JP2014011288A - 配線基板およびそれを用いた電子装置 - Google Patents
配線基板およびそれを用いた電子装置 Download PDFInfo
- Publication number
- JP2014011288A JP2014011288A JP2012146364A JP2012146364A JP2014011288A JP 2014011288 A JP2014011288 A JP 2014011288A JP 2012146364 A JP2012146364 A JP 2012146364A JP 2012146364 A JP2012146364 A JP 2012146364A JP 2014011288 A JP2014011288 A JP 2014011288A
- Authority
- JP
- Japan
- Prior art keywords
- pad
- layer
- layer region
- wiring board
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 52
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910052802 copper Inorganic materials 0.000 claims abstract description 12
- 239000010949 copper Substances 0.000 claims abstract description 12
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 9
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 238000009413 insulation Methods 0.000 abstract 3
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 44
- 239000011347 resin Substances 0.000 description 44
- 229910000679 solder Inorganic materials 0.000 description 37
- 239000004020 conductor Substances 0.000 description 30
- 238000000034 method Methods 0.000 description 11
- 238000005452 bending Methods 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 9
- 230000006870 function Effects 0.000 description 7
- 238000000151 deposition Methods 0.000 description 6
- 239000000945 filler Substances 0.000 description 6
- 238000007772 electroless plating Methods 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 239000012212 insulator Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000011133 lead Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09436—Pads or lands on permanent coating which covers the other conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/099—Coating over pads, e.g. solder resist partly over pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
【解決手段】本発明の一形態にかかる配線基板4は、絶縁基板8と、絶縁基板8上に部分的に配された複数のパッド9とを備え、複数のパッド9は、絶縁基板8上に配された銅からなる第1層領域19aと、第1層領域19a上に配されたニッケルからなる第2層領域19bとを有し、少なくとも1つのパッド9は、電子部品2の電極6が電気的に接続される第1パッド9aをなしており、少なくとも1つのパッド9は、リード端子3が電気的に接続される第2パッド9bをなしており、第2パッド9bにおける第2層領域19bの厚みは、第1パッド9aにおける第2層領域19bの厚みよりも大きい。
【選択図】 図2
Description
本発明の一形態にかかる電子装置によれば、上記配線基板を備えるため、信頼性に優れた電子装置を得ることができる。
2 電子部品
3 リード端子
4 配線基板
5 半導体基板
6 電極
7a 第1はんだ
7b 第2はんだ
8 絶縁基板
9 パッド
9a 第1パッド
9b 第2パッド
10 コア基板
11 ビルドアップ層
12 基体
13 スルーホール導体
14 絶縁体
15 絶縁層
15a 第1絶縁層
15b 第2絶縁層
16 導電層
17 ビア導体
18a 第1樹脂層
18b 第2樹脂層
19a 第1層領域
19b 第2層領域
19c 第3層領域
20 露出部
P 貫通孔
Claims (7)
- 絶縁基板と、該絶縁基板上に部分的に配された複数のパッドとを備え、
該複数のパッドは、前記絶縁基板上に配された銅からなる第1層領域と、該第1層領域上に配されたニッケルからなる第2層領域とを有し、
少なくとも1つの前記パッドは、電子部品の電極が電気的に接続される第1パッドをなしており、
少なくとも1つの前記パッドは、リード端子が電気的に接続される第2パッドをなしており、
前記第2パッドにおける前記第2層領域の厚みは、前記第1パッドにおける前記第2層領域の厚みよりも大きいことを特徴とする配線基板。 - 請求項1に記載の配線基板において、
前記絶縁基板は、最上層に位置する第1絶縁層と、該第1絶縁層よりも下方にて前記第1絶縁層に近接した第2絶縁層とを備え、
前記第1絶縁層には、厚み方向に貫通する貫通孔が形成されており、
前記第2パッドは、前記第1絶縁層上に配されており、
前記第1パッドは、前記第2絶縁層上に配されるとともに、上面の少なくとも一部が前記貫通孔内に露出していることを特徴とする配線基板。 - 請求項2に記載の配線基板において、
前記第1パッドの前記第1層領域は、前記第1絶縁層と前記第2絶縁層との間に配されるとともに、上面の少なくとも一部が前記貫通孔内に露出してなる露出部を有しており、
前記第1パッドの前記第2層領域は、前記貫通孔内において前記露出部上に配されており、
前記第2パッドの前記第2層領域は、前記第2パッドの前記第1層領域の上面および側面を覆っていることを特徴とする配線基板。 - 請求項1に記載の配線基板において、
前記第1パッドの平面視における面積は、前記第2パッドの平面視における面積よりも小さいことを特徴とする配線基板。 - 請求項1に記載の配線基板において、
前記第1パッドにおける前記第1層領域の厚みは、前記第1パッドにおける前記第2層領域の厚みよりも小さく、
前記第2パッドにおける前記第1層領域の厚みは、前記第2パッドにおける前記第2層領域の厚みよりも大きいことを特徴とする配線基板。 - 請求項1に記載の配線基板において、
前記第1パッドにおける前記第1層領域の厚みは、前記第2パッドにおける前記第1層領域の厚みと同じであることを特徴とする配線基板。 - 請求項1に記載の配線基板と、該配線基板の前記第1パッドに電気的に接続した電極を有する電子部品と、前記配線基板の前記第2パッドに電気的に接続したリード端子とを備えたことを特徴とする電子装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012146364A JP5868274B2 (ja) | 2012-06-29 | 2012-06-29 | 配線基板およびそれを用いた電子装置 |
US13/927,554 US9426887B2 (en) | 2012-06-29 | 2013-06-26 | Wiring board and electronic device using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012146364A JP5868274B2 (ja) | 2012-06-29 | 2012-06-29 | 配線基板およびそれを用いた電子装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014011288A true JP2014011288A (ja) | 2014-01-20 |
JP5868274B2 JP5868274B2 (ja) | 2016-02-24 |
Family
ID=49776965
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012146364A Expired - Fee Related JP5868274B2 (ja) | 2012-06-29 | 2012-06-29 | 配線基板およびそれを用いた電子装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US9426887B2 (ja) |
JP (1) | JP5868274B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018190950A (ja) * | 2017-04-28 | 2018-11-29 | 日東電工株式会社 | 配線回路基板、および、撮像装置 |
WO2019073936A1 (ja) * | 2017-10-11 | 2019-04-18 | 国立研究開発法人理化学研究所 | 電流導入端子並びにそれを備えた圧力保持装置及びx線撮像装置 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109156080B (zh) | 2016-05-16 | 2021-10-08 | 株式会社村田制作所 | 陶瓷电子部件 |
US10342127B2 (en) * | 2016-11-14 | 2019-07-02 | Samsung Electronics Co., Ltd | Electronic device including a reinforced printed circuit board |
TWI742991B (zh) * | 2021-01-20 | 2021-10-11 | 啟耀光電股份有限公司 | 基板結構與電子裝置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61164300A (ja) * | 1985-01-16 | 1986-07-24 | 日立化成工業株式会社 | セラミツク多層配線板の製造法 |
JPH07106489A (ja) * | 1993-10-05 | 1995-04-21 | Matsushita Electric Ind Co Ltd | 半導体装置およびその製造方法 |
JPH08255977A (ja) * | 1995-03-16 | 1996-10-01 | Fujitsu Ltd | 実装回路基板 |
JPH10229143A (ja) * | 1997-02-14 | 1998-08-25 | Toppan Printing Co Ltd | 複合リードフレーム |
WO2002005609A1 (fr) * | 2000-07-12 | 2002-01-17 | Rohm Co., Ltd. | Structure permettant l'interconnexion de conducteurs et procede de connexion |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1321980A4 (en) * | 2000-09-25 | 2007-04-04 | Ibiden Co Ltd | SEMICONDUCTOR ELEMENT, METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT, MULTILAYER PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD |
JP2009141229A (ja) | 2007-12-10 | 2009-06-25 | Panasonic Corp | 半導体装置およびその製造方法 |
-
2012
- 2012-06-29 JP JP2012146364A patent/JP5868274B2/ja not_active Expired - Fee Related
-
2013
- 2013-06-26 US US13/927,554 patent/US9426887B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61164300A (ja) * | 1985-01-16 | 1986-07-24 | 日立化成工業株式会社 | セラミツク多層配線板の製造法 |
JPH07106489A (ja) * | 1993-10-05 | 1995-04-21 | Matsushita Electric Ind Co Ltd | 半導体装置およびその製造方法 |
JPH08255977A (ja) * | 1995-03-16 | 1996-10-01 | Fujitsu Ltd | 実装回路基板 |
JPH10229143A (ja) * | 1997-02-14 | 1998-08-25 | Toppan Printing Co Ltd | 複合リードフレーム |
WO2002005609A1 (fr) * | 2000-07-12 | 2002-01-17 | Rohm Co., Ltd. | Structure permettant l'interconnexion de conducteurs et procede de connexion |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018190950A (ja) * | 2017-04-28 | 2018-11-29 | 日東電工株式会社 | 配線回路基板、および、撮像装置 |
JP7105549B2 (ja) | 2017-04-28 | 2022-07-25 | 日東電工株式会社 | 配線回路基板、および、撮像装置 |
WO2019073936A1 (ja) * | 2017-10-11 | 2019-04-18 | 国立研究開発法人理化学研究所 | 電流導入端子並びにそれを備えた圧力保持装置及びx線撮像装置 |
JP2019071245A (ja) * | 2017-10-11 | 2019-05-09 | 国立研究開発法人理化学研究所 | 電流導入端子並びにそれを備えた圧力保持装置及びx線撮像装置 |
US11470722B2 (en) | 2017-10-11 | 2022-10-11 | Riken | Current introduction terminal, and pressure holding apparatus and X-ray image sensing apparatus therewith |
Also Published As
Publication number | Publication date |
---|---|
US9426887B2 (en) | 2016-08-23 |
US20140000946A1 (en) | 2014-01-02 |
JP5868274B2 (ja) | 2016-02-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW448709B (en) | Low-thermal expansion circuit board and multilayer circuit board | |
JP2008085089A (ja) | 樹脂配線基板および半導体装置 | |
KR19990030122A (ko) | 다층 배선 기판 및 이의 제조 방법 | |
JP5868274B2 (ja) | 配線基板およびそれを用いた電子装置 | |
JP5725962B2 (ja) | 配線基板の製造方法及びその実装構造体の製造方法 | |
US10211119B2 (en) | Electronic component built-in substrate and electronic device | |
JP2015015302A (ja) | プリント配線板及びプリント配線板の製造方法 | |
JPWO2007138771A1 (ja) | 半導体装置、電子部品モジュールおよび半導体装置の製造方法 | |
US8829361B2 (en) | Wiring board and mounting structure using the same | |
JP5705565B2 (ja) | 実装構造体 | |
TWI451826B (zh) | 多層電路板及其製作方法 | |
JP5981368B2 (ja) | 配線基板、これを用いた実装構造体および配線基板の製造方法 | |
JP2016100352A (ja) | プリント配線板およびその製造方法 | |
JPH10335528A (ja) | 半導体パッケージおよび半導体パッケージの製造方法 | |
TW202007241A (zh) | 利用防焊限定開窗形成連接端子之電路板結構 | |
JP2015195319A (ja) | モジュール部品及びその製造方法 | |
TW201413842A (zh) | 層疊封裝結構及其製作方法 | |
JP2014103285A (ja) | 配線基板およびその実装構造体 | |
JP2006286660A (ja) | 立体的電子回路装置 | |
JP3988629B2 (ja) | 電子装置 | |
JP2019062062A (ja) | 配線基板、電子装置、及び、配線基板の製造方法 | |
TWI420989B (zh) | 印刷電路板及其製造方法 | |
KR101543031B1 (ko) | 인쇄회로기판 및 그 제조 방법 | |
JP2013008873A (ja) | 配線基板およびその実装構造体 | |
JP2011249456A (ja) | 部品内蔵配線板、部品内蔵配線板の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20150128 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20151019 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20160105 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160105 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5868274 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
LAPS | Cancellation because of no payment of annual fees |