗覆。
於某些實施例，反應器28可於電漿沈積前使用一活性氣體電漿實施原位清洗PCB 10之曝露表面。於此等實施例，於使先質化合物36引入用於電漿沈積貯存之腔室30內之前，反應器28可使一活性氣體電漿引至相同腔室30內以清理PCB 10之基材14及/或導電軌16。活性氣體電漿可以穩定氣體為主，諸如，稀氣體、烴類氣體，及/或鹵化烴類氣體。於某些實施例，活性氣體電漿可以氫、氧、氮、氬、甲烷、乙烷、四氟甲烷(CF4 )、六氟乙烷(C2 F6 )、四氯甲烷(CCl4 )、其它氟化或氯化之烴類，及/或其等之混合物為主。依據某些實施例，PCB 10可於腔室30內以欲沈積於10上之相同材料清理。例如，諸如四氟甲烷(CF4 )、六氟乙烷(C2 F6 )、六氟丙烯(C3 F6 )，及/或八氟丙烷(C3 F8 )之氟化或氯化之烴類可用以清理PCB 10之表面及於基材14上鋪置一層鹵-烴類聚合物及/或一層金屬鹵化物(例如，金屬氟化物、金屬氯化物等)。
於其間一層包含以鹵素或鹵化物為主之材料之塗層18被直接塗敷至PCB 10之導電軌16之某些實施例，一極薄(例如，5nm或更少)之金屬鹵化物層可於導電軌16之一曝露表面上形成。於某些實施例，金屬鹵化物係金屬氟化物，諸如，氟化銅，或其衍生物。金屬鹵化物層可為活性，可為惰性，及/或可避免於導電軌16上形成會阻礙有效焊接之氧化物層及/或污點。
但是，於某些情況，PCB 10上之金屬鹵化物層若其形成，例如，於特定環境條件下易弱化之介金屬時可能為非所欲。於此等情況，於PCB 10上沈積一包含非鹵-烴類材料(例如，聚乙烯及/或聚丙烯)之第一塗層層可於沈積一包含鹵-烴類聚合物之第二塗層時避免金屬鹵化物層形成。
雖然第2圖例示於反應器28內之腔室30內之單一PCB 10，需瞭解任何數量之PCB 10可同時置放於腔室30內且以塗層18塗覆。雖然第2圖例示藉由電漿沈積於PCB 10上形成塗層18，需瞭解塗層18可使用任何適合技術沈積於PCB 10上。
如上所解釋，一旦塗層18沈積於基材14上之導電軌16上，電組件12可經由塗層18固定於導電軌16。電組件12可使用任何適合技術固定於導電軌16，諸如，焊接、線結合、靜電結合，及/或凡得瓦(Van der Waals)結合。於某些實施例，電組件12可藉由使用於塗層18上之黏著劑與導電軌16連接(藉此，利用塗層18之z-軸導性)。
第3A-B圖例示依據某些實施例使電組件12焊接至PCB 10之導電軌16。如第3A圖所例示，電組件12可經由塗層18焊接，而無需事先自導電軌16移除塗層18。焊接方法可包含使熱及焊料38施加至PCB 10之一其間焊料接頭26欲被形成之特定區域。熱可使用任何適合之熱源(諸如，焊接鐵40)施加至焊料38。於某些實施例，焊接方法亦可包含塗敷助熔劑42至PCB 10之此特定區域。熱、助熔劑42，及/或焊料38可選擇性地改變PCB 10之此特定區域之塗層18。於某些實施例，改變塗層18可指自PCB 10之此特定區域移除塗層18。塗層18可藉由於一溫度使焊料38及選擇性之助熔劑42塗敷至PCB 10持續一段時間以使焊料38與導電軌16結合且塗層18被局部分散、吸收、蒸發、溶解，及/或降解而移除。於某些實施例，改變塗層18可包含改變塗層18之結構、多孔性，及/或表面能量。例如，助熔可改變塗層18內之孔洞之表面能量，此會改變塗層18之濕潤性，如此，焊料38可經塗層18內之孔洞流至導電軌16。因此，於此實施例，焊料接頭26可經由塗層形成電組件12與導電軌16間之電連接。作為另一實施例，焊接方法可藉由誘發孔隙(例如，裂痕)及/或使孔隙於塗層18之其間塗敷焊料38及/或助熔劑42之此特定區域增殖而選擇性改變塗層18。較佳地，一或多個因素被建構以使焊接方法達成良好之焊料流動，以焊料38覆蓋基材14上之一部份之導電軌16，及/或形成強的焊料接頭26。此等因素包含：(i)基材14之特徵，(ii)塗層18之特徵，(iii)焊料/助熔劑之特徵，(iv)焊接輪廓(包含時間及溫度)，(v)分散塗層18之方法，及(vi)控制焊料接頭26周圍之焊料流動之方法。
於某些實施例，單獨之助熔劑42及溫度之作用可與塗層18之鹵-烴類聚合物交互作用而於PCB 10之塗敷助熔劑42之特定區域局部地改變塗層18。依據某些實施例，改變於PCB 10之特定區域之塗層18可包含自PCB 10之此特定區域移除塗層18。焊料38及/或助熔劑42可加熱至任何適合溫度，其至少部份依焊料38之組成而定。於某些實施例，焊料38及/或助熔劑42被加熱至200℃與300℃之間。依據某些實施例，焊料38及/或助熔劑42被加熱至240℃與280℃之間。於一使用無鉛之焊料38之較佳實施例，焊料38及/或助熔劑42加熱至約260℃。
助熔劑42及/或溫度之作用可局部地分散、吸收、蒸發、溶解，及/或降解包含鹵-烴類聚合物之塗層18。因此，塗層18僅會於PCB 10之其間塗敷焊料38及/或助熔劑42之特定區域被改變(例如，移除)。如第3B圖所例示，塗層18可維持與PCB 10之表面附接至焊料接頭26為止。藉由鄰接焊料接頭26，塗層18可提供PCB 10之導電軌16環境保護至焊料接頭26。
依據某些實施例，於用以改變塗層18所需之時間，用以改變塗層18所需之溫度，及/或助熔劑42之酸性或侵略性間可具平衡。因此，若使用較高溫度，較溫和之助熔劑42可能足夠，反之亦然。於某些實施例，一金屬鹵化物層(例如，氟化銅)可位於導電軌16與塗層18內之一鹵-烴類層之間。當熱施加至PCB 10之一特定區域，金屬鹵化物層可展現自行助熔作用。焊接方法可利用此自行助熔性質。於某些實施例，於焊接方法期間，金屬鹵化物及/或塗層18內之鹵-烴類聚合物之分解會釋放氟及/或氟化氫(HF)而起始助熔作用(自行助熔)。由於自行助熔性質，若足夠高之溫度於焊接方法期間使用，焊料接頭26可於未使用任何助熔劑42下形成。
任何適合之焊料38可用以形成焊料接頭26。於某些實施例，焊料38可為一具有90℃至450℃範圍之熔點之可熔性金屬合金。於某些實施例，焊料38係錫/鉛焊料38，例如，60/40Sn/Pb或63/37Sn/Pb。於其它實施例，焊料38係無鉛之焊料38，例如，一包含錫、銅、銀、鉍、銦、鋅，及/或銻之合金。無鉛之焊料38之例子包含SnCu0.7、SnAg3.5Cu0.7，及SnAg3.0Cu0.5。於某些實施例，焊料38可包含懸浮於助熔劑42之粉末狀金屬。粉末狀金屬及助熔劑42之混合物被稱為焊料糊料。
於使用助熔劑42形成焊料接頭26之實施例，任何適合之助熔劑42可被使用。於某些實施例，助熔劑42可為溫和之助熔劑42，諸如，“免洗”助熔劑(例如，松脂助熔劑)，其無需其後之清洗PCB 10之步驟。於其它實施例，助熔劑42可為有機助熔劑42，諸如，有機酸(例如，乳酸、丙烯酸等)、有機鹽(例如，二甲基氯化銨(DMA HCl))，及/或有機胺(例如，尿素)。於其它實施例，助熔劑42可為樹脂/松脂助熔劑42，諸如，合成樹脂或天然松脂。於其它實施例，助熔劑42可為無機助熔劑42，諸如，無機鹽(例如，氯化鋅、氯化鈉、氯化鉀、氟化鈉等)及/或無機酸(例如，氫氯酸、硝酸等)。於其它實施例，助熔劑42可為無鹵化物之助熔劑、無殘質之助熔劑，及/或低固體之助熔劑。此外，或另外，工業助熔劑42可被使用，諸如，用於一般之焊接、銅焊、熔接、清洗，或蝕刻一金屬表面之助熔劑42。此一工業助熔劑42之一例子係硼砂。助熔劑42之選擇可依塗層18之性質而定，特別是塗層18之特定厚度24及組成。較厚、更具阻性之塗層18可能需使用更具侵略性之助熔劑42。此外，或另外，助熔劑42之選擇可依塗層18內之材料之濕潤性質而定。包含助熔劑42之一活性成份或多種活性成份且選擇性改變PCB 10上之塗層18(例如，選擇性移除塗層18)之組成物可用以替代助熔劑42。
如上所解釋，塗層18能於PCB 10之導電軌16上形成良好之焊料接頭26。一或多個因素可被控制以於PCB 10上達成良好品質之強的焊料接頭26。此等因素可包含：(i)經塗覆之基材14及/或PCB 10之濕潤特徵及/或表面能量；(ii)經塗覆之基材14及/或PCB 10之表面粗造性；(iii)基材14上之導電軌16之表面粗糙性；(iv)焊料38及/或焊料糊料(包含活性劑及/或溶劑)之組成；(v)焊接方法之溫度分佈，其可包含用以改良焊料38、焊料糊料，及/或活性組份之濕潤性能之最佳化分佈之溫度及滯留時間；(vi)經塗覆之基材14上之導電軌16之尺寸及/或幾何形狀；及/或(vii)存在於焊料38及/或焊料糊料內之組份之顆粒尺寸。於某些實施例，焊料接頭26之強度及/或品質可藉由基材14上之導電軌16之預處理、清理，及/或表面製備而促進。導電軌16可藉由電漿氣體、硫酸，及/或過氧化氫之表面處理及/或藉由以過硫酸鹽為主之蝕刻劑方法而清理。依據某些實施例，焊料糊料模板之孔徑尺寸及/或厚度可被建構以控制分配於經塗覆之基材14上之導電軌16焊料糊料之量、位置、濕化，及/或擴展。
於某些實施例，焊料接頭26之品質及/或強度可藉由使焊料糊料之黏度及表面張力與溫度平衡而促進以(i)控制導電軌16上之焊料糊料之濕化及流動，及/或(ii)控制藉由導電軌16上之電子組件造成之毛細作用。此毛細作用會易使焊料糊料自其所欲位置偏移，特別是若細間距(Fine Pitch)及/或球格陣列(Ball Grid Array)(BGA)焊接被使用時。依據某些實施，焊料接頭26之品質及/或強度可藉由控制塗層18之組成、化學穩定性及/或厚度24而促進，以使焊料糊料選擇性地改變基材14之表面上之一特定區域上之塗層18。於某些實施例，焊料接頭26之品質及/或強度可藉由以塗層18內之鹵-烴類聚合物控制焊料糊料內之活性組份之化學作用以促進塗層18之選擇性改變(例如，選擇性移除)而促進。焊料糊料內之活性組份之量及/或組成可被最佳化以促進此作用。
雖然第3A-B圖例示一種使用焊料38、熱，及助熔劑42形成焊料接頭26之焊接方法，需瞭解焊料接頭26可使用焊料38及熱且無任何助熔劑42經由塗層18而形成。雖然第3A-B圖例示經由單層塗層18形成之焊料接頭26，需瞭解焊料接頭26可經由一多層塗層18形成。
第4圖例示依據某些實施例之包含一多層塗層18之PCB 10。“多層”一辭可指包含二或更多之可區別及/或漸變式之聚合物層44之塗層18。若一多層塗層18包含可區別之層44，每一層44可包含一可區別之化學組成。若一多層塗層18包含漸變式之層44，個別之層44可形成於個別層44間之一區域之中間組成。中間組成之區域內之材料可具有變化之分子量、化學組成、結構、幾何形狀、多孔性，及/或其它性質。因此，多層塗層18可包含多個可區別之聚合物層44，及/或可包含多個漸變式之聚合物層44。
於某些實施例，此多層塗層18可包含一包含第一種聚合物之第一層44a，及一包含第二種聚合物之第二層44b。於其它實施例，此多層塗層18之第一層44a及第二層44b可包含具有相似化學組成但不同結構、不同共軛度，及/或不同重量之聚合物。於某些實施例，此多層塗層18內之一特定層44可包含單種之鹵-烴類聚合物。於其它實施例，此多層塗層18內之一特定層44可包含可包含不同種之鹵-烴類聚合物之混合物。依據某些實施，此多層塗層18內之每一層44可包含相同或不同之聚合物組成物。於某些實施例，每一層44包含相似先質化合物36，其被不同地加工處理形成每一層44。此可造成具有不同聚合物、不同聚合物網絡、不同分子量、不同尺寸、不同物理結構，及/或於其它性質不同之每一層44。於其它實施例，每一層44包含不同先質化合物36，其可使每一層包含不同材料及/或材料性質。
PCB 10上之此多層塗層18可包含任何適合數量之層44。於某些實施例，此多層塗層18包含2至5個層44。於其它實施例，此多層塗層18包含2至4個層44。於一較佳實施例，此多層塗層18包含2或3個層44。於其間塗層18包含3或更多個層44之實施例，此多層塗層18可被建構以使未彼此相鄰之此二或更多個層44包含相同聚合物。對於一些應用，此多層塗層18內之層44之數量可被選擇以促進此多層塗層18之抗反射及/或介電性質。於此等實施例，此多層塗層18可包含較高數量之層44(例如，4或更多)，且每一個層44之厚度及/或幾何形狀被控制。於此等實施例，此多層塗層18內之一特定之層44可為手性，以使此特定之層44經由位向化及/或化學結構順序化。
PCB 10上之一多層塗層18可具有任何適合之厚度24。例如，一多層塗層18可具有從1nm至10μm，從1nm至500nm，從3nm至500nm，從10nm至500nm，從10nm至250nm，或從10nm至30nm，之總厚度24。於一較佳實施例，於PCB 10上之一多層塗層18具有從10nm至100nm之總厚度24，且100nm係一較佳之厚度24。
一多層塗層18內之個別層44可具有任何適合厚度。於某些實施例，每一層44之厚度之比例可被改變以達成塗層18之不同性質。於某些實施例，PCB 10上之塗層18內之每一層44可具有相同或約相同之厚度。於其它實施例，一層44可比其它之層44更厚，以使一多層塗層18展現可被調整之整體厚度，以提供自塗層18內之每一層44之貢獻衍生之組合功能。依據某些實施例，一特定之44之厚度可包含一多層塗層18之整體厚度24之60至90%，且剩餘之層44之組合厚度可包含此多層塗層18之整體厚度10之40%。
於其間包含多個漸變式之層44之塗層18之實施例，此漸變式之層44內之個別聚合物之比率可改變以達成整體塗層18之不同性質。若塗層18包含多個漸變式之層44，相鄰之層44可稠合在一起以使具中間化學組成之聚合物存在於相鄰之層44之間。此外，或另外，一多層塗層18可包含一或多個與一金屬鹵化物層44(例如，金屬氟化物)相鄰之合物層44。依據某些實施例，一漸變式多層塗層18內之每一聚合物之比率可為相等。於包含具不同聚合物之漸變式層44之塗層18之其它實施例，塗層18可包含比其它聚合物更多之一特定聚合物，以使此多層塗層18更高度地展現此特定聚合物之性。於此等實施例，此特定聚合物可構成塗層18之60至90%，如此，剩餘之聚合物構成塗層18之10至40%。如上所示，層44間之界面於某些實施例係被充份界定，且於其它實施例，層44間之界面可為漸變式。
依據某些實施例，此多層塗層18之第一層44a(即，鄰接基材14及/或導電軌16之特定層44)係連續或實質上連續。於此等實施例，第二層44b係無或實質上無接觸PCB 10之基材14及/或導電軌16。此多層塗層18之一或多個層44可於任何電組件12焊接至基材14上之導電軌16前被沈積於基材1及/或導電軌16上。因此，於多層塗層18之一或多個層44與導電軌16間可為無焊料38，或基本上無焊料38。
如上所解釋，電組件12可藉由各種方法(諸如，焊接及/或線結合)與導電軌16連接。於某些實施例，一多層塗層18之至少一層44可被最佳化以供線結合，且此多層塗層18之另外層可被最佳化以供焊接。例如，被最佳化以供線結合之第一層44可先沈積於導電軌16上。然後，線結合方法被執行以使至少一電組件12與導電軌16連接。然後，此多層塗層18之第二層44可沈積於PCB 10上。此第二層44可被最佳化以供焊接。然後，另外之電組件12可經由此多層塗層18焊接至導電軌16。另外，前述步驟可被顛倒以使被最佳化以供焊接之特定層44可被沈積，然後，焊接可被實施，然後，被最佳化以供線結合之特定層44可被沈積，然後，線結合可被實施。
於某些實施例，塗層18包含至少一包含含有低鹵素之烴類聚合物之層44。含有低鹵素之烴類聚合物可為具有少於一臨界量之鹵素原子之任何適合聚合物。例如，含有低鹵素之烴類聚合物可指具有少於一可建構之百分率(以質量計)之鹵素原子(例如，少於2質量%，少於0.5質量%，及/或任何適合百分率)之聚合物。
依據某些實施例，塗層18包含至少一包含鹵-烴類聚合物之層44，及包含非鹵-烴類聚合物之另外層44。於某些實施例，非鹵-烴類聚合物可為不包含鹵素原子之任何適合聚合物。非鹵-烴類聚合物可具有一直或分支之鏈或環之碳結構。於某些實施例，於非鹵-烴類聚合物之鏈間可具有交聯。非鹵-烴類聚合物可包含一或多個不飽和基團，諸如，碳-碳雙及/或三鍵。於某些實施例，非鹵-烴類聚合物包含一或多個雜原子(即，非碳、氫，或鹵素之原子)，諸如，氮、硫、矽，及/或氧。依據某些實施例，非鹵-烴類聚合物之分子量係大於500amu。非鹵-烴類聚合物可為可藉由電漿沈積而沈積之聚合物。
塗層18之一特定層44可包含任何適合之非鹵-烴類聚合物。例如，此特定層44可包含聚烯、聚酯、乙烯基聚合物、酚醛樹脂，及/或聚酐。於一較佳實施例，此特定層44包含聚烯，諸如，聚乙烯及/或聚丙烯。
於某些實施例，PCB 10可包含含有(i)一直接沈積於基材14及/或導電軌16上非鹵-烴類聚合物之第一層44a，及(ii)一沈積於第一層44a上之鹵-烴類聚合物之第二層之塗層18。此等實施例於若導電軌16上之一金屬鹵化物層44係非所欲時係有利的。特別地，非鹵-烴類聚合物之第一層44a直接沈積於導電軌16上可避免於導電軌16上形成一金屬鹵化物層44。於某些實施例，一金屬鹵化物層44若造成，例如，於特定環境條件下易弱化之介金屬時可能係非所欲。於此等實施例，一包含非鹵烴類聚合物之第一層44a可作為導電軌16與包含鹵-烴類聚合物之第二層44b間之障壁。因此，包含非鹵烴類聚合物之第一層44a之形成可避免於其後沈積一包含鹵-烴類聚合物之層44期間形成一金屬鹵化物層44。
於其它實施例，金屬鹵化物可能係所欲。於此等實施例，塗層18可包含(i)一金屬鹵化物之第一層44a，其係直接於基材14及/或導電軌16上形成，及(ii)一鹵-烴類聚合物之第二層44b，其係沈積於第一層44a上。
雖然一或多個如上所述之實施例包含一非鹵-烴類聚合物之第一層44a及一鹵-烴類聚合物之第二層44b，但需瞭解，於其它實施例，一多層塗層18之層44之所有、一些，或無一者可包含鹵-烴類聚合物。需進一步瞭解此多層塗層18之層44之所有、一些，或無一者可包含非鹵-烴類聚合物。
於PCB10上之一多層塗層18可被建構以提供變化及/或客製化之性能。於某些實施例，一多層塗層18之層44可被建構以使此多層塗層18之導性、耐氧化性、環境保護、成本、吸水性/耐水性、樹突物妨止性、阻燃性，及/或其它光學、電、物理，及/或化學性質。例如，於某些實施例，經高度氟化之一相對較厚之塗層18對於提供良好之環境保護可為所欲的，而於其它實施例，包含較少鹵化物之相對較薄之塗層18可能係較佳。如上關於第3A-B圖所述，電組件12可經由一多層塗層18焊接至導電軌16，而無需先移除此多層塗層18。
依據某些實施例，於PCB 10上之一多層塗層18包含一包含第一種鹵-烴類聚合物之第一層44a及一包含第二種鹵-烴類聚合物之第二層44b。於某些實施例，一多層塗層18包含聚四氟乙烯(PTFE)型材料之一特別層44，及聚氯三氟乙烯(PCTFE)型材料之另一層44。此PCTFE層44可直接沈積於基材14及/或導電軌16上，且PTFE層44可沈積於PCTFE層44上。於此等實施例，PCTFE層44可避免導電軌16氧化，且PTFE層可提供對於PCB 10之環境保護。於其它實施例，PTFE層44可直接沈積於基材14及/或導電軌16上，且PCTFE層44可沈積於PTFE層44上。此使PCB 10之表面之外部物理及/或化學性質係藉由PCTFE層44決定。
雖然第4圖例示一具有可區別層之多層塗層18，需瞭解此多層塗層18可具有漸變式之層。雖然一多層塗層18之一PTFE層44及一PCTFE層44係於上描述，需瞭解此多層塗層18可包含任何適合型式及/或組合之材料。於某些實施例，此多層塗層18內之材料可不為PTFE型及/或PCTFE型之材料。
第5圖例示依據某些實施例之包含一選擇性塗敷型PCB 10之特定區域之多層塗層18之PCB 10。如所例示，PCB 10之特定區域可為具有一單層塗層18之塗層18，且PCB 10之其它區域可以一多層塗層18塗覆。因此，PCB 10之不同區域可以不同之聚合物，或其等之混合物塗覆，以於不同區域達成不同性質。例如，於PCB 10之一第一區域，所欲地係具有一展現壓電及/或電阻性質之多層塗層18，而於PCB 10之一第二區域，所欲地係具有一展現電絕緣性質之單層塗層18。於此實施例，可於PCB 10之第一區域塗敷一具有一包含偏氟乙烯聚合物(PVDF)之第一層44a及一包含另一鹵-烴類聚合物之第二層44b之多層塗層18。PVDF層44可促進PCB 10之第一區域之塗層18之壓電、電阻，及/或電伸縮性質。於此實施例，可於PCB 10之第二區域塗敷一包含展現比PVDF更大之絕緣性質之鹵-烴類聚合物或非鹵-烴類聚合物之單層塗層18。因此，PCB 10之特定區域可以一單層塗層18塗覆，且PCB 10之其它區域可以一多層塗層18塗覆。
雖然前述實施例係例示包含PVDF之塗層18，需瞭解任何適合之聚合物可用於任何單層及/或多層之塗層18。
一多層塗層18可使用任何適合技術塗敷至PCB 10。例如，一多層塗層18可使用電漿沈積、化學蒸氣沈積(CVD)、分子束磊晶(MBE)、電漿促進之化學蒸氣沈積(PE-CVD)、高壓/大氣電漿沈積、金屬-有機-化學蒸氣沈積(MO-CVD)，及/或雷射促進之化學蒸氣沈積(LE-CVD)沈積。於某些實施例，一多層塗層18可藉由產生互穿式聚合物網絡(IPN)及/或藉由聚合物或單體之單層表面吸收(SAM)而沈積，而於原位形成聚合物及/或聚合物混合物。於其它實施例，一多層塗層18可使用液體塗覆技術沈積，諸如，液體浸漬、噴灑塗覆、旋轉塗覆、噴濺，及/或溶膠-凝膠方法。於包含多層塗層18之實施例，每一層44可使用相同或不同之技術形成。
於某些實施例，一多層塗層18係使用如上關於第2圖所述之電漿沈積技術塗敷至PCB 10。於此等實施例，一旦導電軌16於基材14上形成，基材14可被置於反應器28內之腔室30內。反應器28可使氣體(例如，氫、氬，及/或氮)引至腔室30內以清理基材14。然後，反應器28可使一或多種先質化合物36引至腔室30內藉由電漿沈積於基材14上形成一多層塗層18。於某些實施例，此多層塗層18可依循PCB 10之基材14及/或導電軌之三維形狀。
一多層塗層18(包含可區別或漸變式之層44)可藉由改變引至腔室30內之先質化合物36之組成而沈積於基材14上。於某些實施例，一或多種先質化合物36可用以於腔室30內產生氣體混合物。先質化合物36之混合物可被建構以於基材14上產生塗層18之漸變式之層44。於其它實施例，塗層18之可區別層44係藉由切換腔室30內之先質化合物36與改質條件而沈積於基材14上。一多層塗層18之組成可藉由一或多個下列因素控制：(i)選擇之電漿氣體；(ii)使用之特定先質化合物36；(iii)先質化合物36之量(其可藉由先質化合物36之壓力及流速之組合而決定)；(iv)先質化合物36之比例；(v)先質化合物36之順序；(vi)電漿壓力；(vii)電漿趨動頻率；(viii)脈寬調速；(ix)塗覆時間；(x)電漿功率(包含峰值及/或平均電漿功率)；(xi)腔室電極配置；(xii)進料PCB 10之製備；及/或(xiii)腔室30之尺寸及幾何形狀。藉由電漿沈積之塗層18可完全或實質上完全封裝PCB 10之所有表面。因此，塗層18可停止或降低水份吸收及PCB 10之“濕潤”。此可顯著降低基材14內及/或與導電軌16相鄰或其下之任何腐蝕作用。此對於以環氧為主之PCB 10及紙/卡PCB 10其易於吸收水、含水之酸，及/或腐蝕性材料，且易藉由此等於原位之機構而腐蝕)係特別有利。
電漿沈積可用以沈積鹵-烴類聚合物之層44及/或非鹵-烴類聚合物之44。鹵-烴類聚合物之先質化合物36係於上關於第2圖而描述。有關於非鹵-烴類聚合物，先質化合物36可為烴類材料，其被選擇以提供所欲塗層18性質。當引入氣體電漿內時，此特定之先質化合物36可被離子化/分解產生一範圍之活性物種，其會於PCB 10之表面反應(例如，藉由聚合化方法)產生非鹵-烴類聚合物之薄層44。任何適合之先質化合物36可用以形成一非鹵-烴類層44。用於沈積非鹵-烴類聚合物之層44之先質化合物36之例子係烷、烯，及炔。
如上所解釋，PCB 10可以錯合之三維塗層18塗覆。此等塗層18可包含於PCB 10之特定區域上之單一層44及於PCB 10之其它區域上之多數層44。任何適合技術可用以形成此等塗層18。於某些實施例，塗層18之一或多數之層44可僅於PCB 10之選擇區域上沈積。例如，塗層18之一或多數之層44可(i)藉由遮蔽PCB 10之表面使塗層18僅於未被遮蔽之區域沈積，(ii)藉由使用光輔助之電漿沈積技術(例如，雷射或UV光輔助)，及/或(iii)藉由使用金屬-有機化學蒸氣沈積(MOCVD)型之先質化合物36，諸如，金屬-烷基及/或羰基先質而被選擇性地沈積。於其它實施例，塗層18可使用一或多種消去技術形成。
依據某些實施例，沈積方法可被建構以改良PCB 10上之塗層18之濕潤特徵。濕潤可指(i)藉由液體(諸如，水)濕潤經塗覆之PCB 10之表面，(ii)於焊接方法期間藉由焊料38及/或助熔劑42濕潤塗層18，及/或(iii)於塗層18已被改變(例如，局部移除)後藉由焊料38濕潤導電軌16。塗層18之濕潤特徵可依據任何適合技術改質。例如，塗層18之濕潤特徵可藉由使用反應性氣體電漿(諸如，四氟化碳(CF4 ))之電漿蝕刻改質。作為另一例子，塗層18之濕潤特徵可藉由使用用以提供所欲表面活化而選擇之氣體電漿(諸如，以氫、氧、氬、氮，及/或此等氣體之混合物為主之氣體電漿)之電漿活化而改質。作為另一例子，塗層18之濕潤特徵可藉由電漿聚合化及/或使用物鹵-烴類(例如，氟-烴類、氯-烴類等)及/或非鹵-烴類(例如，聚乙烯、聚丙烯等)之變化物及/或混合物而改質。作為另一例子，塗層18之濕潤特徵可藉由使用，例如，強酸(例如，硫酸、硝酸等)及/或氧化劑(例如，過氧化氫)之以液體為主之化學蝕刻(其可改質塗層18之表面活化及/或表面粗糙性)而改質。於某些實施例，塗層18之濕潤特徵可被空間控制以提供具有不同濕潤特徵之PCB 10之不同區域。一具有促進之濕潤特徵之區域(於PCB 10之表面上)可選擇性地控制液體流過PCB 10之方向。因此，此一區域可作為“溝槽”以導引液體流至液體不會造成損害之區域。
於某些實施例，PCB 10之所有或全部之表面可以塗層18完全或大量地封裝。此可保護PCB 10及/或避免PCB 10吸水及/或“濕化”。此外，或另外，此可降低基材14內或導電軌16之下或與其相鄰之任何腐蝕作用。因此，塗層18可保護具有以環氧為主、以紙為主，及/或以卡為主之基材14(其否則會吸收液體(例如，水、含水之酸，及腐蝕性材料)及否則易腐蝕)之PCB 10。
包含塗層18之PCB 10可提供優於未經塗覆之PCB 10之優點。揭露之塗層18可提供下列優點之無一者、一些，或全部。一優係，於某些實施例，塗層18可使PCB 10於惡劣及/或腐蝕性之環境中操作。傳統之PCB 10一般不能於此等環境中可信賴地作用。於未經塗覆之PCB 10上之導電軌16會腐蝕，其會造成遠比一般預期更短之此裝置之壽命。此可於，例如，一未經塗覆之PCB 10被用於極潮濕之境環時發生，特別是其間包含溶解氣體(諸如，二氧化硫、硫化氫、二氧化氮、氯化氫、氯、臭氧，及/或水蒸氣)之顯微水滴形成腐蝕性溶液時。此會導致一薄膜或腐蝕沈積於未經塗覆之PCB 10上之導電軌16間形成，此會造成短路。於某些情況，製造業者係於使電組件12焊接至PCB 10後使聚合物之敷形塗層塗敷至PCB 10。但是，此等敷形塗層一般係昂貴。塗敷此等塗層可能需於此製造方法於電組件12已被焊接至PCB 10後需一額外步驟。當需要重作一受損或失效之PCB 10時或當需要測試PCB 10以確定其性能或解決問題時，此等敷形塗層亦可能需要另一步驟以移除此敷形塗層。與此等敷形塗層相反，包含鹵-烴類聚合物之塗層18可能代表一用以保護於及/或腐蝕性環境之PCB 10之較低成本及/或較高性能之溶液。於某些實施例，塗層18之一或多個層44可於使電組件12附接(例如，焊接、線結合等)至導電軌16後以敷形方式塗敷至PCB 10。因此，塗層18可塗敷至一插件PCB 10作為敷形層18，其提供一或多個此間所述之優點(例如，耐氧化性/耐腐蝕性、焊料流過能力、線結合能力、z-軸導性等)。
另一優點係，於某些實施例，塗層18可避免PCB 10之基材14、導電軌16，及/或其它元件免於吸收水及/或溶劑。傳統PCB 10之元件可包含吸收呈液體、蒸氣，及/或氣體型式之水及/或溶劑(包含，水性、有機、無機，及/或混合之溶劑)之材料。例如，包含織物(例如，環氧樹脂結合之玻璃織物)、紙(例如，合成樹脂結合之紙、棉紙、酚醛棉紙、環氧化物、紙、紙板等)、織物，及/或以木材為主之材料(天然及/或合成)之基材14可吸收水及/或以溶劑為主之化學品。作為另一例子，包含金屬、導性聚合物，及/或印刷導性墨水之導電軌16可吸收水及/或以溶劑為主之化學品。作為另一例子，PCB 10可包含磁性結構物、印刷磁性墨水，及/或可吸收水及/或以溶劑為主之化學品之其它元件。因此，PCB 10可包含具有對會造成此等結構物改變之水及/或溶劑之自然趨勢之多孔性及/或親水性之結構物。(材料與液相內或經由自氣相濃縮之水及/或溶劑交互作用之趨勢可固體溶劑)。當PCB 10之元件吸收水及/或溶劑時，一或更多之問題會產生。此等問題可包含：(i)由於熱膨脹系數差異而於熱週期期間之增加機械應力；(ii)改變PCB元件之黏著性質；(iii)對PCB元件之介電常數及損失正切之改變；(iv)結構物膨脹使某些材料不適於經由孔洞電鍍及/或用於某些高濕度之條件，特別是其間使用高電壓時；(v)導電軌16及基材14間之界面處或其周圍之導電軌16腐蝕；(vi)機械強度喪失；(vii)於水存在中之PCB 10內之材料之重新排列；及/或(viii)於應用場存在中之電解導致PCB 10腐蝕及/或降解。
另一優點可於其中導電軌16包含導性墨水聚合物時實現。導性墨水聚合物可能易吸收液體及/或水份，此會造成膨脹、電性質改質，及/或電路性能降解。此外，或另外，印刷活性裝置(例如，用於塑料電子設備)可吸收水及/或以溶劑為主之化學品，其會改變印刷活性裝置之性能及/或性質。使塗層18塗敷至包含導性墨水聚合物之印刷活性裝置及/或導電軌16可避免水吸收。
於某些實施例，塗層18可被建構而展現沿指向經塗覆表面之平面之軸(“z-軸”22)之導性，同時於沿與經塗覆之表面平行之軸(“x-軸”46及“y-軸”48)作為絕緣物。因此，塗層18可塗敷至一導性接頭50，而不會阻礙此接頭50將一電信號及/或載荷電流傳送至一相配合之接頭50之能力。因此，於某些實施例，塗層18可保護接頭50免於氧化及/或腐蝕，且不會阻礙接頭50之導性。
第6A-B圖例示依據某些實施例之一鍵盤52，其包含以塗層18塗覆之接頭50。鍵盤52可為一包含多數個按鍵54之輸入裝置。藉由按壓按鍵54，使用者可使鍵盤52傳統電信號。鍵盤52可為包含按鍵54之任何適合型式之輸入裝置。例如，鍵盤52可為一彈片開關之鍵盤52、一薄膜鍵盤52，及/或任何適合之鍵盤52。
鍵盤52可包含多數個按鍵54。於某些實施例，每一按鍵54包含一使用者可見到之曝露表面56，及一使用者一般見不到之隱藏表面58。一導性接頭50可附接至鍵盤52內之每一按鍵54之隱藏表面58。於某些實施例，鍵盤52包含具有多數個導性接頭50之PCB 10。PCB 10上之特一接頭50可相對應於鍵盤52之一或多個54。因此，當使用者按壓一特定按鍵54時，與按鍵54附接之接頭50可接觸與PCB 10附接之相對應之接頭50，因此使一電信號流動(例如，藉由關閉一開放電路)。
鍵盤52可包含任何適合型式之按鍵54。按鍵54之例子包含金屬“鍋仔片(snap-dome)”按鍵54、彈簧促動式按鍵54，及具有一或多個碳嵌件之矽膠按鈕。於某些實施例，按鍵54可代表一薄膜鍵盤52之一區域。一薄膜鍵盤52可包含一般係藉由氣隙間隔之二膜層(例如，塑料或聚合物基材)。此二膜之內表面可包含可撓性接頭50，諸如，導性墨水(例如，銀墨水)、導性膠，及/或導性黏著劑。鍵盤52之按鍵54之按壓可造成此二膜之接頭50接觸，造成信號傳送。需瞭解鍵盤52可包含任何適合型式及/或組合之按鍵54。
鍵盤52內之接頭50可為用於結合及/或關閉一電路之任何適合導性裝置。接頭50可包含一電極、連接器、插銷、墊材，及/或任何適合之導性裝置。接頭50可包含任何適合之導性材料。例如，接頭50可包含一或多種金屬，諸如，不銹鋼、鎳、錫、銅、鋁、金、銀，及/或其等之任何適合之合金。於某些實施例，接頭50可包含導性墨水、裝填銀之環氧化物、導性塑料，及/或非金屬之導性材料(諸如，碳及/或石墨)。因此，接頭50可包含任何適合型式及/或組合之導性材料。
於某些實施例，鍵盤52內之一或多個接頭50可以塗層18塗覆。如上所解釋，塗層18可被建構以於z-軸方向呈電導性，但於x-軸及y-軸方向作為絕緣體。換言之，塗層18可於x-軸及y-軸方向展現較高之阻抗及/或電阻，但於z-軸方向係低之阻抗及/或電阻。此性質能使以塗層18塗覆之接頭50將電信號及/或電流經由塗層18傳送至相配合之接頭50。
鍵盤52內之接頭50上之塗層18可具有任何適合厚度24。於某些實施例，接頭50上之塗層18之厚度24係從1nm至2μm。於其它實施例，塗層18之厚度24係從1nm至500nm。於其它實施例，塗層18之厚度24可從3nm至500nm。於其它實施例，塗層18之厚度24可從10nm至500nm。於其它實施例，塗層18之厚度24可從10nm至250nm。於其它實施例，塗層18之厚度24可從10nm至30nm。於其它實施例，塗層18係一單層之鹵-烴類聚合物(具有數埃()之厚度24)。於一較佳實施例，塗層18之厚度係從10nm型100nm，且呈各種不同梯度，且100nm係較佳之厚度24。
於某些實施例，塗層18之最佳厚度24可依所欲之塗層性質而定。例如，若需要極高之環境韌性(例如，高的耐腐蝕性及耐磨耗性)，較厚之塗層18可能係較佳。於某些實施例，塗層18之厚度24可於此裝置之不同位置具不同厚度24而最佳化，其係依欲被最佳化之性質而定(例如，環境保護對z-軸導性)。塗層18可被最佳化以遵循避免彎曲時破裂；使塗層18上之磨損及/或塗層18造成之磨損達最小；環境保護；較軟之下層材料之物理性保護；用於電路修整之控制電阻；感應器/電極之參考測量之穩定性；及/或表面能量、電荷消散，及/或輝散。
如上所示，以塗層18塗覆之接頭50可使電信號及/或電流經由塗層18傳送至相配合之接頭50。於此內容，“經...傳送”一辭可指於無需移除塗層18下於二或更多個接頭50間傳送電信號及/或電流。因此，塗層18可沈積於至少二相配合之接頭50之間，然後，信號及/或電流可於未移除塗層18下於此等相配合之接頭50間傳送。使信號及/或電流經由塗層18傳送之能力可能至少部份係由於塗層18於z-軸方向之低的阻抗及/或電阻。因此，“經...傳送”一辭可指於未移除塗層18下於二或更多個接頭50間傳送電信號及/或電流。
塗層18之導性可依據任何適合技術測量。於某些實施例，塗層18之導性可藉由決定塗層18之電阻而而測量。此測量可藉由使導線焊接至接頭50且使線材連接至一電阻計60而達成。一預定之力量62可造成接頭50彼此接觸(例如，產生電接觸)。如第6B圖所例示，然後，電阻計60可測量相對應接頭50間之經過塗層18之電阻。作為參考點，接頭50本身之電阻可藉由測量未經塗覆之接頭50間之電阻而決定。依據某些實施例，塗層18可展現0至10千歐姆(kΩ)之範圍之z-軸電阻。於一較佳實施例，塗層18可展現0至1歐姆(Ω)之範圍之z-軸電阻。
第7圖係一例示依據某些實施例之具有各種厚度24之例示塗層18之z-軸電阻之圖64。圖64例示之量度係例示塗層18之例示之z-軸電阻值。但需瞭解與不同材料、結構、沈積技術，及/或其它因素有關之塗層可展現不同量之z-軸導性。雖然圖64例示與厚度24有關之z-軸電阻，需瞭解其它變數(例如，材料、結構、沈積方法等)會影響塗層18之z-軸導性。
於例示之實施例，鍵盤52上之一例示塗層18之z-軸電阻係使用第6B圖例示之電阻計60測量。於此實施例之接頭50係以PTFE型之材料塗覆。一金屬“鍋仔片”按鍵54被作為接頭50之一者。電線焊接至接頭50，且與電阻計60連接。一預定力量62(約5牛頓-公尺)施加至一接頭50，造成此接頭50接觸一相對應之接頭50。然後，電阻計60測量相接觸之接頭50間之電阻。預定之力量62係藉由使用ENIG電鍍之軌道及藉由改變力量62至穩定電阻測量為止而施加。此測量係對具不同厚度24之塗層18而重複。形成之讀數被調整以考量(i)塗層18之二厚度24(即，對每一接頭50之一厚度24)係存在於測量路徑，及(ii)不具塗層18之特定接頭50之電阻。接頭50之電阻係藉由使用一未經塗覆之PCB 10作為參考物而決定。
此等測量之結果係例示於第7圖之圖64及下表中。第7圖之圖64包含對應於塗層18之電阻之第一軸66，及對應於塗層18之厚度24之第二軸68。測得之電阻係以圖64中之點70例示。
雖然前述實施例係例示一包含PTFE型材料之特定塗層18之電阻，需瞭解塗層18可包含任何適合型式及/或組合之鹵-烴類聚合物。雖然前述實施例係例示具有特定厚度24之塗層18之電阻，需瞭解塗層18可被建構而具有任何適合厚度24。
一般，一裝置內之接頭50可於建構此裝置之前或之後以塗層18塗覆。於一較佳實施例，接頭50係於建構此裝置之前以塗層18塗覆。塗層18可塗敷至接頭50之一、一些，或所有之表面。於某些實施例，塗層18可塗敷至此裝置(例如，鍵盤52)之一或多個表面。塗層18可被塗敷至將會曝露於環境之接頭50及/或裝置之表面，諸如，作為一電路之二或更多部份間之電接觸區域之表面。使塗層18塗敷至除接頭50之表面外之此裝置之另外表面可(i)增加此裝置之免於腐蝕及/或氧化之保護，及/或(ii)避免形成至此裝置之接觸區域之變質路徑。
塗層18可依據任何適合技術沈積於接頭50上。例如，塗層18可使用化學蒸氣沈積(CVD)、分子束磊晶(MBE)、電漿促進之化學蒸氣沈積(PE-CVD)、高壓/大氣電漿沈積、金屬-有機-化學蒸氣沈積(MO-CVD)，及/或雷射促進之化學蒸氣沈積(LE-CVD)沈積。於某些實施例，塗層18可藉由產生互穿式聚合物網絡(IPN)及/或聚合物或單體之單層表面吸收(SAM)而於原位形成聚合物及/或聚合物混合物而沈積於接頭50上。於其它實施例，塗層18可使用一液體塗覆技術(諸如，液體浸漬、噴灑塗覆、旋轉塗覆、噴濺，及/或溶膠-凝膠方法)沈積。
依據某些實施例，塗層18可使用如上有關於第2圖所述之電漿沈積而沈積於接頭50上。因此，接頭50可被置於反應器28內之腔室30內。然後，反應器28可使氣體(例如，氫、氬，及/或氮)引至腔室30內以清理接頭50。於一或多個步驟，反應器28可使一或多種先質化合物36引至腔室30內藉由電漿沈積於接頭50上形成一單層或多層之塗層18。於某些實施例，塗層18可依循接頭50之三維形狀。使塗層18沈積於接頭50上之較佳方法可依所欲之塗層18之特定厚度24而定。液體塗覆技術對於較厚之塗層18係較佳，而電漿沈積對於較薄之塗層18係較佳。
用以使塗層18沈積於接頭50上之技術可被建構以控制塗層18之z-軸導性。於某些實施例，塗層18之z-軸導性可藉由調節下列因素之一或多者而控制：
■塗層18內之鹵-烴類材料之組成，其可包含混合不同之鹵-烴類材料及控制具不同材料之層44間之漸變。
■塗層18內之鹵-烴類材料內之鹵素原子/雜原子/碳原子之比例。
■鹵-烴類塗層材料內之碳之比率。
■鹵-烴類塗層材料內之共軛度。
■鹵-烴類塗層材料之平均分子量。
■鹵-烴類塗層材料內之分支及交聯之程度。
■鹵-烴類塗層材料內之分子之分子尺寸分佈。
■鹵-烴類塗層材料之密度。
■鹵-烴類塗層材料之另外摻雜劑之存在。
■鹵-烴類塗層材料內之離子/鹽、離子，及/或共價組份之存在。
■鹵-烴類塗層材料內之有機/聚合物及包含過渡金屬之無機化合物之存在，包含於此材料內之錯合物陽離子及陰離子。
■鹵-烴類塗層材料內之具有可變化氧化態之化合物及/或元素之存在。
■鹵-烴類塗層材料內之具有離域特徵之化學化合物之存在。
■鹵-烴類塗層材料內之包藏組份之存在。
■當塗層18藉由電漿沈積而沈積時，電漿條件(例如，功率、氣體壓力、電極配置)之調整。
■鹵-烴類塗層材料之厚度(例如，較厚之塗層18可展現比具相同材料之較薄之塗層18更大之電阻)。
■塗層18之位向。
■塗層18之持續性(例如，多孔性及/或三維結構)。
雖然鍵盤52於如上之實施例中描述，塗層18可被塗敷至於任何型式之裝置內接頭50。例如，塗層18可被塗敷至安全開關、警示開關、保險絲座、行動電話上之鍵盤52、觸控螢幕、電池、電池端子、半導體晶片、智慧卡、感應器、測試晶片、彈性體連接器(例如，導電膠條(Zebra strip))、電連接器(例如，插座及插頭)、終止器、壓接式連接器、壓入型連接器，及/或滑式接頭50(諸如，用於晶片、智慧卡、代幣，及閱讀器機構內之接頭50。
第8圖例示依據某些實施例之包含具有經塗覆之接頭50之感應器70之測量裝置72。感應器74可為任何適合型式之感應器74。於某些實施例，感應器74係一種測量分析物(諸如，有毒氣體、葡萄糖、生理流體為主之化學化合物，及/或其它化學化合物)之拋棄式感應器74。感應器74可包含一膜76、一或多個電極78、一或多個接頭50，及一感應器基材80。膜76可為過濾流體以使分析物到達電極78之任何適合材料。於某些實施例，膜76可為一生物可相容之膜。因此，分析物可經由膜76擴散且於電解質-催化劑之界面反應，而可產生電流。
感應器74內之電極78可包含一催化劑及/或被建構以與分析物交互作用之其它材料。例如，電極78可為一包含葡萄糖氧化酶及/或脫氫酶之酶電極。分析物與電極78之交互作用可產生一信號，其係電或可被轉化成電信號。感應器74內之一或多個接頭50可使電信號傳送至測量裝置72之主體82。於某些實施例，電極78上之接頭50係與測量裝置72之主體82呈電接觸，如此，電流係以測量裝置72之主體82產生。於某些實施例，通過接頭50之總電荷係與流體內已與電極之酶反應之分析物之量呈比例。測量裝置72可被建構及/或校正以測量來自接頭50之信號及報告分析物之存在及/或濃度。
電極78固定及/或印刷於感應器基材80上。於某些實施例，感應器74可包含一與電極78偶合之電源。感應器74可被建構以檢測氣體及/或液體態之分析物。
感應器74內之接頭50可包含任何適合材料。於某些實施例，接頭50包含一軟性接頭材料，諸如，碳、導性墨水，及/或銀填充之環氧化物。於某些實施例，感應器74內之接頭50可與測量裝置72內之主體82內之另一接頭50電接觸，因而於測量裝置72之感應器74及主體82間形成一電路。接頭50可以任何適合厚度24(例如，從1nm至2μm)之塗層18塗覆。感應器74內之一或多個接頭50可為未經塗覆。
於某些實施例，測量裝置之主體82係可重複使用，而感應器74係可拋棄(例如，僅使用一次)。於其它實施例，感應器74可為一多次使用之感應器74或用於長壽命之其它設計。測量裝置之主體82與感應器74之經由接頭50之連接可再製及/或可提供固定或基本上固定之電阻。如上所示，接頭50可包含一軟性接頭材料，諸如，碳、導性墨水，及/或銀填充之環氧化物。無塗層18時，來自此等軟性材料之顆粒會自接頭50脫離且累積於測量裝置72之主體82之組件上。但是，藉由使塗層18塗敷型接頭50，可避免此等軟性材料自接頭50脫離50及累積於測量裝置72之主體82之組件上。
雖然前述實施例描述使塗層18塗敷至一分析物感應器74之接頭50，需瞭解塗層18可塗敷至任何型式之感應器74或適合之其它裝置之接頭50或其它組件。例如，塗層18可塗敷至其間軟性(例如，碳)墊材被用以製造一重複電連接之任何適合裝置或系統。此等系統可多次使用相同感應器74或可以拋棄式感應器74重複地使用相同裝置。
於某些實施例，一裝置之接頭50上之塗層18可包含一直接於接頭50表面上之極薄層(例如，5nm或更少)之金屬鹵化物(較佳係金屬氟化物)。於某些實施例，此金屬鹵化物層可為一單層，實質上一單層或一些單層。於其它實施例，此金屬鹵化物層可包含於接頭50之表面處之此等層之一金屬鹵化物區域。接頭50上之金屬鹵化物層可為活性，可為惰性，及/或可避免於接頭50上形成氧化物層及/或其它污點，其會阻礙有效電接觸或其後之加工處理。
於其間塗層18係藉由電漿沈積塗敷之實施例，當氣體電漿內之活性物種與接頭50之金屬表面反應時，一金屬鹵化物層可形成於接頭50上。於某些實施例，此金屬鹵化物層可使用較高濃度之氟物種而促進。然後，一層包含鹵-烴類聚合物之塗層18可塗敷於此金屬鹵化物層上及/或與其混合。此金屬鹵化物層及此鹵-烴類聚合物層可為軸向或空間上呈獨立。另外，接頭50上之塗層18從金屬鹵化物至鹵-烴類聚合物可為漸變式轉化。於某些實施例，此金屬鹵化物層可保護接頭50免於氧化，而鹵-烴類聚合物層(i)可提供環境保護而免於腐蝕性氣體及/或液體，及/或(ii)可提供氧化保護。若塗層18內之鹵-烴類聚合物層最終藉由機械磨耗而磨損掉，下層之金屬鹵化物層可避免氧化聚積物，因而使接頭50持續產生電連接。
於某些實施例，塗層18之表面性質可被建構以使組件結合至塗層18之表面。例如，塗層18可被建構以使塗層18之表面與電組件12間黏著。於某些實施例，塗層18之退火及/或熱性質可被建構以使塗層18之一或多個層44可選擇性地自一經塗覆之裝置移除。
使塗層18塗敷至接頭50可提供優於傳統裝置之優點。塗層18可提供下列優點之無一者、一些，或全部。一優點係塗層18可藉由保護其免於環境損害及/或腐蝕而延長接頭50之壽命。一些裝置典型上係用於極潮濕之環境。於此等環境，包含溶解氣體(例如，二氧化硫、硫化氫、二氧化氮、氯化氫、氯、臭氧，及/或水蒸氣)之顯微水滴會形成腐蝕性溶液。此等水滴會於一裝置之接頭50上形成一腐蝕薄膜或沈積物。此腐蝕會使接頭50退化及縮短有用壽命。傳統之塗覆物質(諸如，傳統之聚合物及塑料)一般係絕緣體，因此，已證明係不適於塗覆接頭50。但是，包含鹵-烴類聚合物之塗層18可於z-軸方向展現導性。因此，塗層18不會阻礙接頭50接收及/或傳送信號之能力。此外，或另外，若接頭50以塗層18塗覆，接頭50可對腐蝕產生防護。
另一優點係塗層18可保持接頭50之表面之整體性。如上所解釋，接頭50之腐蝕及/或氧化會妨礙及/或干擾接頭50彼此呈電連接之能力。此問題會於腐蝕及/或氧化造成於接頭50之表面上形成一絕緣層及/或接頭50之表面物理性變化(其妨礙接頭50彼此形成良好之電接觸)時發生。此問題會於，例如，一未經塗覆之接頭50係一警告系統之安全開關或連接器時產生。此等系統經常係長期無作用，但需要時需正確地作用。未經塗覆之接頭50於此腐蝕於相配合之接頭50間(諸如，於保險絲座及電池端子)形成一絕緣障壁時會變不連接。但是，若接頭50以塗層18塗覆，接頭50會保護而免於腐蝕及/或氧化。因此，塗層18可保持接頭50之表面整體性。
另一優點係塗層18可保護接頭50免於腐蝕。於包含未經塗覆之接頭50之裝置，腐蝕會妨礙被設計用以移除之接頭50移動。於某些情況，腐蝕會改變一電路之電且/性能，及/或使一裝置之可移動元件退化。但是，若接頭50以塗層18塗覆，接頭50可被保護免於腐蝕，藉此，延長一包含接頭50之裝置之壽命。
如上所解釋，電組件12可藉由經塗層18之焊接(未先移除塗層18)附接至PCB 10而於PCB 10之電組件12與導電軌16間形成焊料接頭26。於其它實施例，電組件12可藉由使電組件12與PCB 10之導電軌16線結合附接至經塗覆之PCB 10。
第9圖例示一依據某些實施例之經由塗層18形成之線結合84。線結合84可於線材86與任何適合表面間形成。於某些實施例，線結合84可於線材86及電組件12、導電軌16，及/或電路元件之一表面間形成。其上形成線結合84之表面可稱為一接觸表面88。於例示之實施例，線材86及接觸表面88皆以塗層18塗覆。於其它實施例，線材86可經塗覆且接觸表面88可未經塗覆。於其它實施例，線材86可未經塗覆且接觸表面可經塗覆。於某些實施例，塗層18僅塗敷至線材86及/或接觸表面88之其間欲形成線結合84之區域。於其它實施例，塗層18被塗敷至所有或實質上所有之線材86及/或接觸表面88上。
“線結合”一辭一般係指一種於無焊料38及/或助熔劑42使電組件12及/或電路元件結合之技術。於某些實施例，線結合可用以使用導線86製造二或更多組件間之電連接。線結合可用以產生裸晶型式之積體電路及積體電路內之導線架間之相互連接。此外，或另外，線結合可用以產生裸晶及PCB 10間之相互連接。
線結合84可使用線材86及一線結合器90於接觸表面88上形成。線結合84可使用任何適合型式之線材86形成。“線材”一辭可指一或多個長線股之導性材料。於某些實施例，線材86可載負電流，傳送電信號，及/或承载機械負重。於某些實施例，線材包含電組件12之一插栓、一長絲、一電導線，及/或一腳。
線材86可包含任何適合材料。於某些實施例，線材86包含一或多種導性材料，諸如，一般之金屬、貴/稀金屬、導性聚合物，及/或導性非金屬材料。於一較佳實施例，線材86包含金、鋁、銅，及/或銀。於其它實施例，線材86包含鎳、鈀、鉑、銠、銥、錫、鉛、鍺、銻、鉍、銦、鎵、鈷、鐵、錳、鉻、釩、鈦、鈧、鋯、鉬、鎢、其它過渡金屬，及/或其它適合材料。線材86可包含任何適合之金屬合金及/或導性材料之組合物。於某些實施例，包含輕易氧化及/或玷污之金屬(包含合金)之線材86可特別自塗層18獲利。使塗層18塗敷至線材86可延長包含線材86之裝置之保存期及/或作用壽命。
線材86可具有圓形、矩形，或任何其它形狀之截面。於某些實施例，具有矩形截面之線材86稱為帶材。於其間線材86具有圓形截面之實施例，線材86具有5μm至1mm範圍之直徑92。於其它實施例，線材86具有10μm至200μm範圍之直徑92。於一較佳實施例，線材86具有15μm至75μm範圍之直徑92。於其間線材86具有矩形截面之實施例，線材86之一側可具有5μm至1mm範圍之尺寸。於其它實施例，一矩形線材86之一側可具有10μm至200μm範圍之尺寸。於一較佳實施例，一矩形線材86之一側可具有20μm至75μm範圍之尺寸。不同型式之線材86可能需不同之線結合設備及/或參數。
線結合器90一般可操作而於線材86與接觸表面88間形成線結合84。線結合器90可為使用熱及/或壓力而於線材86與接觸表面88間形成結合之任何適合型式之機器。線結合器90可為一楔形-楔形結合器90、一球形-楔形結合器90、一三通轉換式線結合器90、一超音波絕緣式線結合器90、一高頻線結合器90、一手動式線結合器90，及自動線結合器90，及/或任何適合型式之線結合器90。於某些實施例，線結合器90包含一針狀工具(稱為毛細管)，線材86係經其穿線。線結合器90可使線材86之一端置於接觸表面88上形成一球形結合84a或一楔形結合84b。“球形”及“楔形”一辭一般係指於產生連接處之線材86之幾何形狀。此二線結合方法--球形結合及楔形結合--可使用熱、壓力，及超音波能量之不同組合以於線材86之任一端或二熔接。
於某些實施例，線結合器90係藉由使高電壓之電荷施加至線材86(其會於線結合器90之毛細管尖部使線材86熔融)而形成球形結合84a。線材86之尖部由於熔融金屬之表面張力而形成一球。於球形固化之前、期間，或之後，線結合器90趨動此毛細管，使線材86之端接觸接觸表面88。然後，線結合器90可施加熱、壓力，及/或趨音波能量而於線材86之端部及接觸表面88間產生熔接。因此，線結合器90可形成球形結合84a。第10A圖例示依據某些實施例之於未經塗覆之線材86與經塗覆之接觸表面88間形成之球形結合84a之顯微影像。線材86及接觸表面88可包含任何適合型狀及/或組合之導性材料。於此例示之實施例，線材86包含金，且接觸表面88包含銅。接觸表面88於塗層18塗敷至接觸表面88前可被預處理。於此例示之實施例，接觸表面88係以一液體為主之硫酸/過氧化氫溶液預處理。乾燥後，此實施例之接觸表面88以氫電漿處理，其後，塗層18沈積於接觸表面88上。於此例示之實施例，線材86與接觸表面88間之球形結合84a係於塗層18沈積於接觸表面88之後形成。雖然前述實施例係例示以一特定溶液及氫電漿預處理之接觸表面88，需瞭解任何適合之表面處理可於塗敷塗層18前使用。需進一步瞭解，於某些實施例，無接觸表面88之表面處理會於塗敷塗層18前發生。
第10B圖例示依據某些實施例之於一未經塗覆之線材86與一經塗覆之接觸表面88間之球形結合84a之截面圖之顯微影像。線材86及接觸表面88可包含任何適合型式及/或組合之導性材料。於此例示之實施例，線材86包含金，且接觸表面88包含銅。接觸表面88可於塗層18塗敷至接觸表面88前預處理。於此例示之實施例，接觸表面88係以一以液體為主之硫酸/過氧化氫溶液預處理。接觸表面88乾燥後，塗層18沈積於此例示之接觸表面88上。然後，此實施例之經塗覆之接觸表面88以氫電漿後處理。於此實施例，然後，球形結合84a於線材86與接觸表面88間形成。
雖然前述實施例例示以一特定溶液預處理且以氫電漿後處理之接觸表面88，需瞭解接觸表面88可接受任何適合之預處理及/或後處理。需進一步瞭解，於某些實施例，無接觸表面88之表面處理可於塗敷塗層18之前或之後發生。
於某些實施例，線結合器90於線材86與接觸表面88間形成楔形結合84b。線結合器90可藉由使線材86抵著接觸表面88壓碎而形成楔形結合84b。形成楔形結合84b後，線結合器90可切割線材86。第11A圖例示依據某些實施例之於未經塗覆之線材86及一經塗覆之接觸表面88間之楔形結合之顯微影像。第11B圖例示一經塗覆之線材86與一經塗覆之接觸表面88間之楔形結合84b之截面圖之顯微影像。
線結合器90可被建構以於線材86之一端形成球形結合84a及於線材86之另一端形成楔形結合84b。此方法被稱為球形-楔形結合。第12圖例示依據某些實施例之具有球形結合84a及楔形結合84b之PCB 10。於某些實施例，線結合器90可先於接觸表面88及線材86之端部之一熔融圓球間形成球形結合84a。球形結合84a可使用熱及/或超音波能量形成。然後，線結合器90可使用線材86形成一所欲高度及形狀之迴路。一旦此迴路係於用以形成第二結合之所欲位置，線結合器90可於線材86與接觸表面88間形成楔形結合84b。形成楔形結合84b後，線結合器90可切割線材86，留下一自由端，其可形成一可用以形成下一線結合84之圓球。
於某些實施例，線結合器90可被建構而於線材86之二端形成楔形結合84b。此方法可稱為楔形-楔形結合。楔形結合可依賴超音波及磨擦能量之組合。楔形結合84b可於具有或不具有藉由加熱線材86而引入之另外熱能之貢獻而形成。於某些實施例，楔形結合84b對於使線材86與PCB 10之導電軌連接係較佳。
一般，一良好之線結合84可藉由使用無或實質上無污染物(諸如，氧化產物)之線材86及接觸表面88達成。傳統上，使用銅線材86達成良好之線結合84係困難，因為銅於一般氛圍條件下輕易氧化。線材86及/或接觸表面88之表面上之氧化銅層會使線結合84之形成變困難。此外，用於線結合所需之高溫會導致增加之氧化反應。因此，製造業者已避免使用輕易氧化之線材86(例如，銅線材)或需使用惰性氛圍以避免氧化反應。於某些情況，製造業者試圖於線結合前立即清理銅線材86以自銅線材86之表面移除氧化銅聚積物及/或其它污點。清理銅線材86及/或使用惰性氛圍使複雜性及費用引至線結合方法。因此，某些型式之線材86(例如，銅線材)未普遍用於線結合。
使塗層18塗敷至線材86及/或接觸表面88會減輕一些、全部，或無一者之上述問題。於某些實施例，使包含鹵-烴類聚合物之塗層18塗敷至線材86及/或接觸表面88可保護線材86及/或接觸表面88免於氧化及/或腐蝕。因此，塗層18可避免形成會妨礙線材86與接觸表面88結合之氧化物及/或腐蝕層。於某些實施例，塗層18可被建構以使線結合84可經由塗層18形成，而無需事先自線材86及/或接觸表面88移除塗層18。藉由避免氧化及/或藉由使線結合84經由塗層18形成，塗層18可降低線結合方法之費用及/或困難性。
於某些實施例，線材86及接觸表面88皆以塗層18塗覆。線材86上之塗層18可與接觸表面88上之塗層18相同或實質上相同。另外，線材86上之塗層18可包含與接觸表面88上之塗層18不同之鹵-烴類聚合物。於其它實施例，線材86係未經塗覆，且接觸表面88係以塗層18塗覆。於其它實施例，線材86係以塗層18塗覆，且接觸表面88係未經塗覆。線材86及/或接觸表面88上之塗層18可為連續、實質上連續，或非連續。一連續或實質上連續之塗層18對於對有害環境之高度防護可為較佳。非連續之塗層18對於其它目的可為較佳。
線材86及/或接觸表面88上之塗層18可具有任何適合厚度24。於某些實施例，塗層18之厚度24係1nm至2μm。於其它實施例，塗層18之厚度24係1nm至500nm。於其它實施例，塗層18之厚度24係3nm至500nm。於其它實施例，塗層18之厚度24係10nm至500nm。於其它實施例，塗層18之厚度24係10nm至250nm。於其它實施例，塗層18之厚度24係10nm至30nm。於其它實施例，塗層18係一單層之鹵-烴類聚合物(例如，具有數埃()之厚度24)。於一較佳實施例，塗層18之厚度24係10nm至100nm，且呈各種梯度，且100nm係一較佳之厚度24。線材86及/或接觸表面88上之塗層18可為一單層塗層18或一多層塗層18。
塗層18之最佳厚度24可依於線結合84形成後之線材86及/或接觸表面88所欲之特定性質而定。例如，若期望高度之耐腐蝕性、耐磨耗性，及/或環境韌性，一較厚之塗層18可能係所欲的。因此，塗層18之厚度24可對於一裝置之特定要求而建構及/或最佳化。
如上所解釋，塗層18可被建構以使線結合器90可形成經過塗層18之線結合84。換言之，線結合器90可操作以使材86與接觸表面88結合而無需先自線材86及/或接觸表面88移除塗層18。因此，線結合方法可選擇性地改變線結合84之區域內之塗層18。於某些實施例，塗層18係藉由此線結合方法僅於線結合84之局部區域選擇性地自線材86及/或接觸表面88移除，以使塗層18保持完整至線結合84。因此，於線結合84形成後，塗層18可鄰接線結合84。於某些實施例，塗層18於線材86及/或接觸表面88上於除形成線結合84外之任何處保持完整。因為塗層18可保持完整至線結合84，於線結合84形成後，塗層18可保護線材86、接觸表面88，及/或此裝置之其餘者免於氧化、腐蝕，及/或環境作用。因此，塗層18可提一裝置長期之穩定性及保護。
於某些實施例，線材86及/或接觸表面88上之塗層18係藉由楔形結合及/或球形結合之作用及/或方法而置換。於此等結合方法，能量可有效地偶合於線結合84之區域內。此能量可促進接觸表面88及/或線材86上之塗層18之置換，且能形成線結合84。如上所解釋，楔形結合可依賴超音波及摩擦能量之結合且具有或不具有藉由加熱線材86引入之另外熱能之貢獻。相反地，球形結合主要係一種熱音波方法。對於楔形結合及球形結合，塗層18可藉由摩擦及/或熱作用於線結合84之區域選擇性地置換。因此，塗層18可藉由相變化以固體材料及/或藉由蒸發作用置換。
經過塗層18於線材86及/或接觸表面88間形成之線結合84可展現良好之結合強度。於某些實施例，線結合84係足夠強而使任何失效會於在線結合84與接觸表面88之界面發生前於線材86發生。因此，結合強度可大於，少於，或等於線材86之失效強度。於實施例s其間線材86具有25μm之直徑92，5g至12g之力量對於破壞線結合84係需要。於其間線材86具有25μm之直徑92之實施例，7g至12g之力量對於破壞線結合84係需要。線結合84之強度可藉由於塗敷塗層18前清理線材86及/或接觸表面88而促進。於某些實施例，線材86及/或接觸表面88可以氣體電漿處理以達成一“超清潔”表面。藉由氣體電漿活化及清理線材86及/或接觸表面88可提供較強之線結合84。
於某些實施例，線結合84之強度可使用拉伸強度測試器測量。此測量可對於接觸表面88上之塗層18之不同厚度24及對於不同型式之線材86重複。於一實施例，一Kullicke ＆ Soffe 4523楔形線結合器90被用以形成線結合84。於此實施例，線結合器90被設定成下列設定：(i)“第一結合”設定為“功率2.20”，“時間4.0”，“力量3.0=60g”；(ii)“第二結合”設定為“功率2.20”，“時間3.0”，“力量3.0=60g”；(iii)電子設定係“長時間”間隔。於此實施例，線結合器90於下表中列示之線材86與一以包含鹵-烴類聚合物之塗層18塗覆之銅接觸表面88間形成線結合84。塗敷塗層18前，銅接觸表面88以一以液體為主之硫酸/過氧化氫溶液預處理。
於線結合84於此實施例形成後，一Kullicke ＆ Soffe BT22拉伸強度測試器被用以測量線結合84之強度。此實施例之測量係列示於下表中。
於此實施例，金及鋁線材86係未經塗覆，且銅線材86係以包含鹵-烴類聚合物之塗層18塗覆。於塗層18前，銅線材86係使用氫電漿預處理約2分鐘。於此實施例之每一拉伸強度測試，觀察到最後失效之點係由於線材86斷裂，而非線結合84失效。因此，對於此實施例，表中之結合強度有效地代表平均結合強度之下限。
雖然前述實施例係例示特定型式之線材86與接觸表面88間之線結合84之結合強度，需瞭解線結合84可於任何型式之線材86與任何型式之接觸表面88間形成。雖然前述實施例係例示一特定型式之線結合器90，需瞭解任何適合型式之線結合器90可用以形成線結合84。雖然前述實施例係例示於接觸表面88上之塗層18之特定厚度24，需瞭解接觸表面88及/或線材86上之塗層18可具有任何適合厚度24。
於某些實施例，改質線材86、接觸表面88，及/或塗層18之表面粗糙性可增加線結合84之強度。線材86、接觸表面88，及/或塗層18可以相同或不同之表面粗糙性建構，以使線結合84對於各種應用最佳化。於某些實施例，線材86及/或接觸表面88之表面粗糙性可於塗敷塗層18前改質。於某些實施例，塗層18之表面粗糙性可於其敷至線材86及/或接觸表面88後改質。
線材86、接觸表面88，及/或塗層18之表面粗糙性可以巨觀尺度(例如，等於或大於1μm)及/或微觀尺度(例如，少於1μm)控制。改質線材86及/或接觸表面88之表面粗糙性及/或平坦性可有效改質於線結合方法期間之線材86及/或接觸表面88間之接觸面積及/或摩擦特徵。此等型式之改質可於線結合方法期間使能量有效率地偶合線結合84之區域。此等改質可於線材86與接觸表面88間形成強的線結合84。
線材86、接觸表面88，及/或塗層18之表面粗糙性、摩擦特徵，及/或表面能量特徵可藉由任何適合方法改質，諸如，氣體電漿處理、液體/酸蝕刻、機械式處理，及/或選擇用於沈積塗層18之先質化合物36(例如，氯)。
於某些實施例，塗層18於線材結合處理前未自線材86及/或接觸表面88移除。於其它實施例，塗層18於線結合處理前可選擇性地自線材86及/或接觸表面88移除。於其它實施例，於線結合處理前，塗層18可自線材86完全移除及/或自接觸表面88之全部區域移除。於其間至少一部份之塗層18於線結合處理前移除之實施例，塗層18可藉由加熱接觸表面88、藉由雷射剝離、藉由電漿處理，及/或液體化學蝕刻選擇性地或自全部區域移除。於此等實施例，塗層18可於線結合84形成後被置換。於其它實施例，塗層18可於線結合後塗敷至一乾淨之接觸表面88或一經預塗覆之接觸表面88。此一步驟可於，例如，選擇於其後伴隨加工處理或修改時需要長期穩定性時考慮。於某些實施例，一旦線結合84形成，線材86、接觸表面88，及/或線結合84係藉由塗敷一另外之塗層18覆蓋層而進一步保護。
塗層18可使用任何適合技術塗敷至線材86及/或接觸表面88。例如，塗層18可使用化學蒸氣沈積(CVD)、分子束磊晶(MBE)、電漿促進之化學蒸氣沈積(PE-CVD)、高壓/大氣電漿沈積、金屬-有機-化學蒸氣沈積(MO-CVD)，及/或雷射促進之化學蒸氣沈積(LE-CVD)沈積。於某些實施例，塗層18可藉由產生互穿式聚合物網絡(IPN)及/或聚合物或單體之單層表面吸收(SAM)沈積於原位形成聚合物及/或聚合物混合物。於其它實施例，塗層18可使用一液體塗覆技術(諸如，液體浸漬、噴灑塗覆、旋轉塗覆、噴濺，及/或溶膠-凝膠方法)沈積。於某些實施例，線材86及/或接觸表面88可於製造後不久即以塗層18塗覆以避免氧化。
於某些實施例，塗層18可藉由如上有關於第2圖所述之電漿沈積沈積於線材86及/或接觸表面88上。於此等實施例，線材86及/或接觸表面88可被置於腔室30內，且反應器28可使氣體(例如，氫、氬，及/或氮)引至腔室30內以清理線材86及/或接觸表面88。然後，反應器28可使一或多種先質化合物36引至腔室30內於線材86及/或接觸表面88上形成一單層塗層18或多層塗層18。於某些實施例，塗層18可封裝及/或依循線材86及/或接觸表面88之三維形狀。
於某些實施例，線材86及/或接觸表面88之塗層18可包含一與線材86及/或接觸表面88之表面直接接觸之極薄層(例如，5nm或更少)之金屬鹵化物(較佳係金屬氟化物)。此金屬鹵化物薄層可包含一最小量之鹵-烴類材料(例如，少於1重量%，少於5重量%等)。於某些實施例，此金屬鹵化物層可為一單層，實質上一單層，或數個單層。於其它實施例，此金屬鹵化物層可包含位於線材86及/或接觸表面88之表面之一金屬鹵化物區域層。金屬鹵化物層可為具活性，可為惰性，及/或可避免於線材86及/或接觸表面88上形成會妨礙有效線結合之氧化物層及/或污點。
於其間塗層18係藉由電漿沈積塗敷之實施例，當氣體電漿內之活性物種與金屬表面反應時，金屬鹵化物層可於線材86及/或接觸表面88上形成。於某些實施例，金屬鹵化物層可使用較高濃度之氟物種而促進。然後，一層包含鹵-烴類聚合物之塗層18可被沈積於金屬鹵化物層上及/或與其混合。金屬鹵化物層及鹵-烴類聚合物層於軸向或空間上可呈獨立。另外，於塗層18從金屬鹵化物至鹵-烴類聚合物可為漸變式轉化。於某些實施例，金屬鹵化物層可保護線材86及/或接觸表面88免於氧化，且鹵-烴類聚合物層(i)可提供環境保護而免於腐蝕性氣體及/或液體，及(ii)可提供氧化保護。若塗層18內之鹵-烴類聚合物層最終藉由機械磨耗而磨損掉，下層之金屬鹵化物層可避免氧化聚積物，因而保護及延長一裝置之壽命。
於某些實施例，塗層18可使線材86及/或接觸表面88於一非惰性氛圍中線結合而未氧化。非惰性氛圍一辭係指一包含一般會氧化及/或腐蝕未經塗覆之線材86及/或未經塗覆之接觸表面88之氣體(例如，氧)之氛圍。如上所解釋，惰性氛圍傳統上用於形成與未經塗覆之銅線材86之線結合。惰性氛圍典型上包含諸如氮及/或氬之惰性氣體。因為塗層18可保護線材86及/或接觸表面88免於氧化及/或腐蝕，塗層18可使線結合84於一非惰性氛圍中形成，且具有極少或無氧化危險。因此，塗層18可降低成本及/或增加線結合方法之效率。但是，需瞭解無論線結合84係於惰性或非惰性之氛圍中形成，塗層18可用於線材86及/或接觸表面88上。
雖然本發明以數個實施例描述，但多種之改變及改良可對熟習此項技藝者暗示，且係欲使本發明包含落於所附申請專利範圍之範圍內之此等改變及改良。
10．．．印刷電路板
12．．．電組件
14．．．基材
16．．．導電軌
18．．．塗層
20．．．界面
22．．．z-軸
24．．．厚度
26．．．焊料接頭
27．．．孔
28．．．反應器
29．．．導線
30．．．腔室30
32．．．真空系統
34．．．能量源
36．．．先質化合物
38．．．焊料
40．．．焊接鐵
42．．．助熔劑
44．．．聚合物層
44a．．．包含第一種聚合物之第一層
44b．．．包含第二種聚合物之第二層
46．．．x-軸
48．．．y-軸
50．．．導性接頭
52．．．鍵盤
54．．．按鍵
56．．．曝露表面
58．．．隱藏表面
60．．．電阻計
62．．．力量
64．．．圖
66．．．第一軸
68．．．第二軸
70．．．點
72．．．測量裝置
74．．．感應器
76．．．膜
78．．．電極
80．．．感應器基材
82．．．主體
84．．．線結合
84a．．．球形結合
84b．．．楔形結合
86．．．線材
88．．．接觸表面
90．．．線結合器
92．．．直徑
第1A-C圖例示依據某些實施例之一印刷電路板(PCB)；
第2圖例示依據某些實施例使一塗層沈積於一PCB上；
第3A-B圖例示依據某些實施例使一電組件焊接至PCB之導電軌；
第4圖例示依據某些實施例之一包含一多層塗層之PCB；
第5圖例示依據某些實施例之一包含選擇性塗敷至PCB之特定區域之多層塗層之PCB；
第6A-B圖例示依據某些實施例之一包含以一塗層塗覆之接頭之鍵盤；
第7圖係一例示依據某些實施例之具有各種厚度之例示塗層之z-軸導性之圖；
第8圖例示依據某些實施例之一包含一具有經塗覆之接頭之感應器之測量裝置；
第9圖係依據某些實施例之一經由一塗層形成之線結合；
第10A圖例示依據某些實施例之於未經塗覆之線材及一經塗覆之接觸表面間形成之球型結合之顯微影像；
第10B圖例示依據某些實施例之於一未經塗覆之線材及一經塗覆之接觸表面間之一球型結合之截面圖之顯微影像；
第11A圖例示依據某些實施例之未經塗覆線材與一經塗覆之接觸表面間之楔型結合之顯微影像；
第11B圖例示一經塗覆之線材與一經塗覆之接觸表面間之一楔型結合之截面圖之顯微影像；且
第12圖例示依據某些實施例之一具有一球型結合及一楔型結合之PCB。
10．．．印刷電路板
12．．．電組件
14．．．基材
16．．．導電軌
18．．．塗層
20．．．界面
22．．．z-軸
24．．．厚度
26．．．焊料接頭
27．．．孔
29．．．導線

Claims (77)

  1. 一種印刷電路板，包含：一基材，其包含一絕緣材料；多個導電軌，其等係附接至該基材之至少一表面；一多層塗層，其係沈積於該基材之該至少一表面上，該多層塗層覆蓋該等多個導電軌之至少一部份，該多層塗層包含至少一由一鹵-烴類聚合物形成之層；及至少一電組件，其係藉由一焊料接頭與至少一導電軌連接，其中，該焊料接頭係經由該多層塗層焊接，如此，該焊料接頭鄰接該多層塗層。
  2. 如申請專利範圍第1項之印刷電路板，其中，該多層塗層具有一從1奈米至10微米之厚度。
  3. 如申請專利範圍第1項之印刷電路板，其中，該多層塗層包含彼此可區別之一第一層及一第二層，該第一層及該第二層包含不同聚合物。
  4. 如申請專利範圍第1項之印刷電路板，其中，該多層塗層包含一第一層，其包含一特定型式之聚合物；該多層塗層包含一第二層，其包含該特定型式之聚合物；該第一層內之該聚合物於有關於下列性質之至少一者係不同於該第二層內之該聚合物：分子量；化學組成；結構；幾何形狀；及 多孔性。
  5. 如申請專利範圍第1項之印刷電路板，其中，該多層塗層包含一特定層之一第一聚合物，及另一層之一第二聚合物，該等層彼此鄰接；且該等層係漸變式，如此，該多層塗層從該第一聚合物轉化成該第二聚合物。
  6. 如申請專利範圍第1項之印刷電路板，其中，該多層塗層包含一由一鹵-烴類聚合物形成之特定層，及另一由一無鹵素原子之聚合物形成之層。
  7. 如申請專利範圍第1項之印刷電路板，其中，該多層塗層被沈積以使一金屬鹵化物層覆蓋該等多個導電軌之至少一部份。
  8. 如申請專利範圍第1項之印刷電路板，其中，該多層塗層被沈積以使該等多個導電軌與該多層塗層間基本上無金屬鹵化物層。
  9. 如申請專利範圍第1項之印刷電路板，其中，該鹵-烴類聚合物包含一或多種氟-烴類。
  10. 如申請專利範圍第1項之印刷電路板，其中，該多層塗層包含：一第一層，其包含一氟-烴類材料；及一第二層，其包含一氯氟-烴類材料。
  11. 如申請專利範圍第10項之印刷電路板，其中，該第二層係於該第一層與該等多個導電軌之間形成。
  12. 如申請專利範圍第10項之印刷電路板，其中，該第一層 係於該第二層與該等多個導電軌之間形成。
  13. 如申請專利範圍第1項之印刷電路板，其中，該焊料接頭係於該多層塗層之一實質上連續層沈積於該基材上後於該基材之一特定區域上形成；且該焊接改變於該基材之該特定區域之該多層塗層，且不會改變該基材之其它區域之該多層塗層。
  14. 如申請專利範圍第13項之印刷電路板，其中，該焊接係藉由自該基材之該特定區域移除該多層塗層且未自該基材之其它區域移除該多層塗層而改變該基材之該特定區域之該多層塗層。
  15. 如申請專利範圍第1項之印刷電路板，其中，該基材之一第一區域係以該多層塗層塗覆；且該基材之一第二區域係以另外塗層塗覆。
  16. 如申請專利範圍第15項之印刷電路板，進一步包含一接頭，其係附接至該基材之至少一表面，該接頭係以該單層塗層塗覆，該接頭可操作使一電信號經由該單層塗層傳送至另外接頭。
  17. 如申請專利範圍第1項之印刷電路板，進一步包含一接頭，其係附接至該基材之至少一表面，該接頭係以該多層塗層塗覆，該接頭可操作使一電信號經由該多層塗層傳送至另外接頭。
  18. 如申請專利範圍第1項之印刷電路板，進一步包含至少一線材，其係藉由一線結合與至少一導電軌連接，該線結合係經由該多層塗層形成，以使該線結合鄰接該多層 塗層。
  19. 如申請專利範圍第1項之印刷電路板，其中，加熱於該基材之一特定區域之一助熔劑改變於該基材之該特定區域之該多層塗層，且不會改變於該基材之其它區域之該多層塗層。
  20. 如申請專利範圍第1項之印刷電路板，其中，該基材包含下列之至少一者：一環氧樹脂結合之玻璃織物；一合成樹脂結合之紙；一環氧化物；一棉紙；一紙板；一以天然木材為主之材料；及一以合成木材為主之材料。
  21. 如申請專利範圍第1項之印刷電路板，其中，該多層塗層之至少一層包含一金屬材料。
  22. 一種用於製備具有鹵-烴類聚合物塗層之電路板的方法，包含：使多個導電軌附接至一包含一絕緣材料之基材之至少一表面；使一多層塗層沈積於該基材之該至少一表面上，該多層塗層覆蓋該等多個導電軌之至少一部份，該多層塗層之至少一層包含至少一鹵-烴類聚合物；及於沈積該多層塗層後，經由該多層塗層焊接而於一電組 件與和該基材附接之至少一導電軌間形成一焊料接頭，該焊料接頭鄰接該多層塗層。
  23. 如申請專利範圍第22項之方法，其中，該多層塗層具有一從1奈米至10微米之厚度。
  24. 如申請專利範圍第22項之方法，其中，該多層塗層包含彼此可區別之一第一層及一第二層，該第一層及該第二層包含不同聚合物。
  25. 如申請專利範圍第22項之方法，其中，該多層塗層包含一第一層，其包含一特定型式之聚合物；該多層塗層包含一第二層，其包含該特定型式之聚合物；該第一層內之該聚合物於有關於下列性質之至少一者係不同於該第二層內之該聚合物：分子量；化學組成；結構；幾何形狀；及多孔性。
  26. 如申請專利範圍第22項之方法，其中，該多層塗層包含一特定層之一第一聚合物，及另一層之一第二聚合物，該等層彼此鄰接；且該等層係漸變式，如此，該多層塗層從該第一聚合物轉化成該第二聚合物。
  27. 如申請專利範圍第22項之方法，其中，該多層塗層包含一由一鹵-烴類聚合物形成之特定層，及另一由一無鹵素 原子之聚合物形成之層。
  28. 如申請專利範圍第22項之方法，其中，該多層塗層被沈積以使一金屬鹵化物層覆蓋該等多個導電軌之至少一部份。
  29. 如申請專利範圍第22項之方法，其中，該多層塗層被沈積以使該等多個導電軌與該多層塗層間基本上無金屬鹵化物層。
  30. 如申請專利範圍第22項之方法，其中，該鹵-烴類聚合物包含一或多種氟-烴類。
  31. 如申請專利範圍第22項之方法，其中，該多層塗層包含：一第一層，其包含一氟-烴類材料；及一第二層，其包含一氯氟-烴類材料。
  32. 如申請專利範圍第31項之方法，其中，該第二層係於該第一層與該等多個導電軌之間形成。
  33. 如申請專利範圍第31項之方法，其中，該第一層係於該第二層與該等多個導電軌之間形成。
  34. 如申請專利範圍第22項之方法，其中，該焊料接頭係於該多層塗層之一實質上連續層沈積於該基材上後於該基材之一特定區域上形成；且該焊接改變於該基材之該特定區域之該多層塗層，且不會改變該基材之其它區域之該多層塗層。
  35. 如申請專利範圍第34項之方法，其中，該焊接係藉由自該基材之該特定區域移除該多層塗層且未自該基材之其它區域移除該多層塗層而改變該基材之該特定區域 之該多層塗層。
  36. 如申請專利範圍第22項之方法，其中，該基材之一第一區域係以該多層塗層塗覆；且該基材之一第二區域係以另外塗層塗覆。
  37. 如申請專利範圍第36項之方法，進一步包含：附接一接頭至該基材之至少一表面，該接頭係以該單層塗層塗覆，該接頭可操作使一電信號經由該單層塗層傳送至另外接頭。
  38. 如申請專利範圍第22項之方法，進一步包含：附接一接頭至該基材之至少一表面，該接頭係以該多層塗層塗覆，該接頭可操作使一電信號經由該多層塗層傳送至另外接頭。
  39. 如申請專利範圍第22項之方法，進一步包含：經由該多層塗層形成一線結合，該線結合使至少一線材與至少一導電軌連接，該線結合鄰接該多層塗層。
  40. 如申請專利範圍第22項之方法，進一步包含：藉由下列之至少一者改良該多層塗層之浸潤特徵：電漿清理；電漿蝕刻；電漿活化；電漿聚合化及塗覆；及以液體為主之化學蝕刻。
  41. 如申請專利範圍第22項之方法，其中，該多層塗層係藉由下列之至少一者沈積： 電漿沈積；化學蒸氣沈積；金屬-有機-化學蒸氣沈積；分子束晶磊；噴灑塗層；噴濺；及旋轉塗層。
  42. 如申請專利範圍第22項之方法，其中，該基材係包含於一印刷電路板內；且該塗層造成該印刷電路板呈阻燃性。
  43. 如申請專利範圍第22項之方法，進一步包含於該焊接期間控制該多層塗層之浸潤。
  44. 如申請專利範圍第22項之方法，進一步包含平衡該塗層之可焊接性及可保護性，該平衡係至少部份藉由控制該多層塗層之多孔性及濕潤性而達成。
  45. 如申請專利範圍第22項之方法，進一步包含：於形成該焊料接頭後，使一敷形塗層沈積於該印刷電路板上，該敷形塗層包含至少一鹵-烴類聚合物，該敷形塗層具有下列性質之至少一者：焊料通過之能力；能經由該敷形塗層線結合之能力；及沿一與以該敷形塗層塗覆之表面垂直之軸之導性。
  46. 如申請專利範圍第22項之方法，進一步包含：於形成該焊料接頭後，使一敷形塗層沈積於該印刷電路 板上，該敷形塗層包含至少一鹵-烴類聚合物，其中，該敷形塗層沿一與以該敷形塗層塗覆之表面垂直之軸係絕緣；及該敷形塗層具有下列性質之至少一者：焊料通過之能力；能經由該敷形塗層線結合之能力。
  47. 一種印刷電路板，包含：一基材，其包含一絕緣材料；多個導電軌，其附接至該基材之至少一表面；一塗層，其係沈積於該基材之該至少一表面上，其中，該塗層覆蓋該等多個導電軌之至少一部份；且包含至少一鹵-烴類聚合物；及至少一導性線材，其係藉由一線結合與至少一導電軌連接，該線結合係經由該塗層形成而無需事先移除該塗層，如此，該線結合鄰接該塗層。
  48. 如申請專利範圍第47項之印刷電路板，其中，該線結合係沿一與該基材之該至少一表面平行之平面鄰接該塗層。
  49. 如申請專利範圍第47項之印刷電路板，其中，該線結合係下列之至少一者：一球形結合；及一楔形結合。
  50. 如申請專利範圍第47項之印刷電路板，其中，下列之至 少一者：金；鋁；銀；銅；鎳；及鐵。
  51. 如申請專利範圍第47項之印刷電路板，其中，該線材之至少一部份係以該塗層覆蓋。
  52. 如申請專利範圍第47項之印刷電路板，其中，該塗層具有一從1奈米至2微米之厚度。
  53. 如申請專利範圍第47項之印刷電路板，其中，該塗層具有一從10奈米至100奈米之厚度。
  54. 如申請專利範圍第47項之印刷電路板，其中，該至少一鹵-烴類聚合物係一氟-烴類聚合物。
  55. 如申請專利範圍第47項之印刷電路板，其中，該線結合係於該基材之一特定區域形成，該線結合之形成改變該特定區域之該塗層，且不會改變該基材之其它區域之該塗層。
  56. 如申請專利範圍第55項之印刷電路板，其中，於形成該線結合前，該塗層係未自該基材之該特定區域移除；且該線結合之形成係藉由自該基材之該特定區域選擇性移除該塗層改變該基材之該特定區域之該塗層。
  57. 如申請專利範圍第47項之印刷電路板，進一步包含至少一電組件，其係藉由一焊料接頭與至少一導電軌連接，其中，該焊料接頭係經由該塗層焊接，如此，該焊料接頭鄰接該塗層。
  58. 如申請專利範圍第47項之印刷電路板，其中，該線結合係於該基材之一第一區域形成，該第一區域以該塗層塗覆，且進一步包含：至少一電組件，其係藉由一焊料接頭與該基材之一第二區域之至少一導電軌連接，該第二區域係以另一塗層塗覆。
  59. 如申請專利範圍第47項之印刷電路板，進一步包含一接頭，其係附接至該基材之至少一表面，該接頭係以該塗層塗覆，該接頭可操作以使一電信號經由該塗層傳送至另外接頭。
  60. 如申請專利範圍第47項之印刷電路板，其中，該塗層被沈積，如此，一金屬鹵化物層覆蓋該等多個導電軌之至少一部份。
  61. 如申請專利範圍第47項之印刷電路板，其中，該塗層被沈積，如此，於該等多個導電軌與該塗層間基本上無金屬鹵化物層。
  62. 一種用於製備具有鹵-烴類聚合物塗層之電路板的方法，包含：使多個導電軌附接至一包含一絕緣材料之基材之至少一表面； 使一塗層沈積於該基材之至少一表面上，該塗層覆蓋該等多個導電軌之至少一部份，該塗層包含至少一鹵-烴類聚合物；及於至少一導性線材與至少一導電軌間形成一線結合，該線結合係經由該塗層形成，而未事先移除該塗層，如此，該線結合鄰接該塗層。
  63. 如申請專利範圍第62項之方法，其中，該線結合係沿一與該基材之該至少一表面平行之平面鄰接該塗層。
  64. 如申請專利範圍第62項之方法，其中，該線結合係下列之至少一者：一球形結合；及一楔形結合。
  65. 如申請專利範圍第62項之方法，其中，該線材包含下列之至少一者：金；鋁；銀；銅；鎳；及鐵。
  66. 如申請專利範圍第62項之方法，其中，該線材之至少一部份係於形成該線結合前以該塗層覆蓋。
  67. 如申請專利範圍第62項之方法，其中，該塗層具有一從1奈米至2微米之厚度。
  68. 如申請專利範圍第62項之方法，其中，該塗層具有一從10奈米至100奈米之厚度。
  69. 如申請專利範圍第62項之方法，其中，該至少一鹵-烴類聚合物係一氟-烴類聚合物。
  70. 如申請專利範圍第62項之方法，其中，該線結合係於該基材之一特定區域形成，該線結合之形成改變該特定區域之該塗層，且不會改變該基材之其它區域之該塗層。
  71. 如申請專利範圍第70項之方法，其中，於形成該線結合前，該塗層係未自該基材之該特定區域移除；且該線結合之形成係藉由自該基材之該特定區域選擇性移除該塗層改變該基材之該特定區域之該塗層。
  72. 如申請專利範圍第62項之方法，進步包含：於沈積該塗層後，經由該塗層焊接而於一電組件與和該基材附接之至少一導電軌間形成一焊料接頭，該焊料接頭鄰接該塗層。
  73. 如申請專利範圍第62項之方法，其中，該線結合係於該基材之一第一區域形成，該第一區域係以該塗層塗覆，且進一步包含：使另一塗層沈積於該基材之一第二區域上；及經由該基材之該第二區域上之該另一塗層焊接而於一電組件與和該基材附接之至少一導電軌間形成一焊料接頭。
  74. 如申請專利範圍第62項之方法，進一步包含： 使一接頭固定於該基材之至少一表面，該接頭係以該塗層塗覆，該接頭可操作而經由該塗層使一電信號傳送至另一接頭。
  75. 如申請專利範圍第62項之方法，其中，沈積該塗層包含沈積一第一層之該塗層，且進一步包含於形成該線結合後，使一第二層之該塗層沈積於該基材之該至少一表面上，該第二層之該塗層覆蓋該線結合之至少一部份。
  76. 如申請專利範圍第62項之方法，其中，該結合係一裸晶線結合。
  77. 如申請專利範圍第62項之方法，其中，該基材係包含於一印刷電路板，且進一步包含：於形成該線結合後，使一敷形塗層沈積於該印刷電路板上，該敷形塗層包含至少一鹵-烴類聚合物，該敷形塗層具有下列性質之至少一者：焊料通過之能力；能經由該敷形塗層線結合之能力；及沿一與以該敷形塗層塗覆之表面垂直之軸之導性。
TW098127585A 2008-08-18 2009-08-17 包含鹵-烴類聚合物塗層之電路板裝置及其製備方法 TWI459878B (zh)

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