DE69737375D1 - Verfahren zur Befestigung eines elektronischen Bauteils auf einer Leiterplatte und System zum Ausführen des Verfahrens - Google Patents
Verfahren zur Befestigung eines elektronischen Bauteils auf einer Leiterplatte und System zum Ausführen des VerfahrensInfo
- Publication number
- DE69737375D1 DE69737375D1 DE69737375T DE69737375T DE69737375D1 DE 69737375 D1 DE69737375 D1 DE 69737375D1 DE 69737375 T DE69737375 T DE 69737375T DE 69737375 T DE69737375 T DE 69737375T DE 69737375 D1 DE69737375 D1 DE 69737375D1
- Authority
- DE
- Germany
- Prior art keywords
- mounting
- carrying
- circuit board
- printed circuit
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP35073896 | 1996-12-27 | ||
JP35073896 | 1996-12-27 |
Publications (2)
Publication Number | Publication Date |
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DE69737375D1 true DE69737375D1 (de) | 2007-03-29 |
DE69737375T2 DE69737375T2 (de) | 2007-11-29 |
Family
ID=18412526
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69737375T Expired - Lifetime DE69737375T2 (de) | 1996-12-27 | 1997-12-26 | Verfahren zur Befestigung eines elektronischen Bauteils auf einer Leiterplatte und System zum Ausführen des Verfahrens |
Country Status (6)
Country | Link |
---|---|
US (1) | US6981317B1 (de) |
EP (4) | EP1448033A1 (de) |
JP (3) | JP3150347B2 (de) |
KR (1) | KR100384314B1 (de) |
DE (1) | DE69737375T2 (de) |
WO (1) | WO1998030073A1 (de) |
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-
1997
- 1997-12-26 EP EP04011178A patent/EP1448033A1/de not_active Ceased
- 1997-12-26 US US09/331,763 patent/US6981317B1/en not_active Expired - Fee Related
- 1997-12-26 JP JP52985998A patent/JP3150347B2/ja not_active Expired - Lifetime
- 1997-12-26 KR KR10-1999-7005885A patent/KR100384314B1/ko not_active IP Right Cessation
- 1997-12-26 EP EP04011180A patent/EP1448034A1/de not_active Ceased
- 1997-12-26 DE DE69737375T patent/DE69737375T2/de not_active Expired - Lifetime
- 1997-12-26 WO PCT/JP1997/004873 patent/WO1998030073A1/ja active IP Right Grant
- 1997-12-26 EP EP97950421A patent/EP0954208A4/de not_active Ceased
- 1997-12-26 EP EP04011179A patent/EP1445995B1/de not_active Expired - Lifetime
-
2000
- 2000-05-26 JP JP2000156287A patent/JP3927759B2/ja not_active Expired - Fee Related
- 2000-05-26 JP JP2000156304A patent/JP3880775B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1445995B1 (de) | 2007-02-14 |
WO1998030073A1 (en) | 1998-07-09 |
JP2001024034A (ja) | 2001-01-26 |
JP2001007159A (ja) | 2001-01-12 |
JP3880775B2 (ja) | 2007-02-14 |
KR100384314B1 (ko) | 2003-05-16 |
EP1445995A1 (de) | 2004-08-11 |
EP1448034A1 (de) | 2004-08-18 |
JP3927759B2 (ja) | 2007-06-13 |
JP3150347B2 (ja) | 2001-03-26 |
EP1448033A1 (de) | 2004-08-18 |
DE69737375T2 (de) | 2007-11-29 |
KR20000062375A (ko) | 2000-10-25 |
US6981317B1 (en) | 2006-01-03 |
EP0954208A4 (de) | 2002-09-11 |
EP0954208A1 (de) | 1999-11-03 |
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Owner name: PANASONIC CORP., KADOMA, OSAKA, JP |