RU2014121727A - Печатная плата и способ ее получения - Google Patents

Печатная плата и способ ее получения Download PDF

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Publication number
RU2014121727A
RU2014121727A RU2014121727/07A RU2014121727A RU2014121727A RU 2014121727 A RU2014121727 A RU 2014121727A RU 2014121727/07 A RU2014121727/07 A RU 2014121727/07A RU 2014121727 A RU2014121727 A RU 2014121727A RU 2014121727 A RU2014121727 A RU 2014121727A
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RU
Russia
Prior art keywords
coating
substrate
circuit board
printed circuit
wire connection
Prior art date
Application number
RU2014121727/07A
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English (en)
Other versions
RU2685692C2 (ru
Inventor
Марк Робсон ХАМФРИЗ
Фрэнк ФЕРДИНАНДИ
Родни Эдвард СМИТ
Original Assignee
Семблант Лимитед
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Publication date
Priority claimed from GB0815095A external-priority patent/GB2462823A/en
Priority claimed from GB0815094A external-priority patent/GB2462822B/en
Priority claimed from GB0815096A external-priority patent/GB2462824A/en
Application filed by Семблант Лимитед filed Critical Семблант Лимитед
Publication of RU2014121727A publication Critical patent/RU2014121727A/ru
Application granted granted Critical
Publication of RU2685692C2 publication Critical patent/RU2685692C2/ru

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
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    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
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    • H01L2924/19042—Component type being an inductor
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    • H01L2924/19101—Disposition of discrete passive components
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    • H01L2924/3011—Impedance
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K2201/01—Dielectrics
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1322—Encapsulation comprising more than one layer
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

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  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
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Abstract

1. Печатная плата, включающая:подложку, включающую изоляционный материал;множество электропроводных печатных дорожек, присоединенных по меньшей мере к одной поверхности подложки;покрытие, осажденное по меньшей мере на одну поверхность подложки, причем:покрытие покрывает по меньшей мере часть множества электропроводных печатных дорожек; ивключает по меньшей мере один галогенуглеводородный полимер; ипо меньшей мере один электропроводный провод, который соединен проводным соединением по меньшей мере с одной электропроводной печатной дорожкой, причем проводное соединение формируют через покрытие без предварительного удаления покрытия так, что проводное соединение примыкает к покрытию.2. Печатная плата по п. 1, в которой проводное соединение примыкает к покрытию вдоль плоскости, параллельной по меньшей мере одной поверхности подложки.3. Печатная плата по п. 1, в которой проводное соединение представляет собой по меньшей мере одно из:шарикового термокомпрессионного микросварного соединения; иклинового термокомпрессионного микросварного соединения.4. Печатная плата по п. 1, в которой провод включает по меньшей мере одно из:золота;алюминия;серебра;меди;никеля; ижелеза.5. Печатная плата по п. 1, в которой по меньшей мере часть провода покрыта покрытием.6. Печатная плата по п. 1, в которой покрытие имеет толщину от 1 нанометра до 2 микрометров.7. Печатная плата по п. 1, в которой покрытие имеет толщину от 10 нанометров до 100 нанометров.8. Печатная плата по п. 1, в которой по меньшей мере один галогенуглеводородный полимер представляет собой фторуглеводородный полимер.9. Печатная плата по п. 1, в которой проводное соединение с�

Claims (29)

1. Печатная плата, включающая:
подложку, включающую изоляционный материал;
множество электропроводных печатных дорожек, присоединенных по меньшей мере к одной поверхности подложки;
покрытие, осажденное по меньшей мере на одну поверхность подложки, причем:
покрытие покрывает по меньшей мере часть множества электропроводных печатных дорожек; и
включает по меньшей мере один галогенуглеводородный полимер; и
по меньшей мере один электропроводный провод, который соединен проводным соединением по меньшей мере с одной электропроводной печатной дорожкой, причем проводное соединение формируют через покрытие без предварительного удаления покрытия так, что проводное соединение примыкает к покрытию.
2. Печатная плата по п. 1, в которой проводное соединение примыкает к покрытию вдоль плоскости, параллельной по меньшей мере одной поверхности подложки.
3. Печатная плата по п. 1, в которой проводное соединение представляет собой по меньшей мере одно из:
шарикового термокомпрессионного микросварного соединения; и
клинового термокомпрессионного микросварного соединения.
4. Печатная плата по п. 1, в которой провод включает по меньшей мере одно из:
золота;
алюминия;
серебра;
меди;
никеля; и
железа.
5. Печатная плата по п. 1, в которой по меньшей мере часть провода покрыта покрытием.
6. Печатная плата по п. 1, в которой покрытие имеет толщину от 1 нанометра до 2 микрометров.
7. Печатная плата по п. 1, в которой покрытие имеет толщину от 10 нанометров до 100 нанометров.
8. Печатная плата по п. 1, в которой по меньшей мере один галогенуглеводородный полимер представляет собой фторуглеводородный полимер.
9. Печатная плата по п. 1, в которой проводное соединение сформировано в отдельной области подложки, причем формирование проводного соединения изменяет покрытие в отдельной области без изменения покрытия в других областях подложки.
10. Печатная плата по п. 9, в которой:
покрытие не удалено с отдельной области подложки перед формированием проводного соединения; и
формирование проводного соединения изменяет покрытие в отдельной области подложки в результате избирательного удаления покрытия с отдельной области подложки.
11. Печатная плата по п. 1, дополнительно включающая по меньшей мере один электрический компонент, соединенный паяным соединением по меньшей мере с одной электропроводной печатной дорожкой, причем паяное соединение припаяно через покрытие так, что паяное соединение примыкает к покрытию.
12. Печатная плата по п. 1, в которой проводное соединение сформировано в первой области подложки, причем первая область покрыта покрытием, и дополнительно включает:
по меньшей мере один электрический компонент, соединенный паяным соединением по меньшей мере с одной электропроводной печатной дорожкой во второй области подложки, причем вторая область покрыта другим покрытием.
13. Печатная плата по п. 1, в которой покрытие осаждают так, что слой галогенида металла покрывает по меньшей мере часть многочисленных электропроводных печатных дорожек.
14. Печатная плата по п. 1, в которой покрытие осаждают так, что слой галогенида металла по существу отсутствует между многочисленными электропроводными печатными дорожками и покрытием.
15. Способ получения печатной платы, включающий этапы, на которых:
присоединяют множество электропроводных печатных дорожек по меньшей мере к одной поверхности подложки, включающей изоляционный материал;
осаждают покрытие по меньшей мере на одну поверхность подложки, причем покрытие покрывает по меньшей мере часть множества электропроводных печатных дорожек, причем покрытие включает по меньшей мере один галогенуглеводородный полимер; и
формируют проводное соединение между по меньшей мере одним электропроводным проводом и по меньшей мере одной электропроводной печатной дорожкой, причем проводное соединение
формируют через покрытие без предварительного удаления покрытия так, что проводное соединение примыкает к покрытию.
16. Способ по п. 15, в котором проводное соединение примыкает к покрытию вдоль плоскости, параллельной по меньшей мере одной поверхности подложки.
17. Способ по п. 15, в котором проводное соединение представляет собой по меньшей мере одно из:
шарикового термокомпрессионного микросварного соединения; и
клинового термокомпрессионного микросварного соединения.
18. Способ по п. 15, в котором провод включает по меньшей мере одно из:
золота;
алюминия;
серебра;
меди;
никеля; и
железа.
19. Способ по п. 15, в котором по меньшей мере часть провода покрывают покрытием перед формированием проводного соединения.
20. Способ по п. 15, в котором покрытие имеет толщину от 1 нанометра до 2 микрометров.
21. Способ по п. 15, в котором покрытие имеет толщину от 10 нанометров до 100 нанометров.
22. Способ по п. 15, в котором по меньшей мере один галогенуглеводородный полимер представляет собой фторуглеводородный полимер.
23. Способ по п. 15, в котором проводное соединение формируют в отдельной области подложки, причем формирование проводного соединения изменяет покрытие в отдельной области без изменения покрытия в других областях подложки.
24. Способ по п. 23, в котором:
покрытие не удаляют с отдельной области подложки перед формированием проводного соединения; и
формирование проводного соединения изменяет покрытие в отдельной области подложки избирательным удалением покрытия с отдельной области подложки.
25. Способ по п. 15, дополнительно включающий этап, на котором:
после осаждения покрытия проводят пайку через покрытие с образованием паяного соединения между электрическим компонентом и по меньшей мере одной электропроводной печатной дорожкой, присоединенной к подложке, причем паяное соединение примыкает к покрытию.
26. Способ по п. 15, в котором проводное соединение формируют по меньшей мере в первой области подложки, причем первую область покрывают покрытием, и дополнительной включающий этапы, на которых:
осаждают другое покрытие во второй области подложки; и
проводят пайку через другое покрытие во второй области подложки для формирования паяного соединения между электрическим компонентом и по меньшей мере одной электропроводной печатной дорожкой, присоединенной к подложке.
27. Способ по п. 15, в котором осаждение покрытия включает осаждение первого слоя покрытия, и дополнительно включающий
этап, на котором после формирования проводного соединения осаждают второй слой покрытия по меньшей мере на одну поверхность подложки, причем второй слой покрытия покрывает по меньшей мере часть проводного соединения.
28. Способ по п. 15, в котором проводное соединение представляет собой проводное соединение бескорпусного кристалла.
29. Способ по п. 15, в котором подложка включена в печатную плату, и дополнительно включающий этап, на котором:
после формирования проводного соединения на печатную плату осаждают конформное покрытие, причем конформное покрытие включает по меньшей мере один галогенуглеводородный полимер, причем конформное покрытие имеет по меньшей мере одно из следующих свойств:
способность к пайке через покрытие;
способность обеспечивать проведение проводного монтажа через конформное покрытие.
RU2014121727A 2008-08-18 2014-05-28 Печатная плата и способ ее получения RU2685692C2 (ru)

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GB0815095A GB2462823A (en) 2008-08-18 2008-08-18 A switch
GB0815094A GB2462822B (en) 2008-08-18 2008-08-18 Wire bonding
GB0815096.3 2008-08-18
GB0815096A GB2462824A (en) 2008-08-18 2008-08-18 Printed circuit board encapsulation
GB0815094.8 2008-08-18
GB0815095.5 2008-08-18

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