DE69104678T2 - Verfahren zur Montage von elektronischen Bauteilen auf einer Leiterplatte. - Google Patents

Verfahren zur Montage von elektronischen Bauteilen auf einer Leiterplatte.

Info

Publication number
DE69104678T2
DE69104678T2 DE69104678T DE69104678T DE69104678T2 DE 69104678 T2 DE69104678 T2 DE 69104678T2 DE 69104678 T DE69104678 T DE 69104678T DE 69104678 T DE69104678 T DE 69104678T DE 69104678 T2 DE69104678 T2 DE 69104678T2
Authority
DE
Germany
Prior art keywords
circuit board
printed circuit
electronic components
mounting electronic
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69104678T
Other languages
English (en)
Other versions
DE69104678D1 (de
Inventor
Jun Tamashima
Masatoshi Ide
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Publication of DE69104678D1 publication Critical patent/DE69104678D1/de
Application granted granted Critical
Publication of DE69104678T2 publication Critical patent/DE69104678T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/102—Using microwaves, e.g. for curing ink patterns or adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
DE69104678T 1990-09-06 1991-07-15 Verfahren zur Montage von elektronischen Bauteilen auf einer Leiterplatte. Expired - Fee Related DE69104678T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2234421A JPH0828565B2 (ja) 1990-09-06 1990-09-06 電子部品のプリント基板への搭載方法

Publications (2)

Publication Number Publication Date
DE69104678D1 DE69104678D1 (de) 1994-11-24
DE69104678T2 true DE69104678T2 (de) 1995-05-24

Family

ID=16970758

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69104678T Expired - Fee Related DE69104678T2 (de) 1990-09-06 1991-07-15 Verfahren zur Montage von elektronischen Bauteilen auf einer Leiterplatte.

Country Status (5)

Country Link
US (1) US5102030A (de)
EP (1) EP0473911B1 (de)
JP (1) JPH0828565B2 (de)
KR (1) KR950000400B1 (de)
DE (1) DE69104678T2 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5320250A (en) * 1991-12-02 1994-06-14 Asymptotic Technologies, Inc. Method for rapid dispensing of minute quantities of viscous material
US5447267A (en) * 1993-02-08 1995-09-05 Matsushita Electric Industrial Co., Ltd. Method of soldering electronic part using a bond for tacking the electronic part
US5992729A (en) * 1996-10-02 1999-11-30 Mcnc Tacking processes and systems for soldering
AU1123300A (en) 1998-10-16 2000-05-08 Micro Robotics Systems, Inc. Dispensing apparatus
KR100357961B1 (ko) * 2000-08-04 2002-10-25 삼성에스디아이 주식회사 아크릴 에멀젼의 합성방법
US7637415B2 (en) 2005-10-31 2009-12-29 General Electric Company Methods and apparatus for assembling a printed circuit board
WO2007122442A1 (en) * 2006-04-25 2007-11-01 Cl Inspiration Llc Dispenser for adhesive materials in liquid form
EP3071006B1 (de) * 2013-11-11 2019-12-25 FUJI Corporation Substratverarbeitungsvorrichtung und abgabekopf
CN114424688B (zh) * 2019-09-24 2023-10-27 株式会社富士 干燥装置及干燥方法
US20220108930A1 (en) * 2020-10-07 2022-04-07 Murata Manufacturing Co., Ltd. Electronic component with metallic cap

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3707944A (en) * 1970-10-23 1973-01-02 Ibm Automatic photoresist apply and dry apparatus
US3723223A (en) * 1971-01-11 1973-03-27 Nat Starch Chem Corp Heat curing adhesive
US3717543A (en) * 1971-01-13 1973-02-20 Rexham Corp Laminations of polyimide films to like films and/or to metal foils
US3963551A (en) * 1974-03-05 1976-06-15 Stromberg-Carlson Corporation Method for bonding semiconductor chips
JPS55110097A (en) * 1979-02-19 1980-08-25 Matsushita Electric Ind Co Ltd Method of mounting electronic part
US5037700A (en) * 1981-01-19 1991-08-06 National Starch And Chemical Investment Holding Corporation Flexible laminates
US4398660A (en) * 1981-06-04 1983-08-16 Rca Corporation Method of mounting electronic components
GB2147148A (en) * 1983-09-27 1985-05-01 John Patrick Burke Electronic circuit assembly
EP0171466A1 (de) * 1984-07-24 1986-02-19 Siemens Aktiengesellschaft Verfahren zum Übertragen von Klebstoff auf einen Chipträger und Vorrichtung zur Durchfürung des Verfahrens
US4695508A (en) * 1985-09-06 1987-09-22 The Yokohama Rubber Co., Ltd. Adhesive composition
DE3537125A1 (de) * 1985-10-18 1987-04-23 Philips Patentverwaltung Verfahren und vorrichtung zum aufbringen kleiner tropfenfoermiger klebstoffmengen auf ein werkstueck
US4761881A (en) * 1986-09-15 1988-08-09 International Business Machines Corporation Single step solder process
JPH0793484B2 (ja) * 1986-09-19 1995-10-09 松下電器産業株式会社 プリント配線基板
JPH0787277B2 (ja) * 1987-03-25 1995-09-20 ティーディーケイ株式会社 表面実装部品の基板搭載方法
JPS63296391A (ja) * 1987-05-28 1988-12-02 Matsushita Electric Ind Co Ltd 印刷配線基板への部品取付方法
JPH01190779A (ja) * 1988-01-26 1989-07-31 Cemedine Co Ltd アクリル系接着剤組成物

Also Published As

Publication number Publication date
US5102030A (en) 1992-04-07
KR950000400B1 (ko) 1995-01-16
EP0473911A3 (en) 1993-01-27
JPH04116890A (ja) 1992-04-17
DE69104678D1 (de) 1994-11-24
EP0473911B1 (de) 1994-10-19
JPH0828565B2 (ja) 1996-03-21
KR930003794A (ko) 1993-02-24
EP0473911A2 (de) 1992-03-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee