DE69113679D1 - Verfahren und Bauteil zum Montieren von Bauelementen auf einer Leiterplatte. - Google Patents

Verfahren und Bauteil zum Montieren von Bauelementen auf einer Leiterplatte.

Info

Publication number
DE69113679D1
DE69113679D1 DE69113679T DE69113679T DE69113679D1 DE 69113679 D1 DE69113679 D1 DE 69113679D1 DE 69113679 T DE69113679 T DE 69113679T DE 69113679 T DE69113679 T DE 69113679T DE 69113679 D1 DE69113679 D1 DE 69113679D1
Authority
DE
Germany
Prior art keywords
component
circuit board
printed circuit
mounting components
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69113679T
Other languages
English (en)
Other versions
DE69113679T2 (de
Inventor
Shigeru Kamei
Yoshimi Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE69113679D1 publication Critical patent/DE69113679D1/de
Publication of DE69113679T2 publication Critical patent/DE69113679T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10401—Eyelets, i.e. rings inserted into a hole through a circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10916—Terminals having auxiliary metallic piece, e.g. for soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DE69113679T 1990-05-31 1991-05-31 Verfahren und Bauteil zum Montieren von Bauelementen auf einer Leiterplatte. Expired - Fee Related DE69113679T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2144920A JPH0437087A (ja) 1990-05-31 1990-05-31 印刷配線板装置並びにその装置に用いるハトメ及びその取付け方法

Publications (2)

Publication Number Publication Date
DE69113679D1 true DE69113679D1 (de) 1995-11-16
DE69113679T2 DE69113679T2 (de) 1996-03-21

Family

ID=15373307

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69113679T Expired - Fee Related DE69113679T2 (de) 1990-05-31 1991-05-31 Verfahren und Bauteil zum Montieren von Bauelementen auf einer Leiterplatte.

Country Status (4)

Country Link
US (1) US5281770A (de)
EP (1) EP0459831B1 (de)
JP (1) JPH0437087A (de)
DE (1) DE69113679T2 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06203894A (ja) * 1992-12-29 1994-07-22 Funai Electric Co Ltd 電気接続端子
JPH07202063A (ja) * 1993-12-28 1995-08-04 Toshiba Corp セラミックス回路基板
US5596178A (en) * 1995-10-12 1997-01-21 Christian; Suzanne single replacement pad with perforated shaft for the repair of printed circuit boards
DE19757719C2 (de) * 1997-12-23 2001-08-16 Delphi Automotive Systems Gmbh Verfahren und Vorrichtung zum Verbinden von flexiblen gedruckten Schaltungen
GB9828490D0 (en) * 1998-12-23 1999-02-17 Lucas Ind Plc Printed circuit device
JP2000245034A (ja) * 1999-02-24 2000-09-08 Sumitomo Wiring Syst Ltd 配線板組立体
JP3751472B2 (ja) * 1999-05-27 2006-03-01 Ｎｅｃディスプレイソリューションズ株式会社 両面パターン導通用板金部品及びプリント配線板
JP2001135906A (ja) * 1999-11-05 2001-05-18 Yazaki Corp 配線板の電気部品接続構造
US6617520B1 (en) * 2000-08-30 2003-09-09 Heatron, Inc. Circuit board
US20060216135A1 (en) * 2005-03-28 2006-09-28 Suzanne Marchesano Decorative eyelet
KR100843388B1 (ko) * 2006-08-31 2008-07-03 삼성전기주식회사 접속부를 구비한 회로기판
WO2008139563A1 (ja) * 2007-05-07 2008-11-20 Fujitsu Limited 電子装置及びその製造方法、当該電子装置を有する電子機器
CN101437360B (zh) * 2007-11-12 2011-12-21 富葵精密组件(深圳)有限公司 柔性电路基板、柔性电路基板的制作方法及固定方法
DE102008005547B4 (de) 2008-01-23 2013-08-29 Infineon Technologies Ag Leistungshalbleitermodul und Schaltungsanordnung mit einem Leistungshalbleitermodul
TWI449136B (zh) * 2011-04-20 2014-08-11 Cyntec Co Ltd 金屬芯印刷電路板及電子封裝結構
TWI451817B (zh) * 2011-05-26 2014-09-01 豐田自動織機股份有限公司 配線板及配線板的製造方法
JP2014086401A (ja) * 2012-10-26 2014-05-12 Toshiba Lighting & Technology Corp 発光装置
CN108337817A (zh) * 2017-01-20 2018-07-27 台达电子工业股份有限公司 电子装置和连接方法
GB2566943B (en) * 2017-09-25 2020-09-02 Ge Aviat Systems Ltd Surface mount connector and method of forming a printed circuit board
DE102019104318C5 (de) 2019-02-20 2023-06-22 Auto-Kabel Management Gmbh Elektrischer Leiter sowie Verfahren zur Herstellung eines elektrischen Leiters
DE102020209840A1 (de) * 2020-08-05 2022-02-10 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines Kameramoduls, Kameramodul
CN116746290A (zh) * 2021-05-25 2023-09-12 三星电子株式会社 显示装置及其制造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3103547A (en) * 1963-09-10 ansley
US2915678A (en) * 1955-06-14 1959-12-01 Hughes Aircraft Co Electrical mounting devices
US3190953A (en) * 1961-06-15 1965-06-22 Martin Marietta Corp Channel flanged capillary eyelet for printed circuit boards
US3504328A (en) * 1968-01-03 1970-03-31 Berg Electronics Inc Circuit board eyelet
US3654583A (en) * 1970-06-22 1972-04-04 Berg Electronics Inc Circuit board eyelet
US5010448A (en) * 1987-12-18 1991-04-23 Alpine Electronics Inc. Printed circuit board
US4881906A (en) * 1988-02-25 1989-11-21 Helwett-Packard Company Method for obtaining electrical interconnect using a solderable mechanical fastener

Also Published As

Publication number Publication date
EP0459831A3 (en) 1993-01-27
US5281770A (en) 1994-01-25
DE69113679T2 (de) 1996-03-21
JPH0437087A (ja) 1992-02-07
EP0459831A2 (de) 1991-12-04
EP0459831B1 (de) 1995-10-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee