KR930003794A - 전자 부품의 프린트 기판에의 탑재 방법 - Google Patents

전자 부품의 프린트 기판에의 탑재 방법 Download PDF

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Publication number
KR930003794A
KR930003794A KR1019910012460A KR910012460A KR930003794A KR 930003794 A KR930003794 A KR 930003794A KR 1019910012460 A KR1019910012460 A KR 1019910012460A KR 910012460 A KR910012460 A KR 910012460A KR 930003794 A KR930003794 A KR 930003794A
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KR
South Korea
Prior art keywords
resin emulsion
modified resin
electronic component
mounting
acrylic modified
Prior art date
Application number
KR1019910012460A
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English (en)
Other versions
KR950000400B1 (ko
Inventor
준 라마시마
마사토시 이데
Original Assignee
사또 히로시
티이디이케이 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 사또 히로시, 티이디이케이 가부시기가이샤 filed Critical 사또 히로시
Publication of KR930003794A publication Critical patent/KR930003794A/ko
Application granted granted Critical
Publication of KR950000400B1 publication Critical patent/KR950000400B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/102—Using microwaves, e.g. for curing ink patterns or adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

내용 없음.

Description

전자 부품의 프린트 기판에의 탑재 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 전자부품의 프린트기판에의 탑재방법에 있어서의 바인더를 분배하는 공정을 도시한 도면,
제4도는 본 발명에 따른 전자부품에의 납땜처리하는 공정을 도시한 도면,
제5도는 본 발명에 따른 방법에 사용되는 바인더분배장치의 개략도.

Claims (5)

  1. 전자 부품이 탐재되는 소정위치에서 프린트기판에 접착재를 도포하고, 상기 접착제가 도포된 상기 위치에서 상기 부품을 상기 기판에 탑재하고, 상기 전자부품의 외부단자와 상기 프린트기판상의 소정 도전체사이의 영역에 납땜을 시행하는 전자부품의 프린트기판에의 탑재방법에 있어서, 각각의 상기 위치에서 노즐로부터 상기 기판으로 소정용적의 아크릴변성수지 에멀션바인더의 드로플릿을 방출하는 공정과, 상기 부품을 고착하기 위한 충분한 점착성을 확보하기 위하여 상기 바인더를 건조하여 수분을 제거하는 공정과, 상기 영역에 상기 납땜을 시행하는 공정으로 이루어진 것을 특징으로 하는 전자부품의 프린트기판에의 탑재방법.
  2. 제1항에 있어서, 상기 접착제는, 가압된 접착제 공급탱크로부터 안내관을 개재해서 상기 안내관과 이젝터노즐의 유입구와 연통되어 있는 밸브실로 도입된 후, 제어된 시간간격에 대한 이동가능한 밸브체의 개방에 응해서 상기 노즐을 개재해서 방출되며, 상기 밸브체는 상기 밸브실내에 위치되어 상기 노즐의 유입구에 대항해서 탈착 가능하게 설치되고 통상 폐쇄상태로 되어있는 것을 특징으로 하는 전자부품의 프린트기판에의 탑재방법.
  3. 제1항에 있어서, 마이크로파 수단을 이용해서 상기 바인더의 건조를 수행하는 것을 특징으로 하는 전자부품의 프린트기판에의 탑재방법.
  4. 제1항에 있어서, 상기 아크릴변성 수지 에멀션은 아크릴에폭시수지에멀션과 같은 열결화성 아크릴변성수지인 것을 특징으로 하는 전자부품의 프린트기판에의 탑재방법.
  5. 제1항에 있어서, 상기 아크릴 변성수지 에멀션은 아크릴 실리콘수지에멀션과 같은 열가소성 아크릴변성수지인 것을 특징으로 하는 전자부품의 프린트기판에의 탑재방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910012460A 1990-09-06 1991-07-20 전자부품의 프린트 기판에의 탑재방법 KR950000400B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2-234421 1990-09-06
JP2234421A JPH0828565B2 (ja) 1990-09-06 1990-09-06 電子部品のプリント基板への搭載方法

Publications (2)

Publication Number Publication Date
KR930003794A true KR930003794A (ko) 1993-02-24
KR950000400B1 KR950000400B1 (ko) 1995-01-16

Family

ID=16970758

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910012460A KR950000400B1 (ko) 1990-09-06 1991-07-20 전자부품의 프린트 기판에의 탑재방법

Country Status (5)

Country Link
US (1) US5102030A (ko)
EP (1) EP0473911B1 (ko)
JP (1) JPH0828565B2 (ko)
KR (1) KR950000400B1 (ko)
DE (1) DE69104678T2 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100357961B1 (ko) * 2000-08-04 2002-10-25 삼성에스디아이 주식회사 아크릴 에멀젼의 합성방법

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US5320250A (en) * 1991-12-02 1994-06-14 Asymptotic Technologies, Inc. Method for rapid dispensing of minute quantities of viscous material
US5447267A (en) * 1993-02-08 1995-09-05 Matsushita Electric Industrial Co., Ltd. Method of soldering electronic part using a bond for tacking the electronic part
US5992729A (en) * 1996-10-02 1999-11-30 Mcnc Tacking processes and systems for soldering
WO2000023712A1 (en) 1998-10-16 2000-04-27 Micro Robotics Systems, Inc. Dispensing apparatus
US7637415B2 (en) 2005-10-31 2009-12-29 General Electric Company Methods and apparatus for assembling a printed circuit board
WO2007122442A1 (en) * 2006-04-25 2007-11-01 Cl Inspiration Llc Dispenser for adhesive materials in liquid form
EP3071006B1 (en) * 2013-11-11 2019-12-25 FUJI Corporation Substrate processing device and dispensing head
CN114424688B (zh) * 2019-09-24 2023-10-27 株式会社富士 干燥装置及干燥方法
US20220108930A1 (en) * 2020-10-07 2022-04-07 Murata Manufacturing Co., Ltd. Electronic component with metallic cap

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Also Published As

Publication number Publication date
EP0473911A3 (en) 1993-01-27
EP0473911B1 (en) 1994-10-19
EP0473911A2 (en) 1992-03-11
KR950000400B1 (ko) 1995-01-16
JPH0828565B2 (ja) 1996-03-21
DE69104678T2 (de) 1995-05-24
DE69104678D1 (de) 1994-11-24
US5102030A (en) 1992-04-07
JPH04116890A (ja) 1992-04-17

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