JP6578562B2 - 無機及び有機の過渡電子デバイス - Google Patents
無機及び有機の過渡電子デバイス Download PDFInfo
- Publication number
- JP6578562B2 JP6578562B2 JP2016507672A JP2016507672A JP6578562B2 JP 6578562 B2 JP6578562 B2 JP 6578562B2 JP 2016507672 A JP2016507672 A JP 2016507672A JP 2016507672 A JP2016507672 A JP 2016507672A JP 6578562 B2 JP6578562 B2 JP 6578562B2
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- JP
- Japan
- Prior art keywords
- electronic device
- layer
- substrate
- transient
- inorganic
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/68—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient
- A61B5/6846—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be brought in contact with an internal body part, i.e. invasive
- A61B5/6847—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be brought in contact with an internal body part, i.e. invasive mounted on an invasive device
- A61B5/686—Permanently implanted devices, e.g. pacemakers, other stimulators, biochips
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- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
- A61M5/00—Devices for bringing media into the body in a subcutaneous, intra-vascular or intramuscular way; Accessories therefor, e.g. filling or cleaning devices, arm-rests
- A61M5/44—Devices for bringing media into the body in a subcutaneous, intra-vascular or intramuscular way; Accessories therefor, e.g. filling or cleaning devices, arm-rests having means for cooling or heating the devices or media
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H05K1/03—Use of materials for the substrate
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H—ELECTRICITY
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Description
上式において、tcは臨界時間であり、ρmは材料の質量密度であり、M(H2O)は水のモル質量であり、M(m)は材料のモル質量であり、h0は材料の初期厚さであり、Dは水の拡散率であり、kは溶解反応の反応定数であり、w0は水の初期濃度であり、ここでkは1×105s−1〜1×10−10s−1の範囲から選択された値を有する。
実施例1 過渡的なエレクトロニクス向けの無機基板及び封入層
背景及び動機
基板及び封入層としての無機材料に関する溶解速度
二酸化ケイ素(SiO2)の析出及び成長層
金属(Mg、Mg合金、Fe、W及びZn)から成るバルク箔及び薄膜コーティング
過渡的なエレクトロニクス向けの無機基板構造
無機基板及び封入材に基づいた過渡的なエレクトロニクスに関する立証手段
1. S.-W. Hwang, H. Tao, D.-H. Kim, H.Cheng, J.-K. Song, E. Rill, M.A. Brenckle, B. Panilaitis, S.M. Won, Y.-S. Kim,Y.M. Song, K.J. Yu, A. Ameen, R. Li, Y. Su, M. Yang, D.L. Kaplan, M.R. Zakin,M.J. Slepian, Y. Huang, F.G. Omenetto and J.A. Rogers, “A Physically TransientForm of Silicon Electronics,” Science 337, 1640-1644 (2012).
2. R. Li,H. Cheng, Y. Su, S.-W. Hwang, L. Yin, H. Tao, M.A. Brenckle, D.-H. Kim, F.G.Omenetto, J.A. Rogers and Y. Huang, “An Analytical Model ofReactive Diffusion for Transient Electronics,” AdvancedFunctional Materials, ASAP (2013). DOI: 10.1002/adfm.201203088
実施例2 過渡的なエレクトロニクス向けの無機基板及び封入層
[1] K.G. Knauss & T.J. Wolery, Geochim.Cosmochim. Acta 52, 43-53 (1998). W.A. House & L.A. Hickinbotham, J.Chem. Soc. Faraday, Trans. 88, 2021-2026 (1992).[2] E. Laarz et al., J. Am. Ceram. Soc. 83,2394-2400 (2000). Toxicological Profile for Ammonia, published by theU.S. Department of Health and Human Services, ATSDR (2004).
実施例3 過渡的なエレクトロニクスにおける酸化ケイ素及び窒化物の溶解挙動及び用途
背景及び動機
導入
異なるタイプの酸化物に関する溶解スタディ
様々なクラスの窒化物に関する溶解スタディ
無機層による封入方式
結論
実験上の選択
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[14] C. Dagdeviren, S.-W. Hwang, Y. Su, S. Kim,H. Cheng, O. Gur, R. Haney, F.G. Omenetto, Y. Huang, J.A. Rogers, Small 2013,9, 3398.
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[16] W. A. House, L. A. Hickinbotham, J. Chem.Soc. FARADAY Trans. 1992, 88, 2021.
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実施例4 過渡封入向けのポリ無水物
援用及び変形例に関する記述
Claims (28)
- 基板と、
前記基板により支持された1つ又は複数の能動又は受動電子デバイスコンポーネントであり、溶媒に溶解可能な材料を単独で含んだ1つ又は複数の能動又は受動電子デバイスコンポーネントと、
前記1つ又は複数の能動又は受動電子デバイスコンポーネントを少なくとも部分的に封入する封入材層と、
を備えた過渡電子デバイスであって、
前記基板及び前記封入材層が、外部刺激に反応して選択的に除去可能な無機材料であって、溶媒に溶解可能な無機材料を単独で含み、
前記刺激は、前記溶媒への曝露であり、
前記溶媒への前記曝露が、前記基板、前記封入材層又はこれら両者の少なくとも部分的な除去を開始させ、
前記外部刺激に応答した前記基板、前記封入材層又はこれら両者の少なくとも部分的な除去が前記外部刺激に応答して事前選択の時点又は事前選択の速度で前記過渡電子デバイスのプログラム可能な変態をもたらす前記1つ又は複数の能動又は受動電子デバイスコンポーネントの少なくとも部分的な変態を開始させ、前記プログラム可能な変態が前記過渡電子デバイスの第1の条件から第2の条件への機能の変化をもたらし、
前記基板、前記封入材層又はこれら両者の前記少なくとも部分的な除去が前記1つ又は複数の能動又は受動電子デバイスコンポーネントを前記外部刺激に対して曝露させ、これにより前記1つ又は複数の能動又は受動電子デバイスコンポーネントの前記少なくとも部分的な変態を開始させている、過渡電子デバイス。 - 前記1つ又は複数の能動又は受動電子デバイスコンポーネントが、1つ若しくは複数の無機半導体コンポーネント、1つ若しくは複数の金属導体コンポーネント、又は1つ若しくは複数の無機半導体コンポーネント及び1つ若しくは複数の金属導体コンポーネントを備えた、請求項1に記載の過渡電子デバイス。
- 前記基板及び前記封入材層が全体的に無機の構造又は無機と有機の複合構造を単独で含む、請求項1又は2に記載の過渡電子デバイス。
- 前記全体的に無機の構造が、SiO2、スピンオンガラス、Mg、Mg合金、Fe、W、Zn、Mo、Si、SiGe、Si3N4及びMgOのうちの1つ又は複数を含む、請求項3に記載の過渡電子デバイス。
- 前記無機と有機の複合構造が、前記能動又は受動電子デバイスコンポーネントに隣接する第1の表面と有機層に隣接する第2の表面とを有する無機層を含む、又は、前記能動又は受動電子デバイスコンポーネントに隣接する第1の表面と前記無機層に隣接する第2の表面とを有する有機層を含む、請求項3に記載の過渡電子デバイス。
- 前記無機層が、SiO2、スピンオンガラス、Mg、Mg合金、Fe、W、Zn、Mo、Si、SiGe、Si3N4及びMgOのうちの1つ又は複数を含み、且つ前記有機層が、ポリ無水物及びポリ(ジメチルシロキサン)(PDMS)のうちの1つ又は複数を含む、請求項5に記載の過渡電子デバイス。
- 前記デバイスが全体的に無機のデバイスであり、前記能動又は受動電子デバイスコンポーネント、前記基板及び前記封入材層がそれぞれ、単独で全体的に1つ又は複数の無機材料から構成される、請求項1〜4のいずれか一項に記載の過渡電子デバイス。
- 前記基板、前記封入材層又はこれら両者が、前記外部刺激に応答して事前選択の過渡性プロファイルを単独で有する、請求項1〜7のいずれか一項に記載の過渡電子デバイス。
- 前記基板、前記封入材層又はこれら両者の前記選択的に除去可能な無機材料が、金属、金属酸化物、セラミック、これらの組み合わせ、結晶質材料、非晶質材料、これらの組み合わせ、単結晶材料、多結晶材料、ドープした結晶質材料、ガラス、薄膜、コーティング、箔、これらの任意の組み合わせ、ナノ構造層又はマイクロ構造層を単独で含む、請求項1〜8のいずれか一項に記載の過渡電子デバイス。
- 前記基板、前記封入材層又はこれら両者の前記選択的に除去可能な無機材料が、Mg、W、Mo、Fe、Zn、その合金、SiO2、MgO、N4Si3又はSiC、スピンオンガラス、溶液処理可能なガラス、生体適合性材料、生体不活性材料又は生体適合性材料と生体不活性材料の組み合わせを単独で含む、請求項1〜9のいずれか一項に記載の過渡電子デバイス。
- 前記基板、前記封入材層又はこれら両者が、前記選択的に除去可能な無機材料を含む1つ又は複数の薄膜、コーティング又は箔を含んだ多層構造を単独で含む、請求項1〜10のいずれか一項に記載の過渡電子デバイス。
- 前記基板、前記封入材層又はこれら両者が、多層形状を有する無機と有機の複合構造を単独で含む、請求項11に記載の過渡電子デバイス。
- 前記多層構造が、1つ又は複数の電気絶縁層、バリア層又はこれらの任意の組み合わせをさらに含み、
前記1つ又は複数の電気絶縁層又はバリア層が、前記1つ又は複数の薄膜、コーティング又は箔との物理的な接触、電気的な接触又はこれら両者によって設けられている、又は、
前記1つ又は複数の電気絶縁層又はバリア層が前記多層構造の外部層を含むか、或いは前記1つ又は複数の電気絶縁層又はバリア層が前記1つ又は複数の能動又は受動電子デバイスコンポーネントと物理的に接触又は電気的に接触して前記多層構造の内部層を含む、又は、
前記1つ又は複数の電気絶縁層又はバリア層が、ポリマー、絶縁セラミック、ガラス、SiO2、スピンオンガラス、MgO又はこれらの任意の組み合わせを含む、請求項11に記載の過渡電子デバイス。 - 前記多層構造が、第1の電気絶縁層又はバリア層と物理的に接触した第1の側面を有する金属箔又は金属薄膜を含み、
前記第1の電気絶縁層又はバリア層が前記多層構造の外部層であるか、或いは前記第1の電気絶縁層又はバリア層が前記能動又は受動電子デバイスコンポーネントと物理的に接触又は電気的に接触した前記多層構造の内部層である、又は、
前記第1の電気絶縁層又はバリア層が、ポリマー層若しくはコーティング、金属酸化物層若しくはコーティング、ガラス層若しくはコーティング、又はこれらの任意の組み合わせを含む、
前記多層構造が第2の電気絶縁層又はバリア層と接触してコーティングされた第2の側面を有する前記金属箔又は金属薄膜を含む、又は、
前記金属箔又は金属薄膜が前記第1の電気絶縁層又はバリア層と前記第2の電気絶縁層又はバリア層の間に設けられている、請求項11に記載の過渡電子デバイス。 - 前記基板及び前記封入材層が、1ms〜5年の範囲から選択された時間間隔にわたる前記基板又は前記封入材層の0.01%〜100%の除去によって特徴付けられる、又は、0.01nm/日〜100ミクロンs−1の範囲で選択された速度で前記基板又は前記封入材層の平均厚さを低減することによって特徴付けられる事前選択の過渡性プロファイルを単独で有する、請求項1〜14のいずれか一項に記載の過渡電子デバイス。
- 前記基板及び前記封入材層が、前記外部刺激に応答した前記基板、前記封入材層又はこれら両者の前記少なくとも部分的な除去に先立って、0.01%〜99.9%の範囲から選択された多孔率、0.01%〜100%の範囲から選択された結晶度、又は、バルクと比較して0.01%〜100%の範囲から選択された密度を単独で有する、請求項1〜15のいずれか一項に記載の過渡電子デバイス。
- 前記選択的に除去可能な無機材料の厚さがゼロに至るまでの時間が次式によって提供され、
上式において、tcは臨界時間であり、ρmは材料の質量密度であり、M(H2O)は水のモル質量であり、M(m)は材料のモル質量であり、h0は材料の初期厚さであり、Dは水の拡散率であり、kは溶解反応の反応定数であり、w0は水の初期濃度であり、ここでkは1×105s−1〜1×10−10s−1の範囲から選択された値を有する、請求項1〜16のいずれか一項に記載の過渡電子デバイス。 - 前記基板、前記封入材層又はこれら両者が、前記外部刺激に応答した前記基板、前記封入材層又はこれら両者の前記少なくとも部分的な除去に先立って、水に対して実質的に不浸透性である、周囲に対する正味漏れ電流を0.1μA/cm2以下に制限している、又は、水性又は非水性溶媒に曝露されたときに10%以下の体積増加を受ける、請求項1〜17のいずれか一項に記載の過渡電子デバイス。
- 前記薄膜、コーティング又は箔が、前記外部刺激に応答した前記基板、前記封入材層又はこれら両者の前記少なくとも部分的な除去に先立って、前記1つ又は複数の能動又は受動電子デバイスコンポーネントの上又は下に1000μm以下の平均厚さを有する、請求項11に記載の過渡電子デバイス。
- 前記基板、前記封入材層又はこれら両者が、前記外部刺激に応答した前記基板、前記封入材層又はこれら両者の前記少なくとも部分的な除去に先立って、0.1μm〜1000μmの範囲から選択された厚さ、0.5KPa〜10TPaの範囲で選択される平均ヤング率、1×10−4Nm以下の正味撓み剛性、又は、1×108GPaμm4以下の正味曲げ剛性を単独で有する、請求項1〜19のいずれか一項に記載の過渡電子デバイス。
- 前記基板、前記封入材層又はこれら両者が、電磁波スペクトルの可視光領域又は赤外光領域において少なくとも部分的に光学的に透明である、請求項1〜20のいずれか一項に記載の過渡電子デバイス。
- 前記基板、前記封入材層又はこれら両者が、物理的気相成長、化学的気相成長、スパッタリング、原子層堆積、電気化学析出、スピンキャスティング、電気流体力学的ジェット式印刷、スクリーン印刷、又はこれらの任意の組み合わせを介して作成されている、請求項1〜21のいずれか一項に記載の過渡電子デバイス。
- 前記基板、前記封入材層又はこれら両者が、前記1つ又は複数の能動又は受動電子デバイスコンポーネントの外部面積又は内部面積に関して1%〜100%の範囲から選択された百分率をカバーする又は百分率に対応する、又は、
前記基板、前記封入材層又はこれら両者が、前記1つ又は複数の能動又は受動電子デバイスコンポーネントの外部面積又は内部面積に関する10%以上をカバーする又は10%以上に対応する、請求項1〜22のいずれか一項に記載の過渡電子デバイス。 - 前記1つ又は複数の無機半導体コンポーネントが、多結晶半導体材料、単結晶半導体材料、ドープした多結晶若しくは単結晶半導体材料、Si、Ga、GaAs、ZnO又はこれらの任意の組み合わせを含む、請求項2に記載の過渡電子デバイス。
- 前記1つ又は複数の金属導体コンポーネントが、Mg、W、Mo、Fe、Zn又はその合金を含む、請求項2に記載の過渡電子デバイス。
- 前記1つ若しくは複数の無機半導体コンポーネント、1つ若しくは複数の金属導体コンポーネント、又はこれら両者が、トランジスタ、ダイオード、増幅器、マルチプレクサ、発光ダイオード、レーザ、フォトダイオード、集積回路、センサ、温度センサ、電気化学セル、サーミスタ、ヒータ、抵抗性ヒータ、アンテナ、電池、エネルギー蓄積システム、アクチュエータ、ナノエレクトロメカニカルシステム若しくはマイクロエレクトロメカニカルシステム、及びアクチュエータやそのアレイから成る群より選択される電子デバイスのコンポーネントを備える、請求項2に記載の過渡電子デバイス。
- 前記デバイスが、通信システム、フォトニックデバイス、センサ、光電子デバイス、バイオメディカルデバイス、温度センサ、光検出器、光起電力デバイス、ひずみゲージ、撮像システム、ワイヤレス送信機、電気化学セル、アンテナ、電池、エネルギー蓄積システム、アクチュエータ、ナノエレクトロメカニカルシステム又はマイクロエレクトロメカニカルシステムである、請求項1〜26のいずれか一項に記載の過渡電子デバイス。
- 基板と、
前記基板により支持された1つ又は複数の能動又は受動電子デバイスコンポーネントであり、溶媒に溶解可能な材料を単独で含んだ1つ又は複数の能動又は受動電子デバイスコンポーネントと、
前記1つ又は複数の能動又は受動電子デバイスコンポーネントを少なくとも部分的に封入する封入材層と、
を備えた過渡電子デバイスであり、
前記基板及び前記封入材層が、外部刺激に反応して選択的に除去可能な無機材料であって、溶媒に溶解可能な無機材料を単独で含み、
前記刺激は、前記溶媒への曝露であり、
前記溶媒への前記曝露が、前記基板、前記封入材層又はこれら両者の少なくとも部分的な除去を開始させ、
前記外部刺激に応答した前記基板、前記封入材層又はこれら両者の少なくとも部分的な除去が前記外部刺激に応答して事前選択の時点又は事前選択の速度で前記過渡電子デバイスのプログラム可能な変態をもたらす前記1つ又は複数の能動又は受動電子デバイスコンポーネントの少なくとも部分的な変態を開始させ、前記プログラム可能な変態が前記過渡電子デバイスの第1の条件から第2の条件への機能の変化をもたらす、過渡電子デバイスを用意するステップと、
前記1つ又は複数の能動又は受動電子デバイスコンポーネントを前記外部刺激に対して曝露させ、これにより前記過渡電子デバイスの前記プログラム可能な変態をもたらすような前記基板又は封入材層の前記少なくとも部分的な除去がもたらされるように前記過渡電子デバイスを前記外部刺激に対して曝露させるステップと、
を含む過渡電子デバイスを用いる方法。
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WO2014169218A3 (en) | 2015-02-26 |
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