ATE548430T1 - Aushärtbare harzfolie für flexible schaltkreisplatine und herstellungsverfahren dafür - Google Patents

Aushärtbare harzfolie für flexible schaltkreisplatine und herstellungsverfahren dafür

Info

Publication number
ATE548430T1
ATE548430T1 AT05809303T AT05809303T ATE548430T1 AT E548430 T1 ATE548430 T1 AT E548430T1 AT 05809303 T AT05809303 T AT 05809303T AT 05809303 T AT05809303 T AT 05809303T AT E548430 T1 ATE548430 T1 AT E548430T1
Authority
AT
Austria
Prior art keywords
production method
resin film
circuit boards
flexible circuit
copper
Prior art date
Application number
AT05809303T
Other languages
English (en)
Inventor
Hirofumi Inoue
Original Assignee
Showa Denko Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko Kk filed Critical Showa Denko Kk
Application granted granted Critical
Publication of ATE548430T1 publication Critical patent/ATE548430T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C5/00—Photographic processes or agents therefor; Regeneration of such processing agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Laminated Bodies (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
AT05809303T 2004-11-19 2005-11-18 Aushärtbare harzfolie für flexible schaltkreisplatine und herstellungsverfahren dafür ATE548430T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004336357 2004-11-19
PCT/JP2005/021628 WO2006054791A1 (en) 2004-11-19 2005-11-18 Resin cured film for flexible printed wiring board and production process thereof

Publications (1)

Publication Number Publication Date
ATE548430T1 true ATE548430T1 (de) 2012-03-15

Family

ID=38226710

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05809303T ATE548430T1 (de) 2004-11-19 2005-11-18 Aushärtbare harzfolie für flexible schaltkreisplatine und herstellungsverfahren dafür

Country Status (8)

Country Link
US (1) US20080166550A1 (de)
EP (1) EP1814955B1 (de)
JP (1) JP4986439B2 (de)
KR (1) KR100909992B1 (de)
CN (1) CN101068893B (de)
AT (1) ATE548430T1 (de)
TW (1) TW200630447A (de)
WO (1) WO2006054791A1 (de)

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TW200613903A (en) * 2004-05-26 2006-05-01 Showa Denko Kk Photosensitive resin composition, and cured product and use thereof
SG176498A1 (en) * 2006-08-18 2011-12-29 Hybrid Plastics Inc Nanoscopic assurance coating for lead-free solders
TWI382055B (zh) * 2006-10-03 2013-01-11 Tech Advance Ind Co Ltd 熱固性樹脂組合物
US20080216704A1 (en) * 2007-03-09 2008-09-11 Fisher Controls International Llc Conformal Coating
US20120305295A1 (en) * 2010-02-03 2012-12-06 Showa Denko K.K. Thermosetting composition
JP5855405B2 (ja) * 2011-09-26 2016-02-09 株式会社タムラ製作所 感光性樹脂組成物
WO2014092019A1 (ja) 2012-12-12 2014-06-19 株式会社ニコン 組成物、積層体、積層体の製造方法、トランジスタおよびトランジスタの製造方法
JP5635655B1 (ja) * 2013-06-28 2014-12-03 太陽インキ製造株式会社 熱硬化性組成物、ドライフィルムおよびプリント配線板
CN104293123B (zh) * 2013-07-17 2017-05-03 深圳富泰宏精密工业有限公司 涂料组合物及应用该涂料组合物的电子装置主板
JP5688129B1 (ja) * 2013-09-30 2015-03-25 太陽インキ製造株式会社 プリント配線板用硬化型組成物、これを用いた硬化塗膜及びプリント配線板
JP5910799B2 (ja) * 2014-02-10 2016-04-27 Dic株式会社 床材用活性エネルギー線硬化性組成物の硬化方法、及びその硬化方法を用いた硬化装置
JP5897637B2 (ja) * 2014-04-30 2016-03-30 ファナック株式会社 耐食性を向上させたプリント基板およびその製造方法
JP5835416B2 (ja) * 2014-06-25 2015-12-24 日立化成株式会社 感光性樹脂組成物、感光性フィルム及びレジストパターンの形成方法
JP6114799B2 (ja) * 2015-10-20 2017-04-12 株式会社タムラ製作所 感光性樹脂組成物並びに感光性樹脂組成物の硬化被膜を有するプリント配線板及び反射シートの製造方法
JP6449824B2 (ja) * 2016-09-16 2019-01-09 株式会社タムラ製作所 硬化性樹脂組成物
CN107022219A (zh) * 2017-04-27 2017-08-08 安徽智胜光学科技有限公司 手机触控面板屏幕功能涂层料及其制备方法
CN111647332A (zh) * 2019-03-04 2020-09-11 中核华兴达丰机械工程有限公司 一种塔机用水性漆及其制备方法
JP7028828B2 (ja) * 2019-05-28 2022-03-02 株式会社タムラ製作所 保護被膜を有する配線板の製造方法
CN110540803A (zh) * 2019-08-30 2019-12-06 海洋化工研究院有限公司 一种不含氧化亚铜高柔性水性网箱防污涂料
WO2024204234A1 (ja) * 2023-03-29 2024-10-03 三井化学株式会社 樹脂組成物、液晶シール剤、およびこれを用いた液晶表示パネル

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JP2002308960A (ja) * 2001-04-11 2002-10-23 Nippon Kayaku Co Ltd 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物
JP2002308951A (ja) * 2001-04-11 2002-10-23 Nippon Kayaku Co Ltd 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物
JP2003021898A (ja) * 2001-07-10 2003-01-24 Nippon Kayaku Co Ltd 感光性樹脂組成物並びにその硬化物
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TW200613903A (en) 2004-05-26 2006-05-01 Showa Denko Kk Photosensitive resin composition, and cured product and use thereof

Also Published As

Publication number Publication date
CN101068893A (zh) 2007-11-07
WO2006054791A1 (en) 2006-05-26
TW200630447A (en) 2006-09-01
EP1814955B1 (de) 2012-03-07
EP1814955A1 (de) 2007-08-08
US20080166550A1 (en) 2008-07-10
JP4986439B2 (ja) 2012-07-25
JP2006173592A (ja) 2006-06-29
KR100909992B1 (ko) 2009-07-29
KR20070086390A (ko) 2007-08-27
CN101068893B (zh) 2010-10-20

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