JPS5785250A - Coating method for semiconductor device - Google Patents

Coating method for semiconductor device

Info

Publication number
JPS5785250A
JPS5785250A JP55162470A JP16247080A JPS5785250A JP S5785250 A JPS5785250 A JP S5785250A JP 55162470 A JP55162470 A JP 55162470A JP 16247080 A JP16247080 A JP 16247080A JP S5785250 A JPS5785250 A JP S5785250A
Authority
JP
Japan
Prior art keywords
nozzle
resin
chip
width
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55162470A
Other languages
Japanese (ja)
Inventor
Hiroshi Shinohara
Kenji Anami
Masahiko Yoshimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP55162470A priority Critical patent/JPS5785250A/en
Publication of JPS5785250A publication Critical patent/JPS5785250A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05553—Shape in top view being rectangular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating

Abstract

PURPOSE:To control the quantity of coating, and to prevent the disconnection of a wire by forming a nozzle port ejecting a coating material in a rectangle and coating while moving a nozzle. CONSTITUTION:The nozzle 7 with the rectangular nozzle port is approached to a housing vessel 2 at the one end side of a chip 1, and resin 6 is stuck. The nozzle 7 is moved to one end of the chip 1 from the other end while ejecting the resin 6 from the nozzle 7. Lastly, the nozzle 7 is approached to the housing vessel 2 at the other end side of the chip 1 and the resin 6 is glued, and a terminal of the resin 6 is fixed. The resin 6 spreads in a beltlike shape in width corresponding to the width of the nozzle and covers the surface of the chip because of high viscosity. When the width of the nozzle is made shorter than a space of an opposed bonding pad at that time, the resin 6 does not adhere on a lead wire, and the disconnection of the wire can be prevented.
JP55162470A 1980-11-17 1980-11-17 Coating method for semiconductor device Pending JPS5785250A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55162470A JPS5785250A (en) 1980-11-17 1980-11-17 Coating method for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55162470A JPS5785250A (en) 1980-11-17 1980-11-17 Coating method for semiconductor device

Publications (1)

Publication Number Publication Date
JPS5785250A true JPS5785250A (en) 1982-05-27

Family

ID=15755228

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55162470A Pending JPS5785250A (en) 1980-11-17 1980-11-17 Coating method for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5785250A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0401746A2 (en) * 1989-06-05 1990-12-12 Siemens Aktiengesellschaft Method for encapsulating an electronic device and apparatus for carrying out this method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0401746A2 (en) * 1989-06-05 1990-12-12 Siemens Aktiengesellschaft Method for encapsulating an electronic device and apparatus for carrying out this method

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