JP2002329741A - Bonding copper wire - Google Patents

Bonding copper wire

Info

Publication number
JP2002329741A
JP2002329741A JP2001136058A JP2001136058A JP2002329741A JP 2002329741 A JP2002329741 A JP 2002329741A JP 2001136058 A JP2001136058 A JP 2001136058A JP 2001136058 A JP2001136058 A JP 2001136058A JP 2002329741 A JP2002329741 A JP 2002329741A
Authority
JP
Japan
Prior art keywords
bonding
wire
copper
antioxidant
bonding wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001136058A
Other languages
Japanese (ja)
Inventor
Shingo Kaimori
信吾 改森
Masato Fukagaya
正人 深萱
Yuuji Sugimoto
裕示 杉本
Takeshi Nonaka
毅 野中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUMIDEN MAGNET WIRE KK
Original Assignee
SUMIDEN MAGNET WIRE KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUMIDEN MAGNET WIRE KK filed Critical SUMIDEN MAGNET WIRE KK
Priority to JP2001136058A priority Critical patent/JP2002329741A/en
Publication of JP2002329741A publication Critical patent/JP2002329741A/en
Pending legal-status Critical Current

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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide bonding copper wire having good junction characteristic, which prevents surface oxidation during storage and surface oxidation by heat during bonding. SOLUTION: The bonding copper wire where its surface is applied with thin film coating having a film thickness of 0.05 μm or more and 0.1 μm or less by antioxidant of imidazole series or the like.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、集積回路素子（I
C、LSI、トランジスタ等）上の電極と、回路配線基板
（リードフレーム、セラミックス基板、プリント基板
等）の導体配線とを接続する銅ボンディングワイヤーに
関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an integrated circuit device (I
The present invention relates to a copper bonding wire for connecting an electrode on a C, LSI, transistor, or the like) to a conductor wiring of a circuit wiring board (a lead frame, a ceramic substrate, a printed board, etc.).

【０００２】[0002]

【従来の技術】集積回路素子と回路配線基盤との接続法
としては、半田接続法、抵抗溶接法等も行われている
が、ボールボンディング法、ウェッヂボンディング法が
一般的である。ボールボンディング法には高速ボンディ
ングが可能という長所があり、ウェッヂボンディング法
には低ループ化が可能、ファインピッチボンディングに
好適等の長所が有る。2. Description of the Related Art As a method of connecting an integrated circuit element to a circuit wiring board, a solder connection method, a resistance welding method, and the like are also performed, but a ball bonding method and a wet bonding method are generally used. The ball bonding method has the advantage that high-speed bonding is possible, and the wet bonding method has the advantages that a low loop can be achieved and that it is suitable for fine pitch bonding.

【０００３】一般的なボールボンディング法のプロセス
とは以下のとおりである。移動自在なキャピラリー（以
下「ボンディングツール」という）にガイドされたワイ
ヤの先端に、放電・溶融加工によりボールを形成した
後、第１ボンディング点である集積回路素子上の電極
に、超音波を印加しつつ前記ボールを押圧して接合を形
成する（ボールボンディング）。その後ワイヤを引き出
しながら、ボンディングツールを第２ボンディング点で
ある回路配線基板の電極に移動して、同様に接続する
（ウェッヂボンディング。このときボールの形成は無
い）。接続後、キャピラリーを上昇させワイヤーをクラ
ンプで引っぱることによりワイヤを切断する。以上のプ
ロセスを通じて、接合促進のため集積回路素子、回路配
線基板共に150度〜300度程度に加熱されている。The general ball bonding process is as follows. After a ball is formed at the tip of a wire guided by a movable capillary (hereinafter referred to as a “bonding tool”) by electric discharge / melting processing, ultrasonic waves are applied to an electrode on an integrated circuit element which is a first bonding point. While pressing, the ball is pressed to form a bond (ball bonding). Thereafter, while pulling out the wire, the bonding tool is moved to the electrode of the circuit wiring board, which is the second bonding point, and connected in the same manner (wet bonding; no ball is formed at this time). After connection, the capillary is raised and the wire is cut by pulling the wire with a clamp. Through the above process, both the integrated circuit element and the circuit wiring board are heated to about 150 to 300 degrees to promote the bonding.

【０００４】ボールボンディング法で、ボンディングワ
イヤーの素材としては、金が一般に使われてきたが、近
年銅ボンディングワイヤーが脚光を浴びつつある。その
主な理由としては次の３点が挙げられる。第１には、集
積回路素子の高集積化、高周波化に対応して集積回路素
子の配線がアルミから銅へと変わりつつあることの影響
である。集積回路素子の配線がアルミから銅へと変われ
ば、ボンディングの素材もアルミから銅へと変更した方
が、同一金属であり、好接合性が実現出来やすい。第２
には、半導体パッケージの「高集積化に伴う多ワイヤー
配線化」の影響が挙げられる。これにより隣接ワイヤー
間隔は狭く、ワイヤー配線長は長くなる傾向にある。そ
の結果、樹脂封止時にワイヤーが倒れ、隣接ワイヤーと
接触短絡する危険性が増す。そこで金ワイヤーより弾性
が大きく、倒れにくい銅ワイヤーが着目されている。第
３には、「価格」である。安価な銅ワイヤーを使用する
ことにより安価に半導体パッケージを製造することが出
来る。In the ball bonding method, gold has been generally used as a material of a bonding wire, but recently, a copper bonding wire has been spotlighted. The main reasons are as follows. First, there is an influence of the fact that the wiring of the integrated circuit element is changing from aluminum to copper in response to the higher integration and higher frequency of the integrated circuit element. If the wiring of the integrated circuit element changes from aluminum to copper, it is easier to achieve good bonding if the bonding material is changed from aluminum to copper because the same metal is used. Second
For example, there is an influence of the "multi-wire wiring accompanying high integration" of a semiconductor package. As a result, the distance between adjacent wires tends to be narrow, and the wire length tends to be long. As a result, the risk of the wire falling down during resin sealing and short-circuiting with an adjacent wire is increased. Therefore, attention has been paid to copper wires that are larger in elasticity than gold wires and are hard to fall down. Third is “price”. By using an inexpensive copper wire, a semiconductor package can be manufactured at low cost.

【０００５】[0005]

【発明が解決しようとする課題】前述のような長所を有
する銅ボンディングワイヤーではあるが、実際には、次
の２つの課題があった。一つは、保管中に表面酸化する
こと。もう一つは、ボンディング時の熱により表面酸化
することである。これらは、いずれもボンディングワイ
ヤーの接合性の低下の原因になるものである。なお、ボ
ンディング時の熱としては、ワイヤー先端を溶融してボ
ールを形成するための熱、接合部からの熱伝導、集積回
路素子・回路配線基板からの熱放射が挙げられる。Although the copper bonding wire has the above-mentioned advantages, there are actually the following two problems. First, surface oxidation during storage. Another is that the surface is oxidized by heat at the time of bonding. Any of these causes a decrease in the bonding property of the bonding wire. Examples of the heat at the time of bonding include heat for melting a wire tip to form a ball, heat conduction from a bonding portion, and heat radiation from an integrated circuit element / circuit wiring board.

【０００６】[0006]

【課題を解決するための手段】本発明は前記の２つの課
題を解決し、接合性の良好な銅ボンディングワイヤーを
提供することを目的とするもので、表面に酸化防止剤を
薄膜コーティングしたことを特徴とする銅ボンディング
ワイヤーであり、好ましくは、酸化防止剤として、イミ
ダゾール系の酸化防止剤を使用して、これを薄膜コーテ
ィングしたことを特徴とする銅ボンディングワイヤーで
ある。SUMMARY OF THE INVENTION An object of the present invention is to solve the above two problems and to provide a copper bonding wire having a good bonding property. Preferably, a copper bonding wire characterized by using an imidazole-based antioxidant as an antioxidant and coating it with a thin film.

【０００７】[0007]

【発明の実施の形態】本発明で、ボンディングワイヤー
の表面にコーティングする酸化防止剤としては、イミダ
ゾール系、トリアゾール系、ロジン系などが挙げられ
る。中でも、イミダゾール系、及び一部のロジン系は、
ボンディング時の熱に抗して充分に耐酸化性を示すので
好ましい。この点では、ベンゼン環を有するイミダゾー
ル系の酸化防止剤が特に好ましい。ところで、ロジン系
は、コーテイング時に、有機酸などの有機溶剤が必要な
ため、揮発残留溶剤が半導体プロセスに悪影響を及ぼす
おそれがあるが、イミダゾール系は、水に溶解してコー
ティングすることが可能であり、前記の悪影響の心配が
なく、この観点からも好ましい。BEST MODE FOR CARRYING OUT THE INVENTION In the present invention, examples of an antioxidant for coating the surface of a bonding wire include imidazole, triazole, and rosin. Among them, imidazole-based and some rosin-based
It is preferable because it shows sufficient oxidation resistance against heat at the time of bonding. In this regard, an imidazole-based antioxidant having a benzene ring is particularly preferred. By the way, rosin-based solvents require an organic solvent such as an organic acid during coating, so volatile residual solvents may have an adverse effect on semiconductor processes.Imidazole-based solvents can be dissolved and coated in water. Yes, there is no concern about the above-mentioned adverse effects, and it is preferable from this viewpoint.

【０００８】コーティング層の膜厚は、0.05μｍ〜0.1
μｍが好適である。０．１μｍより厚膜の場合、被覆材
が接合を阻害し、接合性の悪化が生じるおそれがある。
逆に、0.05μｍより薄膜だと、酸化防止性が不十分とな
る。The thickness of the coating layer is 0.05 μm to 0.1 μm.
μm is preferred. When the film thickness is larger than 0.1 μm, the coating material may hinder the bonding, and the bonding property may be deteriorated.
Conversely, if the thickness is less than 0.05 μm, the antioxidant properties will be insufficient.

【０００９】アルカリ及びハロゲン元素などの不純物
は、銅の腐食の原因となる。従って、酸化防止剤のコー
ティング層中には、アルカリ及びハロゲン元素などの不
純物が含くまれていないか、含くまれていても、いずれ
も、1ppm以下の含有量であることが望ましい。[0009] Impurities such as alkali and halogen elements cause corrosion of copper. Therefore, it is desirable that the coating layer of the antioxidant does not contain impurities such as alkalis and halogen elements, or even if it does contain any impurities, the content is 1 ppm or less.

【００１０】例えば、特開昭61-194735号公報、特開平2
-155121号公報、特開平3-165044号公報、特開平4-35039
号公報には、銅ワイヤー表面に樹脂等で絶縁被覆コーテ
ィングをしたワイヤーが開示されている。これらの絶縁
被覆ボンディングワイヤーも、銅表面の酸化を防ぐ機能
を有する可能性がある。しかし、これらの被覆の目的
は、樹脂封止時等に隣接ワイヤーが接触しても導通が生
じないように厚膜絶縁被覆を施すことであり、前記のよ
うな薄膜被覆のものではない。従って、絶縁被覆を剥離
せずにボンディングしようとすると、通常、接合性が悪
くなる傾向がある。For example, JP-A-61-194735 and JP-A-Hei 2
-155121, JP-A-3-65044, JP-A-4-35039
Japanese Patent Application Publication No. JP-A-2005-115125 discloses a wire in which a copper wire surface is coated with an insulating coating with a resin or the like. These insulating-coated bonding wires may also have a function of preventing oxidation of the copper surface. However, the purpose of these coatings is to apply a thick-film insulating coating so that conduction does not occur even when adjacent wires come in contact with each other at the time of resin sealing or the like, and is not a thin-film coating as described above. Therefore, if it is attempted to bond without peeling off the insulating coating, there is usually a tendency that the bondability deteriorates.

【００１１】本発明の銅ボンディングワイヤーにあって
も、薄膜とはいえ酸化防止剤のコーテイング層があるの
で、このコーテイング層による接合性の阻害が皆無とは
言い切れない。従って、ボンディング方法として、例え
ば、超音波前発振法のような、絶縁被覆ボンディングワ
イヤーに適したボンディング方法を採用することが好ま
しい。The copper bonding wire of the present invention has a coating layer of an antioxidant even though it is a thin film. Therefore, it cannot be said that there is no hindrance of the bonding property by the coating layer. Therefore, it is preferable to adopt a bonding method suitable for an insulating-coated bonding wire, such as an ultrasonic pre-oscillation method, for example.

【００１２】[0012]

【実施例】（実施例１）イミダゾール系酸化防止剤の水
溶液を含ませた２枚のフェルトを押し付けた間を、直径
25μｍ銅ボンディングワイヤーを通過させ、銅ボンディ
ングワイヤーの表面に、イミダゾール系酸化防止剤の薄
膜コーティング層を形成させた。(Example 1) The diameter between two felts containing an aqueous solution of an imidazole-based antioxidant was pressed.
After passing through a 25 μm copper bonding wire, a thin film coating layer of an imidazole antioxidant was formed on the surface of the copper bonding wire.

【００１３】（実施例２）トリアゾール系酸化防止剤を
酢酸水溶液に溶かしたものを含ませた２枚のフェルトを
押し付けた間を、直径25μｍ銅ボンディングワイヤーを
通過させ、銅ボンディングワイヤーの表面に、トリアゾ
ール系酸化防止剤の薄膜コーティング層を形成させた。(Example 2) While pressing two felts containing a solution of a triazole-based antioxidant in an acetic acid aqueous solution, a copper bonding wire having a diameter of 25 μm was passed through and pressed onto the surface of the copper bonding wire. A triazole antioxidant thin film coating layer was formed.

【００１４】実施例１、実施例２の銅ボンディングワイ
ヤー、および、比較例として、酸化防止剤のコーティン
グ層を設けていない裸の銅ボンディングワイヤーについ
て、接合性、長期保管性、加熱酸化性（変色）の評価を
した。For the copper bonding wires of Examples 1 and 2, and as a comparative example, a bare copper bonding wire provided with no antioxidant coating layer, the bonding property, long-term storage property, heat oxidation property (discoloration) ) Was evaluated.

【００１５】（接合性の評価）次の接合条件で、それぞ
れの銅ボンディングワイヤーを接合し、下記の測定方法
で測定した接合強度の大きさで接合性の評価とした。 ＜接合条件＞ 基板温度250℃ パッドピッチ100μｍ（先端径130μｍのボンディングツ
ール使用） 第一ボンド点材質：アルミ 第二ボンド点材質：銀メッ
キ ワイヤーは、製造後すぐの物を使用した。 ＜接合強度の測定方法＞第一ボンド、第二ボンドの中央
をフックで引っかけて、上方に0.5mm/sで引っ張った際
の破断強度を接合強度とした。(Evaluation of bondability) Under the following bonding conditions, the respective copper bonding wires were bonded, and the bondability was evaluated based on the magnitude of the bonding strength measured by the following measuring method. <Joining conditions> Substrate temperature 250 ° C Pad pitch 100 µm (using a bonding tool with a tip diameter of 130 µm) First bond point material: Aluminum Second bond point material: Silver plating The wire used immediately after production was used. <Measurement method of bonding strength> The breaking strength when the center of the first bond and the second bond was hooked with a hook and pulled upward at 0.5 mm / s was defined as the bonding strength.

【００１６】（ 長期保管性、加熱酸化性の評価 ）長期
保管性、加熱酸化性（変色）は、次の基準で評価した。 ＜長期保管性＞ボンディングワイヤーを１ヶ月室温放置
し、その後、前記の条件で接合した場合に、接合強度に
0.1ｇ以上0.5g未満の強度低下が確認出来た場合は△、
0.5g以上の強度低下が見られる場合×とした。 ＜加熱酸化性（変色）＞加熱された際の酸化程度を変色
程度にて確認した。25μｍのワイヤーでは判別しにくい
ため銅箔上に酸化防止剤をコートし、これを200℃で15
秒放置した際に変色が見られない場合は○、少し変色す
る場合は△、著しく変色する場合は×とした。(Evaluation of long-term storage property and heat oxidation property) Long-term storage property and heat oxidation property (discoloration) were evaluated according to the following criteria. <Long-term storage> When the bonding wire is left at room temperature for one month and then bonded under the above conditions,
If a decrease in strength of 0.1 g or more and less than 0.5 g can be confirmed,
When a decrease in strength of 0.5 g or more was observed, it was evaluated as x. <Heat oxidation property (discoloration)> The degree of oxidation when heated was confirmed by the degree of discoloration. An antioxidant is coated on the copper foil because it is difficult to distinguish with a 25 μm wire.
When no discoloration was observed after standing for a second, it was evaluated as ○, slightly discolored as Δ, and markedly discolored as X.

【００１７】[0017]

【表１】 [Table 1]

【００１８】接合性、長期保管性、加熱酸化性（変色）
の評価結果は、表１に示した通りで、比較例の、裸の銅
ボンディングワイヤーは接合強度が低く、また、長期保
管性、加熱酸化性（変色）もよくないという問題があっ
た。しかし、酸化防止剤のコーティング膜を形成した実
施例１、実施例２は、いずれの項目も問題ないという評
価結果で、とくに、イミダゾールのコーティング膜を形
成した銅ボンディングワイヤーは、良好な評価結果であ
った。Bondability, long-term storage, heat oxidation (discoloration)
Are as shown in Table 1. As a result, the bare copper bonding wire of the comparative example had a problem that the bonding strength was low, and the long-term storage property and the heat oxidation property (discoloration) were not good. However, Examples 1 and 2 in which an antioxidant coating film was formed were evaluated as having no problem in any of the items. In particular, the copper bonding wire in which an imidazole coating film was formed had good evaluation results. there were.

【００１９】[0019]

【発明の効果】以上に述べた通り、表面に酸化防止剤を
薄膜コーティングした銅ボンディングワイヤーにより、
長期保管性に優れ、、加熱酸化（変色）を受け難く、接
合性の良好な銅ボンディングワイヤーが得られた。As described above, the copper bonding wire whose surface is coated with an antioxidant in a thin film,
A copper bonding wire having excellent long-term storage properties, being less susceptible to thermal oxidation (discoloration), and having good bonding properties was obtained.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 杉本 裕示 名古屋市南区菊住一丁目７番10号 住電マ グネットワイヤー株式会社内 (72)発明者 野中 毅 大阪市此花区島屋一丁目１番３号 住友電 気工業株式会社大阪製作所内 Ｆターム(参考） 5F044 FF06  ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Yuji Sugimoto 1-7-10 Kikuzumi, Minami-ku, Nagoya City Within Sumiden Magnet Wire Co., Ltd. (72) Inventor Takeshi Nonaka 1-3-1 Shimaya, Konohana-ku, Osaka-shi No. Sumitomo Electric Industries, Ltd. Osaka Works F-term (reference) 5F044 FF06

Claims (4)

【特許請求の範囲】[Claims] 【請求項１】 表面に酸化防止剤のコーティング層を設
けたことを特徴とする銅ボンディングワイヤー。1. A copper bonding wire having a surface provided with a coating layer of an antioxidant. 【請求項２】 酸化防止剤がイミダゾール系酸化防止剤
であることを特徴とする請求項１に記載の銅ボンディン
グワイヤー。2. The copper bonding wire according to claim 1, wherein the antioxidant is an imidazole antioxidant. 【請求項３】 コーティング層の膜厚が0.05μｍ以上0.
1μｍ以下であることを特徴とする請求項１または請求
項２に記載の銅ボンディングワイヤー。3. The coating layer has a thickness of 0.05 μm or more and 0.1 μm or more.
The copper bonding wire according to claim 1 or 2, wherein the thickness is 1 µm or less. 【請求項４】 コーティング層は、含有するアルカリ及
びハロゲン元素の量がいずれも1ppm以下であることを特
徴とする請求項１または請求項２に記載の銅ボンディン
グワイヤー。4. The copper bonding wire according to claim 1, wherein the coating layer contains both alkali and halogen elements in an amount of 1 ppm or less.
JP2001136058A 2001-05-07 2001-05-07 Bonding copper wire Pending JP2002329741A (en)

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008153625A (en) * 2006-11-21 2008-07-03 Sumitomo Metal Mining Co Ltd Copper bonding wire
GB2462822A (en) * 2008-08-18 2010-02-24 Crombie 123 Ltd Wire bonding
US8492898B2 (en) 2007-02-19 2013-07-23 Semblant Global Limited Printed circuit boards
US8618420B2 (en) 2008-08-18 2013-12-31 Semblant Global Limited Apparatus with a wire bond and method of forming the same
US8995146B2 (en) 2010-02-23 2015-03-31 Semblant Limited Electrical assembly and method
US9055700B2 (en) 2008-08-18 2015-06-09 Semblant Limited Apparatus with a multi-layer coating and method of forming the same
US11786930B2 (en) 2016-12-13 2023-10-17 Hzo, Inc. Protective coating

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008153625A (en) * 2006-11-21 2008-07-03 Sumitomo Metal Mining Co Ltd Copper bonding wire
US8492898B2 (en) 2007-02-19 2013-07-23 Semblant Global Limited Printed circuit boards
US9648720B2 (en) 2007-02-19 2017-05-09 Semblant Global Limited Method for manufacturing printed circuit boards
GB2462822A (en) * 2008-08-18 2010-02-24 Crombie 123 Ltd Wire bonding
GB2462822B (en) * 2008-08-18 2011-11-02 Crombie 123 Ltd Wire bonding
US8618420B2 (en) 2008-08-18 2013-12-31 Semblant Global Limited Apparatus with a wire bond and method of forming the same
US9055700B2 (en) 2008-08-18 2015-06-09 Semblant Limited Apparatus with a multi-layer coating and method of forming the same
US8995146B2 (en) 2010-02-23 2015-03-31 Semblant Limited Electrical assembly and method
US11786930B2 (en) 2016-12-13 2023-10-17 Hzo, Inc. Protective coating

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