US20080055581A1
(en)
*
|
2004-04-27 |
2008-03-06 |
Rogers John A |
Devices and methods for pattern generation by ink lithography
|
US8217381B2
(en)
|
2004-06-04 |
2012-07-10 |
The Board Of Trustees Of The University Of Illinois |
Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
|
US7799699B2
(en)
|
2004-06-04 |
2010-09-21 |
The Board Of Trustees Of The University Of Illinois |
Printable semiconductor structures and related methods of making and assembling
|
US7521292B2
(en)
|
2004-06-04 |
2009-04-21 |
The Board Of Trustees Of The University Of Illinois |
Stretchable form of single crystal silicon for high performance electronics on rubber substrates
|
WO2005122285A2
(en)
|
2004-06-04 |
2005-12-22 |
The Board Of Trustees Of The University Of Illinois |
Methods and devices for fabricating and assembling printable semiconductor elements
|
MY149190A
(en)
*
|
2006-09-20 |
2013-07-31 |
Univ Illinois |
Release strategies for making transferable semiconductor structures, devices and device components
|
KR101519038B1
(ko)
|
2007-01-17 |
2015-05-11 |
더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 |
프린팅기반 어셈블리에 의해 제조되는 광학 시스템
|
CN102113089B
(zh)
|
2008-03-05 |
2014-04-23 |
伊利诺伊大学评议会 |
可拉伸和可折叠的电子器件
|
US8470701B2
(en)
*
|
2008-04-03 |
2013-06-25 |
Advanced Diamond Technologies, Inc. |
Printable, flexible and stretchable diamond for thermal management
|
US7927976B2
(en)
|
2008-07-23 |
2011-04-19 |
Semprius, Inc. |
Reinforced composite stamp for dry transfer printing of semiconductor elements
|
US8679888B2
(en)
|
2008-09-24 |
2014-03-25 |
The Board Of Trustees Of The University Of Illinois |
Arrays of ultrathin silicon solar microcells
|
US9123614B2
(en)
|
2008-10-07 |
2015-09-01 |
Mc10, Inc. |
Methods and applications of non-planar imaging arrays
|
US8372726B2
(en)
*
|
2008-10-07 |
2013-02-12 |
Mc10, Inc. |
Methods and applications of non-planar imaging arrays
|
US8886334B2
(en)
|
2008-10-07 |
2014-11-11 |
Mc10, Inc. |
Systems, methods, and devices using stretchable or flexible electronics for medical applications
|
US8389862B2
(en)
|
2008-10-07 |
2013-03-05 |
Mc10, Inc. |
Extremely stretchable electronics
|
US9119533B2
(en)
|
2008-10-07 |
2015-09-01 |
Mc10, Inc. |
Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
|
US9289132B2
(en)
|
2008-10-07 |
2016-03-22 |
Mc10, Inc. |
Catheter balloon having stretchable integrated circuitry and sensor array
|
US8097926B2
(en)
|
2008-10-07 |
2012-01-17 |
Mc10, Inc. |
Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
|
US8477103B2
(en)
|
2008-10-26 |
2013-07-02 |
Microsoft Corporation |
Multi-touch object inertia simulation
|
US8466879B2
(en)
|
2008-10-26 |
2013-06-18 |
Microsoft Corporation |
Multi-touch manipulation of application objects
|
WO2010059781A1
(en)
*
|
2008-11-19 |
2010-05-27 |
Semprius, Inc. |
Printing semiconductor elements by shear-assisted elastomeric stamp transfer
|
WO2010071574A1
(en)
*
|
2008-12-16 |
2010-06-24 |
Cheng Shi |
Stretchable high-frequency electronics
|
WO2010081137A2
(en)
*
|
2009-01-12 |
2010-07-15 |
Mc10, Inc. |
Methods and applications of non-planar imaging arrays
|
JP2010165032A
(ja)
*
|
2009-01-13 |
2010-07-29 |
Hitachi Displays Ltd |
タッチパネルディスプレイ装置
|
WO2010086034A1
(en)
*
|
2009-01-30 |
2010-08-05 |
Interuniversitair Microelektronica Centrum Vzw |
Stretchable electronic device
|
US8629353B2
(en)
*
|
2009-03-05 |
2014-01-14 |
The Board Of Trustees Of The Leland Stanford Junior University |
Apparatus and method using patterned array with separated islands
|
US9012763B2
(en)
*
|
2009-03-13 |
2015-04-21 |
Sunlight Photonics Inc. |
Stretchable photovoltaic devices and carriers
|
US8641617B2
(en)
*
|
2009-04-02 |
2014-02-04 |
Indian Institute Of Science |
In-place display on sensory data
|
US8591239B2
(en)
|
2009-05-04 |
2013-11-26 |
Advanced Bionics Ag |
Multi-contact connector system
|
EP2430652B1
(en)
|
2009-05-12 |
2019-11-20 |
The Board of Trustees of the University of Illionis |
Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays
|
WO2011008459A2
(en)
*
|
2009-06-29 |
2011-01-20 |
Infinite Corridor Technology, Llc |
Structured material substrates for flexible, stretchable electronics
|
WO2011022100A2
(en)
*
|
2009-07-13 |
2011-02-24 |
Arizona Board Of Regents, For And On Behalf Of Arizona State University |
Flexible circuits and electronic textiles
|
US8261660B2
(en)
*
|
2009-07-22 |
2012-09-11 |
Semprius, Inc. |
Vacuum coupled tool apparatus for dry transfer printing semiconductor elements
|
GB0915687D0
(en)
|
2009-09-08 |
2009-10-07 |
Dupont Teijin Films Us Ltd |
Polyester films
|
US9723122B2
(en)
|
2009-10-01 |
2017-08-01 |
Mc10, Inc. |
Protective cases with integrated electronics
|
US20110218756A1
(en)
*
|
2009-10-01 |
2011-09-08 |
Mc10, Inc. |
Methods and apparatus for conformal sensing of force and/or acceleration at a person's head
|
KR101221871B1
(ko)
*
|
2009-12-07 |
2013-01-15 |
한국전자통신연구원 |
반도체 소자의 제조방법
|
JP6046491B2
(ja)
|
2009-12-16 |
2016-12-21 |
ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ |
コンフォーマル電子機器を使用した生体内での電気生理学
|
US9936574B2
(en)
|
2009-12-16 |
2018-04-03 |
The Board Of Trustees Of The University Of Illinois |
Waterproof stretchable optoelectronics
|
US10441185B2
(en)
|
2009-12-16 |
2019-10-15 |
The Board Of Trustees Of The University Of Illinois |
Flexible and stretchable electronic systems for epidermal electronics
|
US20110242310A1
(en)
*
|
2010-01-07 |
2011-10-06 |
University Of Delaware |
Apparatus and Method for Electrospinning Nanofibers
|
US10500770B2
(en)
*
|
2010-03-02 |
2019-12-10 |
So-Semi Technologies, Llc |
LED packaging with integrated optics and methods of manufacturing the same
|
EP2544598B1
(en)
*
|
2010-03-12 |
2020-05-06 |
The Board of Trustees of the University of Illionis |
Waterproof stretchable optoelectronics
|
CN102892356B
(zh)
|
2010-03-17 |
2016-01-13 |
伊利诺伊大学评议会 |
基于生物可吸收基质的可植入生物医学装置
|
IT1399202B1
(it)
|
2010-03-30 |
2013-04-11 |
Corbelli |
Metodo per la produzione di manufatti elastomerici funzionalizzati e manufatti cosi' ottenuti
|
GB201005889D0
(en)
|
2010-04-08 |
2010-05-26 |
Cambridge Entpr Ltd |
Tuning of mechanical properties of polymers
|
US8637802B2
(en)
*
|
2010-06-18 |
2014-01-28 |
Semiconductor Energy Laboratory Co., Ltd. |
Photosensor, semiconductor device including photosensor, and light measurement method using photosensor
|
JP5899220B2
(ja)
*
|
2010-09-29 |
2016-04-06 |
ポスコ |
ロール状の母基板を利用したフレキシブル電子素子の製造方法、フレキシブル電子素子及びフレキシブル基板
|
US20120097971A1
(en)
*
|
2010-10-25 |
2012-04-26 |
Jacobs Scott L |
Contiguous and virtually contiguous area expansion of semiconductor substrates
|
CN102097148B
(zh)
*
|
2010-11-03 |
2013-03-13 |
北京理工大学 |
一种砷化镓基多结同位素微电池
|
US9442285B2
(en)
*
|
2011-01-14 |
2016-09-13 |
The Board Of Trustees Of The University Of Illinois |
Optical component array having adjustable curvature
|
GB2488787A
(en)
*
|
2011-03-07 |
2012-09-12 |
Dupont Teijin Films Us Ltd |
Stabilised polyester films
|
EP2681538B1
(en)
|
2011-03-11 |
2019-03-06 |
Mc10, Inc. |
Integrated devices to facilitate quantitative assays and diagnostics
|
KR101982852B1
(ko)
*
|
2011-03-21 |
2019-05-29 |
서울시립대학교 산학협력단 |
격리판을 구비한 염료감응형 태양전지 및 그 제조방법
|
KR101976376B1
(ko)
*
|
2011-03-22 |
2019-05-10 |
서울시립대학교 산학협력단 |
전기석을 이용한 염료감응형 태양전지 및 그 제조방법
|
WO2012158709A1
(en)
|
2011-05-16 |
2012-11-22 |
The Board Of Trustees Of The University Of Illinois |
Thermally managed led arrays assembled by printing
|
KR102000302B1
(ko)
*
|
2011-05-27 |
2019-07-15 |
엠씨10, 인크 |
전자, 광학, 및/또는 기계 장치 및 시스템, 그리고 이를 제조하기 위한 방법
|
EP2713863B1
(en)
|
2011-06-03 |
2020-01-15 |
The Board of Trustees of the University of Illionis |
Conformable actively multiplexed high-density surface electrode array for brain interfacing
|
DE112012003250T5
(de)
|
2011-08-05 |
2014-04-30 |
Mc10, Inc. |
Katheder Ballon-Verfahren und Vorrichtung unter Einsatz von Abtastelementen
|
US9757050B2
(en)
|
2011-08-05 |
2017-09-12 |
Mc10, Inc. |
Catheter balloon employing force sensing elements
|
KR20130017696A
(ko)
*
|
2011-08-11 |
2013-02-20 |
한국전자통신연구원 |
광치료용 패드
|
WO2013033724A1
(en)
|
2011-09-01 |
2013-03-07 |
Mc10, Inc. |
Electronics for detection of a condition of tissue
|
JP5654037B2
(ja)
*
|
2011-09-15 |
2015-01-14 |
パナソニック株式会社 |
有機el素子の製造方法及び評価方法
|
US9412727B2
(en)
*
|
2011-09-20 |
2016-08-09 |
Semprius, Inc. |
Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion
|
JP6277130B2
(ja)
|
2011-10-05 |
2018-02-14 |
エムシーテン、インコーポレイテッド |
医療用の装置およびそれの製造方法
|
KR101979354B1
(ko)
|
2011-12-01 |
2019-08-29 |
더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 |
프로그램 변형을 실행하도록 설계된 과도 장치
|
US20130160183A1
(en)
*
|
2011-12-23 |
2013-06-27 |
Akseli Reho |
Textile arrangement and method for manufacturing
|
US20130214875A1
(en)
|
2012-02-16 |
2013-08-22 |
Elwha Llc |
Graphene sheet and nanomechanical resonator
|
US9672796B2
(en)
*
|
2012-02-17 |
2017-06-06 |
Lg Electronics Inc. |
Electronic device including flexible display
|
KR101387176B1
(ko)
*
|
2012-02-24 |
2014-04-21 |
경북대학교 산학협력단 |
2차원 배열 초음파 트랜스듀서의 후면층 주조 방법
|
KR101415168B1
(ko)
*
|
2012-03-14 |
2014-07-07 |
한국기계연구원 |
금속배선을 포함하는 섬유형 태양전지의 제조방법 및 이에 따라 제조되는 금속배선을 포함하는 섬유형 태양전지
|
EP2640168A1
(en)
*
|
2012-03-15 |
2013-09-18 |
Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO |
Submount, assembly including submount, method of assembling and assembling device
|
CN105283122B
(zh)
*
|
2012-03-30 |
2020-02-18 |
伊利诺伊大学评议会 |
可共形于表面的可安装于附肢的电子器件
|
US9752259B2
(en)
|
2012-04-09 |
2017-09-05 |
The Hong Kong Research Intitute Of Textiles And Apparel Limited |
Stretchable electrical interconnect and method of making same
|
ITMI20120617A1
(it)
*
|
2012-04-16 |
2013-10-17 |
St Microelectronics Srl |
Sensore di pressione a stato solido
|
US9247637B2
(en)
|
2012-06-11 |
2016-01-26 |
Mc10, Inc. |
Strain relief structures for stretchable interconnects
|
US9226402B2
(en)
|
2012-06-11 |
2015-12-29 |
Mc10, Inc. |
Strain isolation structures for stretchable electronics
|
JP2015521894A
(ja)
|
2012-07-05 |
2015-08-03 |
エムシー10 インコーポレイテッドMc10,Inc. |
流量センシングを含むカテーテルデバイス
|
US9295842B2
(en)
|
2012-07-05 |
2016-03-29 |
Mc10, Inc. |
Catheter or guidewire device including flow sensing and use thereof
|
KR101367888B1
(ko)
*
|
2012-07-06 |
2014-02-27 |
인텔렉추얼디스커버리 주식회사 |
그래핀 패턴의 제조방법
|
US9595624B2
(en)
|
2012-07-12 |
2017-03-14 |
Massachussets Institute Of Technology |
Strain engineered bandgaps
|
CN102981060B
(zh)
*
|
2012-09-07 |
2014-12-03 |
清华大学 |
石墨烯量子电容测试器件及其制备方法
|
US20140069795A1
(en)
*
|
2012-09-11 |
2014-03-13 |
City University Of Hong Kong |
Sensing arrangement, sensor and apparatus comprising same, and method of manufacture thereof
|
US9686867B2
(en)
|
2012-09-17 |
2017-06-20 |
Massachussetts Institute Of Technology |
Foldable machines
|
US9288898B2
(en)
*
|
2012-09-18 |
2016-03-15 |
Palo Alto Research Center Incorporated |
Reconfigurable stretchable connector substrate
|
US9082025B2
(en)
|
2012-10-09 |
2015-07-14 |
Mc10, Inc. |
Conformal electronics integrated with apparel
|
US9171794B2
(en)
*
|
2012-10-09 |
2015-10-27 |
Mc10, Inc. |
Embedding thin chips in polymer
|
KR101485541B1
(ko)
|
2012-11-29 |
2015-01-22 |
한국과학기술원 |
유기발광소자를 포함하는 전계발광 직물, 및 유기발광소자를 포함하는 전계발광 직물의 제조 방법
|
US10497633B2
(en)
*
|
2013-02-06 |
2019-12-03 |
The Board Of Trustees Of The University Of Illinois |
Stretchable electronic systems with fluid containment
|
US10840536B2
(en)
|
2013-02-06 |
2020-11-17 |
The Board Of Trustees Of The University Of Illinois |
Stretchable electronic systems with containment chambers
|
US9613911B2
(en)
|
2013-02-06 |
2017-04-04 |
The Board Of Trustees Of The University Of Illinois |
Self-similar and fractal design for stretchable electronics
|
CA2900583A1
(en)
|
2013-02-06 |
2014-08-14 |
The Board Of Trustees Of The University Of Illinois |
Stretchable electronic systems with containment chambers
|
WO2014126927A1
(en)
|
2013-02-13 |
2014-08-21 |
The Board Of Trustees Of The University Of Illinois |
Injectable and implantable cellular-scale electronic devices
|
KR102051519B1
(ko)
|
2013-02-25 |
2019-12-03 |
삼성전자주식회사 |
파이버 상에 형성된 박막 트랜지스터 및 그 제조 방법
|
WO2014138465A1
(en)
|
2013-03-08 |
2014-09-12 |
The Board Of Trustees Of The University Of Illinois |
Processing techniques for silicon-based transient devices
|
US9327965B2
(en)
|
2013-03-15 |
2016-05-03 |
Versana Micro Inc |
Transportation device having a monolithically integrated multi-sensor device on a semiconductor substrate and method therefor
|
US20140299362A1
(en)
*
|
2013-04-04 |
2014-10-09 |
Electronics And Telecommunications Research Institute |
Stretchable electric device and manufacturing method thereof
|
WO2014165686A2
(en)
|
2013-04-04 |
2014-10-09 |
The Board Of Trustees Of The University Of Illinois |
Purification of carbon nanotubes via selective heating
|
US10292263B2
(en)
|
2013-04-12 |
2019-05-14 |
The Board Of Trustees Of The University Of Illinois |
Biodegradable materials for multilayer transient printed circuit boards
|
JP6578562B2
(ja)
|
2013-04-12 |
2019-09-25 |
ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ |
無機及び有機の過渡電子デバイス
|
KR20140123852A
(ko)
|
2013-04-15 |
2014-10-23 |
삼성디스플레이 주식회사 |
칩 온 필름 및 이를 포함하는 표시 장치
|
US8975121B2
(en)
*
|
2013-05-09 |
2015-03-10 |
Johnson & Johnson Vision Care, Inc. |
Methods and apparatus to form thin film nanocrystal integrated circuits on ophthalmic devices
|
US9706647B2
(en)
|
2013-05-14 |
2017-07-11 |
Mc10, Inc. |
Conformal electronics including nested serpentine interconnects
|
KR102080011B1
(ko)
*
|
2013-06-13 |
2020-02-24 |
삼성디스플레이 주식회사 |
표시장치 및 그 제조방법
|
US8927338B1
(en)
|
2013-06-13 |
2015-01-06 |
International Business Machines Corporation |
Flexible, stretchable electronic devices
|
GB201310837D0
(en)
|
2013-06-18 |
2013-07-31 |
Dupont Teijin Films Us Ltd |
Polyester film -IV
|
KR102109933B1
(ko)
*
|
2013-07-01 |
2020-05-12 |
삼성전자주식회사 |
디스플레이의 곡률을 참조하는 영상 처리장치 및 방법
|
JP2016527649A
(ja)
|
2013-08-05 |
2016-09-08 |
エムシー10 インコーポレイテッドMc10,Inc. |
適合する電子機器を含む可撓性温度センサ
|
KR20150017819A
(ko)
*
|
2013-08-07 |
2015-02-23 |
삼성디스플레이 주식회사 |
윈도우 부재 및 이를 포함하는 표시장치
|
US8987707B2
(en)
*
|
2013-08-20 |
2015-03-24 |
Wisconsin Alumni Research Foundation |
Stretchable transistors with buckled carbon nanotube films as conducting channels
|
CN103445763B
(zh)
*
|
2013-08-26 |
2015-08-26 |
华中科技大学 |
一种基于表皮电子的健康监测系统
|
EP3049227B1
(en)
|
2013-09-27 |
2021-10-27 |
TactoTek Oy |
Method for manufacturing an electromechanical structure and an arrangement for carrying out the method
|
EP3052017B1
(en)
|
2013-10-02 |
2019-12-11 |
The Board of Trustees of the University of Illionis |
Organ mounted electronics
|
GB201317551D0
(en)
|
2013-10-03 |
2013-11-20 |
Dupont Teijin Films Us Ltd |
Co-extruded polyester films
|
JP2016532468A
(ja)
|
2013-10-07 |
2016-10-20 |
エムシー10 インコーポレイテッドMc10,Inc. |
検知および分析のためのコンフォーマルセンサシステム
|
FR3012255B1
(fr)
*
|
2013-10-17 |
2017-03-10 |
Commissariat Energie Atomique |
Procede de formation de rides par fusion d'une fondation sur laquelle repose une couche contrainte
|
US9962673B2
(en)
|
2013-10-29 |
2018-05-08 |
Palo Alto Research Center Incorporated |
Methods and systems for creating aerosols
|
US10016777B2
(en)
|
2013-10-29 |
2018-07-10 |
Palo Alto Research Center Incorporated |
Methods and systems for creating aerosols
|
KR102227276B1
(ko)
*
|
2013-11-05 |
2021-03-11 |
더 리전트 오브 더 유니버시티 오브 캘리포니아 |
금속 산화물이 고정된 그래핀과 탄소 나노튜브 하이브리드 발포체
|
KR102093794B1
(ko)
|
2013-11-14 |
2020-03-27 |
삼성디스플레이 주식회사 |
플렉서블 표시 장치
|
US9730330B1
(en)
*
|
2013-11-21 |
2017-08-08 |
H4 Engineering, Inc. |
Compliant electronic devices
|
EP3071096A4
(en)
|
2013-11-22 |
2017-08-09 |
Mc10, Inc. |
Conformal sensor systems for sensing and analysis of cardiac activity
|
GB2521619A
(en)
*
|
2013-12-23 |
2015-07-01 |
Nokia Technologies Oy |
An apparatus and associated methods for flexible carrier substrates
|
US9171719B2
(en)
*
|
2013-12-30 |
2015-10-27 |
Shenzhen China Star Optoelectronics Technology Co., Ltd |
Method of defining poly-silicon growth direction
|
KR102207252B1
(ko)
|
2013-12-30 |
2021-01-25 |
삼성전자주식회사 |
플렉서블 디스플레이 소자, 이를 채용한 접철식 전자 기기, 및 플렉서블 디스플레이 소자의 제조 방법
|
WO2015103580A2
(en)
|
2014-01-06 |
2015-07-09 |
Mc10, Inc. |
Encapsulated conformal electronic systems and devices, and methods of making and using the same
|
WO2015106282A1
(en)
|
2014-01-13 |
2015-07-16 |
The Arizona Board Of Regents On Behalf Of The University Of Arizona |
Materials, devices and systems for piezoelectric energy harvesting and storage
|
US10029416B2
(en)
|
2014-01-28 |
2018-07-24 |
Palo Alto Research Center Incorporated |
Polymer spray deposition methods and systems
|
US9281298B2
(en)
|
2014-02-10 |
2016-03-08 |
Nthdegree Technologies Worldwide Inc. |
Process for forming ultra-micro LEDS
|
CN104869754B
(zh)
*
|
2014-02-25 |
2018-06-26 |
财团法人工业技术研究院 |
嵌有导线的软性基板及其制造方法
|
JP6637896B2
(ja)
|
2014-03-04 |
2020-01-29 |
エムシー10 インコーポレイテッドMc10,Inc. |
電子デバイス用の可撓性を有するマルチパート封止ハウジングを備えるコンフォーマルなicデバイス
|
WO2015138712A1
(en)
|
2014-03-12 |
2015-09-17 |
Mc10, Inc. |
Quantification of a change in assay
|
US20170003594A1
(en)
*
|
2014-03-17 |
2017-01-05 |
Northeastern University |
Elastomer-Assisted Manufacturing
|
KR101574521B1
(ko)
*
|
2014-03-18 |
2015-12-04 |
한국과학기술연구원 |
계층구조를 이용하여 내재된 형태를 가지는 형태변환소재 및 이를 포함하는 전극
|
US9134295B1
(en)
*
|
2014-04-08 |
2015-09-15 |
Massachusetts Institute Of Technology |
Serial arrays of suspended microchannel resonators
|
US10071487B2
(en)
|
2014-05-06 |
2018-09-11 |
Massachusetts Institute Of Technology |
Systems and methods for compiling robotic assemblies
|
US9757747B2
(en)
|
2014-05-27 |
2017-09-12 |
Palo Alto Research Center Incorporated |
Methods and systems for creating aerosols
|
US9527056B2
(en)
|
2014-05-27 |
2016-12-27 |
Palo Alto Research Center Incorporated |
Methods and systems for creating aerosols
|
US9707588B2
(en)
|
2014-05-27 |
2017-07-18 |
Palo Alto Research Center Incorporated |
Methods and systems for creating aerosols
|
KR20160138249A
(ko)
|
2014-05-28 |
2016-12-02 |
인텔 코포레이션 |
만곡 및 신축 가능한 장치를 위한 파형 상호접속부
|
KR102042137B1
(ko)
*
|
2014-05-30 |
2019-11-28 |
한국전자통신연구원 |
전자장치 및 그 제조 방법
|
US10764999B2
(en)
|
2014-06-30 |
2020-09-01 |
Panasonic Intellectual Property Management Co., Ltd. |
Flexible substrate
|
EP3167695A4
(en)
*
|
2014-07-08 |
2018-06-06 |
David Markus |
Elastic circuit
|
US10383550B2
(en)
|
2014-07-17 |
2019-08-20 |
Elwha Llc |
Monitoring body movement or condition according to motion regimen with conformal electronics
|
US10099053B2
(en)
|
2014-07-17 |
2018-10-16 |
Elwha Llc |
Epidermal electronics to monitor repetitive stress injuries and arthritis
|
US10390755B2
(en)
|
2014-07-17 |
2019-08-27 |
Elwha Llc |
Monitoring body movement or condition according to motion regimen with conformal electronics
|
US10279201B2
(en)
|
2014-07-17 |
2019-05-07 |
Elwha Llc |
Monitoring and treating pain with epidermal electronics
|
US10279200B2
(en)
|
2014-07-17 |
2019-05-07 |
Elwha Llc |
Monitoring and treating pain with epidermal electronics
|
MY182253A
(en)
|
2014-07-20 |
2021-01-18 |
X Celeprint Ltd |
Apparatus and methods for micro-transfer-printing
|
US9484489B2
(en)
|
2014-08-05 |
2016-11-01 |
Massachusetts Institute Of Technology |
Engineered band gaps
|
WO2016025468A2
(en)
|
2014-08-11 |
2016-02-18 |
The Board Of Trustees Of The University Of Illinois |
Devices and related methods for epidermal characterization of biofluids
|
KR20170041872A
(ko)
|
2014-08-11 |
2017-04-17 |
더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 |
온도 및 열 전달 특성분석을 위한 표피 장치
|
US10736551B2
(en)
|
2014-08-11 |
2020-08-11 |
The Board Of Trustees Of The University Of Illinois |
Epidermal photonic systems and methods
|
KR102161644B1
(ko)
|
2014-08-20 |
2020-10-06 |
삼성디스플레이 주식회사 |
스트레쳐블 표시 패널 및 이를 포함하는 표시 장치
|
US11247501B2
(en)
*
|
2014-08-27 |
2022-02-15 |
3M Innovative Properties Company |
Layer-by-layer assembled multilayer lamination transfer films
|
US9485862B2
(en)
|
2014-08-28 |
2016-11-01 |
Apple Inc. |
Electronic devices with carbon nanotube printed circuits
|
EP2991460B1
(en)
|
2014-08-29 |
2018-11-21 |
Nokia Technologies OY |
An apparatus and associated methods for deformable electronics
|
US9980659B2
(en)
*
|
2014-09-26 |
2018-05-29 |
NeuroRex Inc. |
Bio-potential sensing materials as dry electrodes and devices
|
KR102271817B1
(ko)
|
2014-09-26 |
2021-07-01 |
삼성전자주식회사 |
증강현실을 위한 스마트 콘택렌즈와 그 제조 및 동작방법
|
US9899330B2
(en)
|
2014-10-03 |
2018-02-20 |
Mc10, Inc. |
Flexible electronic circuits with embedded integrated circuit die
|
US10297572B2
(en)
|
2014-10-06 |
2019-05-21 |
Mc10, Inc. |
Discrete flexible interconnects for modules of integrated circuits
|
WO2016057796A1
(en)
|
2014-10-08 |
2016-04-14 |
The Arizona Board Of Regents On Behalf Of The University Of Arizona |
Flowable electronics
|
USD781270S1
(en)
|
2014-10-15 |
2017-03-14 |
Mc10, Inc. |
Electronic device having antenna
|
EP3010315A1
(en)
|
2014-10-16 |
2016-04-20 |
Nokia Technologies OY |
A deformable apparatus and method
|
CN105592640B
(zh)
*
|
2014-10-22 |
2019-02-15 |
中国科学院理化技术研究所 |
一种柔性印制电路的制备方法
|
WO2016069866A2
(en)
*
|
2014-10-30 |
2016-05-06 |
Smartear, Inc. |
Smart flexible interactive earplug
|
US9942979B2
(en)
*
|
2014-11-03 |
2018-04-10 |
Samsung Electronics Co., Ltd. |
Flexible printed circuit board
|
US10538028B2
(en)
|
2014-11-17 |
2020-01-21 |
The Board Of Trustees Of The University Of Illinois |
Deterministic assembly of complex, three-dimensional architectures by compressive buckling
|
KR102315621B1
(ko)
|
2014-11-24 |
2021-10-22 |
삼성디스플레이 주식회사 |
표시 장치
|
US10345703B2
(en)
|
2014-11-26 |
2019-07-09 |
Massachusetts Institute Of Technology |
Systems, devices, and methods for printing on three-dimensional objects
|
US9773711B2
(en)
|
2014-12-01 |
2017-09-26 |
Industrial Technology Research Institute |
Picking-up and placing process for electronic devices and electronic module
|
US9607907B2
(en)
|
2014-12-01 |
2017-03-28 |
Industrial Technology Research Institute |
Electric-programmable magnetic module and picking-up and placement process for electronic devices
|
US11069734B2
(en)
|
2014-12-11 |
2021-07-20 |
Invensas Corporation |
Image sensor device
|
US9878493B2
(en)
|
2014-12-17 |
2018-01-30 |
Palo Alto Research Center Incorporated |
Spray charging and discharging system for polymer spray deposition device
|
US9373561B1
(en)
|
2014-12-18 |
2016-06-21 |
International Business Machines Corporation |
Integrated circuit barrierless microfluidic channel
|
US10393414B2
(en)
|
2014-12-19 |
2019-08-27 |
Palo Alto Research Center Incorporated |
Flexible thermal regulation device
|
CN104523227B
(zh)
|
2014-12-22 |
2018-03-09 |
浙江智柔科技有限公司 |
一种基于生物兼容薄膜的柔性可延展电子器件及制备方法
|
US9543495B2
(en)
|
2014-12-23 |
2017-01-10 |
Palo Alto Research Center Incorporated |
Method for roll-to-roll production of flexible, stretchy objects with integrated thermoelectric modules, electronics and heat dissipation
|
EP3241412A2
(en)
|
2014-12-30 |
2017-11-08 |
3M Innovative Properties Company |
Electrical conductors
|
KR102327582B1
(ko)
*
|
2015-01-06 |
2021-11-17 |
삼성디스플레이 주식회사 |
신축성 표시 장치 및 그 제조 방법
|
KR101976811B1
(ko)
*
|
2015-01-08 |
2019-05-09 |
한국과학기술연구원 |
극가변 구조체 및 그러한 극가변 구조체로 이루어진 리튬 이차전지
|
KR102340855B1
(ko)
|
2015-01-15 |
2021-12-17 |
삼성디스플레이 주식회사 |
신축성 표시 장치
|
KR102355844B1
(ko)
|
2015-01-16 |
2022-01-27 |
삼성디스플레이 주식회사 |
표시 장치
|
KR102320382B1
(ko)
|
2015-01-28 |
2021-11-02 |
삼성디스플레이 주식회사 |
전자 장치
|
US10477354B2
(en)
|
2015-02-20 |
2019-11-12 |
Mc10, Inc. |
Automated detection and configuration of wearable devices based on on-body status, location, and/or orientation
|
US10335086B2
(en)
|
2015-02-27 |
2019-07-02 |
Elwha Llc |
Item attachable to a subject and including a sensor for sensing an object that a body portion of the subject may contact
|
US9881477B2
(en)
|
2015-02-27 |
2018-01-30 |
Elwha Llc |
Device having a sensor for sensing an object and a communicator for coupling the sensor to a determiner for determining whether a subject may collide with the object
|
WO2016140961A1
(en)
|
2015-03-02 |
2016-09-09 |
Mc10, Inc. |
Perspiration sensor
|
KR102282492B1
(ko)
*
|
2015-03-10 |
2021-07-27 |
삼성디스플레이 주식회사 |
유기 발광 표시 장치
|
KR102381654B1
(ko)
|
2015-03-23 |
2022-04-04 |
삼성디스플레이 주식회사 |
온도 검출 소자 및 이를 이용한 온도 센서
|
KR102480632B1
(ko)
|
2015-03-23 |
2022-12-26 |
삼성디스플레이 주식회사 |
압전 소자 및 이를 이용한 압전 센서
|
US10098225B2
(en)
*
|
2015-03-31 |
2018-10-09 |
Industrial Technology Research Institute |
Flexible electronic module and manufacturing method thereof
|
WO2016168789A1
(en)
|
2015-04-17 |
2016-10-20 |
The Arizona Board Of Regents On Behalf Of The University Of Arizona |
Systems, devices, and methods for contact measurement and modulation of material properties
|
KR102432345B1
(ko)
|
2015-04-30 |
2022-08-12 |
삼성디스플레이 주식회사 |
신축성 표시 장치
|
US10235737B2
(en)
|
2015-05-11 |
2019-03-19 |
Elwha Llc |
Interactive surgical drape, system, and related methods
|
US10226219B2
(en)
|
2015-05-11 |
2019-03-12 |
Elwha Llc |
Interactive surgical drape, system, and related methods
|
BR112017025609A2
(pt)
|
2015-06-01 |
2018-08-07 |
The Board Of Trustees Of The University Of Illinois |
sistemas eletrônicos miniaturizados com potência sem fio e capacidades de comunicação de campo próximo
|
KR20180034342A
(ko)
|
2015-06-01 |
2018-04-04 |
더 보드 오브 트러스티즈 오브 더 유니버시티 오브 일리노이 |
대안적인 자외선 감지방법
|
US10057981B2
(en)
|
2015-06-10 |
2018-08-21 |
Industry Foundation Of Chonnam National University |
Stretchable circuit board and method of manufacturing the same
|
US9881113B2
(en)
*
|
2015-06-17 |
2018-01-30 |
Mentor Graphics Corporation |
Layout synthesis of a three-dimensional mechanical system design
|
US9741620B2
(en)
|
2015-06-24 |
2017-08-22 |
Invensas Corporation |
Structures and methods for reliable packages
|
US10136563B2
(en)
|
2015-06-25 |
2018-11-20 |
International Business Machines Corporation |
Active perforation for advanced server cooling
|
US9907210B2
(en)
*
|
2015-06-25 |
2018-02-27 |
International Business Machines Corporation |
Active perforation for advanced server cooling
|
US11160489B2
(en)
|
2015-07-02 |
2021-11-02 |
The Board Of Trustees Of The University Of Illinois |
Wireless optofluidic systems for programmable in vivo pharmacology and optogenetics
|
JP6491556B2
(ja)
*
|
2015-07-09 |
2019-03-27 |
日東電工株式会社 |
配線回路基板
|
US10653332B2
(en)
|
2015-07-17 |
2020-05-19 |
Mc10, Inc. |
Conductive stiffener, method of making a conductive stiffener, and conductive adhesive and encapsulation layers
|
KR20170010695A
(ko)
*
|
2015-07-20 |
2017-02-01 |
재단법인 나노기반소프트일렉트로닉스연구단 |
표면 스트레인을 감소시키는 유연 기판 적층체 및 그를 포함하는 유연 전자 소자
|
US9704821B2
(en)
|
2015-08-11 |
2017-07-11 |
X-Celeprint Limited |
Stamp with structured posts
|
US9707577B2
(en)
|
2015-07-29 |
2017-07-18 |
Palo Alto Research Center Incorporated |
Filament extension atomizers
|
US9789499B2
(en)
|
2015-07-29 |
2017-10-17 |
Palo Alto Research Center Incorporated |
Filament extension atomizers
|
US10709384B2
(en)
|
2015-08-19 |
2020-07-14 |
Mc10, Inc. |
Wearable heat flux devices and methods of use
|
US10067007B2
(en)
|
2015-09-02 |
2018-09-04 |
Oculus Vr, Llc |
Resistive-capacitive deformation sensor
|
WO2017042708A1
(en)
*
|
2015-09-09 |
2017-03-16 |
Couponizer Ltd |
Method and system for photographing long text subjects that extend beyond borders of a viewfinder
|
DE102015115812A1
(de)
*
|
2015-09-18 |
2017-03-23 |
Osram Opto Semiconductors Gmbh |
Bauelement sowie Verfahren zur Herstellung eines Bauelements
|
DE102015218749A1
(de)
|
2015-09-29 |
2017-03-30 |
Siemens Healthcare Gmbh |
Adaptive MR-Lokalspule
|
US10300371B2
(en)
|
2015-10-01 |
2019-05-28 |
Mc10, Inc. |
Method and system for interacting with a virtual environment
|
US10532211B2
(en)
|
2015-10-05 |
2020-01-14 |
Mc10, Inc. |
Method and system for neuromodulation and stimulation
|
KR101758317B1
(ko)
*
|
2015-10-07 |
2017-07-14 |
광주과학기술원 |
섬모 구조를 이용한 전자소자의 전사인쇄 방법
|
JP6886460B2
(ja)
|
2015-10-13 |
2021-06-16 |
コーニング インコーポレイテッド |
屈曲性電子装置モジュール、物品及びその製造方法
|
US10925543B2
(en)
|
2015-11-11 |
2021-02-23 |
The Board Of Trustees Of The University Of Illinois |
Bioresorbable silicon electronics for transient implants
|
RU2632677C2
(ru)
*
|
2015-12-07 |
2017-10-09 |
Илья Валерьевич Молохин |
Солнечная батарея космического аппарата
|
RU2682154C1
(ru)
*
|
2015-12-07 |
2019-03-14 |
Сергей Александрович Филин |
Космический аппарат
|
SG11201805193WA
(en)
|
2015-12-18 |
2018-07-30 |
3M Innovative Properties Co |
Extensible barrier films, articles employing same and methods of making same
|
US10206277B2
(en)
|
2015-12-18 |
2019-02-12 |
Intel Corporation |
Gradient encapsulant protection of devices in stretchable electronics
|
US9816799B2
(en)
|
2015-12-18 |
2017-11-14 |
Oculus Vr, Llc |
Embroidered strain sensing elements
|
CN108431103B
(zh)
|
2015-12-18 |
2021-05-25 |
3M创新有限公司 |
可延伸的阻挡膜、采用其的制品及其制造方法
|
KR101634091B1
(ko)
*
|
2015-12-18 |
2016-06-29 |
한국기계연구원 |
상부 pi 적층 유연기판 및 그 제조 방법
|
US20170181276A1
(en)
*
|
2015-12-21 |
2017-06-22 |
Panasonic Intellectual Property Management Co., Ltd. |
Substrate including stretchable sheet
|
CN105578738B
(zh)
*
|
2015-12-21 |
2019-01-25 |
上海交通大学 |
基于弹性衬底的可拉伸电路板的制备方法及可拉伸电路板
|
US9773764B2
(en)
*
|
2015-12-22 |
2017-09-26 |
Intel Corporation |
Solid state device miniaturization
|
US10477688B2
(en)
*
|
2015-12-24 |
2019-11-12 |
Intel Corporation |
Stretchable electronic assembly
|
US9993839B2
(en)
|
2016-01-18 |
2018-06-12 |
Palo Alto Research Center Incorporated |
System and method for coating a substrate
|
USD794611S1
(en)
|
2016-01-19 |
2017-08-15 |
Smartear, Inc. |
In-ear utility device
|
USD798843S1
(en)
|
2016-01-19 |
2017-10-03 |
Smartear, Inc. |
In-ear utility device
|
US10434703B2
(en)
|
2016-01-20 |
2019-10-08 |
Palo Alto Research Center Incorporated |
Additive deposition system and method
|
US10500784B2
(en)
|
2016-01-20 |
2019-12-10 |
Palo Alto Research Center Incorporated |
Additive deposition system and method
|
US10427397B2
(en)
|
2016-01-27 |
2019-10-01 |
Palo Alto Research Center Incorporated |
Structural designs for stretchable, conformal electrical interconnects
|
EP3420732B8
(en)
|
2016-02-22 |
2020-12-30 |
Medidata Solutions, Inc. |
System, devices, and method for on-body data and power transmission
|
WO2017147053A1
(en)
|
2016-02-22 |
2017-08-31 |
Mc10, Inc. |
System, device, and method for coupled hub and sensor node on-body acquisition of sensor information
|
US10132478B2
(en)
*
|
2016-03-06 |
2018-11-20 |
Svv Technology Innovations, Inc. |
Flexible solid-state illumination devices
|
CN107159885B
(zh)
*
|
2016-03-08 |
2018-09-28 |
香港生产力促进局 |
一种应用金属增材制造技术植入电子组件的金属零部件及其制备方法
|
USD795224S1
(en)
|
2016-03-08 |
2017-08-22 |
Smartear, Inc. |
In-ear utility device
|
KR102462110B1
(ko)
|
2016-03-15 |
2022-11-03 |
삼성디스플레이 주식회사 |
게이트 구동부 및 이를 포함하는 표시 장치
|
US20170268972A1
(en)
*
|
2016-03-18 |
2017-09-21 |
Intel Corporation |
Lateral Expansion Apparatus for Mechanical Testing of Stretchable Electronics
|
KR101973163B1
(ko)
|
2016-03-22 |
2019-04-29 |
삼성디스플레이 주식회사 |
디스플레이 장치
|
WO2017173339A1
(en)
|
2016-04-01 |
2017-10-05 |
The Board Of Trustees Of The University Of Illinois |
Implantable medical devices for optogenetics
|
US9828456B2
(en)
|
2016-04-11 |
2017-11-28 |
International Business Machines Corporation |
Macromolecular block copolymers
|
US9834637B2
(en)
|
2016-04-11 |
2017-12-05 |
International Business Machines Corporation |
Macromolecular block copolymer formation
|
US10414913B2
(en)
|
2016-04-11 |
2019-09-17 |
International Business Machines Corporation |
Articles of manufacture including macromolecular block copolymers
|
KR102618354B1
(ko)
|
2016-04-15 |
2023-12-28 |
삼성디스플레이 주식회사 |
디스플레이 장치
|
CN109310340A
(zh)
|
2016-04-19 |
2019-02-05 |
Mc10股份有限公司 |
用于测量汗液的方法和系统
|
US9908042B2
(en)
*
|
2016-04-25 |
2018-03-06 |
Performance Designed Products Llc |
Guitar shaped video game controller
|
US9908043B2
(en)
*
|
2016-04-25 |
2018-03-06 |
Performance Designed Products Llc |
Guitar shaped video game controller
|
US9914050B2
(en)
*
|
2016-04-25 |
2018-03-13 |
Performance Designed Products Llc |
Guitar shaped video game controller
|
KR101894137B1
(ko)
|
2016-05-13 |
2018-10-04 |
서울대학교산학협력단 |
신장성 전기 회로 형성 방법 및 신장성 전기 회로 형성 장치
|
US10204893B2
(en)
*
|
2016-05-19 |
2019-02-12 |
Invensas Bonding Technologies, Inc. |
Stacked dies and methods for forming bonded structures
|
ITUA20163746A1
(it)
*
|
2016-05-24 |
2017-11-24 |
Wise S R L |
Sistema di interconnessione elettrica tra un conduttore intrinsecamente estensibile ed uno non intrinsecamente estensibile
|
US10045130B2
(en)
|
2016-05-25 |
2018-08-07 |
Smartear, Inc. |
In-ear utility device having voice recognition
|
US9838771B1
(en)
|
2016-05-25 |
2017-12-05 |
Smartear, Inc. |
In-ear utility device having a humidity sensor
|
US20170347177A1
(en)
|
2016-05-25 |
2017-11-30 |
Smartear, Inc. |
In-Ear Utility Device Having Sensors
|
EP3465277B1
(en)
|
2016-05-26 |
2024-02-21 |
Koninklijke Philips N.V. |
Multifunctional radiation detector
|
US9536758B1
(en)
|
2016-05-26 |
2017-01-03 |
Anand Deo |
Time-varying frequency powered semiconductor substrate heat source
|
US9970830B2
(en)
|
2016-06-14 |
2018-05-15 |
International Business Machines Corporation |
Approach to measuring strain effects using ring oscillators
|
WO2017218878A1
(en)
|
2016-06-17 |
2017-12-21 |
The Board Of Trustees Of The University Of Illinois |
Soft, wearable microfluidic systems capable of capture, storage, and sensing of biofluids
|
WO2018009150A1
(en)
*
|
2016-07-08 |
2018-01-11 |
Nanyang Technological University |
A method of fabricating an electrical circuit assembly on a flexible substrate
|
US10310686B2
(en)
|
2016-07-11 |
2019-06-04 |
Apple Inc. |
Rigid trackpad for an electronic device
|
KR101856500B1
(ko)
*
|
2016-07-26 |
2018-06-21 |
재단법인 대구경북첨단의료산업진흥재단 |
레이저 가공된 포토마스크를 이용한 미세유체칩 제조방법
|
US10447347B2
(en)
|
2016-08-12 |
2019-10-15 |
Mc10, Inc. |
Wireless charger and high speed data off-loader
|
EP3500375A4
(en)
*
|
2016-08-17 |
2020-06-03 |
The University of North Carolina at Chapel Hill |
FLEXIBLE CONDUCTIVE TRANSPARENT FILMS, ARTICLES, AND METHODS OF MAKING SAME
|
US10147772B2
(en)
*
|
2016-08-23 |
2018-12-04 |
3M Innovative Properties Company |
Foldable OLED device with compatible flexural stiffness of layers
|
US9670061B1
(en)
*
|
2016-09-12 |
2017-06-06 |
International Business Machines Corporation |
Flexible electronics for wearable healthcare sensors
|
CN106185782A
(zh)
*
|
2016-09-12 |
2016-12-07 |
桂林电子科技大学 |
一种面向可延展电子的柔性基底
|
KR20180032742A
(ko)
|
2016-09-22 |
2018-04-02 |
삼성디스플레이 주식회사 |
플렉시블 디스플레이 패널 및 플렉시블 디스플레이 패널 벤딩 방법
|
EP3300467B1
(en)
*
|
2016-09-26 |
2023-04-05 |
IMEC vzw |
Method for manufacturing shape-retaining non-flat devices
|
CN106328547B
(zh)
*
|
2016-09-26 |
2019-03-15 |
昆山工研院新型平板显示技术中心有限公司 |
一种柔性电子器件的制备方法和制备结构
|
WO2018063198A1
(en)
|
2016-09-28 |
2018-04-05 |
Aleksandar Aleksov |
Flexible packaging for a wearable electronic device
|
US9988720B2
(en)
|
2016-10-13 |
2018-06-05 |
Palo Alto Research Center Incorporated |
Charge transfer roller for use in an additive deposition system and process
|
JP6806328B2
(ja)
*
|
2016-11-14 |
2021-01-06 |
国立研究開発法人産業技術総合研究所 |
電子装置
|
CA2986503A1
(en)
*
|
2017-11-23 |
2019-05-23 |
Vuereal Inc. |
Microdevice transfer setup
|
US10746612B2
(en)
|
2016-11-30 |
2020-08-18 |
The Board Of Trustees Of Western Michigan University |
Metal-metal composite ink and methods for forming conductive patterns
|
DE102016123795A1
(de)
*
|
2016-12-08 |
2018-06-14 |
Gottfried Wilhelm Leibniz Universität Hannover |
Verfahren zur Anbringung einer elektrischen Mikrostruktur sowie Elastomerstruktur, Faserverbundbauteil und Reifen
|
US10732712B2
(en)
*
|
2016-12-27 |
2020-08-04 |
Facebook Technologies, Llc |
Large scale integration of haptic devices
|
KR20180079055A
(ko)
|
2016-12-30 |
2018-07-10 |
엘지디스플레이 주식회사 |
스트레처블 터치 스크린, 이의 제조 방법 및 이를 이용한 표시 장치
|
JP7180074B2
(ja)
|
2017-01-31 |
2022-11-30 |
株式会社リコー |
撮像装置
|
CN110291373B
(zh)
*
|
2017-02-17 |
2021-06-29 |
索尼公司 |
传感器、输入装置以及电子设备
|
CN108461519A
(zh)
*
|
2017-02-21 |
2018-08-28 |
京东方科技集团股份有限公司 |
柔性显示面板及其制备方法、显示装置
|
US20180248342A1
(en)
*
|
2017-02-28 |
2018-08-30 |
Hubbell Incorporated |
Panels and enclosures with component positioning templates
|
US10576268B2
(en)
|
2017-03-22 |
2020-03-03 |
International Business Machines Corporation |
High resolution brain-electronics interface
|
CN107112720B
(zh)
*
|
2017-03-27 |
2020-10-16 |
香港中文大学(深圳) |
基于光子晶体的柔性激光器及其制备方法
|
US11375895B2
(en)
*
|
2017-04-03 |
2022-07-05 |
The Regents Of The University Of California |
Three-dimensional integrated stretchable electronics
|
US10113325B1
(en)
|
2017-04-19 |
2018-10-30 |
Kohler Co. |
Generator enclosure system
|
EP3619553A1
(en)
*
|
2017-05-01 |
2020-03-11 |
Koninklijke Philips N.V. |
Multi-layer radiation detector
|
US10879212B2
(en)
|
2017-05-11 |
2020-12-29 |
Invensas Bonding Technologies, Inc. |
Processed stacked dies
|
US10410634B2
(en)
|
2017-05-18 |
2019-09-10 |
Smartear, Inc. |
Ear-borne audio device conversation recording and compressed data transmission
|
KR101939462B1
(ko)
*
|
2017-05-19 |
2019-01-16 |
경희대학교 산학협력단 |
스트레처블 전자 소자 및 그의 제조 방법
|
KR101980272B1
(ko)
*
|
2017-05-22 |
2019-05-21 |
한국과학기술원 |
폴더블 전자소자 및 이의 제조방법
|
US10932721B2
(en)
*
|
2017-05-31 |
2021-03-02 |
Iowa State University Research Foundation, Inc. |
High-resolution patterning and transferring of functional nanomaterials toward massive production of flexible, conformal, and wearable sensors of many kinds on adhesive tapes
|
KR102423030B1
(ko)
*
|
2017-06-05 |
2022-07-20 |
삼성디스플레이 주식회사 |
전자 장치 및 이의 제조 방법
|
DE102017210038B4
(de)
|
2017-06-14 |
2020-02-13 |
Ford Global Technologies, Llc |
Sensorbefestigungsanordnung in einem Kraftfahrzeug
|
US10217720B2
(en)
|
2017-06-15 |
2019-02-26 |
Invensas Corporation |
Multi-chip modules formed using wafer-level processing of a reconstitute wafer
|
US10953793B2
(en)
|
2017-06-28 |
2021-03-23 |
Honda Motor Co., Ltd. |
Haptic function leather component and method of making the same
|
US11225191B2
(en)
|
2017-06-28 |
2022-01-18 |
Honda Motor Co., Ltd. |
Smart leather with wireless power
|
US11665830B2
(en)
|
2017-06-28 |
2023-05-30 |
Honda Motor Co., Ltd. |
Method of making smart functional leather
|
US10742061B2
(en)
|
2017-06-28 |
2020-08-11 |
Honda Motor Co., Ltd. |
Smart functional leather for recharging a portable electronic device
|
US10682952B2
(en)
|
2017-06-28 |
2020-06-16 |
Honda Motor Co., Ltd. |
Embossed smart functional premium natural leather
|
US10272836B2
(en)
|
2017-06-28 |
2019-04-30 |
Honda Motor Co., Ltd. |
Smart functional leather for steering wheel and dash board
|
KR101926034B1
(ko)
*
|
2017-06-29 |
2019-02-26 |
한국과학기술연구원 |
굴곡진 금속 나노와이어 네트워크 박막, 이를 포함하는 신축성 투명전극 및 이의 제조방법
|
US10493483B2
(en)
|
2017-07-17 |
2019-12-03 |
Palo Alto Research Center Incorporated |
Central fed roller for filament extension atomizer
|
US10582631B2
(en)
|
2017-07-20 |
2020-03-03 |
Apple Inc. |
Housings formed from three-dimensional circuits
|
US10464094B2
(en)
|
2017-07-31 |
2019-11-05 |
Palo Alto Research Center Incorporated |
Pressure induced surface wetting for enhanced spreading and controlled filament size
|
US10919215B2
(en)
|
2017-08-22 |
2021-02-16 |
Palo Alto Research Center Incorporated |
Electrostatic polymer aerosol deposition and fusing of solid particles for three-dimensional printing
|
KR102336174B1
(ko)
|
2017-08-29 |
2021-12-07 |
삼성전자주식회사 |
전방위 이미지 센서 및 그 제조 방법
|
JP2019041986A
(ja)
*
|
2017-08-31 |
2019-03-22 |
日本メクトロン株式会社 |
受信器及び受信システム
|
US10681843B2
(en)
*
|
2017-09-29 |
2020-06-09 |
Apple Inc. |
Electronic devices having adaptive surfaces
|
USD883491S1
(en)
|
2017-09-30 |
2020-05-05 |
Smartear, Inc. |
In-ear device
|
US10582285B2
(en)
|
2017-09-30 |
2020-03-03 |
Smartear, Inc. |
Comfort tip with pressure relief valves and horn
|
US10838360B2
(en)
*
|
2017-10-02 |
2020-11-17 |
Microsoft Technology Licensing, Llc |
Variable shear with volume holograms
|
US10014390B1
(en)
|
2017-10-10 |
2018-07-03 |
Globalfoundries Inc. |
Inner spacer formation for nanosheet field-effect transistors with tall suspensions
|
WO2019078784A1
(en)
*
|
2017-10-17 |
2019-04-25 |
Agency For Science, Technology And Research |
FORMATION OF TRANSFER REASONS ON FIBROUS MATERIAL
|
US10959326B2
(en)
*
|
2017-11-07 |
2021-03-23 |
Dai Nippon Printing Co., Ltd. |
Stretchable circuit substrate and article
|
KR102427697B1
(ko)
|
2017-11-07 |
2022-08-01 |
삼성디스플레이 주식회사 |
신축성 표시 장치
|
CN111343950A
(zh)
*
|
2017-11-15 |
2020-06-26 |
史密夫及内修公开有限公司 |
实施传感器的集成伤口监测和/或治疗敷料和系统
|
CN107887321A
(zh)
*
|
2017-11-20 |
2018-04-06 |
浙江工业大学 |
一种微观电子器件的转印刷方法
|
CN109859623B
(zh)
*
|
2017-11-30 |
2021-05-18 |
云谷(固安)科技有限公司 |
阵列基板及其制备方法及显示屏
|
CN109870255B
(zh)
*
|
2017-12-05 |
2023-09-12 |
北京佰为深科技发展有限公司 |
法珀传感器及其制造方法
|
US20190186041A1
(en)
*
|
2017-12-20 |
2019-06-20 |
International Business Machines Corporation |
Three-dimensionally stretchable single crystalline semiconductor membrane
|
CN108155294A
(zh)
*
|
2017-12-25 |
2018-06-12 |
上海集成电路研发中心有限公司 |
光电探测器及其制作方法、光电探测器织物
|
KR102173895B1
(ko)
*
|
2018-01-18 |
2020-11-04 |
한양대학교 산학협력단 |
마이크로-패턴화된 곡면 표면 상에 형성된 조절 가능한 콜로이드의 결정성 패턴 및 이의 제조방법
|
US10692996B1
(en)
|
2018-02-05 |
2020-06-23 |
United States Of America As Represented By The Secretary Of The Air Force |
Systems, methods and apparatus for radio frequency devices
|
KR102000034B1
(ko)
*
|
2018-02-28 |
2019-07-15 |
충북대학교 산학협력단 |
선택적 젖음성을 이용한 패터닝 방법
|
CN110277424B
(zh)
*
|
2018-03-14 |
2021-08-17 |
昆山工研院新型平板显示技术中心有限公司 |
可拉伸显示装置及其制作方法、电子设备
|
KR102039990B1
(ko)
*
|
2018-03-15 |
2019-11-04 |
광주과학기술원 |
고분자 프레임의 유기용매 가소화 공정을 통한 3 차원 전자소자 및 이의 제조방법
|
CN108538755B
(zh)
*
|
2018-03-22 |
2019-05-21 |
华中科技大学 |
一种复杂曲面电子系统的共形制造设备及方法
|
US10930677B2
(en)
*
|
2018-04-12 |
2021-02-23 |
Palo Alto Research Center Incorporated |
Alternative designs for addressing contacts that enhance bend ability of TFT backplanes
|
CN108470853A
(zh)
|
2018-04-12 |
2018-08-31 |
京东方科技集团股份有限公司 |
一种柔性显示面板及其制备方法和显示装置
|
CN108597376B
(zh)
|
2018-04-25 |
2020-12-01 |
京东方科技集团股份有限公司 |
预拉伸基底及其制作方法、电子器件及其制作方法
|
US11276676B2
(en)
|
2018-05-15 |
2022-03-15 |
Invensas Bonding Technologies, Inc. |
Stacked devices and methods of fabrication
|
CN108591211B
(zh)
*
|
2018-05-18 |
2019-12-24 |
江苏南京白马现代农业高新技术产业园有限公司 |
一种可拉伸电子器件制备整机
|
CN108682305B
(zh)
*
|
2018-05-21 |
2021-04-27 |
京东方科技集团股份有限公司 |
柔性基板及其制备方法、和柔性显示装置
|
CN114093857A
(zh)
|
2018-05-25 |
2022-02-25 |
群创光电股份有限公司 |
电子装置及其制造方法
|
CN108766951A
(zh)
|
2018-05-30 |
2018-11-06 |
京东方科技集团股份有限公司 |
柔性基板及制备方法、柔性电子装置
|
CN108550587B
(zh)
*
|
2018-06-05 |
2020-08-11 |
京东方科技集团股份有限公司 |
柔性显示基板及其制作方法、柔性显示装置
|
US20210259606A1
(en)
*
|
2018-06-08 |
2021-08-26 |
Georgia Tech Research Corporation |
Multifunctional Biopatch for Wireless Monitoring of Health Conditions and Methods Thereof
|
CN110611051A
(zh)
*
|
2018-06-15 |
2019-12-24 |
京东方科技集团股份有限公司 |
电子装置的制备方法、电子装置及其制备工具
|
US11462419B2
(en)
|
2018-07-06 |
2022-10-04 |
Invensas Bonding Technologies, Inc. |
Microelectronic assemblies
|
US11158606B2
(en)
|
2018-07-06 |
2021-10-26 |
Invensas Bonding Technologies, Inc. |
Molded direct bonded and interconnected stack
|
KR102560102B1
(ko)
|
2018-07-13 |
2023-07-26 |
삼성디스플레이 주식회사 |
표시 장치
|
US11378824B2
(en)
*
|
2018-08-07 |
2022-07-05 |
E Ink Corporation |
Flexible encapsulated electro-optic media
|
US11003289B1
(en)
|
2018-09-24 |
2021-05-11 |
Apple Inc. |
Flexible touch sensor panel
|
US10754440B2
(en)
*
|
2018-09-28 |
2020-08-25 |
Apple Inc. |
Touch sensitive keyboard with flexible interconnections
|
US11656522B2
(en)
*
|
2018-09-28 |
2023-05-23 |
E Ink Corporation |
Solar temperature regulation system for a fluid
|
WO2020081448A1
(en)
|
2018-10-15 |
2020-04-23 |
Semtech Corporation |
Semiconductor package for providing mechanical isolation of assembled diodes
|
US11518080B2
(en)
|
2018-10-16 |
2022-12-06 |
3M Innovative Properties Company |
Methods of making extensible barrier films
|
KR102595566B1
(ko)
|
2018-10-31 |
2023-10-27 |
엘지디스플레이 주식회사 |
스트레쳐블 표시 장치
|
KR102519417B1
(ko)
|
2018-11-28 |
2023-04-10 |
삼성디스플레이 주식회사 |
스트레처블 표시 장치
|
CN114041054B
(zh)
*
|
2018-11-28 |
2023-06-27 |
深圳华大智造科技股份有限公司 |
用于集成生物芯片的系统和方法
|
CN109587970B
(zh)
*
|
2018-12-10 |
2020-12-01 |
福建鸿博光电科技有限公司 |
一种灯珠焊接方法
|
US11340530B2
(en)
*
|
2018-12-14 |
2022-05-24 |
Xia Tai Xin Semiconductor (Qing Dao) Ltd. |
Implanting method and apparatus
|
KR102650478B1
(ko)
*
|
2018-12-14 |
2024-03-25 |
에이지씨 가부시키가이샤 |
유리기판 지지용 코팅직물의 제조방법
|
RU2719733C1
(ru)
*
|
2018-12-26 |
2020-04-22 |
Автономная некоммерческая образовательная организация высшего образования «Сколковский институт науки и технологий» (Сколковский институт науки и технологий) |
Эластичная электрическая схема и способ ее изготовления
|
CN109686842B
(zh)
*
|
2018-12-26 |
2022-10-14 |
厦门天马微电子有限公司 |
一种可拉伸柔性显示面板及显示装置
|
CN109817094B
(zh)
*
|
2019-01-08 |
2021-04-23 |
云谷(固安)科技有限公司 |
可拉伸显示结构以及显示装置
|
KR20210104742A
(ko)
|
2019-01-14 |
2021-08-25 |
인벤사스 본딩 테크놀로지스 인코포레이티드 |
접합 구조체
|
WO2020149796A1
(en)
*
|
2019-01-16 |
2020-07-23 |
National University Of Singapore |
A stretchable interconnect structure and method of fabricating the same
|
US10748793B1
(en)
|
2019-02-13 |
2020-08-18 |
X Display Company Technology Limited |
Printing component arrays with different orientations
|
CN109704268A
(zh)
*
|
2019-02-21 |
2019-05-03 |
厦门大学 |
一种可拉伸电子干扰变形免疫基材
|
CN111613130B
(zh)
*
|
2019-02-25 |
2022-03-11 |
昆山工研院新型平板显示技术中心有限公司 |
显示基板及其制作方法、显示面板
|
US20200296840A1
(en)
*
|
2019-03-13 |
2020-09-17 |
OSI Electronics, Inc. |
Folded Multilayered Flexible Circuit Board and Methods of Manufacturing Thereof
|
CN111724676B
(zh)
*
|
2019-03-21 |
2022-09-02 |
昆山工研院新型平板显示技术中心有限公司 |
可拉伸导线及其制作方法和显示装置
|
US11751337B2
(en)
|
2019-04-26 |
2023-09-05 |
Honda Motor Co., Ltd. |
Wireless power of in-mold electronics and the application within a vehicle
|
US11630007B2
(en)
*
|
2019-06-24 |
2023-04-18 |
Clemson University |
Graphene/polymer heterostructure-based flexible and biocompatible pressure/strain sensor
|
US11296053B2
(en)
|
2019-06-26 |
2022-04-05 |
Invensas Bonding Technologies, Inc. |
Direct bonded stack structures for increased reliability and improved yield in microelectronics
|
CN111798751B
(zh)
*
|
2019-07-24 |
2022-02-25 |
友达光电股份有限公司 |
显示装置
|
CN114270508A
(zh)
*
|
2019-08-23 |
2022-04-01 |
塞尔法雷公司 |
拉伸受体衬底以调节组件的布置的方法及系统
|
KR20210025417A
(ko)
*
|
2019-08-27 |
2021-03-09 |
엘지디스플레이 주식회사 |
스트레쳐블 표시 장치
|
CN110581206A
(zh)
*
|
2019-09-18 |
2019-12-17 |
中南大学 |
一种GaN基Micro-LED及其制备方法
|
CN110649181B
(zh)
*
|
2019-10-08 |
2022-04-26 |
京东方科技集团股份有限公司 |
显示基板、显示装置以及显示基板的制备方法
|
US11147169B2
(en)
*
|
2019-11-04 |
2021-10-12 |
Sharp Kabushiki Kaisha |
Impact absorbing element for display device
|
TWI731517B
(zh)
|
2019-12-18 |
2021-06-21 |
財團法人工業技術研究院 |
軟性混合電子系統及降低此軟性混合電子系統衝擊的方法
|
CN111047991B
(zh)
*
|
2019-12-23 |
2021-12-07 |
厦门天马微电子有限公司 |
一种显示面板、显示装置及其制作方法
|
KR102257552B1
(ko)
*
|
2019-12-24 |
2021-05-27 |
한국세라믹기술원 |
다중 팁 기반 패턴 인쇄 장치의 제조방법
|
US11513085B2
(en)
*
|
2020-02-20 |
2022-11-29 |
Kla Corporation |
Measurement and control of wafer tilt for x-ray based metrology
|
CN111310346B
(zh)
*
|
2020-02-24 |
2021-11-30 |
浙江大学 |
考虑尺寸参数的碳纳米管在复合材料中破坏模式的判断方法
|
CN113497076A
(zh)
*
|
2020-04-01 |
2021-10-12 |
深圳市柔宇科技有限公司 |
显示面板及电子设备
|
WO2021210828A1
(ko)
*
|
2020-04-17 |
2021-10-21 |
한국과학기술원 |
소재고유형 스트레쳐블 유기태양전지, 그의 제조방법 및 그를 포함한 전자장치
|
KR102337109B1
(ko)
*
|
2020-04-17 |
2021-12-10 |
한국과학기술원 |
소재고유형 스트레쳐블 유기태양전지, 그의 제조방법 및 그를 포함한 전자장치
|
CN111462637B
(zh)
*
|
2020-05-29 |
2022-07-01 |
上海天马微电子有限公司 |
一种显示面板和显示装置
|
US11631647B2
(en)
|
2020-06-30 |
2023-04-18 |
Adeia Semiconductor Bonding Technologies Inc. |
Integrated device packages with integrated device die and dummy element
|
WO2022027143A1
(en)
*
|
2020-08-06 |
2022-02-10 |
Curiato Inc. |
System and method for modular flexible sensing array system
|
CN111986572B
(zh)
*
|
2020-08-07 |
2022-04-08 |
武汉华星光电半导体显示技术有限公司 |
一种可折叠显示装置
|
US11728273B2
(en)
|
2020-09-04 |
2023-08-15 |
Adeia Semiconductor Bonding Technologies Inc. |
Bonded structure with interconnect structure
|
US11764177B2
(en)
|
2020-09-04 |
2023-09-19 |
Adeia Semiconductor Bonding Technologies Inc. |
Bonded structure with interconnect structure
|
KR20230095880A
(ko)
|
2020-10-29 |
2023-06-29 |
도꾜 다이가꾸 |
반도체 장치 및 그 제조 방법
|
WO2022120227A1
(en)
*
|
2020-12-03 |
2022-06-09 |
Cummins Inc. |
Enclosure assemblies, and related devices and methods
|
US11772760B2
(en)
|
2020-12-11 |
2023-10-03 |
William T. Myslinski |
Smart wetsuit, surfboard and backpack system
|
CN112504302A
(zh)
*
|
2020-12-15 |
2021-03-16 |
南京工业职业技术大学 |
一种磁吸附转移的氮化镓基柔性差分式无栅生物传感器
|
KR20220097772A
(ko)
*
|
2020-12-31 |
2022-07-08 |
삼성디스플레이 주식회사 |
표시 패널, 이를 구비한 표시 장치, 및 표시 패널의 제조방법
|
KR20220097283A
(ko)
|
2020-12-31 |
2022-07-07 |
경희대학교 산학협력단 |
셀룰로스 종이 광 센서
|
US11693451B2
(en)
*
|
2021-01-19 |
2023-07-04 |
Samsung Display Co., Ltd. |
Digitizer and display device including the same
|
CN113263236B
(zh)
*
|
2021-04-29 |
2023-03-21 |
四川航天燎原科技有限公司 |
一种插针网格阵列封装元器件pga解焊工艺方法
|
WO2022251636A1
(en)
*
|
2021-05-27 |
2022-12-01 |
Georgia Tech Research Corporation |
Strain-isolated soft bioelectronics for wearable sensor devices
|
CN113453421B
(zh)
*
|
2021-06-22 |
2022-11-01 |
浙江清华柔性电子技术研究院 |
具有磁电复合接口的复合电路板
|
KR102622042B1
(ko)
*
|
2021-07-20 |
2024-01-09 |
한국과학기술원 |
3차원 형상을 갖는 단단한 아일랜드 패턴을 이용한 신축성 전자 소자 플랫폼 및 그 제작 방법
|
US11729869B2
(en)
|
2021-10-13 |
2023-08-15 |
Anand Deo |
Conformable polymer for frequency-selectable heating locations
|