GB2462822B - Wire bonding - Google Patents

Wire bonding

Info

Publication number
GB2462822B
GB2462822B GB0815094A GB0815094A GB2462822B GB 2462822 B GB2462822 B GB 2462822B GB 0815094 A GB0815094 A GB 0815094A GB 0815094 A GB0815094 A GB 0815094A GB 2462822 B GB2462822 B GB 2462822B
Authority
GB
United Kingdom
Prior art keywords
bonding
wire
wedge
wire bonding
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0815094A
Other versions
GB2462822A (en
GB0815094D0 (en
Inventor
Frank Ferdinandi
Rodney Edward Smith
Mark Robson Humphries
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CROMBIE 123 Ltd
Semblant Global Ltd
Semblant Ltd
Original Assignee
CROMBIE 123 Ltd
Semblant Global Ltd
Semblant Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CROMBIE 123 Ltd, Semblant Global Ltd, Semblant Ltd filed Critical CROMBIE 123 Ltd
Priority to GB0815094A priority Critical patent/GB2462822B/en
Publication of GB0815094D0 publication Critical patent/GB0815094D0/en
Priority to EP09784909A priority patent/EP2327283A2/en
Priority to MYPI2011000729A priority patent/MY155804A/en
Priority to CN201610133298.2A priority patent/CN105744751B/en
Priority to CN201610131380.1A priority patent/CN105744750B/en
Priority to CN2009801355060A priority patent/CN102150480A/en
Priority to RU2011110260/07A priority patent/RU2533162C2/en
Priority to CA2957997A priority patent/CA2957997C/en
Priority to KR1020117006208A priority patent/KR101574374B1/en
Priority to AU2009283992A priority patent/AU2009283992B2/en
Priority to JP2011523441A priority patent/JP5645821B2/en
Priority to PCT/GB2009/001966 priority patent/WO2010020753A2/en
Priority to MX2011001775A priority patent/MX2011001775A/en
Priority to SG2013062617A priority patent/SG193213A1/en
Priority to CA2733765A priority patent/CA2733765C/en
Priority to US13/059,602 priority patent/US9055700B2/en
Priority to SG10201701218UA priority patent/SG10201701218UA/en
Priority to KR1020147019126A priority patent/KR101591619B1/en
Priority to BRPI0917289A priority patent/BRPI0917289A8/en
Priority to TW098127585A priority patent/TWI459878B/en
Publication of GB2462822A publication Critical patent/GB2462822A/en
Priority to US13/030,684 priority patent/US8618420B2/en
Application granted granted Critical
Publication of GB2462822B publication Critical patent/GB2462822B/en
Priority to RU2014121727A priority patent/RU2685692C2/en
Priority to JP2014224131A priority patent/JP5813850B2/en
Priority to PH12015500087A priority patent/PH12015500087A1/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3616—Halogen compounds
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B23K2103/18—Dissimilar materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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Abstract

A method of snaking a connection between a wire and a contact pad using a wire bonding technique, wherein the wire and/or the substrate is/are coated with a composition that comprises one or more halo-hydrocarbon polymers at a thickness of from 1 nm to 2 pm. The coating may also comprise one or more monolayers of metal halide. The coatings allow bonding using metallic compositions which are susceptible to corrosion in non-inert environments containing oxygen. The removal of the coating material prior to bonding is optional. The bonding method is applicable to the formation ball/wedge and wedge/wedge bonds.
GB0815094A 2008-08-18 2008-08-18 Wire bonding Expired - Fee Related GB2462822B (en)

Priority Applications (24)

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GB0815094A GB2462822B (en) 2008-08-18 2008-08-18 Wire bonding
MX2011001775A MX2011001775A (en) 2008-08-18 2009-08-11 Halo-hydrocarbon polymer coating.
CA2733765A CA2733765C (en) 2008-08-18 2009-08-11 Halo-hydrocarbon polymer coating
CN201610133298.2A CN105744751B (en) 2008-08-18 2009-08-11 Halo-hydrocarbon polymer coating
CN201610131380.1A CN105744750B (en) 2008-08-18 2009-08-11 Halo-hydrocarbon polymer coating
CN2009801355060A CN102150480A (en) 2008-08-18 2009-08-11 Halo-hydrocarbon polymer coating
RU2011110260/07A RU2533162C2 (en) 2008-08-18 2009-08-11 Halogen-hydrocarbon polymer coating
CA2957997A CA2957997C (en) 2008-08-18 2009-08-11 Halo-hydrocarbon polymer coating
KR1020117006208A KR101574374B1 (en) 2008-08-18 2009-08-11 Halo-hydrocarbon polymer coating
AU2009283992A AU2009283992B2 (en) 2008-08-18 2009-08-11 Halo-hydrocarbon polymer coating
JP2011523441A JP5645821B2 (en) 2008-08-18 2009-08-11 Halohydrocarbon polymer coating
PCT/GB2009/001966 WO2010020753A2 (en) 2008-08-18 2009-08-11 Halo-hydrocarbon polymer coating
EP09784909A EP2327283A2 (en) 2008-08-18 2009-08-11 Halo-hydrocarbon polymer coating
SG2013062617A SG193213A1 (en) 2008-08-18 2009-08-11 Halo-hydrocarbon polymer coating
MYPI2011000729A MY155804A (en) 2008-08-18 2009-08-11 Halo-hydrocarbon polymer coating
US13/059,602 US9055700B2 (en) 2008-08-18 2009-08-11 Apparatus with a multi-layer coating and method of forming the same
SG10201701218UA SG10201701218UA (en) 2008-08-18 2009-08-11 Halo-hydrocarbon polymer coating
KR1020147019126A KR101591619B1 (en) 2008-08-18 2009-08-11 Halo-hydrocarbon polymer coating
BRPI0917289A BRPI0917289A8 (en) 2008-08-18 2009-08-11 halo polymeric coating
TW098127585A TWI459878B (en) 2008-08-18 2009-08-17 Halo-hydrocarbon polymer coating and method of making the same
US13/030,684 US8618420B2 (en) 2008-08-18 2011-02-18 Apparatus with a wire bond and method of forming the same
RU2014121727A RU2685692C2 (en) 2008-08-18 2014-05-28 Printed board and method for production thereof
JP2014224131A JP5813850B2 (en) 2008-08-18 2014-11-04 Halohydrocarbon polymer coating
PH12015500087A PH12015500087A1 (en) 2008-08-18 2015-01-14 Halo-hydrocarbon polymer coating

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Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5997029A (en) * 1982-11-26 1984-06-04 Hitachi Ltd Absolute pressure type semiconductor pressure sensor
EP0355955A2 (en) * 1988-07-25 1990-02-28 Hitachi, Ltd. Connection for semiconductor devices or integrated circuits by coated wires and method of manufacturing the same
EP0393832A1 (en) * 1989-04-17 1990-10-24 Emhart Inc. Bonding wedge
JPH02285648A (en) * 1989-04-26 1990-11-22 Nippon Steel Corp Insulation coated bonding wire
JPH08288331A (en) * 1995-04-17 1996-11-01 Tanaka Denshi Kogyo Kk Bonding wire for semiconductor device and production thereof
JPH11251356A (en) * 1998-03-02 1999-09-17 Seiko Epson Corp Wire bonding method and apparatus thereof, and formation of wire bump
EP1091201A2 (en) * 1999-10-04 2001-04-11 Shin-Etsu Chemical Co., Ltd. Pressure sensor unit
US6335224B1 (en) * 2000-05-16 2002-01-01 Sandia Corporation Protection of microelectronic devices during packaging
JP2002329741A (en) * 2001-05-07 2002-11-15 Sumiden Magnet Wire Kk Bonding copper wire
JP2004184340A (en) * 2002-12-05 2004-07-02 Tanaka Kikinzoku Kogyo Kk Manufacturing method of dna probe fixed electrode

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5997029A (en) * 1982-11-26 1984-06-04 Hitachi Ltd Absolute pressure type semiconductor pressure sensor
EP0355955A2 (en) * 1988-07-25 1990-02-28 Hitachi, Ltd. Connection for semiconductor devices or integrated circuits by coated wires and method of manufacturing the same
EP0393832A1 (en) * 1989-04-17 1990-10-24 Emhart Inc. Bonding wedge
JPH02285648A (en) * 1989-04-26 1990-11-22 Nippon Steel Corp Insulation coated bonding wire
JPH08288331A (en) * 1995-04-17 1996-11-01 Tanaka Denshi Kogyo Kk Bonding wire for semiconductor device and production thereof
JPH11251356A (en) * 1998-03-02 1999-09-17 Seiko Epson Corp Wire bonding method and apparatus thereof, and formation of wire bump
EP1091201A2 (en) * 1999-10-04 2001-04-11 Shin-Etsu Chemical Co., Ltd. Pressure sensor unit
US6335224B1 (en) * 2000-05-16 2002-01-01 Sandia Corporation Protection of microelectronic devices during packaging
JP2002329741A (en) * 2001-05-07 2002-11-15 Sumiden Magnet Wire Kk Bonding copper wire
JP2004184340A (en) * 2002-12-05 2004-07-02 Tanaka Kikinzoku Kogyo Kk Manufacturing method of dna probe fixed electrode

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